SG10201609427WA - Method And Apparatus For Enhanced Lifetime And Performance Of Ion Source In An Ion Implantation System - Google Patents
Method And Apparatus For Enhanced Lifetime And Performance Of Ion Source In An Ion Implantation SystemInfo
- Publication number
- SG10201609427WA SG10201609427WA SG10201609427WA SG10201609427WA SG10201609427WA SG 10201609427W A SG10201609427W A SG 10201609427WA SG 10201609427W A SG10201609427W A SG 10201609427WA SG 10201609427W A SG10201609427W A SG 10201609427WA SG 10201609427W A SG10201609427W A SG 10201609427WA
- Authority
- SG
- Singapore
- Prior art keywords
- performance
- implantation system
- ion
- ion implantation
- enhanced lifetime
- Prior art date
Links
- 238000005468 ion implantation Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
- F17C7/00—Methods or apparatus for discharging liquefied, solidified, or compressed gases from pressure vessels, not covered by another subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/08—Ion sources; Ion guns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/3002—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/2225—Diffusion sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/223—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67213—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one ion or electron beam chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/304—Controlling tubes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/32—Hydrogen storage
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Electron Sources, Ion Sources (AREA)
- Physical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
- Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US30842810P | 2010-02-26 | 2010-02-26 | |
| US39071510P | 2010-10-07 | 2010-10-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201609427WA true SG10201609427WA (en) | 2017-01-27 |
Family
ID=44507609
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201506698VA SG10201506698VA (en) | 2010-02-26 | 2011-02-26 | Method and apparatus for enhanced lifetime and performance of ion source in an ion implantation system |
| SG2012059093A SG183248A1 (en) | 2010-02-26 | 2011-02-26 | Method and apparatus for enhanced lifetime and performance of ion source in an ion implantation system |
| SG10201609427WA SG10201609427WA (en) | 2010-02-26 | 2011-02-26 | Method And Apparatus For Enhanced Lifetime And Performance Of Ion Source In An Ion Implantation System |
| SG10201910998SA SG10201910998SA (en) | 2010-02-26 | 2011-02-26 | Method and apparatus for enhanced lifetime and performance of ion source in an ion implantation system |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201506698VA SG10201506698VA (en) | 2010-02-26 | 2011-02-26 | Method and apparatus for enhanced lifetime and performance of ion source in an ion implantation system |
| SG2012059093A SG183248A1 (en) | 2010-02-26 | 2011-02-26 | Method and apparatus for enhanced lifetime and performance of ion source in an ion implantation system |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201910998SA SG10201910998SA (en) | 2010-02-26 | 2011-02-26 | Method and apparatus for enhanced lifetime and performance of ion source in an ion implantation system |
Country Status (9)
| Country | Link |
|---|---|
| US (6) | US8237134B2 (en) |
| EP (2) | EP2539923A4 (en) |
| JP (6) | JP5906196B2 (en) |
| KR (7) | KR101856921B1 (en) |
| CN (3) | CN107393795A (en) |
| MY (1) | MY166024A (en) |
| SG (4) | SG10201506698VA (en) |
| TW (5) | TWI585042B (en) |
| WO (1) | WO2011106750A2 (en) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8598022B2 (en) | 2009-10-27 | 2013-12-03 | Advanced Technology Materials, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
| TWI585042B (en) * | 2010-02-26 | 2017-06-01 | 恩特葛瑞斯股份有限公司 | Method and apparatus for enhanced lifetime and performance of ion source in an ion implantation system |
| US8779383B2 (en) * | 2010-02-26 | 2014-07-15 | Advanced Technology Materials, Inc. | Enriched silicon precursor compositions and apparatus and processes for utilizing same |
| WO2014036064A1 (en) * | 2012-08-28 | 2014-03-06 | Praxair Technology, Inc. | Silicon-containing dopant compositions, systems and methods of use thereof for improving ion beam current and performance during silicon ion implantation |
