RU2836688C2 - Lens assembly and electronic device containing it - Google Patents

Abstract

FIELD: physics.

SUBSTANCE: invention relates to electronic devices including several chambers. Lens assembly comprises at least two lenses aligned along a first optical axis; image sensor configured to receive light guided or condensed through at least two lenses; and at least one optical element located between the at least two lenses and the image sensor with the possibility of receiving light falling through the at least two lenses and refracting or reflecting the light at least twice in order to direct or emit light into the sensor images. Ratio of the longer side of the imaging surface of the image sensor to the longer side of the radiation surface of the first optical element closest to the image sensor is within said range.

EFFECT: high quality of the captured image.

14 cl, 14 dwg, 1 tbl

Description

Field of technology to which the invention relates

[1] The disclosure relates to an electronic device, and more particularly, to a lens assembly and an electronic device containing the same.

State of the art

[2] Electronic devices may refer to devices that perform specific functions based on embedded programs, such as home appliances, electronic notepads, portable media players (PMPs), mobile communication terminals, tablet personal computers (PCs), video/audio devices, desktop/laptop computers, vehicle navigation systems, etc. For example, these electronic devices can output stored information in the form of sound or images. With the increasing integration of electronic devices and the widespread use of high-speed, large-volume wireless communication, various functions are recently provided in a single electronic device, such as a mobile communication terminal. For example, various functions, such as an entertainment function such as games, a multimedia function such as music/video playback, a communication and security function for mobile banking, and/or a function such as schedule management or an electronic wallet, as well as a communication function, are integrated into a single electronic device.

[3] The development of digital camera technology commercializes electronic devices equipped with small and lightweight camera modules. Electronic devices (such as mobile communication terminals) that are usually carried around are equipped with camera modules so that users can easily enjoy various functions, including not only still or moving image capture, but also video conferencing and augmented reality.

[4] Recently, electronic devices including multiple cameras have been widely used. An electronic device may include, for example, a camera module including a wide-angle camera and a telephoto camera. The electronic device may use the wide-angle camera to photograph a wide range of scenes on the periphery of the electronic device, thereby obtaining wide-angle images, or may use the telephoto camera to photograph scenes corresponding to locations relatively far from the electronic device, thereby obtaining telephoto images. In this regard, compact electronic devices (e.g., smartphones) including multiple camera modules or lens assemblies are gradually replacing compact cameras and are expected to replace high-performance cameras (e.g., single-lens reflex cameras) in the future.

[5] The above information may be provided as background information to assist in understanding the disclosure. No claim or determination is made as to whether or not any of the above description is applicable as prior art in connection with the disclosure.

The essence of the invention

Technical solution

[6] According to an embodiment of the disclosure, the lens assembly may comprise at least two lenses aligned along a direction along the first optical axis; an image sensor configured to receive light directed or condensed through the at least two lenses; and at least one optical element R1 located between at least two lenses and the image sensor with the ability to receive light incident through the at least two lenses and refract or reflect the light at least twice and then direct or emit the light to the image sensor. In an embodiment, the lens assembly may satisfy the following conditional equation 1 and conditional equation 2.

[7] conditional equation 1

[8] 1.2≤w/img-X≤2.5

[9] conditional equation 2

[10] 15≤Ang-min≤40

[11] In this document, "img-X" represents the length of the longer side of the horizontal/vertical lengths of the imaging surface (img) of the image sensor; "w" represents the length of the longer side of the horizontal/vertical lengths of the emitting surfaces facing the image sensor of the surfaces of the optical element (hereinafter in this document, "first optical element") closest to the image sensor of at least one optical element; and "Ang-min" represents the smallest angle of the angles formed by two adjacent surfaces of the first optical element.

[12] According to an embodiment of the disclosure, an electronic device may comprise a lens assembly, a memory storing instructions for obtaining an image, and a processor configured to execute the instructions for obtaining an image by receiving external light using the lens assembly. In an embodiment, the lens assembly may comprise at least two lenses aligned along a direction along a first optical axis; an image sensor configured to receive light directed or condensed through the at least two lenses; and at least one optical element located between the at least two lenses and the image sensor with the ability to receive light incident through the at least two lenses and refract or reflect the light at least twice, and then direct or emit the light to the image sensor. In an embodiment, the lens assembly may satisfy the following conditional equation 5 and conditional equation 6.

