[go: up one dir, main page]

SG10201605902RA - Monitoring leveler concentrations in electroplating solutions - Google Patents

Monitoring leveler concentrations in electroplating solutions

Info

Publication number
SG10201605902RA
SG10201605902RA SG10201605902RA SG10201605902RA SG10201605902RA SG 10201605902R A SG10201605902R A SG 10201605902RA SG 10201605902R A SG10201605902R A SG 10201605902RA SG 10201605902R A SG10201605902R A SG 10201605902RA SG 10201605902R A SG10201605902R A SG 10201605902RA
Authority
SG
Singapore
Prior art keywords
electroplating solutions
leveler concentrations
monitoring
monitoring leveler
concentrations
Prior art date
Application number
SG10201605902RA
Inventor
Steven T Mayer
Original Assignee
Novellus Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Novellus Systems Inc filed Critical Novellus Systems Inc
Publication of SG10201605902RA publication Critical patent/SG10201605902RA/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • C25D21/14Controlled addition of electrolyte components
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403Cells and electrode assemblies
    • G01N27/413Concentration cells using liquid electrolytes measuring currents or voltages in voltaic cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Biochemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Organic Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
SG10201605902RA 2011-12-12 2012-12-11 Monitoring leveler concentrations in electroplating solutions SG10201605902RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161569741P 2011-12-12 2011-12-12

Publications (1)

Publication Number Publication Date
SG10201605902RA true SG10201605902RA (en) 2016-09-29

Family

ID=48613119

Family Applications (2)

Application Number Title Priority Date Filing Date
SG10201605902RA SG10201605902RA (en) 2011-12-12 2012-12-11 Monitoring leveler concentrations in electroplating solutions
SG11201403033YA SG11201403033YA (en) 2011-12-12 2012-12-11 Monitoring leveler concentrations in electroplating solutions

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG11201403033YA SG11201403033YA (en) 2011-12-12 2012-12-11 Monitoring leveler concentrations in electroplating solutions

Country Status (6)

Country Link
US (2) US9309605B2 (en)
JP (2) JP6170938B2 (en)
KR (1) KR102147003B1 (en)
MY (1) MY167318A (en)
SG (2) SG10201605902RA (en)
WO (1) WO2013090295A1 (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9076843B2 (en) 2001-05-22 2015-07-07 Novellus Systems, Inc. Method for producing ultra-thin tungsten layers with improved step coverage
US20100267230A1 (en) 2009-04-16 2010-10-21 Anand Chandrashekar Method for forming tungsten contacts and interconnects with small critical dimensions
US9159571B2 (en) 2009-04-16 2015-10-13 Lam Research Corporation Tungsten deposition process using germanium-containing reducing agent
US8709948B2 (en) * 2010-03-12 2014-04-29 Novellus Systems, Inc. Tungsten barrier and seed for copper filled TSV
WO2013090295A1 (en) 2011-12-12 2013-06-20 Novellus Systems, Inc. Monitoring leveler concentrations in electroplating solutions
US8853080B2 (en) 2012-09-09 2014-10-07 Novellus Systems, Inc. Method for depositing tungsten film with low roughness and low resistivity
KR102020572B1 (en) * 2012-10-23 2019-09-10 모세 레이크 인더스트리즈, 인코포레이티드 Improvements in plating bath metrology
US9689083B2 (en) * 2013-06-14 2017-06-27 Lam Research Corporation TSV bath evaluation using field versus feature contrast
PT2821780T (en) * 2013-07-02 2018-10-22 Ancosys Gmbh In-situ fingerprinting for electrochemical deposition and/or electrochemical etching
US20150008134A1 (en) * 2013-07-03 2015-01-08 Tel Nexx, Inc. Electrochemical deposition apparatus and methods for controlling the chemistry therein
US9589808B2 (en) 2013-12-19 2017-03-07 Lam Research Corporation Method for depositing extremely low resistivity tungsten
US9575032B2 (en) * 2014-08-07 2017-02-21 Hong Kong Applied Science and Technology Research Institute Company Limited Method of analyzing at least two inhibitors simultaneously in a plating bath
US9953984B2 (en) 2015-02-11 2018-04-24 Lam Research Corporation Tungsten for wordline applications
US10094038B2 (en) 2015-04-13 2018-10-09 Lam Research Corporation Monitoring electrolytes during electroplating
US11230784B2 (en) 2018-11-30 2022-01-25 Taiwan Semiconductor Manufacturing Co., Ltd. Electrochemical plating system and method of using
TWI711724B (en) * 2018-11-30 2020-12-01 台灣積體電路製造股份有限公司 Electrochemical plating system, method for performing electrochemical plating process, and method of forming semiconductor substrate
WO2021022292A1 (en) * 2019-07-26 2021-02-04 Lam Research Corporation Differential contrast plating for advanced packaging applications
KR102445229B1 (en) * 2019-09-30 2022-09-21 한국재료연구원 Cell for measuring the concentration of decomposition products of additives contained in the plating solution
JP7713456B2 (en) 2020-01-10 2025-07-25 ラム リサーチ コーポレーション TSV Processing Window and Filling Performance Enhancement with Long Pulse Power and Ramp Formation
WO2021202392A1 (en) * 2020-03-30 2021-10-07 Lam Research Corporation Leveling compound control
CN114460146B (en) * 2022-01-24 2023-09-26 常州大学 Method for detecting cuprous ions in dissolved copper solution of electrolytic copper foil

