SG10201504081PA - Method and apparatus for resin-sealing electronic components - Google Patents
Method and apparatus for resin-sealing electronic componentsInfo
- Publication number
- SG10201504081PA SG10201504081PA SG10201504081PA SG10201504081PA SG10201504081PA SG 10201504081P A SG10201504081P A SG 10201504081PA SG 10201504081P A SG10201504081P A SG 10201504081PA SG 10201504081P A SG10201504081P A SG 10201504081PA SG 10201504081P A SG10201504081P A SG 10201504081PA
- Authority
- SG
- Singapore
- Prior art keywords
- resin
- electronic components
- sealing electronic
- sealing
- components
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 238000007789 sealing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/34—Moulds having venting means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014111374A JP6320172B2 (en) | 2014-05-29 | 2014-05-29 | Resin sealing method and resin sealing device for electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201504081PA true SG10201504081PA (en) | 2015-12-30 |
Family
ID=54842557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201504081PA SG10201504081PA (en) | 2014-05-29 | 2015-05-25 | Method and apparatus for resin-sealing electronic components |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP6320172B2 (en) |
| KR (1) | KR101667879B1 (en) |
| CN (1) | CN105280506B (en) |
| MY (1) | MY172522A (en) |
| SG (1) | SG10201504081PA (en) |
| TW (1) | TWI602680B (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6654861B2 (en) * | 2015-11-09 | 2020-02-26 | Ｔｏｗａ株式会社 | Resin sealing device and resin sealing method |
| EP3188260B1 (en) * | 2015-12-31 | 2020-02-12 | Dow Global Technologies Llc | Nanostructure material structures and methods |
| JP6654971B2 (en) * | 2016-06-17 | 2020-02-26 | 本田技研工業株式会社 | Molding method and molding system for resin molded member |
| JP6436260B1 (en) * | 2018-05-31 | 2018-12-12 | 株式会社玉谷製作所 | Pin, sleeve or nesting |
| JP6981935B2 (en) * | 2018-08-23 | 2021-12-17 | アピックヤマダ株式会社 | Mold mold and resin molding device equipped with it |
| JP7149411B2 (en) * | 2018-08-30 | 2022-10-06 | ハスキー インジェクション モールディング システムズ リミテッド | Molding apparatus and method |
| JP6678973B1 (en) * | 2019-04-09 | 2020-04-15 | アサヒ・エンジニアリング株式会社 | Resin sealing device and resin sealing method |
| CN111531802B (en) * | 2020-04-27 | 2025-07-22 | 芜湖鼎联电子科技有限公司 | Remelting-free high-temperature high-pressure injection mold for packaging power semiconductor device |
| CN111775392B (en) * | 2020-08-03 | 2025-02-18 | 昆山大全凯帆精密模具有限公司 | A BMC&DMC transfer pressing die and processing method |
| JP7661285B2 (en) | 2022-07-15 | 2025-04-14 | Ｔｏｗａ株式会社 | Mold, resin molding device, and method for manufacturing resin molded product |
| CN115923049A (en) * | 2022-11-04 | 2023-04-07 | 神通科技集团股份有限公司 | A kind of in-mold cutting mechanism and two-color mold for primary material head for two-color mold |
| WO2025116643A1 (en) * | 2023-12-01 | 2025-06-05 | 삼성전자 주식회사 | Repair kit device for arranging sealing member |
| CN119408074A (en) * | 2025-01-07 | 2025-02-11 | 北京七星华创微电子有限责任公司 | A kind of injection mold structure for FOPLP packaging processing |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61292926A (en) * | 1985-06-21 | 1986-12-23 | Hitachi Hokkai Semiconductor Ltd | Molding method and molding equipment |
| JPH06210658A (en) * | 1993-01-19 | 1994-08-02 | Toshiba Corp | Mold device for resin molding |
| JP2875479B2 (en) * | 1994-09-08 | 1999-03-31 | 日本ペルノックス株式会社 | Semiconductor sealing method |
| WO2001043942A1 (en) * | 1999-12-16 | 2001-06-21 | Dai-Ichi Seiko Co., Ltd. | Resin sealing mold and resin sealing method |
| JP2007152831A (en) * | 2005-12-07 | 2007-06-21 | Sharp Corp | Movable air vent, molding apparatus equipped with the same, and method for manufacturing electronic component |
| JP5138470B2 (en) * | 2008-06-06 | 2013-02-06 | アピックヤマダ株式会社 | Transfer molding apparatus and transfer molding method using the same |
| JP5140517B2 (en) * | 2008-08-07 | 2013-02-06 | アピックヤマダ株式会社 | Resin molding apparatus and resin molding method |
| JP5906528B2 (en) * | 2011-07-29 | 2016-04-20 | アピックヤマダ株式会社 | Mold and resin molding apparatus using the same |
| JP5744683B2 (en) * | 2011-08-31 | 2015-07-08 | Ｔｏｗａ株式会社 | Resin sealing molding method and apparatus for electronic parts |
| JP2013184413A (en) * | 2012-03-08 | 2013-09-19 | Sumitomo Heavy Ind Ltd | Resin sealing device and resin sealing method |
| JP5930394B2 (en) * | 2012-07-06 | 2016-06-08 | アピックヤマダ株式会社 | Resin molding equipment |
| JP6058431B2 (en) * | 2013-03-08 | 2017-01-11 | アピックヤマダ株式会社 | Resin molding apparatus and resin molding method |
| JP6259263B2 (en) * | 2013-11-11 | 2018-01-10 | アピックヤマダ株式会社 | Resin mold and resin mold molding method |
-
2014
- 2014-05-29 JP JP2014111374A patent/JP6320172B2/en active Active
-
2015
- 2015-04-10 CN CN201510169123.2A patent/CN105280506B/en active Active
- 2015-04-14 KR KR1020150052469A patent/KR101667879B1/en active Active
- 2015-04-17 TW TW104112302A patent/TWI602680B/en active
- 2015-05-25 SG SG10201504081PA patent/SG10201504081PA/en unknown
- 2015-05-27 MY MYPI2015001389A patent/MY172522A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWI602680B (en) | 2017-10-21 |
| JP2015226014A (en) | 2015-12-14 |
| CN105280506A (en) | 2016-01-27 |
| KR20150137992A (en) | 2015-12-09 |
| CN105280506B (en) | 2018-06-08 |
| TW201603986A (en) | 2016-02-01 |
| MY172522A (en) | 2019-11-28 |
| JP6320172B2 (en) | 2018-05-09 |
| KR101667879B1 (en) | 2016-10-19 |
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