[13] conditional equation 5

[14] 1.2≤w/img-X≤2.5

[15] conditional equation 6

[16] 15≤Ang-min≤40

[17] In this document, "img-X" represents the length of the longer side of the horizontal/vertical lengths of the imaging surface (img) of the image sensor; "w" represents the length of the longer side of the horizontal/vertical lengths of the emitting surfaces facing the image sensor of the surfaces of the optical element (hereinafter in this document, "first optical element") closest to the image sensor of the at least one optical element; and "Ang-min" represents the smallest angle of the angles formed by two adjacent surfaces of the first optical element.

Brief description of the drawings

[18] The above and other aspects, features and advantages of the disclosure will become apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[19] Fig. 1 is a block diagram illustrating an electronic device in a network environment according to an embodiment;

[20] Fig. 2 is a front perspective view illustrating an electronic device according to an embodiment;

[21] Fig. 3 is a rear perspective view illustrating the electronic device shown in Fig. 2, according to an embodiment;

[22] Fig. 4 is an exploded perspective view illustrating an electronic device according to an embodiment;

[23] Fig. 5 is a rear top view illustrating a rear surface of the electronic device according to the embodiment;

[24] Fig. 6 is a cross-sectional view of a portion of the electronic device shown in Fig. 5 along line AA' according to an embodiment;

[25] Fig. 7 is a view illustrating an optical path of a camera module in an electronic device according to an embodiment;

[26] Fig. 8 is a view illustrating a lens assembly according to an embodiment;

[27] Fig. 9 is a view illustrating a first optical element of a lens assembly according to an embodiment;

[28] Fig. 10 is a view illustrating an image forming surface of an image sensor and an emission surface of a first optical element in a lens unit according to an embodiment;

[29] Fig. 11 is a view illustrating a lens assembly according to an embodiment;

[30] Fig. 12 is a view illustrating an image forming surface of an image sensor and an emission surface of a first optical element in a lens unit according to an embodiment;

[31] Fig. 13 is a view illustrating a lens assembly according to an embodiment; and

[32] Fig. 14 is a view illustrating an image forming surface of an image sensor and an emission surface of a first optical element in a lens unit according to an embodiment.

[33] Throughout the accompanying drawings, like reference numbers may be assigned to like components, configurations and/or structures.

Optimal mode of implementation of the invention

[34] As electronic devices become more compact and lightweight, it may be more convenient to carry electronic devices. In an environment in which a display is deployed to allow a user to enjoy a large screen even in a portable electronic device, electronic devices may become more compact and lightweight by reducing their thickness. However, in this case, it may be difficult to mount a lens assembly having good optical performance due to the narrow space of a miniaturized electronic device. For example, as the number or size of a lens assembly becomes large, it may be easier to ensure good optical performance of a lens assembly; however, as a result, the degree of design freedom may decrease in the placement of a lens or image sensors in a miniaturized electronic device.

[35] An embodiment of the disclosure is to solve the above-described problems and/or disadvantages and provide the advantages described below by providing a lens assembly having increased design freedom and/or an electronic device incorporating the same.

[36] In an embodiment of the disclosure, a lens assembly that can be easily positioned in a narrow space and/or an electronic device including the same may be provided.

[37] The problems to be solved by the present disclosure are not limited to the above problems, and other technical problems that are not mentioned can be clearly understood from the following disclosure by those skilled in the art.

[38] The following description with reference to the accompanying drawings may be provided to assist in a comprehensive understanding for implementing the disclosure defined by the claims and their equivalents in various ways. The specific embodiments disclosed in the following description contain various specific details to assist in understanding, but may be considered as one of various embodiments. Accordingly, it will be apparent to those skilled in the art that various changes and modifications to the various implementations disclosed in the disclosure may be made without departing from the technical spirit and scope of the disclosure. In addition, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[39] The terms and words used in the description and claims below are not limited to bibliographic meanings and may be used to clearly and consistently describe various embodiments of the disclosure. Accordingly, it should be obvious to those skilled in the art that the descriptions below for various embodiments of the disclosure are provided for purposes of explanation only and not for purposes of limiting the disclosure as defined in the scope of rights and their equivalents.

