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SG10201913148YA - System and method for imaging a surface defect on an object - Google Patents

System and method for imaging a surface defect on an object

Info

Publication number
SG10201913148YA
SG10201913148YA SG10201913148YA SG10201913148YA SG10201913148YA SG 10201913148Y A SG10201913148Y A SG 10201913148YA SG 10201913148Y A SG10201913148Y A SG 10201913148YA SG 10201913148Y A SG10201913148Y A SG 10201913148YA SG 10201913148Y A SG10201913148Y A SG 10201913148YA
Authority
SG
Singapore
Prior art keywords
imaging
surface defect
defect
Prior art date
Application number
SG10201913148YA
Inventor
Wenyu Chen
Wei Xiong
Jia Du
Jierong Cheng
Teck Sun Marcus Wan
Original Assignee
Agency Science Tech & Res
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency Science Tech & Res filed Critical Agency Science Tech & Res
Publication of SG10201913148YA publication Critical patent/SG10201913148YA/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/30Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/303Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces using photoelectric detection means
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • G06T7/001Industrial image inspection using an image reference approach
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/40Analysis of texture
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/20Image preprocessing
    • G06V10/25Determination of region of interest [ROI] or a volume of interest [VOI]
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854Grading and classifying of flaws
    • G01N2021/8867Grading and classifying of flaws using sequentially two or more inspection runs, e.g. coarse and fine, or detecting then analysing
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/10Image acquisition modality
    • G06T2207/10028Range image; Depth image; 3D point clouds
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/20Special algorithmic details
    • G06T2207/20016Hierarchical, coarse-to-fine, multiscale or multiresolution image processing; Pyramid transform
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Ink Jet (AREA)
  • Image Processing (AREA)
SG10201913148YA 2016-03-30 2017-03-30 System and method for imaging a surface defect on an object SG10201913148YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG10201602496P 2016-03-30

Publications (1)

Publication Number Publication Date
SG10201913148YA true SG10201913148YA (en) 2020-02-27

Family

ID=59964979

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201808609YA SG11201808609YA (en) 2016-03-30 2017-03-30 System and method for imaging a surface defect on an object
SG10201913148YA SG10201913148YA (en) 2016-03-30 2017-03-30 System and method for imaging a surface defect on an object

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG11201808609YA SG11201808609YA (en) 2016-03-30 2017-03-30 System and method for imaging a surface defect on an object

Country Status (3)

Country Link
US (1) US10823681B2 (en)
SG (2) SG11201808609YA (en)
WO (1) WO2017171651A1 (en)

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CN108133473B (en) * 2017-12-21 2021-10-01 江南大学 Defect detection method of warp knitted jacquard fabric based on Gabor filter and deep neural network
CN108010029B (en) * 2017-12-27 2020-11-03 江南大学 Fabric defect detection method based on deep learning and support vector data description
JP7073785B2 (en) 2018-03-05 2022-05-24 オムロン株式会社 Image inspection equipment, image inspection method and image inspection program
CN108582416B (en) * 2018-04-25 2020-09-08 湖南筑巢智能科技有限公司 Manufacturing method of large and medium ceramic ware
CN108871197B (en) * 2018-04-27 2020-07-28 中国石油大学(北京) Displacement field measuring method, device, equipment and storage medium for material surface
CN108507476B (en) * 2018-04-27 2020-08-07 中国石油大学(北京) Displacement field measurement method, device, equipment and storage medium for material surface
CN109886912B (en) * 2018-10-09 2021-02-05 中国计量大学 A method for detecting surface defects of thrust bearing cage
CN109410192B (en) * 2018-10-18 2020-11-03 首都师范大学 A fabric defect detection method and device for multi-texture grading fusion
JP7134253B2 (en) * 2018-12-11 2022-09-09 本田技研工業株式会社 WORK INSPECTION DEVICE AND WORK INSPECTION METHOD
US11210770B2 (en) 2019-03-15 2021-12-28 Hitachi, Ltd. AI-based inspection in transportation
CN110310258B (en) * 2019-06-18 2022-03-29 深圳大学 Method for evaluating corrosion degree of concrete member steel bar
DE102019219269A1 (en) * 2019-12-10 2021-06-10 Peri Gmbh Computer-aided method and control device for determining the quality of fair-faced concrete
JP7501264B2 (en) * 2020-09-15 2024-06-18 株式会社アイシン Anomaly detection device, anomaly detection program, and anomaly detection system
CN112434694B (en) * 2020-11-20 2021-07-16 哈尔滨市科佳通用机电股份有限公司 Method and system for identifying damage fault of outer ring of front cover of rolling bearing
US12270731B2 (en) 2021-04-08 2025-04-08 Pavement Recycling Systems Inc. Automated analysis and sorting of milling drum tools
US11669956B2 (en) * 2021-06-01 2023-06-06 Caterpillar Inc. Ground engaging tool wear and loss detection system and method
JP7767741B2 (en) * 2021-06-08 2025-11-12 富士フイルムビジネスイノベーション株式会社 Surface inspection device and program
US12229994B1 (en) * 2021-08-23 2025-02-18 Amazon Technologies, Inc. Depth sensor evaluation
CN114581404B (en) * 2022-03-03 2022-08-30 常州市宏发纵横新材料科技股份有限公司 Broken yarn detection method for interweaving binding yarns
CN114663403B (en) * 2022-03-25 2022-11-18 北京城建设计发展集团股份有限公司 Prefabricated part assembling surface local defect identification method based on dense scanning data
CN114612469B (en) * 2022-05-09 2022-08-12 武汉中导光电设备有限公司 Product defect detection method, device and equipment and readable storage medium
CN116165216B (en) * 2023-03-16 2023-08-04 苏州鼎纳自动化技术有限公司 Liquid crystal display micro scratch flaw 3D detection method, system and computing equipment
US12353949B2 (en) * 2023-04-27 2025-07-08 Zebra Technologies Corporation Indicia tracking and decoding systems
CN116609345B (en) * 2023-07-19 2023-10-17 北京阿丘机器人科技有限公司 Battery cover plate defect detection method, device, equipment and storage medium
CN117214183B (en) * 2023-11-07 2024-01-30 山东泗水金立得纸业有限公司 Paper defect detection method based on machine vision

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US5517027A (en) * 1993-06-08 1996-05-14 Mitsubishi Denki Kabushiki Kaisha Method for detecting and examining slightly irregular surface states, scanning probe microscope therefor, and method for fabricating a semiconductor device or a liquid crystal display device using these
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DE10343148A1 (en) * 2003-09-18 2005-04-21 Leica Microsystems Method and device for inspecting a wafer
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Also Published As

Publication number Publication date
WO2017171651A1 (en) 2017-10-05
SG11201808609YA (en) 2018-10-30
US20190120770A1 (en) 2019-04-25
US10823681B2 (en) 2020-11-03

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