[go: up one dir, main page]

SE9901440D0 - A field effect transistor of SiC for high temperature application, use of such a transistor and a method for production thereof - Google Patents

A field effect transistor of SiC for high temperature application, use of such a transistor and a method for production thereof

Info

Publication number
SE9901440D0
SE9901440D0 SE9901440A SE9901440A SE9901440D0 SE 9901440 D0 SE9901440 D0 SE 9901440D0 SE 9901440 A SE9901440 A SE 9901440A SE 9901440 A SE9901440 A SE 9901440A SE 9901440 D0 SE9901440 D0 SE 9901440D0
Authority
SE
Sweden
Prior art keywords
transistor
sic
high temperature
field effect
temperature application
Prior art date
Application number
SE9901440A
Other languages
English (en)
Other versions
SE9901440A0 (en
SE9901440L (sv
Inventor
Andrei Konstantinov
Susan Savage
Chris Harris
Original Assignee
Ind Mikroelektronik Ct Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Publication of SE9901440L publication Critical patent/SE9901440L/xx
Application filed by Ind Mikroelektronik Ct Ab filed Critical Ind Mikroelektronik Ct Ab
Priority to SE9901440A priority Critical patent/SE9901440A0/sv
Publication of SE9901440D0 publication Critical patent/SE9901440D0/sv
Priority to US09/298,116 priority patent/US6278133B1/en
Priority to CNB008065454A priority patent/CN1190852C/zh
Priority to KR1020017013472A priority patent/KR100654010B1/ko
Priority to AU46347/00A priority patent/AU4634700A/en
Priority to HK02107060.8A priority patent/HK1045602B/zh
Priority to CA2370869A priority patent/CA2370869C/en
Priority to JP2000614508A priority patent/JP5433121B2/ja
Priority to PCT/SE2000/000773 priority patent/WO2000065660A2/en
Priority to DE60043614T priority patent/DE60043614D1/de
Priority to AT00928059T priority patent/ATE453928T1/de
Priority to EP00928059A priority patent/EP1186053B1/en
Publication of SE9901440A0 publication Critical patent/SE9901440A0/sv

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403Cells and electrode assemblies
    • G01N27/414Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403Cells and electrode assemblies
    • G01N27/414Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
    • G01N27/4141Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS specially adapted for gases
    • G01N27/4143Air gap between gate and channel, i.e. suspended gate [SG] FETs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/0445Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising crystalline silicon carbide
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01Manufacture or treatment
    • H10D12/031Manufacture or treatment of IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/63Vertical IGFETs
    • H10D30/635Vertical IGFETs having no inversion channels, e.g. vertical accumulation channel FETs [ACCUFET] or normally-on vertical IGFETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/637Lateral IGFETs having no inversion channels, e.g. buried channel lateral IGFETs, normally-on lateral IGFETs or depletion-mode lateral IGFETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/149Source or drain regions of field-effect devices
    • H10D62/151Source or drain regions of field-effect devices of IGFETs 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325Silicon carbide
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/106Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Thermistors And Varistors (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
SE9901440A 1999-04-22 1999-04-22 A field effect transistor of SiC for high temperature application, use of such a transistor and a method for production thereof SE9901440A0 (en)

Priority Applications (12)

