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SG10201705708YA - Detector for low temperature transmission pyrometry - Google Patents

Detector for low temperature transmission pyrometry

Info

Publication number
SG10201705708YA
SG10201705708YA SG10201705708YA SG10201705708YA SG10201705708YA SG 10201705708Y A SG10201705708Y A SG 10201705708YA SG 10201705708Y A SG10201705708Y A SG 10201705708YA SG 10201705708Y A SG10201705708Y A SG 10201705708YA SG 10201705708Y A SG10201705708Y A SG 10201705708YA
Authority
SG
Singapore
Prior art keywords
detector
radiation
low temperature
temperature transmission
substrate
Prior art date
Application number
SG10201705708YA
Inventor
C Howells Samuel
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG10201705708YA publication Critical patent/SG10201705708YA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0801—Means for wavelength selection or discrimination
    • G01J5/0802—Optical filters
    • G01J5/08021—Notch filters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/02—Details
    • G01J3/0205—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows
    • G01J3/0218—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows using optical fibers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/12—Generating the spectrum; Monochromators
    • G01J3/18—Generating the spectrum; Monochromators using diffraction elements, e.g. grating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
    • G01J5/0007—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter of wafers or semiconductor substrates, e.g. using Rapid Thermal Processing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G01J5/041—Mountings in enclosures or in a particular environment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Radiation Pyrometers (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Abstract

SING OF THE DISCLOSURE DETECTOR FOR LOW TEMPERATURE TRANSMISSION PYROMETRY Apparatus and methods of processing substrates include a detector manifold to detect radiation from proximate a processing area in a chamber body; a radiation detector optically coupled to the detector manifold; and a spectral multi-notch filter. Apparatus and methods of processing substrates include detecting transmitted radiation from an emitting surface of a substrate in a chamber body; conveying at least one spectral band of the detected radiation to a photodetector; and analyzing the detected radiation in the at least one spectral band to determine an inferred temperature of the substrate. FIG 3A. 4872894 14
SG10201705708YA 2017-05-26 2017-07-11 Detector for low temperature transmission pyrometry SG10201705708YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762511602P 2017-05-26 2017-05-26
US201762514640P 2017-06-02 2017-06-02

Publications (1)

Publication Number Publication Date
SG10201705708YA true SG10201705708YA (en) 2018-12-28

Family

ID=61546572

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201705708YA SG10201705708YA (en) 2017-05-26 2017-07-11 Detector for low temperature transmission pyrometry

Country Status (7)

Country Link
US (1) US10072986B1 (en)
JP (1) JP7025146B2 (en)
KR (1) KR102416261B1 (en)
CN (2) CN108955889B (en)
SG (1) SG10201705708YA (en)
TW (2) TWI756247B (en)
WO (1) WO2018217220A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG10201705708YA (en) * 2017-05-26 2018-12-28 Applied Materials Inc Detector for low temperature transmission pyrometry
JP7632087B2 (en) * 2021-06-01 2025-02-19 ウシオ電機株式会社 Light heating device
US12085965B2 (en) 2021-08-31 2024-09-10 Applied Materials, Inc. Systems, methods, and apparatus for correcting thermal processing of substrates
CN113758575B (en) * 2021-09-08 2024-07-09 东北林业大学 Multispectral line temperature high-temperature measurement device and method