| KR102208866B1 (en) * | 2012-12-21 | 2021-01-28 | 프랙스에어 테크놀로지, 인코포레이티드 | Storage and sub-atmospheric delivery of dopant compositions for carbon ion implantation |
| EP2965347A4 (en) * | 2013-03-05 | 2017-02-15 | Entegris, Inc. | Ion implantation compositions, systems, and methods |
| US8883620B1 (en) * | 2013-04-24 | 2014-11-11 | Praxair Technology, Inc. | Methods for using isotopically enriched levels of dopant gas compositions in an ion implantation process |
| CN105190826B (en) * | 2013-05-02 | 2019-02-15 | 普莱克斯技术有限公司 | Supply source and method for selenium-enriched ion implantation |
| JP2016524793A (en) * | 2013-05-21 | 2016-08-18 | インテグリス・インコーポレーテッド | Concentrated silicon precursor composition and apparatus and method for utilizing the same |
| CN103413746A (en) * | 2013-06-25 | 2013-11-27 | 上海华力微电子有限公司 | Germanium implanting method for improving service cycle of ion implanter |
| US9524849B2 (en) | 2013-07-18 | 2016-12-20 | Varian Semiconductor Equipment Associates, Inc. | Method of improving ion beam quality in an implant system |
| EP3033765A4 (en) * | 2013-08-16 | 2017-08-16 | Entegris, Inc. | Silicon implantation in substrates and provision of silicon precursor compositions therefor |
| JP6238689B2 (en) * | 2013-11-13 | 2017-11-29 | 住友重機械イオンテクノロジー株式会社 | Ion generating apparatus and ion generating method |
| US9570271B2 (en) * | 2014-03-03 | 2017-02-14 | Praxair Technology, Inc. | Boron-containing dopant compositions, systems and methods of use thereof for improving ion beam current and performance during boron ion implantation |
| US9677171B2 (en) * | 2014-06-06 | 2017-06-13 | Varian Semiconductor Equipment Associates, Inc. | Method of improving ion beam quality in a non-mass-analyzed ion implantation system |
| JP6328023B2 (en) * | 2014-10-08 | 2018-05-23 | 株式会社日立ハイテクノロジーズ | Ion beam equipment |
| US10497532B2 (en) * | 2014-10-27 | 2019-12-03 | Entegris, Inc. | Ion implantation processes and apparatus |
| JP6879663B2 (en) * | 2014-12-25 | 2021-06-02 | 株式会社日立ハイテクサイエンス | Charged particle beam device |
| GB201514895D0 (en) * | 2015-08-21 | 2015-10-07 | Finlay Alan P J | Energy conversion system and reaction apparatus |
| SG11201810163VA (en) * | 2016-03-28 | 2018-12-28 | Entegris Inc | Hydrogenated isotopically enriched boron trifluoride dopant source gas composition |
| KR20180132800A (en) * | 2016-04-05 | 2018-12-12 | 베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크. | A method for injecting a processing species into a workpiece, a method for injecting a dopant into a workpiece, and an apparatus for processing a workpiece |
| US10170286B2 (en) * | 2016-09-30 | 2019-01-01 | Axcelis Technologies, Inc. | In-situ cleaning using hydrogen peroxide as co-gas to primary dopant or purge gas for minimizing carbon deposits in an ion source |
| US20180247800A1 (en) * | 2017-02-28 | 2018-08-30 | International Business Machines Corporation | Gallium implantation cleaning method |
| US11098402B2 (en) | 2017-08-22 | 2021-08-24 | Praxair Technology, Inc. | Storage and delivery of antimony-containing materials to an ion implanter |
| US10580632B2 (en) * | 2017-12-18 | 2020-03-03 | Agilent Technologies, Inc. | In-situ conditioning in mass spectrometry systems |
| JP2021524648A (en) * | 2018-05-17 | 2021-09-13 | インテグリス・インコーポレーテッド | A mixture of germanium tetrafluoride and hydrogen for ion implantation systems |
| CN109300778B (en) * | 2018-09-30 | 2021-10-15 | 上海华力集成电路制造有限公司 | Ion implantation method |
| US11049728B2 (en) | 2018-10-31 | 2021-06-29 | Entegris, Inc. | Boron-doped amorphous carbon hard mask and related methods |
| US10923309B2 (en) * | 2018-11-01 | 2021-02-16 | Applied Materials, Inc. | GeH4/Ar plasma chemistry for ion implant productivity enhancement |
| KR102623884B1 (en) | 2018-12-15 | 2024-01-10 | 엔테그리스, 아이엔씨. | Fluoride ion implantation system and method of use using non-tungsten materials |
| CN109738835B (en) * | 2018-12-31 | 2021-05-28 | 聚光科技(杭州)股份有限公司 | Working method of ion source filament |
| IL297622A (en) | 2020-05-12 | 2022-12-01 | Pbs Biotech Inc | Material transfer devices and related systems and methods |
| CN116325070A (en) * | 2020-10-02 | 2023-06-23 | 恩特格里斯公司 | Method and system for generating aluminum ions |
| US11664183B2 (en) * | 2021-05-05 | 2023-05-30 | Applied Materials, Inc. | Extended cathode and repeller life by active management of halogen cycle |
