SG10201605697UA - Aqueous alkaline compositions and method for treating the surface of silicon substrates - Google Patents
Aqueous alkaline compositions and method for treating the surface of silicon substratesInfo
- Publication number
- SG10201605697UA SG10201605697UA SG10201605697UA SG10201605697UA SG10201605697UA SG 10201605697U A SG10201605697U A SG 10201605697UA SG 10201605697U A SG10201605697U A SG 10201605697UA SG 10201605697U A SG10201605697U A SG 10201605697UA SG 10201605697U A SG10201605697U A SG 10201605697UA
- Authority
- SG
- Singapore
- Prior art keywords
- treating
- aqueous alkaline
- silicon substrates
- alkaline compositions
- compositions
- Prior art date
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/04—Aqueous dispersions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/34—Organic compounds containing sulfur
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/70—Surface textures, e.g. pyramid structures
- H10F77/703—Surface textures, e.g. pyramid structures of the semiconductor bodies, e.g. textured active layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Dispersion Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Inorganic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Photovoltaic Devices (AREA)
- Materials Applied To Surfaces To Minimize Adherence Of Mist Or Water (AREA)
- Detergent Compositions (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161521386P | 2011-08-09 | 2011-08-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201605697UA true SG10201605697UA (en) | 2016-09-29 |
Family
ID=47667939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201605697UA SG10201605697UA (en) | 2011-08-09 | 2012-07-12 | Aqueous alkaline compositions and method for treating the surface of silicon substrates |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US20140134778A1 (en) |
| JP (1) | JP2014529641A (en) |
| KR (1) | KR101922855B1 (en) |
| CN (1) | CN103717687B (en) |
| IN (1) | IN2014CN00877A (en) |
| MY (1) | MY167595A (en) |
| PH (1) | PH12014500150A1 (en) |
| SG (1) | SG10201605697UA (en) |
| TW (1) | TWI564386B (en) |
| WO (1) | WO2013021296A1 (en) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6462572B2 (en) * | 2013-09-05 | 2019-01-30 | 小林 光 | Hydrogen production apparatus, hydrogen production method, silicon fine particles for hydrogen production, and method for producing silicon fine particles for hydrogen production |
| CN104427781B (en) * | 2013-09-11 | 2019-05-17 | 花王株式会社 | Detergent composition for resin mask layer and manufacturing method of circuit board |
| KR102668708B1 (en) * | 2016-09-05 | 2024-05-23 | 동우 화인켐 주식회사 | Etching composition for etching a polysilicon and method for manufacturing a semiconductor device |
| KR102531037B1 (en) * | 2016-11-03 | 2023-05-09 | 토탈에너지스 마케팅 써비씨즈 | Surface treatment of solar cells |
| US10934485B2 (en) | 2017-08-25 | 2021-03-02 | Versum Materials Us, Llc | Etching solution for selectively removing silicon over silicon-germanium alloy from a silicon-germanium/ silicon stack during manufacture of a semiconductor device |
| CN108550639B (en) * | 2018-03-21 | 2020-08-21 | 台州市棱智塑业有限公司 | Silicon heterojunction solar cell interface treating agent and treating method |
| WO2020055529A1 (en) * | 2018-09-12 | 2020-03-19 | Fujifilm Electronic Materials U.S.A., Inc. | Etching compositions |
| KR102624328B1 (en) * | 2018-10-31 | 2024-01-15 | 상라오 신위안 웨동 테크놀러지 디벨롭먼트 컴퍼니, 리미티드 | Solar cell module |
| WO2020102228A1 (en) | 2018-11-15 | 2020-05-22 | Entegris, Inc. | Silicon nitride etching composition and method |
| CN109609290B (en) * | 2018-12-13 | 2021-04-09 | 蓝思科技(长沙)有限公司 | Cleaning agent and cleaning method for polished glass |
| KR20210125997A (en) * | 2019-02-13 | 2021-10-19 | 가부시끼가이샤 도꾸야마 | Treatment liquid for semiconductor wafers containing hypochlorite ions and a pH buffer |
| WO2020195343A1 (en) * | 2019-03-26 | 2020-10-01 | 富士フイルムエレクトロニクスマテリアルズ株式会社 | Cleaning liquid |
| CN110473936A (en) * | 2019-07-26 | 2019-11-19 | 镇江仁德新能源科技有限公司 | A kind of black silicon etching method of single side wet process |
