SG10201500392YA - Black Curable Composition For Wafer-Level Lens, And Wafer-Level Lens - Google Patents
Black Curable Composition For Wafer-Level Lens, And Wafer-Level LensInfo
- Publication number
- SG10201500392YA SG10201500392YA SG10201500392YA SG10201500392YA SG10201500392YA SG 10201500392Y A SG10201500392Y A SG 10201500392YA SG 10201500392Y A SG10201500392Y A SG 10201500392YA SG 10201500392Y A SG10201500392Y A SG 10201500392YA SG 10201500392Y A SG10201500392Y A SG 10201500392YA
- Authority
- SG
- Singapore
- Prior art keywords
- wafer
- level lens
- curable composition
- black curable
- lens
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
- G02B1/041—Lenses
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
- C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
- C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/04—Polymers provided for in subclasses C08C or C08F
- C08F290/046—Polymers of unsaturated carboxylic acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0041—Optical brightening agents, organic pigments
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/003—Light absorbing elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
- G03F1/56—Organic absorbers, e.g. of photo-resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Polymerisation Methods In General (AREA)
- Optical Elements Other Than Lenses (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Graft Or Block Polymers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010009760 | 2010-01-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10201500392YA true SG10201500392YA (en) | 2015-03-30 |
Family
ID=44307017
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10201500392YA SG10201500392YA (en) | 2010-01-20 | 2011-01-20 | Black Curable Composition For Wafer-Level Lens, And Wafer-Level Lens |
| SG2012048302A SG182293A1 (en) | 2010-01-20 | 2011-01-20 | Black curable composition for wafer-level lens, and wafer-level lens |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2012048302A SG182293A1 (en) | 2010-01-20 | 2011-01-20 | Black curable composition for wafer-level lens, and wafer-level lens |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20120262793A1 (en) |
| EP (1) | EP2526447A1 (en) |
| JP (1) | JP2011170334A (en) |
| KR (1) | KR20120127404A (en) |
| CN (1) | CN102667531B (en) |
| SG (2) | SG10201500392YA (en) |
| TW (1) | TW201131297A (en) |
| WO (1) | WO2011090217A1 (en) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5340198B2 (en) * | 2009-02-26 | 2013-11-13 | 富士フイルム株式会社 | Dispersion composition |
| CN102652284B (en) * | 2009-12-11 | 2014-10-08 | 富士胶片株式会社 | Black curable composition, light-shielding color filter, light-shielding film and preparation method thereof, wafer-level lens, and solid-state imaging device |
| JP5489966B2 (en) * | 2009-12-18 | 2014-05-14 | 富士フイルム株式会社 | Light-shielding curable composition, wafer level lens, and light-shielding color filter |
| JP5885465B2 (en) * | 2011-10-28 | 2016-03-15 | 株式会社Dnpファインケミカル | Energy ray curable resin composition |
| JP5843604B2 (en) * | 2011-12-22 | 2016-01-13 | 東京応化工業株式会社 | Photosensitive resin composition for black column spacer, black column spacer, display device, and method for forming black column spacer |
| JP2013231874A (en) * | 2012-04-27 | 2013-11-14 | Panasonic Corp | Video display device |
| JP2013231873A (en) * | 2012-04-27 | 2013-11-14 | Panasonic Corp | Video display device |
| EP2927959A4 (en) | 2012-12-03 | 2016-03-09 | Fujifilm Corp | SEMICONDUCTOR IMAGE CAPTURE ELEMENT RETENTION SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR IMAGE CAPTURE DEVICE |