| KR20230012123A (en) | 2021-07-14 | 2023-01-26 | 삼성디스플레이 주식회사 | Display device |
| KR20250049412A (en) | 2022-08-22 | 2025-04-11 | 엔테그리스, 아이엔씨. | Chlorine-containing precursors for ion implantation systems and related methods |
| CN117038423A (en) * | 2023-10-09 | 2023-11-10 | 上海凡森璞瑞新材料股份有限公司 | Ion implantation system, method and dopant species comprising germanium tetrafluoride gas mixtures |
Family Cites Families (148)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2787564A (en) | 1954-10-28 | 1957-04-02 | Bell Telephone Labor Inc | Forming semiconductive devices by ionic bombardment |
| US6482262B1 (en) | 1959-10-10 | 2002-11-19 | Asm Microchemistry Oy | Deposition of transition metal carbides |
| US4331647A (en) | 1980-03-03 | 1982-05-25 | Goldenberg Milton David | Tumor localization and therapy with labeled antibody fragments specific to tumor-associated markers |
| US4348376A (en) | 1980-03-03 | 1982-09-07 | Goldenberg Milton David | Tumor localization and therapy with labeled anti-CEA antibody |
| JPS588071A (en) | 1981-07-08 | 1983-01-18 | Nippon Iyakuhin Kogyo Kk | Preparation of 2-benzothiazolinone-3-acetic acid amide derivative or its pharmacologically active salt |
| US4459427A (en) | 1981-10-31 | 1984-07-10 | The British Petroleum Company P.L.C. | Process for the conversion of an alkane to a mixture of an alcohol and a ketone |
| US4847504A (en) * | 1983-08-15 | 1989-07-11 | Applied Materials, Inc. | Apparatus and methods for ion implantation |
| DE3584105D1 (en) | 1984-03-16 | 1991-10-24 | Hitachi Ltd | ION SOURCE. |
| JPS60221566A (en) | 1984-04-18 | 1985-11-06 | Agency Of Ind Science & Technol | Thin film forming equipment |
| US4722978A (en) | 1985-08-30 | 1988-02-02 | The B. F. Goodrich Company | Allyl terminated macromolecular monomers of polyethers |
| JPS6295820A (en) * | 1985-10-23 | 1987-05-02 | Hitachi Ltd | Ion implantation method |
| US4680358A (en) | 1985-11-08 | 1987-07-14 | The B F Goodrich Company | Styryl terminated macromolecular monomers of polyethers |
| JPS6315228A (en) | 1986-07-08 | 1988-01-22 | Asahi Glass Co Ltd | Electrochromic element |
| JPH0772167B2 (en) | 1986-09-04 | 1995-08-02 | サントリー株式会社 | Process for producing 4-amino-3-hydroxybutyric acid derivative |
| US4851255A (en) | 1986-12-29 | 1989-07-25 | Air Products And Chemicals, Inc. | Ion implant using tetrafluoroborate |
| JPS6483147A (en) | 1987-09-25 | 1989-03-28 | Olympus Optical Co | Manufacture of chemical sensitivity field effect transistor |
| JPH01225117A (en) | 1988-03-04 | 1989-09-08 | Nippon Telegr & Teleph Corp <Ntt> | Method and device for manufacturing semiconductor device |
| JP2699549B2 (en) | 1988-06-03 | 1998-01-19 | 日産化学工業株式会社 | Method for producing 4-benzoyl-5-hydroxypyrazoles |
| JP2533639B2 (en) | 1988-10-07 | 1996-09-11 | 株式会社富士電機総合研究所 | Method for producing amorphous silicon doped with P-type carbon |
| JPH03165443A (en) * | 1989-11-24 | 1991-07-17 | Shimadzu Corp | Ion implantation method |
| US5144409A (en) | 1990-09-05 | 1992-09-01 | Yale University | Isotopically enriched semiconductor devices |
| US5442191A (en) | 1990-09-05 | 1995-08-15 | Yale University | Isotopically enriched semiconductor devices |
| JPH05254808A (en) | 1992-03-10 | 1993-10-05 | Semiconductor Energy Lab Co Ltd | Preparation of boron nitride |
| JPH0680681A (en) | 1992-07-15 | 1994-03-22 | Nippon Kayaku Co Ltd | Phosphonium compound and electrophotographic toner using the same |
| US5395783A (en) | 1993-02-16 | 1995-03-07 | Texas Instruments Incorporated | Electronic device and process achieving a reduction in alpha particle emissions from boron-based compounds essentially free of boron-10 |
| JP3259400B2 (en) | 1993-02-18 | 2002-02-25 | ソニー株式会社 | Semiconductor device and solid-state imaging device |
| US5306922A (en) * | 1993-03-16 | 1994-04-26 | Genus, Inc. | Production of high beam currents at low energies for use in ion implantation systems |
| JP3541387B2 (en) | 1993-06-23 | 2004-07-07 | 東レ株式会社 | Battery electrode, secondary battery using the same, and method of manufacturing battery electrode |
| JPH0765761A (en) * | 1993-08-30 | 1995-03-10 | Hitachi Ltd | Thin film forming method and ion implantation method |
