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SG10201405469WA - Unitized confinement ring arrangements and methods thereof - Google Patents

Unitized confinement ring arrangements and methods thereof

Info

Publication number
SG10201405469WA
SG10201405469WA SG10201405469WA SG10201405469WA SG10201405469WA SG 10201405469W A SG10201405469W A SG 10201405469WA SG 10201405469W A SG10201405469W A SG 10201405469WA SG 10201405469W A SG10201405469W A SG 10201405469WA SG 10201405469W A SG10201405469W A SG 10201405469WA
Authority
SG
Singapore
Prior art keywords
methods
confinement ring
ring arrangements
unitized confinement
unitized
Prior art date
Application number
SG10201405469WA
Inventor
Rajinder Dhindsa
Rajaramanan Kalyanaraman
Sathyanarayanan Mani
Guatam Bhattacharyya
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG10201405469WA publication Critical patent/SG10201405469WA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H01J37/32495—Means for protecting the vessel against plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32834—Exhausting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
SG10201405469WA 2009-09-28 2010-09-27 Unitized confinement ring arrangements and methods thereof SG10201405469WA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US24652609P 2009-09-28 2009-09-28

Publications (1)

Publication Number Publication Date
SG10201405469WA true SG10201405469WA (en) 2014-10-30

Family

ID=43778979

Family Applications (2)

Application Number Title Priority Date Filing Date
SG2012009619A SG178371A1 (en) 2009-09-28 2010-09-27 Unitized confinement ring arrangements and methods thereof
SG10201405469WA SG10201405469WA (en) 2009-09-28 2010-09-27 Unitized confinement ring arrangements and methods thereof

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG2012009619A SG178371A1 (en) 2009-09-28 2010-09-27 Unitized confinement ring arrangements and methods thereof

Country Status (8)

Country Link
US (2) US20110073257A1 (en)
EP (1) EP2484185A4 (en)
JP (2) JP5792174B2 (en)
KR (1) KR101711687B1 (en)
CN (1) CN102656952B (en)
SG (2) SG178371A1 (en)
TW (1) TWI567818B (en)
WO (1) WO2011038344A2 (en)

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US20130059448A1 (en) * 2011-09-07 2013-03-07 Lam Research Corporation Pulsed Plasma Chamber in Dual Chamber Configuration
CN103854943B (en) * 2012-11-30 2016-05-04 中微半导体设备(上海)有限公司 A kind of confinement ring for plasma process chamber and chamber clean method
CN103906336A (en) * 2014-04-14 2014-07-02 中国科学院工程热物理研究所 Gas discharge plasma generating device with adjustable pressure and temperature
CN105789008B (en) * 2014-12-22 2017-12-19 中微半导体设备(上海)有限公司 Plasma processing apparatus and method for etching plasma
KR102552776B1 (en) 2015-11-30 2023-07-10 (주)아모레퍼시픽 Composition for inhibiting melanoma metastasis comprising miRNA
US9953843B2 (en) * 2016-02-05 2018-04-24 Lam Research Corporation Chamber for patterning non-volatile metals
GB201603581D0 (en) * 2016-03-01 2016-04-13 Spts Technologies Ltd Plasma processing apparatus
JP7296829B2 (en) * 2019-09-05 2023-06-23 東京エレクトロン株式会社 Plasma processing apparatus, processing method, upper electrode structure
CN112713075B (en) * 2019-10-25 2024-03-12 中微半导体设备(上海)股份有限公司 Plasma isolation ring, plasma processing device and substrate processing method
CN113745081B (en) * 2020-05-27 2024-03-12 中微半导体设备(上海)股份有限公司 Isolation ring assembly, plasma processing device and processing method
CN113808900B (en) * 2020-06-17 2023-09-29 中微半导体设备(上海)股份有限公司 Plasma processing device and confinement ring assembly and method thereof
CN114639585B (en) * 2020-12-16 2025-02-14 中微半导体设备(上海)股份有限公司 Confinement ring assembly, plasma processing device and exhaust control method thereof
CN115881506B (en) * 2023-03-02 2023-06-27 深圳市新凯来技术有限公司 Plasma adjusting device and semiconductor etching equipment

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US5534751A (en) * 1995-07-10 1996-07-09 Lam Research Corporation Plasma etching apparatus utilizing plasma confinement
JP3535309B2 (en) * 1996-04-10 2004-06-07 東京エレクトロン株式会社 Decompression processing equipment
JP4405496B2 (en) * 1997-02-24 2010-01-27 株式会社エフオーアイ Plasma processing equipment
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Also Published As

Publication number Publication date
JP5792174B2 (en) 2015-10-07
JP6204940B2 (en) 2017-09-27
EP2484185A4 (en) 2014-07-23
TW201133607A (en) 2011-10-01
EP2484185A2 (en) 2012-08-08
CN102656952A (en) 2012-09-05
JP2013506301A (en) 2013-02-21
WO2011038344A3 (en) 2011-07-28
CN102656952B (en) 2016-10-12
JP2015201653A (en) 2015-11-12
KR101711687B1 (en) 2017-03-02
KR20120088687A (en) 2012-08-08
SG178371A1 (en) 2012-03-29
US20150325414A1 (en) 2015-11-12
TWI567818B (en) 2017-01-21
US20110073257A1 (en) 2011-03-31
WO2011038344A2 (en) 2011-03-31

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