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SE0001369L - Method and apparatus for processing substrates - Google Patents

Method and apparatus for processing substrates

Info

Publication number
SE0001369L
SE0001369L SE0001369A SE0001369A SE0001369L SE 0001369 L SE0001369 L SE 0001369L SE 0001369 A SE0001369 A SE 0001369A SE 0001369 A SE0001369 A SE 0001369A SE 0001369 L SE0001369 L SE 0001369L
Authority
SE
Sweden
Prior art keywords
cleaning
substrate
flushing
chamber
fluid
Prior art date
Application number
SE0001369A
Other languages
Unknown language ( )
Swedish (sv)
Other versions
SE0001369D0 (en
Inventor
Mats Haallberg
Original Assignee
Obducat Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Obducat Ab filed Critical Obducat Ab
Priority to SE0001369A priority Critical patent/SE0001369L/en
Publication of SE0001369D0 publication Critical patent/SE0001369D0/en
Priority to PCT/SE2001/000823 priority patent/WO2001079589A1/en
Priority to AU48967/01A priority patent/AU4896701A/en
Publication of SE0001369L publication Critical patent/SE0001369L/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G3/00—Apparatus for cleaning or pickling metallic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemically Coating (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

In a method for processing a substrate (S), for instance by etching or plating, use is made of an apparatus comprising a chamber (1) for receiving the substrate (S), a unit (10) for feeding a processing fluid to the chamber (1) before and/or during processing, and a flushing unit (20) for cleaning the substrate (S) by means of a flushing fluid after completed processing. The flushing unit (20) comprises a flushing fluid tank (21), a cleaning device (20') and a fluid feeding means (22, 24), the fluid feeding means (22, 24) being arranged to feed from the flushing fluid tank (21) the flushing fluid through the chamber (1) for cleaning the substrate (S) received therein, through the cleaning device (20') for cleaning the flushing fluid and back to the flushing fluid tank (21). Thus, the working operations for cleaning the processed substrate (S) are significantly simplified. The cleaning can easily be automated without necessitating expensive auxiliary equipment. Moreover cleaning takes place in an essentially closed environment inside the chamber (1), thereby minimising the environment's exposure to substances which are dangerous to health. Moreover, an essentially closed process with a minimum of emissions of environmentally dangerous residual products, such as metal ions, is made possible.
SE0001369A 2000-04-13 2000-04-13 Method and apparatus for processing substrates SE0001369L (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE0001369A SE0001369L (en) 2000-04-13 2000-04-13 Method and apparatus for processing substrates
PCT/SE2001/000823 WO2001079589A1 (en) 2000-04-13 2001-04-12 Method in and apparatus for etching or plating of substrates
AU48967/01A AU4896701A (en) 2000-04-13 2001-04-12 Method in and apparatus for etching or plating of substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0001369A SE0001369L (en) 2000-04-13 2000-04-13 Method and apparatus for processing substrates

Publications (2)

Publication Number Publication Date
SE0001369D0 SE0001369D0 (en) 2000-04-13
SE0001369L true SE0001369L (en) 2001-10-14

Family

ID=20279305

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0001369A SE0001369L (en) 2000-04-13 2000-04-13 Method and apparatus for processing substrates

Country Status (3)

Country Link
AU (1) AU4896701A (en)
SE (1) SE0001369L (en)
WO (1) WO2001079589A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2264524A3 (en) 2000-07-16 2011-11-30 The Board of Regents of The University of Texas System High-resolution overlay alignement methods and systems for imprint lithography
WO2002006902A2 (en) 2000-07-17 2002-01-24 Board Of Regents, The University Of Texas System Method and system of automatic fluid dispensing for imprint lithography processes
US6964793B2 (en) 2002-05-16 2005-11-15 Board Of Regents, The University Of Texas System Method for fabricating nanoscale patterns in light curable compositions using an electric field
US6932934B2 (en) 2002-07-11 2005-08-23 Molecular Imprints, Inc. Formation of discontinuous films during an imprint lithography process
US7077992B2 (en) 2002-07-11 2006-07-18 Molecular Imprints, Inc. Step and repeat imprint lithography processes
US6916584B2 (en) 2002-08-01 2005-07-12 Molecular Imprints, Inc. Alignment methods for imprint lithography
US7071088B2 (en) 2002-08-23 2006-07-04 Molecular Imprints, Inc. Method for fabricating bulbous-shaped vias
US6929762B2 (en) 2002-11-13 2005-08-16 Molecular Imprints, Inc. Method of reducing pattern distortions during imprint lithography processes
US6871558B2 (en) 2002-12-12 2005-03-29 Molecular Imprints, Inc. Method for determining characteristics of substrate employing fluid geometries
US7452574B2 (en) 2003-02-27 2008-11-18 Molecular Imprints, Inc. Method to reduce adhesion between a polymerizable layer and a substrate employing a fluorine-containing layer
US7122079B2 (en) 2004-02-27 2006-10-17 Molecular Imprints, Inc. Composition for an etching mask comprising a silicon-containing material
DE10318074B4 (en) 2003-04-17 2009-05-20 Qimonda Ag Process for making BOC module assemblies with improved mechanical properties
US7157036B2 (en) 2003-06-17 2007-01-02 Molecular Imprints, Inc Method to reduce adhesion between a conformable region and a pattern of a mold
US7136150B2 (en) 2003-09-25 2006-11-14 Molecular Imprints, Inc. Imprint lithography template having opaque alignment marks
US8850980B2 (en) 2006-04-03 2014-10-07 Canon Nanotechnologies, Inc. Tessellated patterns in imprint lithography
US7547398B2 (en) 2006-04-18 2009-06-16 Molecular Imprints, Inc. Self-aligned process for fabricating imprint templates containing variously etched features

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4880436A (en) * 1972-01-31 1973-10-27
DE2359691A1 (en) * 1973-11-30 1975-06-05 Josef Dr Phil Heyes Maintaining constant levels in electroplating and rinsing tanks - and controlling the flow of rinsing water
US4163705A (en) * 1975-05-06 1979-08-07 Korpi Teuvo Tapio Apparatus for chemical and electrochemical treatment
IT1177925B (en) * 1984-07-24 1987-08-26 Centro Speriment Metallurg PROCEDURE FOR CONTINUOUS ELECTRODEPOSITION OF METALS WITH HIGH CURRENT DENISTA OF VERTICAL CELLS AND RELEVANT IMPLEMENTATION DEVICE
ATE127865T1 (en) * 1988-11-24 1995-09-15 Gerhard Gramm DEVICE FOR APPLYING AND/OR REMOVAL OF COATINGS ON WORKPIECES.
US5180438A (en) * 1989-10-11 1993-01-19 Hockh Metall-Reinigungsanlagen Gmbh Cleaning and drying system
DE3936363A1 (en) * 1989-11-02 1991-05-08 Hoellmueller Maschbau H Etching unit esp. for printed copper circuit boards - in which used rinsing water is distilled to recover pure water and ammoniacal etchant to which ammonia is added prior to recycling
DE3939222C1 (en) * 1989-11-28 1990-11-08 Schering Ag, 1000 Berlin Und 4709 Bergkamen, De
JP3161494B2 (en) * 1993-12-28 2001-04-25 日本軽金属株式会社 Method for cleaning and draining aluminum material after anodizing
DE4413077C2 (en) * 1994-04-15 1997-02-06 Steag Micro Tech Gmbh Method and device for chemical treatment of substrates

Also Published As

Publication number Publication date
AU4896701A (en) 2001-10-30
SE0001369D0 (en) 2000-04-13
WO2001079589A1 (en) 2001-10-25

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Legal Events

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