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SG11201400116WA - Sintering process and apparatus - Google Patents

Sintering process and apparatus

Info

Publication number
SG11201400116WA
SG11201400116WA SG11201400116WA SG11201400116WA SG11201400116WA SG 11201400116W A SG11201400116W A SG 11201400116WA SG 11201400116W A SG11201400116W A SG 11201400116WA SG 11201400116W A SG11201400116W A SG 11201400116WA SG 11201400116W A SG11201400116W A SG 11201400116WA
Authority
SG
Singapore
Prior art keywords
sintering process
sintering
Prior art date
Application number
SG11201400116WA
Inventor
Ryan Hathaway
Roger Williams
Original Assignee
Xenon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xenon Corp filed Critical Xenon Corp
Publication of SG11201400116WA publication Critical patent/SG11201400116WA/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283After-treatment of the printed patterns, e.g. sintering or curing methods
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10Sintering only
    • B22F3/1017Multiple heating or additional steps
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00Aspects linked to processes or compositions used in powder metallurgy
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14Related to the order of processing steps
    • H05K2203/1476Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
SG11201400116WA 2011-08-16 2012-08-15 Sintering process and apparatus SG11201400116WA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161524091P 2011-08-16 2011-08-16
PCT/US2012/050865 WO2013025756A2 (en) 2011-08-16 2012-08-15 Sintering process and apparatus

Publications (1)

Publication Number Publication Date
SG11201400116WA true SG11201400116WA (en) 2014-05-29

Family

ID=47711896

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201400116WA SG11201400116WA (en) 2011-08-16 2012-08-15 Sintering process and apparatus
SG11201400107UA SG11201400107UA (en) 2011-08-16 2012-08-15 Sintering process and apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201400107UA SG11201400107UA (en) 2011-08-16 2012-08-15 Sintering process and apparatus

Country Status (6)

Country Link
US (1) US20130043221A1 (en)
EP (1) EP2744614A4 (en)
JP (1) JP2014529891A (en)
CN (1) CN103857482A (en)
SG (2) SG11201400116WA (en)
WO (1) WO2013025756A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120017829A1 (en) * 2010-07-21 2012-01-26 Xenon Corporation Reduction of stray light during sinterinig
US20140197159A1 (en) * 2013-01-15 2014-07-17 Xenon Corporation Magnetic field for sintering conductive material with nanoparticles
DE102013104577B3 (en) * 2013-05-03 2014-07-24 Heraeus Noblelight Gmbh Apparatus for drying and sintering metal-containing ink on a substrate
US9310685B2 (en) 2013-05-13 2016-04-12 Nokia Technologies Oy Method and apparatus for the formation of conductive films on a substrate
US20140349025A1 (en) * 2013-05-23 2014-11-27 E I Du Pont De Nemours And Company Conductive compositions and methods relating thereto
KR101506504B1 (en) * 2013-08-22 2015-03-30 (주)유니버셜스탠다드테크놀러지 The apparatus for intense pulsed light sintering
KR101526937B1 (en) * 2013-12-11 2015-06-10 (주)유니버셜스탠다드테크놀러지 The apparatus for lighting white light
EP3083034A4 (en) * 2013-12-20 2017-09-13 Xenon Corporation Continuous flash lamp sintering
KR101799147B1 (en) 2015-02-17 2017-11-20 한양대학교 산학협력단 multistep light sintering method of copper nano ink and patterned copper nanoink thereby
DE102016112836A1 (en) * 2016-06-14 2017-12-14 Leander Kilian Gross Method and device for thermal treatment of a substrate
US10367169B2 (en) * 2016-10-17 2019-07-30 Corning Incorporated Processes for making light extraction substrates for an organic light emitting diode using photo-thermal treatment
US11207734B2 (en) 2016-10-31 2021-12-28 Hewlett-Packard Development Company, L.P. Fusing of metallic particles
EP3928966A1 (en) 2020-06-26 2021-12-29 Carl Zeiss Vision International GmbH Method for manufacturing a coated lens

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4375441A (en) * 1980-12-18 1983-03-01 The Standard Oil Company Method for producing sintered porous polymeric articles
US5431967A (en) * 1989-09-05 1995-07-11 Board Of Regents, The University Of Texas System Selective laser sintering using nanocomposite materials
WO1999011105A1 (en) * 1997-08-22 1999-03-04 Siemens Aktiengesellschaft Method for producing electroconductive structures
JP4483161B2 (en) * 2002-08-13 2010-06-16 住友電気工業株式会社 Aluminum nitride sintered body, metallized substrate, heater, jig, and method of manufacturing aluminum nitride sintered body
US7820097B2 (en) * 2004-11-24 2010-10-26 Ncc Nano, Llc Electrical, plating and catalytic uses of metal nanomaterial compositions
JP2006302679A (en) * 2005-04-21 2006-11-02 Seiko Epson Corp Method for forming conductive film and method for manufacturing electronic device
JP5214153B2 (en) * 2007-02-09 2013-06-19 大日本スクリーン製造株式会社 Heat treatment equipment
WO2008124400A1 (en) * 2007-04-04 2008-10-16 Innovalight, Inc. Methods for optimizing thin film formation with reactive gases
US10231344B2 (en) * 2007-05-18 2019-03-12 Applied Nanotech Holdings, Inc. Metallic ink
US20090053878A1 (en) * 2007-08-21 2009-02-26 Maxim Kelman Method for fabrication of semiconductor thin films using flash lamp processing
US7923837B2 (en) * 2007-10-31 2011-04-12 Hewlett-Packard Development Company, L.P. Microelectronic device patterned by ablating and subsequently sintering said microelectronic device
CN102013332B (en) * 2010-11-24 2012-03-07 华中科技大学 Method and device for preparing photo anode in flexible solar cell through selective laser sintering

Also Published As

Publication number Publication date
WO2013025756A2 (en) 2013-02-21
US20130043221A1 (en) 2013-02-21
EP2744614A4 (en) 2015-05-06
SG11201400107UA (en) 2014-04-28
WO2013025756A3 (en) 2013-07-11
CN103857482A (en) 2014-06-11
EP2744614A2 (en) 2014-06-25
JP2014529891A (en) 2014-11-13

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