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SE0700501L - Micromechanical combination element and corresponding manufacturing procedure - Google Patents

Micromechanical combination element and corresponding manufacturing procedure

Info

Publication number
SE0700501L
SE0700501L SE0700501A SE0700501A SE0700501L SE 0700501 L SE0700501 L SE 0700501L SE 0700501 A SE0700501 A SE 0700501A SE 0700501 A SE0700501 A SE 0700501A SE 0700501 L SE0700501 L SE 0700501L
Authority
SE
Sweden
Prior art keywords
manufacturing procedure
corresponding manufacturing
combination element
micromechanical combination
micromechanical
Prior art date
Application number
SE0700501A
Other languages
Swedish (sv)
Inventor
Frank Reichenbach
Frank Fischer
Christoph Schelling
Arnim Hoechst
Stefan Weiss
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of SE0700501L publication Critical patent/SE0700501L/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/04Microphones
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B1/00Devices without movable or flexible elements, e.g. microcapillary devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023Packaging together an electronic processing unit die and a micromechanical structure die
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0092Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/02Sensors
    • B81B2201/0228Inertial sensors
    • B81B2201/0235Accelerometers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/02Sensors
    • B81B2201/0257Microphones or microspeakers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00Microstructural systems or auxiliary parts thereof
    • B81B2207/01Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00Forming microstructural systems
    • B81C2203/01Packaging MEMS
    • B81C2203/0118Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Chemical & Material Sciences (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
  • Micromachines (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
SE0700501A 2006-03-14 2007-03-01 Micromechanical combination element and corresponding manufacturing procedure SE0700501L (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102006011545.7A DE102006011545B4 (en) 2006-03-14 2006-03-14 Micromechanical combination component and corresponding manufacturing method

Publications (1)

Publication Number Publication Date
SE0700501L true SE0700501L (en) 2007-09-15

Family

ID=38374740

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0700501A SE0700501L (en) 2006-03-14 2007-03-01 Micromechanical combination element and corresponding manufacturing procedure

Country Status (4)

Country Link
JP (1) JP2007259439A (en)
KR (1) KR101056612B1 (en)
DE (1) DE102006011545B4 (en)
SE (1) SE0700501L (en)

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US7829366B2 (en) 2008-02-29 2010-11-09 Freescale Semiconductor, Inc. Microelectromechanical systems component and method of making same
WO2009133506A2 (en) * 2008-04-29 2009-11-05 Nxp B.V. Mems device and manufacturing method
JP4924663B2 (en) * 2008-12-25 2012-04-25 株式会社デンソー Semiconductor device and manufacturing method thereof
JP5260342B2 (en) * 2009-01-30 2013-08-14 ローム株式会社 MEMS sensor
DE102009002376A1 (en) * 2009-04-15 2010-10-21 Robert Bosch Gmbh Multichip sensor module and method of making same
US8119431B2 (en) * 2009-12-08 2012-02-21 Freescale Semiconductor, Inc. Method of forming a micro-electromechanical system (MEMS) having a gap stop
FR2954505B1 (en) * 2009-12-22 2012-08-03 Commissariat Energie Atomique MICROMECHANICAL STRUCTURE COMPRISING A MOBILE PART HAVING STOPS FOR OFFLINE SHIFTS OF THE STRUCTURE AND METHOD FOR CARRYING OUT THE SAME
DE102010008044B4 (en) * 2010-02-16 2016-11-24 Epcos Ag MEMS microphone and method of manufacture
JP5206726B2 (en) * 2010-04-12 2013-06-12 株式会社デンソー Mechanical quantity detection device and manufacturing method thereof
DE102010039057B4 (en) 2010-08-09 2018-06-14 Robert Bosch Gmbh sensor module
US8316718B2 (en) * 2010-08-23 2012-11-27 Freescale Semiconductor, Inc. MEMS pressure sensor device and method of fabricating same
JP5158160B2 (en) * 2010-09-10 2013-03-06 横河電機株式会社 Vibrating transducer
JP5541306B2 (en) 2011-05-27 2014-07-09 株式会社デンソー Mechanical quantity sensor device and manufacturing method thereof
FR2977319B1 (en) 2011-07-01 2014-03-14 Commissariat Energie Atomique OPTIMIZED SENSIBLITY PRESSURE MEASURING DEVICE
DE102011081033B4 (en) * 2011-08-16 2022-02-17 Robert Bosch Gmbh Process for producing a micromechanical structure and micromechanical structure
DE102012206732B4 (en) 2012-04-24 2024-12-12 Robert Bosch Gmbh Method for producing a hybrid integrated component
EP2693182A1 (en) * 2012-07-31 2014-02-05 Honeywell International Inc. On-chip resonant gyro and pressure sensor
US9562820B2 (en) 2013-02-28 2017-02-07 Mks Instruments, Inc. Pressure sensor with real time health monitoring and compensation
CN104678125B (en) * 2013-11-27 2019-07-02 中芯国际集成电路制造(上海)有限公司 The forming method of MEMS acceleration transducer
DE102013224623B4 (en) 2013-11-29 2022-10-06 Robert Bosch Gmbh Process for producing a micromechanical component
DE102014200500A1 (en) 2014-01-14 2015-07-16 Robert Bosch Gmbh Micromechanical pressure sensor device and corresponding manufacturing method
DE102014200512B4 (en) * 2014-01-14 2017-06-08 Robert Bosch Gmbh Micromechanical pressure sensor device and corresponding manufacturing method
DE102014200507A1 (en) * 2014-01-14 2015-07-16 Robert Bosch Gmbh Micromechanical pressure sensor device and corresponding manufacturing method
DE102016216207A1 (en) 2016-08-29 2018-03-01 Robert Bosch Gmbh Method for producing a micromechanical sensor
DE102016220077B4 (en) * 2016-10-14 2025-05-15 Robert Bosch Gmbh Method for producing a micromechanical pressure sensor
DE102019202794B3 (en) 2019-03-01 2019-11-07 Robert Bosch Gmbh Micromechanical sensor device and corresponding manufacturing method
WO2021054081A1 (en) * 2019-09-18 2021-03-25 Phcホールディングス株式会社 Electrode substrate, method for manufacturing same, and biosensor using electrode substrate
DE102019214414A1 (en) * 2019-09-23 2021-03-25 Robert Bosch Gmbh Micromechanical component for a pressure and inertial sensor device

