SG10201705191RA - Cutting apparatus - Google Patents
Cutting apparatusInfo
- Publication number
- SG10201705191RA SG10201705191RA SG10201705191RA SG10201705191RA SG10201705191RA SG 10201705191R A SG10201705191R A SG 10201705191RA SG 10201705191R A SG10201705191R A SG 10201705191RA SG 10201705191R A SG10201705191R A SG 10201705191RA SG 10201705191R A SG10201705191R A SG 10201705191RA
- Authority
- SG
- Singapore
- Prior art keywords
- cutting apparatus
- cutting
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/04—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs
- B28D1/044—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs the saw blade being movable on slide ways
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/04—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs
- B28D1/046—Sawing in a plane parallel to the work table
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/005—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/46—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having an endless band-knife or the like
- B26D1/54—Guides for band-knives or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016138338A JP6815770B2 (en) | 2016-07-13 | 2016-07-13 | Cutting equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201705191RA true SG10201705191RA (en) | 2018-02-27 |
Family
ID=60942443
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201705191RA SG10201705191RA (en) | 2016-07-13 | 2017-06-22 | Cutting apparatus |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10328606B2 (en) |
| JP (1) | JP6815770B2 (en) |
| KR (1) | KR102251723B1 (en) |
| CN (1) | CN107618118B (en) |
| MY (1) | MY183734A (en) |
| SG (1) | SG10201705191RA (en) |
| TW (1) | TWI739849B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7001493B2 (en) * | 2018-02-26 | 2022-01-19 | 株式会社ディスコ | Captured image formation unit |
| CN108415366B (en) * | 2018-03-05 | 2021-01-29 | 高邑县云发专用机床厂 | Feedback method of cutting depth and intelligent cutting method and system based on servo technology |
| JP7072986B2 (en) * | 2018-05-29 | 2022-05-23 | 株式会社ディスコ | Water jet processing equipment |
| JP7206065B2 (en) * | 2018-07-26 | 2023-01-17 | 株式会社ディスコ | cutting equipment |
| JP7098239B2 (en) * | 2018-08-13 | 2022-07-11 | 株式会社ディスコ | Nozzle height inspection method and cutting equipment |
| LU101065B1 (en) * | 2018-12-21 | 2020-06-24 | Univ Luxembourg | Machining system and monitoring method |
| CN110281409B (en) * | 2019-06-13 | 2021-06-11 | 菏泽城建工程发展集团有限公司 | Automatic dust device for cutting CF wallboard |
| JP7461132B2 (en) * | 2019-11-27 | 2024-04-03 | 株式会社ディスコ | Cutting Equipment |
| JP7446683B2 (en) * | 2020-05-11 | 2024-03-11 | 株式会社ディスコ | cutting equipment |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6043114B2 (en) * | 1982-12-24 | 1985-09-26 | 日本たばこ産業株式会社 | cutting device |
| JP3792266B2 (en) * | 1994-06-16 | 2006-07-05 | 森精機興産株式会社 | Method and apparatus for correcting thermal displacement of machine tool |
| JP3071107B2 (en) * | 1994-09-28 | 2000-07-31 | 株式会社日平トヤマ | Wire cleaning equipment for wire saws |
| JPH10202496A (en) * | 1997-01-13 | 1998-08-04 | Mitsubishi Materials Corp | Wire type cutting device |
| JP2000176836A (en) * | 1998-12-17 | 2000-06-27 | Mitsubishi Material Kenzai Corp | Polishing method and device |
| JP4215228B2 (en) * | 1999-10-26 | 2009-01-28 | 独立行政法人理化学研究所 | Desktop 4-axis mirror finishing machine |
| JP2001259961A (en) * | 2000-03-15 | 2001-09-25 | Disco Abrasive Syst Ltd | Processing equipment |
| JP3763734B2 (en) * | 2000-10-27 | 2006-04-05 | 株式会社日立製作所 | Panel member processing method |