| CN104823085B (en) | 2012-12-03 | 2017-10-27 | 富士胶片株式会社 | Infrared cut filter, manufacturing method thereof, solid-state imaging device, and method of forming light-shielding film |
| WO2014119424A1 (en) * | 2013-01-31 | 2014-08-07 | 株式会社ダイセル | Curable composition for wafer level lenses, method for producing wafer level lens, wafer level lens, and optical device |
| US8922913B2 (en) * | 2013-05-08 | 2014-12-30 | Omnivision Technologies, Inc. | Five-aspheric-surface wafer-level lens systems having wide viewing angle |
| KR20160056923A (en) * | 2013-09-18 | 2016-05-20 | 주식회사 다이셀 | Photosensitive resin composition and cured article of same, and optical component |
| KR101686567B1 (en) | 2013-10-23 | 2016-12-14 | 제일모직 주식회사 | Photosensitive resin composition and light blocking layer using the same |
| KR101435652B1 (en) | 2014-01-17 | 2014-08-28 | 주식회사 삼양사 | NOVEL FLUORENYL β-OXIME ESTER COMPOUNDS, PHOTOPOLYMERIZATION INITIATOR AND PHOTORESIST COMPOSITION CONTAINING THE SAME |
| JP6331464B2 (en) * | 2014-02-25 | 2018-05-30 | 東洋インキScホールディングス株式会社 | Photosensitive resin composition and coating film using the same |
| JP2015184425A (en) * | 2014-03-24 | 2015-10-22 | 東芝テック株式会社 | Lens array and image forming apparatus |
| CN103901725B (en) * | 2014-04-19 | 2017-07-28 | 长兴电子(苏州)有限公司 | A kind of light curing resin composition |
| USD765754S1 (en) * | 2014-06-26 | 2016-09-06 | Emcore Corporation | Wafer level focus lens assembly |
| JP6602062B2 (en) * | 2015-06-17 | 2019-11-06 | 東京応化工業株式会社 | Curable composition, method for producing cured product, and hard coat material |
| ITUB20152412A1 (en) * | 2015-07-22 | 2017-01-22 | Fondazione St Italiano Tecnologia | Lens structure that can be coupled with an image acquisition device, in particular for microscopic observation. |
| WO2017078271A1 (en) * | 2015-11-04 | 2017-05-11 | Rohm And Haas Electronic Materials Korea Ltd. | Colored photosensitive resin composition and light shielding spacer prepared therefrom |
| JP6859353B2 (en) * | 2016-08-25 | 2021-04-14 | 富士フイルム株式会社 | Curable composition and its manufacturing method, cured film and its manufacturing method, color filter, solid-state image sensor, solid-state image sensor, and infrared sensor |
| KR101832097B1 (en) * | 2016-10-31 | 2018-02-23 | 롬엔드하스전자재료코리아유한회사 | Colored photosensitive resin composition and light shielding spacer prepared therefrom |
| JPWO2018159335A1 (en) * | 2017-03-01 | 2019-12-19 | 日本電産株式会社 | Lens and method for manufacturing lens |
| KR102361604B1 (en) * | 2017-08-07 | 2022-02-10 | 동우 화인켐 주식회사 | A colored photo resist composition, a color filter comprising the same and a display device comprising the same |
| JP6617785B2 (en) * | 2018-03-22 | 2019-12-11 | 東洋インキScホールディングス株式会社 | Photosensitive resin composition and coating film using the same |
| KR102725516B1 (en) * | 2018-06-08 | 2024-11-01 | 소니 세미컨덕터 솔루션즈 가부시키가이샤 | Camera device |
| JP7385334B2 (en) * | 2019-08-16 | 2023-11-22 | Hoya株式会社 | Optical elements and optical devices |
| WO2021106684A1 (en) * | 2019-11-28 | 2021-06-03 | 東京応化工業株式会社 | Photosensitive composition, cured product, and method for producing cured product |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0836257A (en) * | 1994-07-21 | 1996-02-06 | Sekisui Chem Co Ltd | Colored resist composition |
| JP2000089025A (en) * | 1998-09-14 | 2000-03-31 | Fuji Photo Film Co Ltd | Photosensitive colored composition for color filter |
| JP2000104005A (en) * | 1998-09-28 | 2000-04-11 | Dainippon Printing Co Ltd | Pigment dispersant, photosensitive coloring composition and composition for light-shielding layer |
| JP4465752B2 (en) * | 1998-10-08 | 2010-05-19 | 凸版印刷株式会社 | Electrode substrate and liquid crystal display device |
| JP4126918B2 (en) * | 2002-02-07 | 2008-07-30 | 三菱瓦斯化学株式会社 | High refractive index photocurable composition and cured product thereof |
