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SG10201407348PA - A chemical mechanical polishing (cmp) composition comprising inorganic particles and polymer particles - Google Patents

A chemical mechanical polishing (cmp) composition comprising inorganic particles and polymer particles

Info

Publication number
SG10201407348PA
SG10201407348PA SG10201407348PA SG10201407348PA SG10201407348PA SG 10201407348P A SG10201407348P A SG 10201407348PA SG 10201407348P A SG10201407348P A SG 10201407348PA SG 10201407348P A SG10201407348P A SG 10201407348PA SG 10201407348P A SG10201407348P A SG 10201407348PA
Authority
SG
Singapore
Prior art keywords
cmp
composition
mechanical polishing
chemical mechanical
particles
Prior art date
Application number
SG10201407348PA
Inventor
Michael Lauter
Vijay Immanuel Raman
Yuzhuo Li
Shyam Sundar Venkataraman
Daniel Kwo-Hung Shen
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of SG10201407348PA publication Critical patent/SG10201407348PA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

23 Abstract A CHEMICAL MECHANICAL POLISHING (CMP) COMPOSITION COMPRISING INORGANIC PARTICLES AND POLYMER PARTICLES A chemical mechanical polishing (CMP) composition, comprising (A) at least one type of inorganic particles which are dispersed in the liquid medium (C), (B) at least one type of polymer particles which are dispersed in the liquid medium (C), (C) a liquid medium, wherein the zeta-potential of the inorganic particles (A) in the liquid medium (C) and the zeta-potential of the polymer particles in the liquid medium (C) are of same signs. No Figure
SG10201407348PA 2009-11-13 2010-11-10 A chemical mechanical polishing (cmp) composition comprising inorganic particles and polymer particles SG10201407348PA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US26087309P 2009-11-13 2009-11-13

Publications (1)

Publication Number Publication Date
SG10201407348PA true SG10201407348PA (en) 2015-01-29

Family

ID=43991260

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201407348PA SG10201407348PA (en) 2009-11-13 2010-11-10 A chemical mechanical polishing (cmp) composition comprising inorganic particles and polymer particles

Country Status (11)

Country Link
US (1) US9255214B2 (en)
EP (1) EP2499210B1 (en)
JP (1) JP6005516B2 (en)
KR (1) KR101809762B1 (en)
CN (1) CN102597142B (en)
IL (1) IL219144A (en)
MY (1) MY161863A (en)
RU (1) RU2579597C2 (en)
SG (1) SG10201407348PA (en)
TW (1) TWI500722B (en)
WO (1) WO2011058503A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5574702B2 (en) * 2009-12-28 2014-08-20 日揮触媒化成株式会社 Polishing particle dispersion comprising aggregates of organic particles and silica particles, and method for producing the same
KR101848519B1 (en) 2010-02-24 2018-04-12 바스프 에스이 An aqueous polishing agent and graft copolymers and their use in a process for polishing patterned and unstructured metal surfaces
SG189327A1 (en) 2010-10-07 2013-05-31 Basf Se Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layers
CN103249790A (en) 2010-12-10 2013-08-14 巴斯夫欧洲公司 Aqueous polishing composition and method for chemical mechanical polishing of substrates comprising silicon oxide dielectrics and polysilicon films
EP2753670B1 (en) 2011-09-07 2016-06-22 Basf Se A chemical mechanical polishing (cmp) composition comprising a glycoside
CA2855239A1 (en) 2011-11-10 2013-05-16 Basf Se Paper coating slip additive comprising acid monomer, associative monomer and nonionic monomer
EP2682441A1 (en) * 2012-07-06 2014-01-08 Basf Se A chemical mechanical polishing (CMP) composition comprising a non-ionic surfactant and an aromatic compound comprising at least one acid group
US9340706B2 (en) 2013-10-10 2016-05-17 Cabot Microelectronics Corporation Mixed abrasive polishing compositions
CN107406752B (en) * 2015-03-10 2020-05-08 日立化成株式会社 Polishing agent, stock solution for polishing agent, and polishing method
KR20170030143A (en) 2015-09-08 2017-03-17 삼성에스디아이 주식회사 Cmp slurry composition for copper and polishing method using the same
KR102524807B1 (en) 2016-11-04 2023-04-25 삼성전자주식회사 Method of manufacturing a semiconductor device
KR102782008B1 (en) * 2019-12-06 2025-03-18 주식회사 케이씨텍 Slurry composition for high step height removing