Family Cites Families (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA988879A (en) 1972-11-06 1976-05-11 George Shaw Electrolytic lead refining
US4324621A (en) 1979-12-26 1982-04-13 Cominco Ltd. Method and apparatus for controlling the quality of electrolytes
US5223118A (en) * 1991-03-08 1993-06-29 Shipley Company Inc. Method for analyzing organic additives in an electroplating bath
US5196096A (en) 1992-03-24 1993-03-23 International Business Machines Corporation Method for analyzing the addition agents in solutions for electroplating of PbSn alloys
US7449098B1 (en) 1999-10-05 2008-11-11 Novellus Systems, Inc. Method for planar electroplating
US7531079B1 (en) 1998-10-26 2009-05-12 Novellus Systems, Inc. Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation
JP2001152398A (en) 1999-08-05 2001-06-05 Fujitsu Ltd Electroplating method, plating solution evaluation method, plating apparatus, semiconductor device manufacturing method
JP2001073200A (en) * 1999-08-30 2001-03-21 Ebara Corp Plating liquid management method and management apparatus therefor
US6627066B1 (en) 1999-08-30 2003-09-30 Ebara Corporation Method of measuring the concentration of a leveler in a plating liquid
JP3897936B2 (en) * 1999-08-31 2007-03-28 株式会社荏原製作所 Leveler concentration measurement method in copper sulfate plating solution
US6280602B1 (en) 1999-10-20 2001-08-28 Advanced Technology Materials, Inc. Method and apparatus for determination of additives in metal plating baths
US6645364B2 (en) * 2000-10-20 2003-11-11 Shipley Company, L.L.C. Electroplating bath control
DE60113214T2 (en) 2000-11-02 2006-06-08 Shipley Co., L.L.C., Marlborough Plattierungsbadanalyse
US6458262B1 (en) 2001-03-09 2002-10-01 Novellus Systems, Inc. Electroplating chemistry on-line monitoring and control system
US6740221B2 (en) 2001-03-15 2004-05-25 Applied Materials Inc. Method of forming copper interconnects
US20040046121A1 (en) 2001-07-15 2004-03-11 Golden Josh H. Method and system for analyte determination in metal plating baths
US6936157B2 (en) 2001-08-09 2005-08-30 Advanced Technology Materials, Inc. Interference correction of additives concentration measurements in metal electroplating solutions
US6572753B2 (en) 2001-10-01 2003-06-03 Eci Technology, Inc. Method for analysis of three organic additives in an acid copper plating bath
US7144488B2 (en) * 2002-06-05 2006-12-05 Shipley Company, L.L.C. Electrode, electrochemical cell, and method for analysis of electroplating baths
EP1540046A4 (en) 2002-07-19 2007-04-04 Technic Method and apparatus for real time monitoring of industrial electrolytes
US20040217005A1 (en) 2002-07-24 2004-11-04 Aron Rosenfeld Method for electroplating bath chemistry control
US7799200B1 (en) 2002-07-29 2010-09-21 Novellus Systems, Inc. Selective electrochemical accelerator removal
US7449099B1 (en) 2004-04-13 2008-11-11 Novellus Systems, Inc. Selectively accelerated plating of metal features
US7405163B1 (en) 2003-12-17 2008-07-29 Novellus Systems, Inc. Selectively accelerated plating of metal features
KR20030011018A (en) 2002-10-04 2003-02-06 가다기연 주식회사 Home Rice-cleaning Machine
US6749739B2 (en) 2002-10-07 2004-06-15 Eci Technology, Inc. Detection of suppressor breakdown contaminants in a plating bath
JP2004217997A (en) 2003-01-14 2004-08-05 Fujitsu Ltd Apparatus for evaluating intrinsic properties of additives for electrolytic plating growth, electrolytic plating method, and method for manufacturing semiconductor device
US7820535B2 (en) 2003-03-25 2010-10-26 Toppan Printing Co., Ltd. Method for analyzing copper electroplating solution, apparatus for the analysis, and method for fabricating semiconductor product
CN100585026C (en) 2003-03-25 2010-01-27 凸版印刷株式会社 Method and apparatus for analyzing electrolytic copper plating bath
JP2004323971A (en) * 2003-04-25 2004-11-18 Rohm & Haas Electronic Materials Llc Improved bath analysis
JP2005148011A (en) * 2003-11-19 2005-06-09 Ebara Corp Method and apparatus for measuring concentration of organic additive in copper sulfate plating liquid
JP2005171347A (en) 2003-12-12 2005-06-30 Shinko Electric Ind Co Ltd Management method of electrolytic copper plating solution
US7435320B2 (en) 2004-04-30 2008-10-14 Advanced Technology Materials, Inc. Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
US7291253B2 (en) 2004-05-04 2007-11-06 Eci Technology, Inc. Detection of an unstable additive breakdown product in a plating bath
US7186326B2 (en) 2004-05-27 2007-03-06 Eci Technology, Inc. Efficient analysis of organic additives in an acid copper plating bath
US7232513B1 (en) 2004-06-29 2007-06-19 Novellus Systems, Inc. Electroplating bath containing wetting agent for defect reduction
KR20060074593A (en) * 2004-12-27 2006-07-03 동부일렉트로닉스 주식회사 Concentration titration monitoring device for semiconductor device and its method
WO2006110437A1 (en) 2005-04-08 2006-10-19 The Trustees Of Columbia University In The City Of New York Systems and methods for monitoring plating and etching baths
CN2828067Y (en) 2005-06-09 2006-10-18 福州大学 Real-time monitoring device for concentration of additive in electrolyte
US7662981B2 (en) 2005-07-16 2010-02-16 Rohm And Haas Electronic Materials Llc Leveler compounds
CN100529750C (en) 2006-01-17 2009-08-19 欧恩吉亚洲股份有限公司 Method for analyzing concentration of copper electroplating accelerator and deposition electrolyte thereof
US8500985B2 (en) 2006-07-21 2013-08-06 Novellus Systems, Inc. Photoresist-free metal deposition
US7879222B2 (en) * 2007-08-27 2011-02-01 Eci Technology, Inc. Detection of additive breakdown products in acid copper plating baths
US7776741B2 (en) 2008-08-18 2010-08-17 Novellus Systems, Inc. Process for through silicon via filing
KR101274363B1 (en) 2009-05-27 2013-06-13 노벨러스 시스템즈, 인코포레이티드 Pulse sequence for plating on thin seed layers
US8372258B2 (en) 2009-08-03 2013-02-12 Novellus Systems, Inc. Monitoring of electroplating additives
JP5442400B2 (en) 2009-11-13 2014-03-12 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor integrated circuit device
US8535504B2 (en) 2010-05-03 2013-09-17 Eci Technology, Inc. Analysis of an auxiliary leveler additive in an acid copper plating bath
CN102286760B (en) 2010-05-19 2016-10-05 诺发系统有限公司 Method of electrochemically filling high aspect ratio large recessed features with metal, aqueous electroplating bath solution, electroplating apparatus and system
JP2013077619A (en) 2011-09-29 2013-04-25 Renesas Electronics Corp Manufacturing method of semiconductor device
WO2013090295A1 (en) 2011-12-12 2013-06-20 Novellus Systems, Inc. Monitoring leveler concentrations in electroplating solutions
CN103014823B (en) 2013-01-05 2015-05-13 华进半导体封装先导技术研发中心有限公司 Method for quickly determining effect of additive for improving copper electrodeposition
US9689083B2 (en) 2013-06-14 2017-06-27 Lam Research Corporation TSV bath evaluation using field versus feature contrast

