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SE0000587D0 - Apparatus for heat transport away from heated elements and a method for manufacturing the apparatus - Google Patents

Apparatus for heat transport away from heated elements and a method for manufacturing the apparatus

Info

Publication number
SE0000587D0
SE0000587D0 SE0000587A SE0000587A SE0000587D0 SE 0000587 D0 SE0000587 D0 SE 0000587D0 SE 0000587 A SE0000587 A SE 0000587A SE 0000587 A SE0000587 A SE 0000587A SE 0000587 D0 SE0000587 D0 SE 0000587D0
Authority
SE
Sweden
Prior art keywords
channels
liquid
manufacturing
path
heated elements
Prior art date
Application number
SE0000587A
Other languages
Swedish (sv)
Other versions
SE0000587L (en
Inventor
Goeran Linder
Jari Tuomela
Original Assignee
Teracom Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teracom Ab filed Critical Teracom Ab
Priority to SE0000587A priority Critical patent/SE0000587L/en
Publication of SE0000587D0 publication Critical patent/SE0000587D0/en
Priority to AU2001236288A priority patent/AU2001236288A1/en
Priority to PCT/SE2001/000387 priority patent/WO2001063666A1/en
Publication of SE0000587L publication Critical patent/SE0000587L/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

An apparatus is provided for transporting away heat from heated elements. The ap-paratus comprises a block (9; 18; 27) of a material having good thermal conductivity on to which the elements are provided in thermal contact. Channels (7,8; 17; 25) are provided in the block. A liquid, for example water, is forced to flow through the channels. Path means (10, 11; 15, 16; 28, 29) in the channels provide a spiral path for the liquid. Whirl means (7,8; 17; 25) in the liquid path provide turbulence to the streaming water. The channels could be made by tubes having corrugated thin walls and made by a non-corrosive material against the streaming liquid, such as steel, preferably acid proof stainless steel. The tubes could be cast, or fastened in some other way, in a material having good thermal conductivity, for example aluminium. A method for producing the apparatus is also disclosed.
SE0000587A 2000-02-23 2000-02-23 Apparatus for removing heat from heated elements and method of manufacturing the apparatus. SE0000587L (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SE0000587A SE0000587L (en) 2000-02-23 2000-02-23 Apparatus for removing heat from heated elements and method of manufacturing the apparatus.
AU2001236288A AU2001236288A1 (en) 2000-02-23 2001-02-22 Apparatus for heat transport away from heated elements and method for manufacturing the apparatus
PCT/SE2001/000387 WO2001063666A1 (en) 2000-02-23 2001-02-22 Apparatus for heat transport away from heated elements and a method for manufacturing the apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0000587A SE0000587L (en) 2000-02-23 2000-02-23 Apparatus for removing heat from heated elements and method of manufacturing the apparatus.

Publications (2)

Publication Number Publication Date
SE0000587D0 true SE0000587D0 (en) 2000-02-23
SE0000587L SE0000587L (en) 2001-08-24

Family

ID=20278557

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0000587A SE0000587L (en) 2000-02-23 2000-02-23 Apparatus for removing heat from heated elements and method of manufacturing the apparatus.

Country Status (3)

Country Link
AU (1) AU2001236288A1 (en)
SE (1) SE0000587L (en)
WO (1) WO2001063666A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE524673C2 (en) * 2003-01-31 2004-09-14 Tykoflex Ab Apparatus for cooling heat-generating components by means of a cooling plate and processes for making the same
US7542495B1 (en) 2007-11-12 2009-06-02 Gooch And Housego Plc Corrosion resistant cooled acousto-optic devices
CN101610664B (en) 2008-06-20 2014-05-14 萨帕铝型材（上海）有限公司 Liquid cooler and manufacture method thereof
WO2011031526A2 (en) * 2009-08-27 2011-03-17 Air Motion Systems, Inc. Interchangeable uv led curing system
JP5621908B2 (en) 2011-03-10 2014-11-12 トヨタ自動車株式会社 Cooler
US9468131B2 (en) * 2014-04-16 2016-10-11 Raytheon Company Monolithic multi-module electronics chassis with multi-planar embedded fluid cooling channels
KR102792718B1 (en) * 2022-03-08 2025-04-07 엘에스일렉트릭(주) flow path module and electric device include the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1238462A (en) * 1967-07-11 1971-07-07
JPH06101524B2 (en) * 1985-09-18 1994-12-12 株式会社東芝 Cooling element for semiconductor element
DE4301865A1 (en) * 1993-01-25 1994-07-28 Abb Management Ag Cooling box for electric component
DE4421025C2 (en) * 1994-06-16 1999-09-09 Abb Patent Gmbh Heatsink with at least one cooling channel
JPH08215737A (en) * 1995-02-17 1996-08-27 Toshiba Corp Method of manufacturing cooling block for semiconductor device and cooling block thereof
DE19747321C2 (en) * 1997-10-27 2002-08-01 Semikron Elektronik Gmbh Liquid cooler for power semiconductor components

Also Published As

Publication number Publication date
WO2001063666A1 (en) 2001-08-30
AU2001236288A1 (en) 2001-09-03
SE0000587L (en) 2001-08-24

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Legal Events

Date Code Title Description
NAV Patent application has lapsed