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SG10201605697UA - Aqueous alkaline compositions and method for treating the surface of silicon substrates - Google Patents

Aqueous alkaline compositions and method for treating the surface of silicon substrates

Info

Publication number
SG10201605697UA
SG10201605697UA SG10201605697UA SG10201605697UA SG10201605697UA SG 10201605697U A SG10201605697U A SG 10201605697UA SG 10201605697U A SG10201605697U A SG 10201605697UA SG 10201605697U A SG10201605697U A SG 10201605697UA SG 10201605697U A SG10201605697U A SG 10201605697UA
Authority
SG
Singapore
Prior art keywords
treating
aqueous alkaline
silicon substrates
alkaline compositions
compositions
Prior art date
Application number
SG10201605697UA
Inventor
Berthold Ferstl
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of SG10201605697UA publication Critical patent/SG10201605697UA/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00Etching, surface-brightening or pickling compositions
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1454Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463Aqueous liquid suspensions
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/04Aqueous dispersions
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00Etching, surface-brightening or pickling compositions
    • C09K13/04Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22Organic compounds
    • C11D7/34Organic compounds containing sulfur
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/121The active layers comprising only Group IV materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/70Surface textures, e.g. pyramid structures
    • H10F77/703Surface textures, e.g. pyramid structures of the semiconductor bodies, e.g. textured active layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Photovoltaic Devices (AREA)
  • Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
  • Detergent Compositions (AREA)
SG10201605697UA 2011-08-09 2012-07-12 Aqueous alkaline compositions and method for treating the surface of silicon substrates SG10201605697UA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161521386P 2011-08-09 2011-08-09

Publications (1)

Publication Number Publication Date
SG10201605697UA true SG10201605697UA (en) 2016-09-29

Family

ID=47667939

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201605697UA SG10201605697UA (en) 2011-08-09 2012-07-12 Aqueous alkaline compositions and method for treating the surface of silicon substrates

Country Status (10)

Country Link
US (1) US20140134778A1 (en)
JP (1) JP2014529641A (en)
KR (1) KR101922855B1 (en)
CN (1) CN103717687B (en)
IN (1) IN2014CN00877A (en)
MY (1) MY167595A (en)
PH (1) PH12014500150A1 (en)
SG (1) SG10201605697UA (en)
TW (1) TWI564386B (en)
WO (1) WO2013021296A1 (en)

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JP6462572B2 (en) * 2013-09-05 2019-01-30 小林 光 Hydrogen production apparatus, hydrogen production method, silicon fine particles for hydrogen production, and method for producing silicon fine particles for hydrogen production
CN104427781B (en) * 2013-09-11 2019-05-17 花王株式会社 Detergent composition for resin mask layer and manufacturing method of circuit board
KR102668708B1 (en) * 2016-09-05 2024-05-23 동우 화인켐 주식회사 Etching composition for etching a polysilicon and method for manufacturing a semiconductor device
KR102531037B1 (en) * 2016-11-03 2023-05-09 토탈에너지스 마케팅 써비씨즈 Surface treatment of solar cells
US10934485B2 (en) 2017-08-25 2021-03-02 Versum Materials Us, Llc Etching solution for selectively removing silicon over silicon-germanium alloy from a silicon-germanium/ silicon stack during manufacture of a semiconductor device
CN108550639B (en) * 2018-03-21 2020-08-21 台州市棱智塑业有限公司 Silicon heterojunction solar cell interface treating agent and treating method
WO2020055529A1 (en) * 2018-09-12 2020-03-19 Fujifilm Electronic Materials U.S.A., Inc. Etching compositions
KR102624328B1 (en) * 2018-10-31 2024-01-15 상라오 신위안 웨동 테크놀러지 디벨롭먼트 컴퍼니, 리미티드 Solar cell module
WO2020102228A1 (en) 2018-11-15 2020-05-22 Entegris, Inc. Silicon nitride etching composition and method
CN109609290B (en) * 2018-12-13 2021-04-09 蓝思科技(长沙)有限公司 Cleaning agent and cleaning method for polished glass
KR20210125997A (en) * 2019-02-13 2021-10-19 가부시끼가이샤 도꾸야마 Treatment liquid for semiconductor wafers containing hypochlorite ions and a pH buffer
WO2020195343A1 (en) * 2019-03-26 2020-10-01 富士フイルムエレクトロニクスマテリアルズ株式会社 Cleaning liquid
CN110473936A (en) * 2019-07-26 2019-11-19 镇江仁德新能源科技有限公司 A kind of black silicon etching method of single side wet process
IL291119B2 (en) * 2019-09-10 2025-05-01 Fujifilm Electronic Mat Usa Inc Etching composition
CN112745990B (en) * 2019-10-30 2022-06-03 洛阳阿特斯光伏科技有限公司 Non-phosphorus two-component cleaning agent and preparation method and application thereof
KR102752252B1 (en) 2020-03-24 2025-01-10 동우 화인켐 주식회사 A crystalline silicon ethant compositon, and a pattern formation method
CN112680229A (en) * 2021-01-29 2021-04-20 深圳市百通达科技有限公司 Silicon-based material etching solution for wet electron chemistry and preparation method thereof
JP7760429B2 (en) * 2022-03-29 2025-10-27 株式会社フジミインコーポレーテッド Surface treatment composition, surface treatment method, and method for manufacturing semiconductor substrate
CN116536653A (en) * 2023-05-09 2023-08-04 苏州尊恒半导体科技有限公司 Wafer chemical plating pretreatment method with high uniformity

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US5989353A (en) * 1996-10-11 1999-11-23 Mallinckrodt Baker, Inc. Cleaning wafer substrates of metal contamination while maintaining wafer smoothness
JP2000208466A (en) * 1999-01-12 2000-07-28 Dainippon Screen Mfg Co Ltd Method and apparatus for treating substrate
JP4206233B2 (en) * 2002-07-22 2009-01-07 旭硝子株式会社 Abrasive and polishing method
US20040077295A1 (en) * 2002-08-05 2004-04-22 Hellring Stuart D. Process for reducing dishing and erosion during chemical mechanical planarization
JP2005268665A (en) * 2004-03-19 2005-09-29 Fujimi Inc Polishing composition
DE602005000732T2 (en) * 2004-06-25 2007-12-06 Jsr Corp. Cleaning composition for semiconductor component and method for producing a semiconductor device
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TW200714696A (en) * 2005-08-05 2007-04-16 Advanced Tech Materials High throughput chemical mechanical polishing composition for metal film planarization
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WO2011154875A1 (en) * 2010-06-09 2011-12-15 Basf Se Aqueous alkaline etching and cleaning composition and method for treating the surface of silicon substrates
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Also Published As

Publication number Publication date
US20140134778A1 (en) 2014-05-15
WO2013021296A1 (en) 2013-02-14
KR101922855B1 (en) 2019-02-27
TWI564386B (en) 2017-01-01
CN103717687B (en) 2016-05-18
MY167595A (en) 2018-09-20
IN2014CN00877A (en) 2015-04-03
KR20140057259A (en) 2014-05-12
TW201313894A (en) 2013-04-01
JP2014529641A (en) 2014-11-13
PH12014500150A1 (en) 2014-02-24
CN103717687A (en) 2014-04-09

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