Application Number Priority Date Filing Date Title
SE9901440A SE9901440A0 (en) 1999-04-22 1999-04-22 A field effect transistor of SiC for high temperature application, use of such a transistor and a method for production thereof
US09/298,116 US6278133B1 (en) 1999-04-22 1999-04-23 Field effect transistor of SiC for high temperature application, use of such a transistor and a method for production thereof
EP00928059A EP1186053B1 (en) 1999-04-22 2000-04-20 SiC field-effect transistor and use thereof as gas sensor
AT00928059T ATE453928T1 (de) 1999-04-22 2000-04-20 Sic-feldeffekttransistor und verwendung desselben als gassensor
HK02107060.8A HK1045602B (zh) 1999-04-22 2000-04-20 高溫應用碳化硅場效應晶體管及其使用和製造方法
KR1020017013472A KR100654010B1 (ko) 1999-04-22 2000-04-20 고온 애플리케이션용 탄화규소 전계 효과 트랜지스터, 이러한 트랜지스터의 용도 및 그의 제조 방법
AU46347/00A AU4634700A (en) 1999-04-22 2000-04-20 A field effect transistor of sic for high temperature application, use of such atransistor and a method for production thereof
CNB008065454A CN1190852C (zh) 1999-04-22 2000-04-20 高温应用碳化硅场效应晶体管及其使用和制造方法
CA2370869A CA2370869C (en) 1999-04-22 2000-04-20 A field effect transistor of sic for high temperature application, use of such a transistor and a method for production thereof
JP2000614508A JP5433121B2 (ja) 1999-04-22 2000-04-20 高温利用可能なSiC電界効果トランジスタ、前記トランジスタの使用およびその製造方法
PCT/SE2000/000773 WO2000065660A2 (en) 1999-04-22 2000-04-20 A FIELD EFFECT TRANSISTOR OF SiC FOR HIGH TEMPERATURE APPLICATION, USE OF SUCH A TRANSISTOR AND A METHOD FOR PRODUCTION THEREOF
DE60043614T DE60043614D1 (de) 1999-04-22 2000-04-20 SiC-Feldeffekttransistor und Verwendung desselben als Gassensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9901440A SE9901440A0 (en) 1999-04-22 1999-04-22 A field effect transistor of SiC for high temperature application, use of such a transistor and a method for production thereof

Publications (3)

Publication Number Publication Date
SE9901440L SE9901440L (sv) 1900-01-01
SE9901440D0 true SE9901440D0 (sv) 1999-04-22
SE9901440A0 SE9901440A0 (en) 2000-10-23

Family

ID=20415312

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9901440A SE9901440A0 (en) 1999-04-22 1999-04-22 A field effect transistor of SiC for high temperature application, use of such a transistor and a method for production thereof

Country Status (12)

Country Link
US (1) US6278133B1 (sv)
EP (1) EP1186053B1 (sv)
JP (1) JP5433121B2 (sv)
KR (1) KR100654010B1 (sv)
CN (1) CN1190852C (sv)
AT (1) ATE453928T1 (sv)
AU (1) AU4634700A (sv)
CA (1) CA2370869C (sv)
DE (1) DE60043614D1 (sv)
HK (1) HK1045602B (sv)
SE (1) SE9901440A0 (sv)
WO (1) WO2000065660A2 (sv)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5883995A (en) 1997-05-20 1999-03-16 Adc Telecommunications, Inc. Fiber connector and adapter
CN1302558C (zh) * 2003-03-06 2007-02-28 北京大学 一种场效应晶体管
US7053425B2 (en) * 2003-11-12 2006-05-30 General Electric Company Gas sensor device
US7598134B2 (en) 2004-07-28 2009-10-06 Micron Technology, Inc. Memory device forming methods
JP2006269641A (ja) * 2005-03-23 2006-10-05 National Institute Of Advanced Industrial & Technology 半導体装置及びその製造方法
US20060270053A1 (en) * 2005-05-26 2006-11-30 General Electric Company Apparatus, methods, and systems having gas sensor with catalytic gate and variable bias
JP4571957B2 (ja) * 2007-03-29 2010-10-27 関西電力株式会社 電力変換装置
DE102012211460A1 (de) * 2012-07-03 2014-01-09 Robert Bosch Gmbh Gassensor und Verfahren zum Herstellen eines solchen
KR101229392B1 (ko) * 2012-09-12 2013-02-05 주식회사 아이엠헬스케어 오믹 접합을 이용하는 fet 기반 바이오 센서
KR102046014B1 (ko) * 2013-03-27 2019-12-02 인텔렉추얼디스커버리 주식회사 하이브리드형 수소센서, 그 제조 방법 및 제어 방법
GB2577271A (en) * 2018-09-19 2020-03-25 Sumitomo Chemical Co Thin film transistor gas sensor