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DK0561566T3 (en) * 1992-03-18 2000-03-27 Knowles Electronics Llc Solid state condenser microphone
DE19537814B4 (en) * 1995-10-11 2009-11-19 Robert Bosch Gmbh Sensor and method for producing a sensor
DE19847455A1 (en) * 1998-10-15 2000-04-27 Bosch Gmbh Robert Silicon multi-layer etching, especially for micromechanical sensor production, comprises etching trenches down to buried separation layer, etching exposed separation layer and etching underlying silicon layer
US6088463A (en) * 1998-10-30 2000-07-11 Microtronic A/S Solid state silicon-based condenser microphone
US6522762B1 (en) * 1999-09-07 2003-02-18 Microtronic A/S Silicon-based sensor system
JP2001227902A (en) * 2000-02-16 2001-08-24 Mitsubishi Electric Corp Semiconductor device
DE10017976A1 (en) * 2000-04-11 2001-10-18 Bosch Gmbh Robert Micromechanical component and corresponding manufacturing method
DE10065013B4 (en) * 2000-12-23 2009-12-24 Robert Bosch Gmbh Method for producing a micromechanical component
JP2002209299A (en) * 2000-12-28 2002-07-26 Toshiba Corp Semiconductor vibration sensor
JP2003078981A (en) * 2001-09-05 2003-03-14 Nippon Hoso Kyokai <Nhk> Microphone mounting circuit board and audio processing device mounting the board
GB0123054D0 (en) * 2001-09-25 2001-11-14 Randox Lab Ltd Passive microvalve
JP2003329704A (en) * 2002-05-14 2003-11-19 Mitsubishi Electric Corp Inertial force sensor and method of manufacturing the same
DE10221660B4 (en) * 2002-05-15 2007-12-27 Infineon Technologies Ag Method for producing a micromechanical, capacitive transducer
US20050172717A1 (en) * 2004-02-06 2005-08-11 General Electric Company Micromechanical device with thinned cantilever structure and related methods
KR100622372B1 (en) * 2004-06-01 2006-09-19 삼성전자주식회사 Gyro sensor comprising a plurality of configuration units and a manufacturing method thereof

Also Published As

Publication number Publication date
DE102006011545A1 (en) 2007-09-20
DE102006011545B4 (en) 2016-03-17
JP2007259439A (en) 2007-10-04
KR101056612B1 (en) 2011-08-11
KR20070093837A (en) 2007-09-19

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