| JPH0790201A (en) | 1993-09-22 | 1995-04-04 | Hokko Chem Ind Co Ltd | Underwater antifouling paint |
| JPH08190886A (en) * | 1995-01-10 | 1996-07-23 | Mitsubishi Electric Corp | Ion implantation device, ion implantation method, and semiconductor device |
| JP3502185B2 (en) * | 1995-04-12 | 2004-03-02 | 松下電器産業株式会社 | Ion implantation method |
| DE19537759C1 (en) * | 1995-10-10 | 1996-11-28 | Siemens Ag | Implantation of dopant into semiconductor material |
| GB2344214B (en) * | 1995-11-08 | 2000-08-09 | Applied Materials Inc | An ion implanter with improved beam definition |
| US5977552A (en) | 1995-11-24 | 1999-11-02 | Applied Materials, Inc. | Boron ion sources for ion implantation apparatus |
| US5993766A (en) * | 1996-05-20 | 1999-11-30 | Advanced Technology Materials, Inc. | Gas source and dispensing system |
| GB2314202B (en) * | 1996-06-14 | 2000-08-09 | Applied Materials Inc | Ion implantation apparatus and a method of monitoring high energy neutral contamination in an ion implantation process |
| GB2317265A (en) | 1996-09-13 | 1998-03-18 | Aea Technology Plc | Radio frequency plasma generator |
| JPH10251592A (en) | 1997-03-07 | 1998-09-22 | Kansai Paint Co Ltd | Coating composition and application thereof |
| US6086837A (en) | 1997-04-24 | 2000-07-11 | Bechtel Bwxt Idaho, Llc | Method of synthesizing enriched decaborane for use in generating boron neutron capture therapy pharmaceuticals |
| US5940724A (en) | 1997-04-30 | 1999-08-17 | International Business Machines Corporation | Method for extended ion implanter source lifetime |
| US5943594A (en) | 1997-04-30 | 1999-08-24 | International Business Machines Corporation | Method for extended ion implanter source lifetime with control mechanism |
| US5962858A (en) | 1997-07-10 | 1999-10-05 | Eaton Corporation | Method of implanting low doses of ions into a substrate |
| JPH1154451A (en) * | 1997-08-07 | 1999-02-26 | Mitsubishi Electric Corp | Semiconductor device manufacturing method and semiconductor device |
| US6096467A (en) | 1997-11-19 | 2000-08-01 | Mita Industrial Co., Ltd. | Positive charging color toner |
| JP3099819B2 (en) * | 1997-11-28 | 2000-10-16 | セイコーエプソン株式会社 | Method for manufacturing semiconductor device |
| US6135128A (en) | 1998-03-27 | 2000-10-24 | Eaton Corporation | Method for in-process cleaning of an ion source |
| US6070576A (en) * | 1998-06-02 | 2000-06-06 | Advanced Technology Materials, Inc. | Adsorbent-based storage and dispensing system |
| US6215125B1 (en) | 1998-09-16 | 2001-04-10 | International Business Machines Corporation | Method to operate GEF4 gas in hot cathode discharge ion sources |
| US6614082B1 (en) | 1999-01-29 | 2003-09-02 | Micron Technology, Inc. | Fabrication of semiconductor devices with transition metal boride films as diffusion barriers |
| US6146601A (en) * | 1999-10-28 | 2000-11-14 | Eagle-Picher Industries, Inc. | Enrichment of silicon or germanium isotopes |
| US6756600B2 (en) | 1999-02-19 | 2004-06-29 | Advanced Micro Devices, Inc. | Ion implantation with improved ion source life expectancy |
| US6376664B1 (en) | 1999-03-17 | 2002-04-23 | The Ohio State University | Cyclic bis-benzimidazole ligands and metal complexes thereof |
| JP3401561B2 (en) | 1999-03-29 | 2003-04-28 | 独立行政法人物質・材料研究機構 | Method for producing high purity isotope silicon crystal film |
| US6799603B1 (en) * | 1999-09-20 | 2004-10-05 | Moore Epitaxial, Inc. | Gas flow controller system |
| US7838842B2 (en) * | 1999-12-13 | 2010-11-23 | Semequip, Inc. | Dual mode ion source for ion implantation |
| US6420304B1 (en) | 2000-04-20 | 2002-07-16 | China Petrochemical Development Corporation | Polymer-supported carbonylation catalyst and its use |
| JP4634569B2 (en) | 2000-05-25 | 2011-02-16 | 東芝モバイルディスプレイ株式会社 | Ion implantation apparatus and thin film semiconductor device |
| KR100772772B1 (en) | 2000-06-19 | 2007-11-01 | 킴벌리-클라크 월드와이드, 인크. | Novel Photoinitiators and Their Uses |
| JP4902088B2 (en) | 2000-07-10 | 2012-03-21 | ティーイーエル エピオン インク. | System and method for improving thin films by gas cluster ion beam processing |
| KR20000072651A (en) | 2000-08-08 | 2000-12-05 | 이관호 | Novel plant species ssamchoo and breeding method thereof |
| US6893907B2 (en) | 2002-06-05 | 2005-05-17 | Applied Materials, Inc. | Fabrication of silicon-on-insulator structure using plasma immersion ion implantation |
