[go: up one dir, main page]

SE9203533D0 - Anordning foer kylning av skivformiga kraftelektronikelement jaemte skivformigt kraftelektronikelement avsett att monteras i saadan kylanordning - Google Patents

Anordning foer kylning av skivformiga kraftelektronikelement jaemte skivformigt kraftelektronikelement avsett att monteras i saadan kylanordning

Info

Publication number
SE9203533D0
SE9203533D0 SE9203533A SE9203533A SE9203533D0 SE 9203533 D0 SE9203533 D0 SE 9203533D0 SE 9203533 A SE9203533 A SE 9203533A SE 9203533 A SE9203533 A SE 9203533A SE 9203533 D0 SE9203533 D0 SE 9203533D0
Authority
SE
Sweden
Prior art keywords
substrate
disc
power electronic
circuit pattern
cooling
Prior art date
Application number
SE9203533A
Other languages
English (en)
Other versions
SE500281C2 (sv
SE9203533L (sv
Original Assignee
Asea Brown Boveri
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asea Brown Boveri filed Critical Asea Brown Boveri
Priority to SE9203533A priority Critical patent/SE9203533L/sv
Publication of SE9203533D0 publication Critical patent/SE9203533D0/sv
Priority to PCT/SE1993/000824 priority patent/WO1994013012A1/en
Priority to PCT/SE1993/001004 priority patent/WO1994013014A1/en
Publication of SE500281C2 publication Critical patent/SE500281C2/sv
Publication of SE9203533L publication Critical patent/SE9203533L/sv

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0067—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto an inorganic, non-metallic substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structure Of Printed Boards (AREA)
SE9203533A 1992-11-24 1992-11-24 Anordning för kylning av skivformiga kraftelektronikelement jämte skivformigt kraftelektronikelement avsett att monteras i sådan kylanordning SE9203533L (sv)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE9203533A SE9203533L (sv) 1992-11-24 1992-11-24 Anordning för kylning av skivformiga kraftelektronikelement jämte skivformigt kraftelektronikelement avsett att monteras i sådan kylanordning
PCT/SE1993/000824 WO1994013012A1 (en) 1992-11-24 1993-10-11 Device for cooling sheet elements for power electronics
PCT/SE1993/001004 WO1994013014A1 (en) 1992-11-24 1993-11-22 Disc-formed, heat producing electronic element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9203533A SE9203533L (sv) 1992-11-24 1992-11-24 Anordning för kylning av skivformiga kraftelektronikelement jämte skivformigt kraftelektronikelement avsett att monteras i sådan kylanordning

Publications (3)

Publication Number Publication Date
SE9203533D0 true SE9203533D0 (sv) 1992-11-24
SE500281C2 SE500281C2 (sv) 1994-05-24
SE9203533L SE9203533L (sv) 1994-05-24

Family

ID=20387921

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9203533A SE9203533L (sv) 1992-11-24 1992-11-24 Anordning för kylning av skivformiga kraftelektronikelement jämte skivformigt kraftelektronikelement avsett att monteras i sådan kylanordning

Country Status (2)

Country Link
SE (1) SE9203533L (sv)
WO (2) WO1994013012A1 (sv)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19924960A1 (de) * 1999-05-31 2000-12-14 Siemens Ag Vorrichtung zur Kühlung von Halbleiterbauelementen
DE102005053396B4 (de) * 2005-11-09 2010-04-15 Semikron Elektronik Gmbh & Co. Kg Schaltungseinrichtung, insbesondere Frequenzumrichter
US10638643B2 (en) 2017-11-14 2020-04-28 Canon Kabushiki Kaisha Electronic device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL208617A (sv) * 1955-05-10 1900-01-01
NL260951A (sv) * 1960-03-07
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
US4479140A (en) * 1982-06-28 1984-10-23 International Business Machines Corporation Thermal conduction element for conducting heat from semiconductor devices to a cold plate
JPH063831B2 (ja) * 1987-04-08 1994-01-12 株式会社日立製作所 冷却装置及びそれを用いた半導体装置
US5132875A (en) * 1990-10-29 1992-07-21 Compaq Computer Corporation Removable protective heat sink for electronic components

Also Published As

Publication number Publication date
WO1994013012A1 (en) 1994-06-09
SE500281C2 (sv) 1994-05-24
WO1994013014A1 (en) 1994-06-09
SE9203533L (sv) 1994-05-24

Similar Documents

Publication Publication Date Title
DK0551382T3 (da) Halvlederchipenheder, fremgangsmåder til fremstilling deraf og komponenter dertil
DE3785835D1 (de) Chip-sicherung.
EP0110285A3 (en) Interconnection of integrated circuits
DE59706411D1 (de) Chipmodul und verfahren zur herstellung eines chipmoduls
ES251739U (es) Ÿun elemento de contacto electricoŸ
EP1032041A3 (en) Semiconductor device comprising an internal wiring pattern
EP0883182A3 (en) Lattice arrangement of electrodes on a multi-layer circuit board
EP0295914A3 (en) An interconnect structure for pc boards and integrated circuits
ES478663A1 (es) Perfeccionamientos en bloques de conexion para tarjetas de circuitos impresos.
EP0349957A3 (en) Method for manufacturing an electrical junction box
US4949220A (en) Hybrid IC with heat sink
EP0075890A3 (en) Arrangement to prevent damage of the components or conductors on a circuit board
ES273365U (es) Un ensamble de componente electronico
SE9203533D0 (sv) Anordning foer kylning av skivformiga kraftelektronikelement jaemte skivformigt kraftelektronikelement avsett att monteras i saadan kylanordning
EP0737025A4 (en) PRINTED CIRCUIT BOARD
WO1998039803A3 (de) Halbleiterbauelemente umfassende schaltungsanordnung mit mitteln zur überwachung der junktion-temperatur
KR910005443A (ko) 직접 장착 반도체 팩케이지
GB1374666A (en) Assembly comprising a micro electronic package a bus strip and a printed circuit base
JPS5636147A (en) Semiconductor device and its manufacture
WO1988003356A3 (en) Method and apparatus for producing a stamped substrate
EP0136568A3 (en) Electrical apparatus
KR920007944Y1 (ko) 스위치장치
JPS6428830A (en) Substrate for mounting semiconductor
KR200154914Y1 (ko) 복수프린트기판간의 리드선 연결구조
KR940000743Y1 (ko) 전기, 전자제품의 배선단자 설치구조