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US4954142A (en) 1989-03-07 1990-09-04 International Business Machines Corporation Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor
US6258137B1 (en) * 1992-02-05 2001-07-10 Saint-Gobain Industrial Ceramics, Inc. CMP products
CN1323124C (en) * 1996-09-30 2007-06-27 日立化成工业株式会社 Cerium oxide abrasive material and grinding method of base plate
DE19719503C2 (en) 1997-05-07 2002-05-02 Wolters Peter Werkzeugmasch Device for chemical mechanical polishing of surfaces of semiconductor wafers and method for operating the device
DE19755975A1 (en) 1997-12-16 1999-06-17 Wolters Peter Werkzeugmasch Semiconductor wafer holder suitable also for other flat workpieces
TWI267549B (en) 1999-03-18 2006-12-01 Toshiba Corp Aqueous dispersion, aqueous dispersion for chemical mechanical polishing used for manufacture of semiconductor devices, method for manufacture of semiconductor devices, and method for formation of embedded wiring
KR20020035826A (en) * 1999-07-03 2002-05-15 갤반 마틴 Improved chemical mechanical polishing slurries for metal
TW534917B (en) * 1999-11-22 2003-06-01 Jsr Corp Method of production of composited particle, composited particle produced by this method and aqueous dispersion for chemical mechanical polishing containing this composited particle, and its method of production
JP4151179B2 (en) * 1999-11-22 2008-09-17 Ｊｓｒ株式会社 Method for producing composite particles, composite particles produced by this method, and chemical mechanical polishing aqueous dispersion containing composite particles
JP4123685B2 (en) * 2000-05-18 2008-07-23 Ｊｓｒ株式会社 Aqueous dispersion for chemical mechanical polishing
DE10062496B4 (en) 2000-12-14 2005-03-17 Peter Wolters Cmp - Systeme Gmbh & Co. Kg Holder for flat workpieces, in particular semiconductor wafers
US20040065021A1 (en) * 2002-10-04 2004-04-08 Yasuhiro Yoneda Polishing composition
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US20040175942A1 (en) 2003-01-03 2004-09-09 Chang Song Y. Composition and method used for chemical mechanical planarization of metals
US7071105B2 (en) * 2003-02-03 2006-07-04 Cabot Microelectronics Corporation Method of polishing a silicon-containing dielectric
JP2006041252A (en) * 2004-07-28 2006-02-09 Hitachi Chem Co Ltd Cmp abrasive, its manufacturing method, and method for polishing substrate
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WO2009153162A1 (en) 2008-06-17 2009-12-23 Basf Se Method for preparing an aqueous polymer dispersion
US8597539B2 (en) 2008-10-03 2013-12-03 Basf Se Chemical mechanical polishing (CMP) polishing solution with enhanced performance
EP2427522B1 (en) 2009-05-06 2017-03-01 Basf Se An aqueous polishing agent comprising solid polymer particles and two complexing agents and its use in a process for polishing patterned and unstructured metal surfaces
KR101793288B1 (en) 2009-05-06 2017-11-02 바스프 에스이 An aqueous metal polishing agent comprising a polymeric abrasiv containing pendant functional groups and its use in a cmp process
WO2010128094A1 (en) 2009-05-08 2010-11-11 Basf Se Oxidizing particles based slurry for nobel metal including ruthenium chemical mechanical planarization
EP2438133B1 (en) 2009-06-05 2018-07-11 Basf Se Polishing slurry containing raspberry-type metal oxide nanostructures coated with CeO2

Also Published As

Publication number Publication date
TWI500722B (en) 2015-09-21
RU2012123720A (en) 2013-12-20
EP2499210B1 (en) 2017-01-11
JP2013511144A (en) 2013-03-28
CN102597142A (en) 2012-07-18
RU2579597C2 (en) 2016-04-10
TW201122068A (en) 2011-07-01
IL219144A (en) 2016-07-31
US20120208344A1 (en) 2012-08-16
MY161863A (en) 2017-05-15
US9255214B2 (en) 2016-02-09
KR20120101044A (en) 2012-09-12
KR101809762B1 (en) 2017-12-15
EP2499210A4 (en) 2015-04-29
CN102597142B (en) 2014-09-17
JP6005516B2 (en) 2016-10-12
WO2011058503A1 (en) 2011-05-19
IL219144A0 (en) 2012-06-28
EP2499210A1 (en) 2012-09-19

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