| US7094670B2 (en) | 2000-08-11 | 2006-08-22 | Applied Materials, Inc. | Plasma immersion ion implantation process |
| US20020058385A1 (en) | 2000-10-26 | 2002-05-16 | Taiji Noda | Semiconductor device and method for manufacturing the same |
| US6559462B1 (en) | 2000-10-31 | 2003-05-06 | International Business Machines Corporation | Method to reduce downtime while implanting GeF4 |
| US6855436B2 (en) * | 2003-05-30 | 2005-02-15 | International Business Machines Corporation | Formation of silicon-germanium-on-insulator (SGOI) by an integral high temperature SIMOX-Ge interdiffusion anneal |
| JP3824058B2 (en) | 2001-05-23 | 2006-09-20 | 独立行政法人産業技術総合研究所 | Carborane super cluster and manufacturing method thereof |
| US7119400B2 (en) | 2001-07-05 | 2006-10-10 | Isonics Corporation | Isotopically pure silicon-on-insulator wafers and method of making same |
| JP2003053153A (en) | 2001-08-20 | 2003-02-25 | Japan Atom Energy Res Inst | Highly efficient separation and concentration of silicon isotopes by laser |
| US8037717B2 (en) * | 2001-10-26 | 2011-10-18 | Corning Incorporated | Methods and apparatus for pulsed doping or drying a soot preform |
| GB0128913D0 (en) | 2001-12-03 | 2002-01-23 | Applied Materials Inc | Improvements in ion sources for ion implantation apparatus |
| AU2002364611A1 (en) | 2001-12-31 | 2003-07-24 | The Ohio State University Research Foundation | Strapped and modified bis (benzimidazole) diamides for asymmetric catalysts and other applications |
| GB2417365B (en) | 2002-03-28 | 2006-05-17 | Applied Materials Inc | Monatomic boron ion source and method |
| US7138768B2 (en) | 2002-05-23 | 2006-11-21 | Varian Semiconductor Equipment Associates, Inc. | Indirectly heated cathode ion source |
| WO2004003973A2 (en) | 2002-06-26 | 2004-01-08 | Semequip Inc. | Ion implantation device and method |
| US20040002202A1 (en) | 2002-06-26 | 2004-01-01 | Horsky Thomas Neil | Method of manufacturing CMOS devices by the implantation of N- and P-type cluster ions |
| JP2004039735A (en) | 2002-07-01 | 2004-02-05 | Fujitsu Ltd | Semiconductor substrate and method of manufacturing the same |
| JP2004079930A (en) | 2002-08-22 | 2004-03-11 | Toshiba Corp | Semiconductor material, manufacturing method thereof, and SOI type semiconductor substrate |
| KR100464935B1 (en) | 2002-09-17 | 2005-01-05 | 주식회사 하이닉스반도체 | Method of fabricating semiconductor device with ultra-shallow super-steep-retrograde epi-channel by Boron-fluoride compound doping |
| US20040110351A1 (en) | 2002-12-05 | 2004-06-10 | International Business Machines Corporation | Method and structure for reduction of junction capacitance in a semiconductor device and formation of a uniformly lowered threshold voltage device |
| US7410890B2 (en) * | 2002-12-12 | 2008-08-12 | Tel Epion Inc. | Formation of doped regions and/or ultra-shallow junctions in semiconductor materials by gas-cluster ion irradiation |
| US7396745B2 (en) | 2004-12-03 | 2008-07-08 | Tel Epion Inc. | Formation of ultra-shallow junctions by gas-cluster ion irradiation |
| WO2004053945A2 (en) | 2002-12-12 | 2004-06-24 | Epion Corporation | Re-crystallization of semiconductor surface film and doping of semiconductor by energetic cluster irradiation |
| US7296532B2 (en) * | 2002-12-18 | 2007-11-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Bypass gas feed system and method to improve reactant gas flow and film deposition |
| US6780896B2 (en) | 2002-12-20 | 2004-08-24 | Kimberly-Clark Worldwide, Inc. | Stabilized photoinitiators and applications thereof |
| US6936505B2 (en) | 2003-05-20 | 2005-08-30 | Intel Corporation | Method of forming a shallow junction |
| KR100541050B1 (en) * | 2003-07-22 | 2006-01-11 | 삼성전자주식회사 | Gas supply device and semiconductor device manufacturing equipment using the same |
| CN100437912C (en) | 2003-08-25 | 2008-11-26 | 松下电器产业株式会社 | Method for forming impurity-introduced layer and method for manufacturing device |
| JP2005093518A (en) | 2003-09-12 | 2005-04-07 | Matsushita Electric Ind Co Ltd | Impurity introduction control method and impurity introduction apparatus |
| US7087913B2 (en) * | 2003-10-17 | 2006-08-08 | Applied Materials, Inc. | Ion implanter electrodes |
| CN1894763B (en) | 2003-12-12 | 2010-12-08 | 山米奎普公司 | Method and apparatus for increasing equipment uptime in ion implantation |