| IL291119B2 (en) * | 2019-09-10 | 2025-05-01 | Fujifilm Electronic Mat Usa Inc | Etching composition |
| CN112745990B (en) * | 2019-10-30 | 2022-06-03 | 洛阳阿特斯光伏科技有限公司 | Non-phosphorus two-component cleaning agent and preparation method and application thereof |
| KR102752252B1 (en) | 2020-03-24 | 2025-01-10 | 동우 화인켐 주식회사 | A crystalline silicon ethant compositon, and a pattern formation method |
| CN112680229A (en) * | 2021-01-29 | 2021-04-20 | 深圳市百通达科技有限公司 | Silicon-based material etching solution for wet electron chemistry and preparation method thereof |
| JP7760429B2 (en) * | 2022-03-29 | 2025-10-27 | 株式会社フジミインコーポレーテッド | Surface treatment composition, surface treatment method, and method for manufacturing semiconductor substrate |
| CN116536653A (en) * | 2023-05-09 | 2023-08-04 | 苏州尊恒半导体科技有限公司 | Wafer chemical plating pretreatment method with high uniformity |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5466389A (en) * | 1994-04-20 | 1995-11-14 | J. T. Baker Inc. | PH adjusted nonionic surfactant-containing alkaline cleaner composition for cleaning microelectronics substrates |
| US5989353A (en) * | 1996-10-11 | 1999-11-23 | Mallinckrodt Baker, Inc. | Cleaning wafer substrates of metal contamination while maintaining wafer smoothness |
| JP2000208466A (en) * | 1999-01-12 | 2000-07-28 | Dainippon Screen Mfg Co Ltd | Method and apparatus for treating substrate |
| JP4206233B2 (en) * | 2002-07-22 | 2009-01-07 | 旭硝子株式会社 | Abrasive and polishing method |
| US20040077295A1 (en) * | 2002-08-05 | 2004-04-22 | Hellring Stuart D. | Process for reducing dishing and erosion during chemical mechanical planarization |
| JP2005268665A (en) * | 2004-03-19 | 2005-09-29 | Fujimi Inc | Polishing composition |
| DE602005000732T2 (en) * | 2004-06-25 | 2007-12-06 | Jsr Corp. | Cleaning composition for semiconductor component and method for producing a semiconductor device |
| CN101248516A (en) * | 2005-04-08 | 2008-08-20 | 塞克姆公司 | Selective wet etching of metal nitrides |
| TW200714696A (en) * | 2005-08-05 | 2007-04-16 | Advanced Tech Materials | High throughput chemical mechanical polishing composition for metal film planarization |
| KR100786949B1 (en) * | 2005-12-08 | 2007-12-17 | 주식회사 엘지화학 | Adjuvant capable of controlling a polishing selectivity and chemical mechanical polishing slurry comprising the same |
| JP2007180451A (en) * | 2005-12-28 | 2007-07-12 | Fujifilm Corp | Chemical mechanical planarization method |
| US8685909B2 (en) * | 2006-09-21 | 2014-04-01 | Advanced Technology Materials, Inc. | Antioxidants for post-CMP cleaning formulations |
| JP2008124222A (en) * | 2006-11-10 | 2008-05-29 | Fujifilm Corp | Polishing liquid |
| JP2010512657A (en) * | 2006-12-22 | 2010-04-22 | テクノ セミケム シーオー., エルティーディー. | Copper chemical mechanical polishing composition containing zeolite |
| JP2008181955A (en) * | 2007-01-23 | 2008-08-07 | Fujifilm Corp | Polishing liquid for metal and polishing method using the same |
| JP2008277723A (en) * | 2007-03-30 | 2008-11-13 | Fujifilm Corp | Polishing liquid for metal and polishing method |
| US20100136794A1 (en) * | 2007-05-14 | 2010-06-03 | Basf Se | Method for removing etching residues from semiconductor components |
| TWI598468B (en) * | 2007-05-17 | 2017-09-11 | 恩特葛瑞斯股份有限公司 | Cleaning composition, kit and method for removing residue after chemical mechanical polishing |
| DE112008002315B4 (en) * | 2007-08-31 | 2012-05-16 | Jh Biotech, Inc. | Production of fatty acid metal salts in solid form |
| JP2011503899A (en) * | 2007-11-16 | 2011-01-27 | イー.ケー.シー.テクノロジー.インコーポレーテッド | Composition for removing metal hard mask etching residue from a semiconductor substrate |
| KR101094662B1 (en) * | 2008-07-24 | 2011-12-20 | 솔브레인 주식회사 | Chemical Mechanical Abrasive Composition Containing Polysilicon Abrasive Stopping Agent |
| JP5553985B2 (en) * | 2008-12-11 | 2014-07-23 | 三洋化成工業株式会社 | Electronic material cleaner |
| US8361237B2 (en) * | 2008-12-17 | 2013-01-29 | Air Products And Chemicals, Inc. | Wet clean compositions for CoWP and porous dielectrics |