[40] It should be understood that the use of a term in the singular includes its meaning in the plural unless the context clearly indicates otherwise. Thus, for example, it may mean that the term "surface of an element" includes one or more surfaces of an element.

[41] Fig. 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to an embodiment of the disclosure. Referring to Fig. 1, the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via a first network 198 (e.g., a short-range wireless communication network) or the electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 can communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 can include a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a tactile module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identity module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the connection terminal 178) can be omitted from the electronic device 101, or one or more other components can be added to the electronic device 101. According to an embodiment, some of the components (e.g., the sensor module 176, the camera module 180 or the antenna module 197) may be integrated as a single component (e.g., the display module 160).

[42] The processor 120 may execute, for example, software (e.g., program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or computation. According to an embodiment, as at least part of processing or computing data, the processor 120 may store an instruction or data received from another component (e.g., the sensor module 176 or the communication module 190) in the volatile memory 132, process the instruction or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)), which operates independently of or in combination with the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may be configured to use a lesser amount of power than main processor 121, or be implemented specifically for the designated function. The auxiliary processor 123 can be implemented separately from the main processor 121 or as a part thereof.

[43] The auxiliary processor 123 may control at least some of the functions or states related to at least one component (for example, the display module 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101, instead of the main processor 121, while the main processor 121 is in an inactive (for example, sleeping) state, or together with the main processor 121, while the main processor 121 is in an active state (for example, executing an application). According to an embodiment, the auxiliary processor 123 (for example, an image signal processor or a communication processor) may be implemented as part of another component (for example, a camera module 180 or a communication module 190) operatively connected to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (for example, a neural processor) may include a hardware structure indicated for processing an artificial intelligence-based model. The artificial intelligence model may be formed by machine learning. Such learning may be performed, for example, by the electronic device 101, where the artificial intelligence is executed, or by a separate server (for example, the server 108). The learning algorithms may include, but are not limited to, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of an artificial neural network. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a two-way recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of them, but not limited to. The artificial intelligence model may additionally or alternatively include a software structure different from a hardware structure.

[44] Memory 130 may store various data used by at least one component (e.g., processor 120 or sensor module 176) of electronic device 101. Various data may include, for example, software (e.g., program 140) and input data or output data for a command associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[45] The program 140 may be stored in the memory 130 as software and may include, for example, an operating system (OS) 142, middleware 144, or an application 146.

[46] The input module 150 may receive a command or data to be used by another component (e.g., the processor 120) of the electronic device 101, from outside (e.g., from a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus pen).

[47] The audio output module 155 may output audio signals outside the electronic device 101. The audio output module 155 may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as playing media or playing a recording. The receiver may be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from the speaker or as part of it.

[48] The display module 160 may visually provide information to the outside (e.g., to the user) from the electronic device 101. The display module 160 may include, for example, a display, a holographic device, or a projector and a control circuit to control a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by a touch.

[49] The audio module 170 can convert sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 can receive sound through the input module 150 or output sound through the sound output module 155 or the earphone of an external electronic device (for example, the electronic device 102) directly (for example, wired) or wirelessly connected to the electronic device 101.

[50] The sensor module 176 may detect an operating state (for example, power or temperature) of the electronic device 101 or an environmental state (for example, a user state) external to the electronic device 101, and then generate an electrical signal or a data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyroscopic sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or a light sensor.

[51] Interface 177 may support one or more specified protocols that are to be used to connect electronic device 101 to an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly. According to an embodiment, interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[52] The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (for example, the electronic device 102). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (for example, a headphone connector).

