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SE522105C2 - Integrerad mikrovåghybridkrets - Google Patents

Integrerad mikrovåghybridkrets

Info

Publication number
SE522105C2
SE522105C2 SE9801988A SE9801988A SE522105C2 SE 522105 C2 SE522105 C2 SE 522105C2 SE 9801988 A SE9801988 A SE 9801988A SE 9801988 A SE9801988 A SE 9801988A SE 522105 C2 SE522105 C2 SE 522105C2
Authority
SE
Sweden
Prior art keywords
recess
hybrid circuit
topological
metallization
microwave hybrid
Prior art date
Application number
SE9801988A
Other languages
English (en)
Swedish (sv)
Other versions
SE9801988L (sv
SE9801988D0 (sv
Inventor
Viktor Anatolievich Iovdalsky
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of SE9801988L publication Critical patent/SE9801988L/xx
Publication of SE9801988D0 publication Critical patent/SE9801988D0/xx
Publication of SE522105C2 publication Critical patent/SE522105C2/sv

Links

Classifications

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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Die Bonding (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Waveguides (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
SE9801988A 1996-10-10 1998-06-04 Integrerad mikrovåghybridkrets SE522105C2 (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/RU1996/000294 WO1998015981A1 (fr) 1996-10-10 1996-10-10 Circuit integre hybride et a frequence micro-ondes

Publications (3)

Publication Number Publication Date
SE9801988L SE9801988L (sv) 1998-06-04
SE9801988D0 SE9801988D0 (sv) 1998-06-04
SE522105C2 true SE522105C2 (sv) 2004-01-13

Family

ID=20130049

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9801988A SE522105C2 (sv) 1996-10-10 1998-06-04 Integrerad mikrovåghybridkrets

Country Status (5)

Country Link
US (1) US6204555B1 (fr)
JP (1) JP2000516044A (fr)
KR (1) KR19990072029A (fr)
SE (1) SE522105C2 (fr)
WO (1) WO1998015981A1 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6259148B1 (en) * 1998-08-13 2001-07-10 International Business Machines Corporation Modular high frequency integrated circuit structure
KR100732648B1 (ko) * 2000-02-22 2007-06-28 도레이엔지니어링가부시키가이샤 비접촉 아이디 카드 및 그의 제조방법
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SE9801988L (sv) 1998-06-04
JP2000516044A (ja) 2000-11-28
US6204555B1 (en) 2001-03-20
KR19990072029A (ko) 1999-09-27
SE9801988D0 (sv) 1998-06-04

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