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4917182A (sv) * 1972-05-22 1974-02-15
JPS5315773A (en) * 1976-07-28 1978-02-14 Hitachi Ltd Mis type semiconductor device and its production
JPS5832462A (ja) * 1981-08-21 1983-02-25 Toshiba Corp 半導体装置
US4769338A (en) 1984-05-14 1988-09-06 Energy Conversion Devices, Inc. Thin film field effect transistor and method of making same
JPS63265156A (ja) * 1987-04-23 1988-11-01 Matsushita Electric Works Ltd イオンセンサ
JP2527775B2 (ja) 1987-12-28 1996-08-28 三菱電機株式会社 電界効果トランジスタ及びその製造方法
US5086321A (en) 1988-06-15 1992-02-04 International Business Machines Corporation Unpinned oxide-compound semiconductor structures and method of forming same
US5362975A (en) * 1992-09-02 1994-11-08 Kobe Steel Usa Diamond-based chemical sensors
US5448085A (en) * 1993-04-05 1995-09-05 The United States Of America As Represented By The Secretary Of The Air Force Limited current density field effect transistor with buried source and drain
JP3246189B2 (ja) 1994-06-28 2002-01-15 株式会社日立製作所 半導体表示装置
SE503265C2 (sv) * 1994-09-23 1996-04-29 Forskarpatent Ab Förfarande och anordning för gasdetektion
US5698771A (en) * 1995-03-30 1997-12-16 The United States Of America As Represented By The United States National Aeronautics And Space Administration Varying potential silicon carbide gas sensor
JP3385938B2 (ja) * 1997-03-05 2003-03-10 株式会社デンソー 炭化珪素半導体装置及びその製造方法

Also Published As

Publication number Publication date
KR20020002436A (ko) 2002-01-09
SE9901440A0 (en) 2000-10-23
CN1347570A (zh) 2002-05-01
JP2002543593A (ja) 2002-12-17
EP1186053A2 (en) 2002-03-13
US6278133B1 (en) 2001-08-21
DE60043614D1 (de) 2010-02-11
KR100654010B1 (ko) 2006-12-05
WO2000065660A2 (en) 2000-11-02
CA2370869A1 (en) 2000-11-02
JP5433121B2 (ja) 2014-03-05
EP1186053B1 (en) 2009-12-30
HK1045602B (zh) 2005-09-02
AU4634700A (en) 2000-11-10
HK1045602A1 (en) 2002-11-29
WO2000065660A3 (en) 2001-03-08
SE9901440L (sv) 1900-01-01
CA2370869C (en) 2010-09-21
ATE453928T1 (de) 2010-01-15
CN1190852C (zh) 2005-02-23

Similar Documents

Publication Publication Date Title
TW283263B (en) Fabrication method of semiconductor device and field effect transistor
ATE225568T1 (de) Leistung-mosfet aus siliziumkarbid
MY141412A (en) Shielded gate field effect transistor with improved inter-poly dielectric
WO2003100865A3 (en) Microwave field effect transistor structure
SE9901440D0 (sv) A field effect transistor of SiC for high temperature application, use of such a transistor and a method for production thereof
EP1662558A4 (en) FIELD EFFECT TRANSISTOR AND METHOD FOR THE PRODUCTION THEREOF
NO985472D0 (no) Transistor
WO2005053032A3 (en) Trench insulated gate field effect transistor
TW200504359A (en) Single-electron transistor, field-effect transistor, sensor, method for producing sensor, and sensing method
TWI256081B (en) Semiconductor device and manufacturing method therefor
TW200715562A (en) Thin film transistor substrate and fabrication thereof
TWI267194B (en) A system and method for suppressing oxide formation
WO2004012270A3 (en) Field effect transistor and method of manufacturing same
DE60235313D1 (de) Eweglichkeit einer metal-oxyd-halbleiter feldeffekttransistor aus siliziumcarbid
WO2002078090A3 (en) Field-effect transistor structure and method of manufacture
TW200505030A (en) MOS type semi conductor device
TW200703437A (en) Semiconductor device and manufacturing method thereof
TW200703666A (en) Thin film transistor
EP1403930A3 (en) Semiconductor device and method of manufacturing the same
TW200627683A (en) Organic transistor
TW200731539A (en) Semiconductor device
ATE470852T1 (de) Gassensor
TW200515584A (en) Electrostatic discharge protection structure for deep sub-micron gate oxide
TW200509310A (en) Field effect transistor having increased carrier mobility
WO1997036313A3 (en) A field controlled semiconductor device of sic and a method for production thereof

Legal Events

Date Code Title Description
NAV Patent application has lapsed

Ref document number: 9901440-9