| TWI279644B (en) * | 2004-01-19 | 2007-04-21 | Chi Mei Corp | Photo-sensitive resin composite for black matrix |
| JP2005317745A (en) * | 2004-04-28 | 2005-11-10 | Renesas Technology Corp | Solid-state imaging device and manufacturing method thereof |
| JP4448381B2 (en) * | 2004-05-26 | 2010-04-07 | 東京応化工業株式会社 | Photosensitive composition |
| JP2006154775A (en) * | 2004-10-26 | 2006-06-15 | Showa Denko Kk | Black matrix resist composition containing thiol compound |
| JP4633582B2 (en) * | 2005-09-06 | 2011-02-16 | 東京応化工業株式会社 | Photosensitive composition |
| KR100725023B1 (en) * | 2006-10-16 | 2007-06-07 | 제일모직주식회사 | Resin composition containing cardo resin, and manufacturing method by pattern, color filter using same |
| JP5061922B2 (en) * | 2007-01-25 | 2012-10-31 | 三菱化学株式会社 | Photosensitive composition, black matrix, color filter, and image display device |
| WO2008093516A1 (en) * | 2007-01-30 | 2008-08-07 | Konica Minolta Opto, Inc. | Camera module manufacturing method and camera module |
| KR100961818B1 (en) * | 2007-02-21 | 2010-06-08 | 주식회사 엘지화학 | Photosensitive resin composition for black matrices, black matrix formed thereby and liquid crystal display device comprising the same |
| JP5096814B2 (en) * | 2007-07-04 | 2012-12-12 | 東京応化工業株式会社 | Colored photosensitive composition |
| WO2009048231A2 (en) * | 2007-10-11 | 2009-04-16 | Lg Chem. Ltd. | Fluorene-based polymer containing urethane groups, preparation method thereof and negative-type photosensitive resin composition comprising the same |
| FR2922455B1 (en) * | 2007-10-23 | 2010-10-29 | Plastef Investissements | SYRINGE DEVICE COMPRISING A SYRINGE BODY AND A SUPPORT SLEEVE. |
| JP2009139488A (en) * | 2007-12-04 | 2009-06-25 | Nippon Steel Chem Co Ltd | Light-shielding dispersion, method for producing the same, and photosensitive resin composition for black resist using light-shielding dispersion |
| KR100956250B1 (en) * | 2007-12-10 | 2010-05-06 | 삼성전기주식회사 | Wafer scale lens assembly manufacturing method and wafer scale lens assembly manufactured thereby |
| KR101538820B1 (en) * | 2008-03-21 | 2015-07-22 | 세키스이가가쿠 고교가부시키가이샤 | Curable composition, anisotropic conductive material and connection structure |
| CN102016653B (en) * | 2008-04-28 | 2013-07-10 | 柯尼卡美能达精密光学株式会社 | Manufacturing method of wafer lens polymer and manufacturing method of wafer lens |
| JP2009301601A (en) * | 2008-06-10 | 2009-12-24 | Toshiba Corp | Optical disk recording and reproducing method |
| WO2010038978A2 (en) * | 2008-09-30 | 2010-04-08 | Kolon Industries, Inc. | Photopolymer resin composition |
-
2011
- 2011-01-17 JP JP2011007179A patent/JP2011170334A/en active Pending
- 2011-01-19 TW TW100101969A patent/TW201131297A/en unknown
- 2011-01-20 KR KR1020127015987A patent/KR20120127404A/en not_active Ceased
- 2011-01-20 CN CN201180005007.7A patent/CN102667531B/en not_active Expired - Fee Related
- 2011-01-20 US US13/518,696 patent/US20120262793A1/en not_active Abandoned
- 2011-01-20 SG SG10201500392YA patent/SG10201500392YA/en unknown
- 2011-01-20 EP EP11734823A patent/EP2526447A1/en not_active Withdrawn
- 2011-01-20 WO PCT/JP2011/051537 patent/WO2011090217A1/en not_active Ceased
- 2011-01-20 SG SG2012048302A patent/SG182293A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US20120262793A1 (en) | 2012-10-18 |
| WO2011090217A1 (en) | 2011-07-28 |
| CN102667531A (en) | 2012-09-12 |
| CN102667531B (en) | 2015-03-04 |
| KR20120127404A (en) | 2012-11-21 |
| TW201131297A (en) | 2011-09-16 |
| JP2011170334A (en) | 2011-09-01 |
| SG182293A1 (en) | 2012-08-30 |
| EP2526447A1 (en) | 2012-11-28 |
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