| KR20130016200A (en) * | 2010-01-29 | 2013-02-14 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | Cleaning agent for semiconductor provided with metal wiring |
| WO2011154875A1 (en) * | 2010-06-09 | 2011-12-15 | Basf Se | Aqueous alkaline etching and cleaning composition and method for treating the surface of silicon substrates |
| EP2460860A1 (en) * | 2010-12-02 | 2012-06-06 | Basf Se | Use of mixtures for removing polyurethanes from metal surfaces |
-
2012
- 2012-07-12 WO PCT/IB2012/053576 patent/WO2013021296A1/en not_active Ceased
- 2012-07-12 MY MYPI2013004626A patent/MY167595A/en unknown
- 2012-07-12 IN IN877CHN2014 patent/IN2014CN00877A/en unknown
- 2012-07-12 CN CN201280038487.1A patent/CN103717687B/en not_active Expired - Fee Related
- 2012-07-12 PH PH1/2014/500150A patent/PH12014500150A1/en unknown
- 2012-07-12 SG SG10201605697UA patent/SG10201605697UA/en unknown
- 2012-07-12 JP JP2014524461A patent/JP2014529641A/en active Pending
- 2012-07-12 KR KR1020147003265A patent/KR101922855B1/en not_active Expired - Fee Related
- 2012-07-12 US US14/131,304 patent/US20140134778A1/en not_active Abandoned
- 2012-08-09 TW TW101128828A patent/TWI564386B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US20140134778A1 (en) | 2014-05-15 |
| WO2013021296A1 (en) | 2013-02-14 |
| KR101922855B1 (en) | 2019-02-27 |
| TWI564386B (en) | 2017-01-01 |
| CN103717687B (en) | 2016-05-18 |
| MY167595A (en) | 2018-09-20 |
| IN2014CN00877A (en) | 2015-04-03 |
| KR20140057259A (en) | 2014-05-12 |
| TW201313894A (en) | 2013-04-01 |
| JP2014529641A (en) | 2014-11-13 |
| PH12014500150A1 (en) | 2014-02-24 |
| CN103717687A (en) | 2014-04-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG10201605697UA (en) | Aqueous alkaline compositions and method for treating the surface of silicon substrates | |
| SG11201406961PA (en) | Cleaning agent for semiconductor substrates and method for processing semiconductor substrate surface | |
| SG11201400404PA (en) | Apparatus for treating surfaces of wafer-shaped articles | |
| PL2721118T3 (en) | Method of inhibiting or controlling release of well treatment agent | |
| SG2014012306A (en) | Etching liquid composition and etching method | |
| SG11201500924PA (en) | Polishing composition and method for producing substrate | |
| GB0910626D0 (en) | Method of surface treating microfluidic devices | |
| EP2714820A4 (en) | Surface coating system and method of using surface coating system | |
| PL2526141T3 (en) | Method for surface treatment | |
| SG11201400775PA (en) | Composition and method for polishing aluminum semiconductor substrates | |
| SG11201405381WA (en) | Abrasive composition and method for producing semiconductor substrate | |
| SG11201404587TA (en) | Polishing composition and method for producing semiconductor substrate | |
| TWI559984B (en) | Device and method for treating surfaces of wafer-shaped articles | |
| EP2426705A4 (en) | Method for cleaning of semiconductor substrate and acidic solution | |
| ZA201404327B (en) | Composition comprising block cocondensates of propylfunctional alkaline siliconates and silicates, and method for the production thereof | |
| PL2558541T3 (en) | Surface treatment of cementitious substrates | |
| ZA201308671B (en) | Chemical conversion treatment agent for surface treatment of metal substrate and method for surface treatment of metal substrate using the same | |
| SG11201501256YA (en) | Cleaning method and cleaning system for semiconductor substrates | |
| SG10201604412RA (en) | Device for treating surfaces of wafer-shaped articles | |
| EP2670243A4 (en) | Compositions and methods for treatment of glaucoma | |
| SG2014014674A (en) | Method for coating and bonding substrates | |
| ZA201408259B (en) | Method for the surface treatment of inorganic particles | |
| SG2014009229A (en) | Method for polishing silicon wafer and polishing agent | |
| EP2734188A4 (en) | Compositions and methods for the treatment of ocular surface allergies | |
| GB201108797D0 (en) | Surface treatment method |