| TWI375660B (en) | 2004-01-22 | 2012-11-01 | Semequip Inc | Isotopically-enriched boranes and methods of preparing them |
| TWI372725B (en) | 2004-01-30 | 2012-09-21 | Semequip Inc | Methods of synthesis of isotopically enriched borohydride and methods of synthesis of isotopically enriched boranes |
| US7015108B2 (en) | 2004-02-26 | 2006-03-21 | Intel Corporation | Implanting carbon to form P-type drain extensions |
| US7494888B2 (en) * | 2004-06-23 | 2009-02-24 | Agere Systems Inc. | Device and method using isotopically enriched silicon |
| US7247546B2 (en) | 2004-08-05 | 2007-07-24 | International Business Machines Corporation | Method of forming strained silicon materials with improved thermal conductivity |
| US7397048B2 (en) * | 2004-09-17 | 2008-07-08 | Varian Semiconductor Equipment Associates, Inc. | Technique for boron implantation |
| US7563308B2 (en) * | 2004-09-23 | 2009-07-21 | Air Products And Chemicals, Inc. | Ionic liquid based mixtures for gas storage and delivery |
| US7404845B2 (en) | 2004-09-23 | 2008-07-29 | Air Products And Chemicals, Inc. | Ionic liquid based mixtures for gas storage and delivery |
| US20080242066A1 (en) * | 2004-10-22 | 2008-10-02 | Semiequip Inc. | Method Of Manufacturing Semiconductor |
| US7955797B2 (en) * | 2004-10-25 | 2011-06-07 | Advanced Technology Materials, Inc. | Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel |
| US7687025B2 (en) | 2004-11-12 | 2010-03-30 | The Boeing Company | Isotopic lightening |
| US20060104851A1 (en) | 2004-11-12 | 2006-05-18 | Tillotson Brian J | Isotopic densification of propellant |
| KR20060077942A (en) * | 2004-12-30 | 2006-07-05 | 매그나칩 반도체 유한회사 | How to use ion implanter |
| WO2006095086A2 (en) | 2005-03-07 | 2006-09-14 | Laurence Faure | Traceability of cellular cycle anomalies targeting oncology and neurodegeneration |
| TWI552797B (en) * | 2005-06-22 | 2016-10-11 | 恩特葛瑞斯股份有限公司 | Apparatus and process for integrated gas blending |
| US20060292762A1 (en) * | 2005-06-22 | 2006-12-28 | Epion Corporation | Replacement gate field effect transistor with germanium or SiGe channel and manufacturing method for same using gas-cluster ion irradiation |
| US7491947B2 (en) | 2005-08-17 | 2009-02-17 | Varian Semiconductor Equipment Associates, Inc. | Technique for improving performance and extending lifetime of indirectly heated cathode ion source |
| KR101297917B1 (en) | 2005-08-30 | 2013-08-27 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | Boron ion implantation using alternative fluorinated boron precursors, and formation of large boron hydrides for implantation |
| US20100112795A1 (en) | 2005-08-30 | 2010-05-06 | Advanced Technology Materials, Inc. | Method of forming ultra-shallow junctions for semiconductor devices |
| JP2009507344A (en) * | 2005-08-30 | 2009-02-19 | アドバンスト テクノロジー マテリアルズ,インコーポレイテッド | Delivery of low-pressure dopant gas to high-voltage ion source |
| US7446326B2 (en) * | 2005-08-31 | 2008-11-04 | Varian Semiconductor Equipment Associates, Inc. | Technique for improving ion implanter productivity |
| DE102005054218B4 (en) | 2005-11-14 | 2011-06-09 | Infineon Technologies Ag | Method for producing a semiconductor element and semiconductor element |
| US7666771B2 (en) | 2005-12-09 | 2010-02-23 | Semequip, Inc. | System and method for the manufacture of semiconductor devices by the implantation of carbon clusters |
| US20070178679A1 (en) | 2006-01-28 | 2007-08-02 | Varian Semiconductor Equipment Associates, Inc. | Methods of implanting ions and ion sources used for same |
| US7473606B2 (en) | 2006-02-22 | 2009-01-06 | United Microelectronics Corp. | Method for fabricating metal-oxide semiconductor transistors |
| WO2007134183A2 (en) | 2006-05-13 | 2007-11-22 | Advanced Technology Materials, Inc. | Chemical reagent delivery system utilizing ionic liquid storage medium |
| US8853065B2 (en) | 2006-05-16 | 2014-10-07 | Cree, Inc. | Methods for fabricating semiconductor devices having reduced implant contamination |
| JP5187761B2 (en) | 2006-08-25 | 2013-04-24 | 独立行政法人物質・材料研究機構 | Semiconductor and its manufacturing method |
| WO2008070453A2 (en) | 2006-11-22 | 2008-06-12 | Semequip, Inc. | Vapor delivery system useful with ion sources and vaporizer for use in such system |