Also Published As

Publication number Publication date
JP2015501941A (en) 2015-01-19
SG11201403033YA (en) 2014-09-26
US20130161203A1 (en) 2013-06-27
KR20140113947A (en) 2014-09-25
JP2018009984A (en) 2018-01-18
MY167318A (en) 2018-08-16
KR102147003B1 (en) 2020-08-24
US20160186356A1 (en) 2016-06-30
JP6491700B2 (en) 2019-03-27
US9309605B2 (en) 2016-04-12
WO2013090295A1 (en) 2013-06-20
US9856574B2 (en) 2018-01-02
JP6170938B2 (en) 2017-07-26

Similar Documents

Publication Publication Date Title
SG10201605902RA (en) Monitoring leveler concentrations in electroplating solutions
TWI563708B (en) Electrolytic solution for electrochemical device
GB201115410D0 (en) Asset condition monitoring
EP2753236A4 (en) R-wave detection method
GB201101858D0 (en) Health monitoring
PT2589307E (en) Technical wetsuit
GB201112161D0 (en) Portal monitoring
GB201122027D0 (en) Estimating flow in production well
GB201402857D0 (en) Water retention monitoring
EP2698839A4 (en) Cell block
EP2709128A4 (en) Electrochemical cell
EP2637017A4 (en) Filling-capacity measuring method
EP2707886A4 (en) Electrolyte
IL231563A (en) Manganese-comprising nanostructures
GB201108342D0 (en) Electrochemical sensors
EP2739318A4 (en) In line sterlizer
GB2496402B (en) Monitoring apparatus
GB201118641D0 (en) Electrochemical cell
ZA201404056B (en) Comparator for use in improving water quality
GB2497972B (en) Electrochemical sensors
EP2643689A4 (en) Guar process monitoring methods
GB201111272D0 (en) Defect detection in semiconductors
BR112014010292A2 (en) electrochemical pickling method
GB201322533D0 (en) Assessment method
GB201020662D0 (en) Monitoring process in a coomputer