| DE10349088A1 (en) * | 2002-10-22 | 2004-09-09 | Hitachi Koki Co., Ltd. | Portable electric cutting device for cutting e.g. timber includes groove provided to bottom surface of base and which extends forward in the cutting direction from a front end of the opening to base front end |
| JP4506126B2 (en) * | 2003-08-27 | 2010-07-21 | 株式会社ジェイテクト | Grinding equipment |
| JP4192135B2 (en) * | 2004-09-29 | 2008-12-03 | 株式会社東芝 | Processing apparatus and processing method |
| JP4694210B2 (en) | 2005-01-07 | 2011-06-08 | 株式会社ディスコ | Blade cover device |
| US7771249B2 (en) * | 2007-03-30 | 2010-08-10 | Park Industries, Inc. | Corner saw |
| JP2009285769A (en) * | 2008-05-28 | 2009-12-10 | Disco Abrasive Syst Ltd | Cutting device |
| JP2010228048A (en) * | 2009-03-27 | 2010-10-14 | Disco Abrasive Syst Ltd | Cutting equipment |
| JP2011040511A (en) * | 2009-08-10 | 2011-02-24 | Disco Abrasive Syst Ltd | Method of grinding wafer |
| JP2011189411A (en) * | 2010-03-11 | 2011-09-29 | Renesas Electronics Corp | Wafer grinding device, wafer grinding method, wafer grinding program and wafer grinding control device |
| KR101297306B1 (en) * | 2011-06-10 | 2013-08-14 | 손원호 | Bench Grinder with Water Container |
| JP5947605B2 (en) * | 2012-04-17 | 2016-07-06 | 株式会社ディスコ | Nozzle adjustment jig |
| KR102003997B1 (en) * | 2012-11-22 | 2019-07-30 | 두산공작기계 주식회사 | Apparatus for controlling cutting oil injection of machine tool and method thereof |
| JP2014108463A (en) * | 2012-11-30 | 2014-06-12 | Disco Abrasive Syst Ltd | Cutting equipment |
| JP2014108471A (en) * | 2012-11-30 | 2014-06-12 | Takada Corp | Ultrasonic vibration cutter |
| CN103072084B (en) * | 2013-02-04 | 2015-09-09 | 青岛理工大学 | Nano-fluid electrostatic atomization controllable jet flow trace lubrication grinding system |
| CN103147756B (en) * | 2013-03-20 | 2017-03-29 | 中国矿业大学(北京) | A kind of heading machine memory cutting control system and method thereof |
| CN203579423U (en) * | 2013-12-02 | 2014-05-07 | 青岛理工大学 | Nano particle jet flow controllable transportation trace lubrication grinding equipment in magnetic enhanced electric field |
| JP2015138950A (en) * | 2014-01-24 | 2015-07-30 | 株式会社ディスコ | Cutting equipment |
| JP6223239B2 (en) * | 2014-03-07 | 2017-11-01 | 株式会社ディスコ | Cutting equipment |
| JP6302732B2 (en) * | 2014-04-22 | 2018-03-28 | 株式会社ディスコ | Cutting method |
| EP2960012A1 (en) * | 2014-06-25 | 2015-12-30 | HILTI Aktiengesellschaft | Automatic adjustment of units in a water supply installation |
| US20160311127A1 (en) * | 2015-04-24 | 2016-10-27 | Disco Corporation | Cutting apparatus and cutting method |
| JP6695102B2 (en) * | 2015-05-26 | 2020-05-20 | 株式会社ディスコ | Processing system |
| CN105666254B (en) * | 2016-03-15 | 2017-12-01 | 河南理工大学 | A kind of multi-dimensional ultrasound ELID compound internal grinding experimental rigs of controllableization |
-
2016
- 2016-07-13 JP JP2016138338A patent/JP6815770B2/en active Active
-
2017
- 2017-06-09 TW TW106119305A patent/TWI739849B/en active
- 2017-06-22 SG SG10201705191RA patent/SG10201705191RA/en unknown
- 2017-06-22 MY MYPI2017702337A patent/MY183734A/en unknown
- 2017-07-03 KR KR1020170084142A patent/KR102251723B1/en active Active
- 2017-07-11 CN CN201710560879.9A patent/CN107618118B/en active Active
- 2017-07-12 US US15/647,938 patent/US10328606B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR102251723B1 (en) | 2021-05-12 |
| TW201808522A (en) | 2018-03-16 |
| JP6815770B2 (en) | 2021-01-20 |
| JP2018010952A (en) | 2018-01-18 |
| CN107618118B (en) | 2021-03-26 |
| KR20180007671A (en) | 2018-01-23 |
| US10328606B2 (en) | 2019-06-25 |
| MY183734A (en) | 2021-03-10 |
| TWI739849B (en) | 2021-09-21 |
| CN107618118A (en) | 2018-01-23 |
| US20180015638A1 (en) | 2018-01-18 |
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