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SE9400084D0 - Mönsterkort med särskilt utformade anslutningsöar - Google Patents

Mönsterkort med särskilt utformade anslutningsöar

Info

Publication number
SE9400084D0
SE9400084D0 SE9400084A SE9400084A SE9400084D0 SE 9400084 D0 SE9400084 D0 SE 9400084D0 SE 9400084 A SE9400084 A SE 9400084A SE 9400084 A SE9400084 A SE 9400084A SE 9400084 D0 SE9400084 D0 SE 9400084D0
Authority
SE
Sweden
Prior art keywords
connection terminals
specially designed
pattern card
designed connection
connection islands
Prior art date
Application number
SE9400084A
Other languages
English (en)
Other versions
SE9400084L (sv
SE502224C2 (sv
Original Assignee
Xicon Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xicon Ab filed Critical Xicon Ab
Priority to SE9400084A priority Critical patent/SE502224C2/sv
Publication of SE9400084D0 publication Critical patent/SE9400084D0/sv
Priority to PCT/SE1995/000019 priority patent/WO1995019691A1/en
Priority to EP95907168A priority patent/EP0739579B1/en
Publication of SE9400084L publication Critical patent/SE9400084L/sv
Publication of SE502224C2 publication Critical patent/SE502224C2/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Multi-Conductor Connections (AREA)
  • Structure Of Printed Boards (AREA)
SE9400084A 1994-01-14 1994-01-14 Mönsterkort med särskilt utformade anslutningsöar SE502224C2 (sv)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE9400084A SE502224C2 (sv) 1994-01-14 1994-01-14 Mönsterkort med särskilt utformade anslutningsöar
PCT/SE1995/000019 WO1995019691A1 (en) 1994-01-14 1995-01-12 A circuit board with specifically designed connection terminals
EP95907168A EP0739579B1 (en) 1994-01-14 1995-01-12 A circuit board with specifically designed connection terminals

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9400084A SE502224C2 (sv) 1994-01-14 1994-01-14 Mönsterkort med särskilt utformade anslutningsöar

Publications (3)

Publication Number Publication Date
SE9400084D0 true SE9400084D0 (sv) 1994-01-14
SE9400084L SE9400084L (sv) 1995-07-15
SE502224C2 SE502224C2 (sv) 1995-09-18

Family

ID=20392557

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9400084A SE502224C2 (sv) 1994-01-14 1994-01-14 Mönsterkort med särskilt utformade anslutningsöar

Country Status (3)

Country Link
EP (1) EP0739579B1 (sv)
SE (1) SE502224C2 (sv)
WO (1) WO1995019691A1 (sv)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2744843B1 (fr) * 1996-02-09 1998-04-10 Seb Sa Procede de realisation de connexion electrique par collage d'une cosse rigide sur une piste conductrice, cosse rigide pour la mise en oeuvre du procede et son application a une plaque chauffante pour recipient chauffant
GB2313961A (en) * 1996-06-08 1997-12-10 Motorola Inc Preventing dislocation of surface mounted components during soldering
US6115262A (en) * 1998-06-08 2000-09-05 Ford Motor Company Enhanced mounting pads for printed circuit boards
ES2154593B1 (es) * 1999-06-08 2001-10-16 Mecanismos Aux Es Ind S L Diseño de componentes electronicos sobre una capa de cobre de 400 micras en circuitos impresos.
US6509530B2 (en) 2001-06-22 2003-01-21 Intel Corporation Via intersect pad for electronic components and methods of manufacture
US6566611B2 (en) * 2001-09-26 2003-05-20 Intel Corporation Anti-tombstoning structures and methods of manufacture
EP1653506A4 (en) * 2003-08-05 2008-01-02 Lintec Corp FLIP-CHIP MOUNTING SUBSTRATE
US7630210B2 (en) * 2005-11-29 2009-12-08 Amphenol Corporation Lead(Pb)-free electronic component attachment
US8048069B2 (en) 2006-09-29 2011-11-01 Medtronic, Inc. User interface for ablation therapy
US20170280569A1 (en) * 2016-03-28 2017-09-28 Alcatel-Lucent Canada, Inc. Extended pads to ease rework for btc and bga type technology

Also Published As

Publication number Publication date
EP0739579A1 (en) 1996-10-30
EP0739579B1 (en) 1998-08-26
SE9400084L (sv) 1995-07-15
SE502224C2 (sv) 1995-09-18
WO1995019691A1 (en) 1995-07-20

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Legal Events

Date Code Title Description
NUG Patent has lapsed