| US7919402B2 (en) | 2006-12-06 | 2011-04-05 | Semequip, Inc. | Cluster ion implantation for defect engineering |
| US7732309B2 (en) * | 2006-12-08 | 2010-06-08 | Applied Materials, Inc. | Plasma immersed ion implantation process |
| US7887634B2 (en) | 2006-12-22 | 2011-02-15 | Infineon Technologies Ag | Method of producing a semiconductor element and semiconductor element |
| US7586109B2 (en) * | 2007-01-25 | 2009-09-08 | Varian Semiconductor Equipment Associates, Inc. | Technique for improving the performance and extending the lifetime of an ion source with gas dilution |
| US7655931B2 (en) * | 2007-03-29 | 2010-02-02 | Varian Semiconductor Equipment Associates, Inc. | Techniques for improving the performance and extending the lifetime of an ion source with gas mixing |
| US7833886B2 (en) | 2007-05-14 | 2010-11-16 | Infineon Technologies Ag | Method of producing a semiconductor element in a substrate |
| US20080305598A1 (en) | 2007-06-07 | 2008-12-11 | Horsky Thomas N | Ion implantation device and a method of semiconductor manufacturing by the implantation of ions derived from carborane molecular species |
| JP5710975B2 (en) * | 2007-11-02 | 2015-04-30 | セメクイップ, インコーポレイテッド | Preparation method of class turbolone |
| KR101822779B1 (en) * | 2008-02-11 | 2018-01-26 | 엔테그리스, 아이엔씨. | Ion source cleaning in semiconductor processing systems |
| US8252115B2 (en) * | 2008-04-02 | 2012-08-28 | Raytheon Company | System and method for growing nanotubes with a specified isotope composition via ion implantation using a catalytic transmembrane |
| EP2283509A1 (en) | 2008-05-30 | 2011-02-16 | Axcelis Technologies, Inc. | Control of particles on semiconductor wafers when implanting boron hydrides |
| US7759657B2 (en) | 2008-06-19 | 2010-07-20 | Axcelis Technologies, Inc. | Methods for implanting B22Hx and its ionized lower mass byproducts |
| US8809800B2 (en) | 2008-08-04 | 2014-08-19 | Varian Semicoductor Equipment Associates, Inc. | Ion source and a method for in-situ cleaning thereof |
| US7973293B2 (en) | 2009-01-09 | 2011-07-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Implantation quality improvement by xenon/hydrogen dilution gas |
| US7947582B2 (en) | 2009-02-27 | 2011-05-24 | Tel Epion Inc. | Material infusion in a trap layer structure using gas cluster ion beam processing |
| EP2293114B1 (en) * | 2009-09-02 | 2017-09-06 | 3833364 Canada Inc. (operating as DETEC) | Neutron energy spectrometer |
| US9627180B2 (en) | 2009-10-01 | 2017-04-18 | Praxair Technology, Inc. | Method for ion source component cleaning |
| US8237136B2 (en) | 2009-10-08 | 2012-08-07 | Tel Epion Inc. | Method and system for tilting a substrate during gas cluster ion beam processing |
| EP3062330A3 (en) | 2009-10-27 | 2016-11-16 | Entegris, Inc. | Ion implantation system and method |
| US8062965B2 (en) | 2009-10-27 | 2011-11-22 | Advanced Technology Materials, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
| US8138071B2 (en) | 2009-10-27 | 2012-03-20 | Advanced Technology Materials, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
| US8598022B2 (en) | 2009-10-27 | 2013-12-03 | Advanced Technology Materials, Inc. | Isotopically-enriched boron-containing compounds, and methods of making and using same |
| US8187971B2 (en) | 2009-11-16 | 2012-05-29 | Tel Epion Inc. | Method to alter silicide properties using GCIB treatment |
| US20110143527A1 (en) | 2009-12-14 | 2011-06-16 | Varian Semiconductor Equipment Associates, Inc. | Techniques for generating uniform ion beam |
| US8779383B2 (en) * | 2010-02-26 | 2014-07-15 | Advanced Technology Materials, Inc. | Enriched silicon precursor compositions and apparatus and processes for utilizing same |
| TWI585042B (en) | 2010-02-26 | 2017-06-01 | 恩特葛瑞斯股份有限公司 | Method and apparatus for enhanced lifetime and performance of ion source in an ion implantation system |
| JP5714831B2 (en) | 2010-03-18 | 2015-05-07 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
| US9984855B2 (en) * | 2010-11-17 | 2018-05-29 | Axcelis Technologies, Inc. | Implementation of co-gases for germanium and boron ion implants |
-
2011
- 2011-02-25 TW TW103133042A patent/TWI585042B/en active
- 2011-02-25 TW TW103140114A patent/TWI582836B/en active
- 2011-02-25 TW TW106111301A patent/TWI689467B/en active
- 2011-02-25 TW TW102101998A patent/TWI466179B/en active