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9001200A (en) * 1990-05-23 1991-12-16 Imec Inter Uni Micro Electr METHOD AND APPARATUS FOR MEASURING TEMPERATURE RADIATION USING A PYROMETER USING COMPENSATION LAMPS
US5156461A (en) 1991-05-17 1992-10-20 Texas Instruments Incorporated Multi-point pyrometry with real-time surface emissivity compensation
US5501637A (en) * 1993-08-10 1996-03-26 Texas Instruments Incorporated Temperature sensor and method
US5762419A (en) * 1995-07-26 1998-06-09 Applied Materials, Inc. Method and apparatus for infrared pyrometer calibration in a thermal processing system
US6183130B1 (en) 1998-02-20 2001-02-06 Applied Materials, Inc. Apparatus for substrate temperature measurement using a reflecting cavity and detector
US6799137B2 (en) 2000-06-02 2004-09-28 Engelhard Corporation Wafer temperature measurement method for plasma environments
US6805466B1 (en) 2000-06-16 2004-10-19 Applied Materials, Inc. Lamphead for a rapid thermal processing chamber
US7734439B2 (en) * 2002-06-24 2010-06-08 Mattson Technology, Inc. System and process for calibrating pyrometers in thermal processing chambers
US7180590B2 (en) * 2003-07-09 2007-02-20 Ibsen Photonics A/S Transmission spectrometer with improved spectral and temperature characteristics
KR100590548B1 (en) 2004-03-03 2006-06-19 삼성전자주식회사 Photodetector
US7112763B2 (en) * 2004-10-26 2006-09-26 Applied Materials, Inc. Method and apparatus for low temperature pyrometry useful for thermally processing silicon wafers
US8152365B2 (en) * 2005-07-05 2012-04-10 Mattson Technology, Inc. Method and system for determining optical properties of semiconductor wafers
US20070098594A1 (en) * 2005-11-03 2007-05-03 Roche Molecular Systems, Inc. Analytical multi-spectral optical detection system
US7398693B2 (en) * 2006-03-30 2008-07-15 Applied Materials, Inc. Adaptive control method for rapid thermal processing of a substrate
US7543981B2 (en) * 2006-06-29 2009-06-09 Mattson Technology, Inc. Methods for determining wafer temperature
US7860379B2 (en) 2007-01-15 2010-12-28 Applied Materials, Inc. Temperature measurement and control of wafer support in thermal processing chamber
US8222574B2 (en) 2007-01-15 2012-07-17 Applied Materials, Inc. Temperature measurement and control of wafer support in thermal processing chamber
US8548311B2 (en) * 2008-04-09 2013-10-01 Applied Materials, Inc. Apparatus and method for improved control of heating and cooling of substrates
US8367983B2 (en) 2008-04-09 2013-02-05 Applied Materials, Inc. Apparatus including heating source reflective filter for pyrometry
US8283607B2 (en) 2008-04-09 2012-10-09 Applied Materials, Inc. Apparatus including heating source reflective filter for pyrometry
TWI395272B (en) * 2008-05-02 2013-05-01 Applied Materials Inc System for non radial temperature control for rotating substrates
US8254767B2 (en) * 2008-08-29 2012-08-28 Applied Materials, Inc. Method and apparatus for extended temperature pyrometry
US8294068B2 (en) 2008-09-10 2012-10-23 Applied Materials, Inc. Rapid thermal processing lamphead with improved cooling
US20100068898A1 (en) 2008-09-17 2010-03-18 Stephen Moffatt Managing thermal budget in annealing of substrates
WO2013018197A1 (en) 2011-08-02 2013-02-07 有限会社ワイ・システムズ Method and apparatus for measuring temperature of semiconductor layer
US8666202B2 (en) * 2012-02-20 2014-03-04 Cardinal Ig Company System and method for measuring properties of a thin film coated glass
US20130240502A1 (en) * 2012-03-14 2013-09-19 Taiwan Semiconductor Manufacturing Co., Ltd. Rapid thermal anneal system and process
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WO2014179010A1 (en) * 2013-05-01 2014-11-06 Applied Materials, Inc. Apparatus and methods for low temperature measurement in a wafer processing system
SG10201705708YA (en) * 2017-05-26 2018-12-28 Applied Materials Inc Detector for low temperature transmission pyrometry

Also Published As

Publication number Publication date
CN207095731U (en) 2018-03-13
KR20180129583A (en) 2018-12-05
TWI756247B (en) 2022-03-01
JP2018201004A (en) 2018-12-20
CN108955889B (en) 2022-04-26
TWM572464U (en) 2019-01-01
TW201901122A (en) 2019-01-01
JP7025146B2 (en) 2022-02-24
KR102416261B1 (en) 2022-07-04
WO2018217220A1 (en) 2018-11-29
CN108955889A (en) 2018-12-07
US10072986B1 (en) 2018-09-11

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