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SG10201805667XA - System of heated air staging chamber for server cluster of data center - Google Patents

System of heated air staging chamber for server cluster of data center

Info

Publication number
SG10201805667XA
SG10201805667XA SG10201805667XA SG10201805667XA SG10201805667XA SG 10201805667X A SG10201805667X A SG 10201805667XA SG 10201805667X A SG10201805667X A SG 10201805667XA SG 10201805667X A SG10201805667X A SG 10201805667XA SG 10201805667X A SG10201805667X A SG 10201805667XA
Authority
SG
Singapore
Prior art keywords
data center
heated air
server cluster
staging chamber
air staging
Prior art date
Application number
SG10201805667XA
Inventor
Chun Keat Cheong
Kheng Hock Lee
Chong Meng Goh
Sahroon Bin Mohn Amin Azrin
Original Assignee
Ers Gx Holding Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ers Gx Holding Pte Ltd filed Critical Ers Gx Holding Pte Ltd
Priority to SG10201805667XA priority Critical patent/SG10201805667XA/en
Priority to CN201811534462.6A priority patent/CN110662391B/en
Priority to US16/283,193 priority patent/US10925189B2/en
Priority to PCT/IB2019/054982 priority patent/WO2020003044A1/en
Priority to AU2019293951A priority patent/AU2019293951B2/en
Priority to MYPI2020005694A priority patent/MY205778A/en
Priority to EP19827412.8A priority patent/EP3815478B1/en
Priority to JP2020571680A priority patent/JP7154490B2/en
Priority to KR1020207037162A priority patent/KR102530528B1/en
Publication of SG10201805667XA publication Critical patent/SG10201805667XA/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1485Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208Liquid cooling with phase change
    • H05K7/20827Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718Forced ventilation of a gaseous coolant
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20172Fan mounting or fan specifications
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/202Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718Forced ventilation of a gaseous coolant
    • H05K7/20736Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718Forced ventilation of a gaseous coolant
    • H05K7/20745Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20754Air circulating in closed loop within cabinets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763Liquid cooling without phase change
    • H05K7/2079Liquid cooling without phase change within rooms for removing heat from cabinets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208Liquid cooling with phase change
    • H05K7/20818Liquid cooling with phase change within cabinets for removing heat from server blades
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836Thermal management, e.g. server temperature control

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
SG10201805667XA 2018-06-29 2018-06-29 System of heated air staging chamber for server cluster of data center SG10201805667XA (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
SG10201805667XA SG10201805667XA (en) 2018-06-29 2018-06-29 System of heated air staging chamber for server cluster of data center
CN201811534462.6A CN110662391B (en) 2018-06-29 2018-12-14 Hot air classification room system of data center server cluster
US16/283,193 US10925189B2 (en) 2018-06-29 2019-02-22 System of heated air staging chamber for server cluster of data center
PCT/IB2019/054982 WO2020003044A1 (en) 2018-06-29 2019-06-14 System of heated air staging chamber for server cluster
AU2019293951A AU2019293951B2 (en) 2018-06-29 2019-06-14 System of Heated Air Staging Chamber for Server Cluster of Data Center
MYPI2020005694A MY205778A (en) 2018-06-29 2019-06-14 System of heated air staging chamber for server cluster of data centre
EP19827412.8A EP3815478B1 (en) 2018-06-29 2019-06-14 System of heated air staging chamber for server cluster of data center
JP2020571680A JP7154490B2 (en) 2018-06-29 2019-06-14 Heated air staging chamber system for data center server cluster
KR1020207037162A KR102530528B1 (en) 2018-06-29 2019-06-14 Heated Air Staging Chamber Systems for Server Clusters in Data Centers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG10201805667XA SG10201805667XA (en) 2018-06-29 2018-06-29 System of heated air staging chamber for server cluster of data center

Publications (1)

Publication Number Publication Date
SG10201805667XA true SG10201805667XA (en) 2020-01-30

Family

ID=68986123

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201805667XA SG10201805667XA (en) 2018-06-29 2018-06-29 System of heated air staging chamber for server cluster of data center

