SG10201605902RA - Monitoring leveler concentrations in electroplating solutions - Google Patents
Monitoring leveler concentrations in electroplating solutionsInfo
- Publication number
- SG10201605902RA SG10201605902RA SG10201605902RA SG10201605902RA SG10201605902RA SG 10201605902R A SG10201605902R A SG 10201605902RA SG 10201605902R A SG10201605902R A SG 10201605902RA SG 10201605902R A SG10201605902R A SG 10201605902RA SG 10201605902R A SG10201605902R A SG 10201605902RA
- Authority
- SG
- Singapore
- Prior art keywords
- electroplating solutions
- leveler concentrations
- monitoring
- monitoring leveler
- concentrations
- Prior art date
Links
- 238000009713 electroplating Methods 0.000 title 1
- 238000012544 monitoring process Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/413—Concentration cells using liquid electrolytes measuring currents or voltages in voltaic cells
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Molecular Biology (AREA)
- Biochemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Automation & Control Theory (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Organic Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161569741P | 2011-12-12 | 2011-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201605902RA true SG10201605902RA (en) | 2016-09-29 |
Family
ID=48613119
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201605902RA SG10201605902RA (en) | 2011-12-12 | 2012-12-11 | Monitoring leveler concentrations in electroplating solutions |
| SG11201403033YA SG11201403033YA (en) | 2011-12-12 | 2012-12-11 | Monitoring leveler concentrations in electroplating solutions |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201403033YA SG11201403033YA (en) | 2011-12-12 | 2012-12-11 | Monitoring leveler concentrations in electroplating solutions |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9309605B2 (en) |
| JP (2) | JP6170938B2 (en) |
| KR (1) | KR102147003B1 (en) |
| MY (1) | MY167318A (en) |
| SG (2) | SG10201605902RA (en) |
| WO (1) | WO2013090295A1 (en) |
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| US9076843B2 (en) | 2001-05-22 | 2015-07-07 | Novellus Systems, Inc. | Method for producing ultra-thin tungsten layers with improved step coverage |
| US20100267230A1 (en) | 2009-04-16 | 2010-10-21 | Anand Chandrashekar | Method for forming tungsten contacts and interconnects with small critical dimensions |
| US9159571B2 (en) | 2009-04-16 | 2015-10-13 | Lam Research Corporation | Tungsten deposition process using germanium-containing reducing agent |
| US8709948B2 (en) * | 2010-03-12 | 2014-04-29 | Novellus Systems, Inc. | Tungsten barrier and seed for copper filled TSV |
| WO2013090295A1 (en) | 2011-12-12 | 2013-06-20 | Novellus Systems, Inc. | Monitoring leveler concentrations in electroplating solutions |
| US8853080B2 (en) | 2012-09-09 | 2014-10-07 | Novellus Systems, Inc. | Method for depositing tungsten film with low roughness and low resistivity |
| KR102020572B1 (en) * | 2012-10-23 | 2019-09-10 | 모세 레이크 인더스트리즈, 인코포레이티드 | Improvements in plating bath metrology |
| US9689083B2 (en) * | 2013-06-14 | 2017-06-27 | Lam Research Corporation | TSV bath evaluation using field versus feature contrast |
| PT2821780T (en) * | 2013-07-02 | 2018-10-22 | Ancosys Gmbh | In-situ fingerprinting for electrochemical deposition and/or electrochemical etching |
| US20150008134A1 (en) * | 2013-07-03 | 2015-01-08 | Tel Nexx, Inc. | Electrochemical deposition apparatus and methods for controlling the chemistry therein |
| US9589808B2 (en) | 2013-12-19 | 2017-03-07 | Lam Research Corporation | Method for depositing extremely low resistivity tungsten |
| US9575032B2 (en) * | 2014-08-07 | 2017-02-21 | Hong Kong Applied Science and Technology Research Institute Company Limited | Method of analyzing at least two inhibitors simultaneously in a plating bath |
| US9953984B2 (en) | 2015-02-11 | 2018-04-24 | Lam Research Corporation | Tungsten for wordline applications |
| US10094038B2 (en) | 2015-04-13 | 2018-10-09 | Lam Research Corporation | Monitoring electrolytes during electroplating |
| US11230784B2 (en) | 2018-11-30 | 2022-01-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Electrochemical plating system and method of using |
| TWI711724B (en) * | 2018-11-30 | 2020-12-01 | 台灣積體電路製造股份有限公司 | Electrochemical plating system, method for performing electrochemical plating process, and method of forming semiconductor substrate |
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| KR102445229B1 (en) * | 2019-09-30 | 2022-09-21 | 한국재료연구원 | Cell for measuring the concentration of decomposition products of additives contained in the plating solution |
| JP7713456B2 (en) | 2020-01-10 | 2025-07-25 | ラム リサーチ コーポレーション | TSV Processing Window and Filling Performance Enhancement with Long Pulse Power and Ramp Formation |
| WO2021202392A1 (en) * | 2020-03-30 | 2021-10-07 | Lam Research Corporation | Leveling compound control |
| CN114460146B (en) * | 2022-01-24 | 2023-09-26 | 常州大学 | Method for detecting cuprous ions in dissolved copper solution of electrolytic copper foil |
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-
2012
- 2012-12-11 WO PCT/US2012/069016 patent/WO2013090295A1/en not_active Ceased
- 2012-12-11 MY MYPI2014001731A patent/MY167318A/en unknown
- 2012-12-11 KR KR1020147019507A patent/KR102147003B1/en active Active
- 2012-12-11 SG SG10201605902RA patent/SG10201605902RA/en unknown
- 2012-12-11 JP JP2014547352A patent/JP6170938B2/en active Active
- 2012-12-11 SG SG11201403033YA patent/SG11201403033YA/en unknown
- 2012-12-11 US US13/711,254 patent/US9309605B2/en active Active
-
2016
- 2016-03-04 US US15/061,833 patent/US9856574B2/en active Active
-
2017
- 2017-07-03 JP JP2017130053A patent/JP6491700B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015501941A (en) | 2015-01-19 |
| SG11201403033YA (en) | 2014-09-26 |
| US20130161203A1 (en) | 2013-06-27 |
| KR20140113947A (en) | 2014-09-25 |
| JP2018009984A (en) | 2018-01-18 |
| MY167318A (en) | 2018-08-16 |
| KR102147003B1 (en) | 2020-08-24 |
| US20160186356A1 (en) | 2016-06-30 |
| JP6491700B2 (en) | 2019-03-27 |
| US9309605B2 (en) | 2016-04-12 |
| WO2013090295A1 (en) | 2013-06-20 |
| US9856574B2 (en) | 2018-01-02 |
| JP6170938B2 (en) | 2017-07-26 |
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