SG11201400116WA - Sintering process and apparatus - Google Patents
Sintering process and apparatusInfo
- Publication number
- SG11201400116WA SG11201400116WA SG11201400116WA SG11201400116WA SG11201400116WA SG 11201400116W A SG11201400116W A SG 11201400116WA SG 11201400116W A SG11201400116W A SG 11201400116WA SG 11201400116W A SG11201400116W A SG 11201400116WA SG 11201400116W A SG11201400116W A SG 11201400116WA
- Authority
- SG
- Singapore
- Prior art keywords
- sintering process
- sintering
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 238000005245 sintering Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/1017—Multiple heating or additional steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161524091P | 2011-08-16 | 2011-08-16 | |
| PCT/US2012/050865 WO2013025756A2 (en) | 2011-08-16 | 2012-08-15 | Sintering process and apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201400116WA true SG11201400116WA (en) | 2014-05-29 |
Family
ID=47711896
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201400116WA SG11201400116WA (en) | 2011-08-16 | 2012-08-15 | Sintering process and apparatus |
| SG11201400107UA SG11201400107UA (en) | 2011-08-16 | 2012-08-15 | Sintering process and apparatus |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201400107UA SG11201400107UA (en) | 2011-08-16 | 2012-08-15 | Sintering process and apparatus |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20130043221A1 (en) |
| EP (1) | EP2744614A4 (en) |
| JP (1) | JP2014529891A (en) |
| CN (1) | CN103857482A (en) |
| SG (2) | SG11201400116WA (en) |
| WO (1) | WO2013025756A2 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120017829A1 (en) * | 2010-07-21 | 2012-01-26 | Xenon Corporation | Reduction of stray light during sinterinig |
| US20140197159A1 (en) * | 2013-01-15 | 2014-07-17 | Xenon Corporation | Magnetic field for sintering conductive material with nanoparticles |
| DE102013104577B3 (en) * | 2013-05-03 | 2014-07-24 | Heraeus Noblelight Gmbh | Apparatus for drying and sintering metal-containing ink on a substrate |
| US9310685B2 (en) | 2013-05-13 | 2016-04-12 | Nokia Technologies Oy | Method and apparatus for the formation of conductive films on a substrate |
| US20140349025A1 (en) * | 2013-05-23 | 2014-11-27 | E I Du Pont De Nemours And Company | Conductive compositions and methods relating thereto |
| KR101506504B1 (en) * | 2013-08-22 | 2015-03-30 | (주)유니버셜스탠다드테크놀러지 | The apparatus for intense pulsed light sintering |
| KR101526937B1 (en) * | 2013-12-11 | 2015-06-10 | (주)유니버셜스탠다드테크놀러지 | The apparatus for lighting white light |
| EP3083034A4 (en) * | 2013-12-20 | 2017-09-13 | Xenon Corporation | Continuous flash lamp sintering |
| KR101799147B1 (en) | 2015-02-17 | 2017-11-20 | 한양대학교 산학협력단 | multistep light sintering method of copper nano ink and patterned copper nanoink thereby |
| DE102016112836A1 (en) * | 2016-06-14 | 2017-12-14 | Leander Kilian Gross | Method and device for thermal treatment of a substrate |
| US10367169B2 (en) * | 2016-10-17 | 2019-07-30 | Corning Incorporated | Processes for making light extraction substrates for an organic light emitting diode using photo-thermal treatment |
| US11207734B2 (en) | 2016-10-31 | 2021-12-28 | Hewlett-Packard Development Company, L.P. | Fusing of metallic particles |
| EP3928966A1 (en) | 2020-06-26 | 2021-12-29 | Carl Zeiss Vision International GmbH | Method for manufacturing a coated lens |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4375441A (en) * | 1980-12-18 | 1983-03-01 | The Standard Oil Company | Method for producing sintered porous polymeric articles |
| US5431967A (en) * | 1989-09-05 | 1995-07-11 | Board Of Regents, The University Of Texas System | Selective laser sintering using nanocomposite materials |
| WO1999011105A1 (en) * | 1997-08-22 | 1999-03-04 | Siemens Aktiengesellschaft | Method for producing electroconductive structures |
| JP4483161B2 (en) * | 2002-08-13 | 2010-06-16 | 住友電気工業株式会社 | Aluminum nitride sintered body, metallized substrate, heater, jig, and method of manufacturing aluminum nitride sintered body |
| US7820097B2 (en) * | 2004-11-24 | 2010-10-26 | Ncc Nano, Llc | Electrical, plating and catalytic uses of metal nanomaterial compositions |
| JP2006302679A (en) * | 2005-04-21 | 2006-11-02 | Seiko Epson Corp | Method for forming conductive film and method for manufacturing electronic device |
| JP5214153B2 (en) * | 2007-02-09 | 2013-06-19 | 大日本スクリーン製造株式会社 | Heat treatment equipment |
| WO2008124400A1 (en) * | 2007-04-04 | 2008-10-16 | Innovalight, Inc. | Methods for optimizing thin film formation with reactive gases |
| US10231344B2 (en) * | 2007-05-18 | 2019-03-12 | Applied Nanotech Holdings, Inc. | Metallic ink |
| US20090053878A1 (en) * | 2007-08-21 | 2009-02-26 | Maxim Kelman | Method for fabrication of semiconductor thin films using flash lamp processing |
| US7923837B2 (en) * | 2007-10-31 | 2011-04-12 | Hewlett-Packard Development Company, L.P. | Microelectronic device patterned by ablating and subsequently sintering said microelectronic device |
| CN102013332B (en) * | 2010-11-24 | 2012-03-07 | 华中科技大学 | Method and device for preparing photo anode in flexible solar cell through selective laser sintering |
-
2012
- 2012-08-15 WO PCT/US2012/050865 patent/WO2013025756A2/en not_active Ceased
- 2012-08-15 US US13/586,125 patent/US20130043221A1/en not_active Abandoned
- 2012-08-15 SG SG11201400116WA patent/SG11201400116WA/en unknown
- 2012-08-15 JP JP2014526148A patent/JP2014529891A/en active Pending
- 2012-08-15 CN CN201280050641.7A patent/CN103857482A/en active Pending
- 2012-08-15 EP EP12824082.7A patent/EP2744614A4/en not_active Withdrawn
- 2012-08-15 SG SG11201400107UA patent/SG11201400107UA/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013025756A2 (en) | 2013-02-21 |
| US20130043221A1 (en) | 2013-02-21 |
| EP2744614A4 (en) | 2015-05-06 |
| SG11201400107UA (en) | 2014-04-28 |
| WO2013025756A3 (en) | 2013-07-11 |
| CN103857482A (en) | 2014-06-11 |
| EP2744614A2 (en) | 2014-06-25 |
| JP2014529891A (en) | 2014-11-13 |
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