Country Status (9)

Country Link
US (1) US10925189B2 (en)
EP (1) EP3815478B1 (en)
JP (1) JP7154490B2 (en)
KR (1) KR102530528B1 (en)
CN (1) CN110662391B (en)
AU (1) AU2019293951B2 (en)
MY (1) MY205778A (en)
SG (1) SG10201805667XA (en)
WO (1) WO2020003044A1 (en)

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* Cited by examiner, † Cited by third party
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PL3873183T3 (en) * 2020-02-28 2022-03-28 Ovh Rack arrangement for a data center
US11388832B2 (en) * 2020-05-28 2022-07-12 Baidu Usa Llc Blind-mate connection design for liquid-cooled electronic racks
CN112188801B (en) * 2020-09-25 2022-12-09 深圳广盛浩科技有限公司 5G basic station heat dissipation shell
US11950396B2 (en) * 2020-12-30 2024-04-02 Nvidia Corporation Intelligent swappable modular unit for local cooling loops in a datacenter cooling system
JP2023103909A (en) * 2022-01-14 2023-07-27 株式会社ハイレゾ data center
CN117098356B (en) * 2022-12-15 2024-07-02 江阴百士特控制显示设备有限公司 A vehicle control room equipment cabinet with heat dissipation and heat insulation effects

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US6301837B1 (en) * 2000-03-13 2001-10-16 Kewaunee Scientific Corp. Rack assembly for supporting electronic units
US7259963B2 (en) * 2004-12-29 2007-08-21 American Power Conversion Corp. Rack height cooling
US20100110633A1 (en) * 2007-04-05 2010-05-06 Yekutiel Gigushinsky integrated active cooled cabinet/rack for electronic equipments
US9148980B2 (en) 2007-07-13 2015-09-29 Dell Products L.P. System for a rack design
US8250877B2 (en) * 2008-03-10 2012-08-28 Cooligy Inc. Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
KR20110129514A (en) * 2010-05-26 2011-12-02 삼정데이타서비스 주식회사 Internet Data Center Air Conditioning System with Green Computing Environment
US9016352B2 (en) 2012-05-21 2015-04-28 Calvary Applied Technologies, LLC Apparatus and methods for cooling rejected heat from server racks
US20140206271A1 (en) * 2013-01-22 2014-07-24 Roland M. Ignacio Electronics rack cooling duct
US9149753B2 (en) * 2013-03-26 2015-10-06 Hewlett-Packard Development Company, L.P. Filter member
GB2518659A (en) * 2013-09-27 2015-04-01 Alifabs Cabinets & Ancillaries Ltd Fan Controller
US9690337B1 (en) * 2013-12-09 2017-06-27 Amazon Technologies, Inc. Cooling system for data center
CN203708665U (en) * 2014-01-03 2014-07-09 东南大学 Partition air supply machine cabinet
WO2015102247A1 (en) * 2014-01-06 2015-07-09 네이버비즈니스플랫폼 주식회사 Server room cooling device, filter module for introducing outer air, and data center air-conditioning system comprising same
JP2015185708A (en) * 2014-03-25 2015-10-22 パナソニックIpマネジメント株式会社 Cooling device and data center having the same
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Also Published As

Publication number Publication date
EP3815478A1 (en) 2021-05-05
WO2020003044A8 (en) 2020-12-30
JP7154490B2 (en) 2022-10-18
EP3815478A4 (en) 2022-03-23
EP3815478B1 (en) 2025-07-23
MY205778A (en) 2024-11-12
JP2021530027A (en) 2021-11-04
EP3815478C0 (en) 2025-07-23
US20200008323A1 (en) 2020-01-02
WO2020003044A1 (en) 2020-01-02
AU2019293951B2 (en) 2021-11-25
AU2019293951A1 (en) 2021-01-14
KR20210003941A (en) 2021-01-12
KR102530528B1 (en) 2023-05-08
CN110662391B (en) 2020-10-30
US10925189B2 (en) 2021-02-16
CN110662391A (en) 2020-01-07

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