- 2011-02-25 TW TW100106476A patent/TWI386983B/en active
- 2011-02-26 WO PCT/US2011/026388 patent/WO2011106750A2/en not_active Ceased
- 2011-02-26 KR KR1020177034081A patent/KR101856921B1/en not_active Ceased
- 2011-02-26 CN CN201710707294.5A patent/CN107393795A/en active Pending
- 2011-02-26 MY MYPI2012003733A patent/MY166024A/en unknown
- 2011-02-26 CN CN201710706402.7A patent/CN107578972A/en active Pending
- 2011-02-26 KR KR1020227003688A patent/KR20220021028A/en not_active Ceased
- 2011-02-26 CN CN2011800111899A patent/CN102782811A/en active Pending
- 2011-02-26 KR KR1020177034088A patent/KR20170132909A/en not_active Ceased
- 2011-02-26 SG SG10201506698VA patent/SG10201506698VA/en unknown
- 2011-02-26 KR KR1020177013585A patent/KR20170060163A/en not_active Withdrawn
- 2011-02-26 SG SG2012059093A patent/SG183248A1/en unknown
- 2011-02-26 SG SG10201609427WA patent/SG10201609427WA/en unknown
- 2011-02-26 KR KR1020187036969A patent/KR102360243B1/en active Active
- 2011-02-26 KR KR1020187009974A patent/KR101982457B1/en not_active Expired - Fee Related
- 2011-02-26 SG SG10201910998SA patent/SG10201910998SA/en unknown
- 2011-02-26 JP JP2012555205A patent/JP5906196B2/en active Active
- 2011-02-26 EP EP11748213.3A patent/EP2539923A4/en not_active Withdrawn
- 2011-02-26 KR KR1020127025087A patent/KR101849416B1/en not_active Ceased
- 2011-02-26 EP EP17191409.6A patent/EP3333881A3/en active Pending
-
2012
- 2012-02-21 US US13/401,527 patent/US8237134B2/en not_active Expired - Fee Related
- 2012-08-06 US US13/567,571 patent/US8399865B2/en active Active
-
2013
- 2013-03-15 US US13/840,961 patent/US8785889B2/en active Active
-
2014
- 2014-07-22 US US14/338,132 patent/US9012874B2/en active Active
-
2015
- 2015-02-17 JP JP2015028183A patent/JP2015122534A/en active Pending
- 2015-04-21 US US14/691,904 patent/US9754786B2/en active Active
-
2016
- 2016-03-18 JP JP2016055370A patent/JP6258384B2/en active Active
-
2017
- 2017-05-25 JP JP2017104015A patent/JP2017203216A/en active Pending
- 2017-07-31 US US15/664,554 patent/US20170330756A1/en not_active Abandoned
- 2017-12-05 JP JP2017233396A patent/JP2018073841A/en active Pending
-
2020
- 2020-10-09 JP JP2020171446A patent/JP2021044553A/en active Pending
Also Published As
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG10201910998SA (en) | Method and apparatus for enhanced lifetime and performance of ion source in an ion implantation system | |
| GB2485308B (en) | System and method for replacing an ion source in a mass spectrometer | |
| GB2491526B (en) | Method and apparatus for manufacturing an implant | |
| GB2574524B (en) | Method and system for locating an acoustic source | |
| SG10201605310RA (en) | Ion implantation system and method | |
| IL220944A0 (en) | Method and apparatus for interconnecting distributed power sources | |
| EP2666230A1 (en) | Apparatus and method for providing uninterruptible power | |
| GB2494562B (en) | Apparatus and methods for ion mobility spectrometry | |
| PL2727381T3 (en) | Apparatus and method for rendering audio objects | |
| IL227709A0 (en) | Systems apparatus and methods for implementing implants | |
| SG10201507319XA (en) | Method for extending lifetime of an ion source | |
| EP2665618A1 (en) | Method and apparatus for providing electrical energy | |
| EP2737696B8 (en) | Method and apparatus for quantization level clipping | |
| SG10201509808WA (en) | Ion implanter system including remote dopant source, and method comprising same | |
| GB201002645D0 (en) | Method and apparatus for ion beam polishing | |
| IL221419A0 (en) | Lens inserter apparatus and method | |
| ZA201207551B (en) | Apparatus and method for stabilizing an electrical power import | |
| EP2786396A4 (en) | Ion implant apparatus and a method of implanting ions | |
| GB2467444B (en) | Method and apparatus for guiding charged droplets and ions in an electrospray ion source | |
| GB2483304B (en) | An apparatus and method for controlling power | |
| GB201002099D0 (en) | Lithography apparatus and method | |
| ZA201403031B (en) | Apparatus and method for an anti-spin system | |
| IL221225A0 (en) | Lens holder apparatus and system and method | |
| GB201218380D0 (en) | Method and apparatus for analysis and ion source | |
| ZA201207626B (en) | Method and apparatus for charging an accumalator |