[53] The tactile module 179 may convert an electrical signal into a mechanical excitation (e.g., vibration or movement) or an electrical excitation that can be recognized by the user through his sense of touch or kinesthetic sense. According to an embodiment, the tactile module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[54] The camera module 180 may capture a still image or moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

[55] The power control module 188 may control the power supplied to the electronic device 101. According to an embodiment, the power control module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

[56] The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a primary cell that is not rechargeable, a secondary cell that is rechargeable, or a fuel cell.

[57] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication via the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (e.g., an application processor (AP)) and support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding module of these communication modules can communicate with the external electronic device 104 via the first network 198 (for example, a short-range communication network such as Bluetooth™, a direct connection with wireless authenticity (Wi-Fi) or the Infrared Data Association (IrDA) standard) or the second network 199 (for example, a long-range communication network such as a cellular network, a 5G network, a next-generation communication network, the Internet or a computer network (for example, a local area network (LAN) or a wide area network (WAN)). These different types of communication modules can be implemented as a single component (for example, a single chip) or can be implemented as a plurality of components (for example, a plurality of chips) separate from each other. The wireless communication module 192 can identify or authenticate the electronic device 101 in the communication network, such as the first network 198 or the second network 199, using subscriber information (for example, an international mobile subscriber identity (IMSI)), stored in the subscriber identification module 196.

[58] The wireless communication module 192 may support a 5G network, after the 4G network, and a next-generation communication technology, such as a new radio communication (NR) access technology. The NR access technology may support enhanced mobile broadband (eMBB), machine-type streaming communications (mMTC), or ultra-reliable and low-latency communications (URLLC). The wireless communication module 192 may support a high-frequency range (for example, a millimeter-wave range) in order to achieve, for example, a high data rate. The wireless communication module 192 may support various technologies for ensuring performance in the high-frequency range, such as, for example, beamforming, massive multiple-input and multiple-output (massive MIMO), full-size MIMO (FD-MIMO), antenna array, analog beamforming, or a large-scale antenna. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (for example, the electronic device 104), or a network system (for example, the second network 199). According to an embodiment, the wireless communication module 192 can support a peak data rate (for example, 20 Gbps or more) for implementing eMBB, loss coverage (for example, 164 dB or less) for implementing mMTC, or a U-plane delay (for example, 0.5 ms or less for each downlink (DL) and uplink (UL), or a round-trip time of 1 ms or less) for implementing URLLC.

[59] The antenna module 197 may transmit or receive a signal or power to or from outside (e.g., from an external electronic device). According to an embodiment, the antenna module 197 may include one antenna including a radiator formed from a conductor or a conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., antenna arrays). In this case, at least one antenna suitable for the communication scheme used in the communication network, for example, in the first network 198 or in the second network 199, may be selected from the plurality of antennas, for example, by means of the communication module 190. The signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, other parts (e.g., a radio frequency integrated circuit (RFIC)) in addition to the emitter may be further formed as part of the antenna module 197.

[60] According to an embodiment, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, an RFIC arranged on a first surface (e.g., a lower surface) of the printed circuit board or near the first surface and adapted to support a high frequency range (e.g., a millimeter wave range), and a plurality of antennas (e.g., an antenna array) arranged on a second surface (e.g., a top or side surface) of the printed circuit board, or near the second surface and adapted to transmit or receive signals of the intended high frequency range.

[61] At least some of the above-described components may be interconnected and exchange signals (e.g., commands or data) with each other via a peripheral device communication scheme (e.g., a bus, a general-purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industrial processor interface (MIPI)).

[62] According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the external electronic devices 102 and 104 may be a device of the same type or a different type relative to the electronic device 101. According to an embodiment, all or some of the operations to be performed in the electronic device 101 may be performed in one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 is to perform a function or service automatically or in response to a request from a user or another device, the electronic device 101, instead of or in addition to performing the function or service, may request one or more external electronic devices to perform at least a portion of the function or service. One or more external electronic devices receiving the request can perform at least a part of the requested function or service or an additional function or additional service associated with the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 can provide the result, with or without subsequent processing of the result, as at least a part of the response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC) or client-server computing technology can be used, for example. The electronic device 101 can provide services with ultra-low latency using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 can include an Internet of Things (IoT) device. The server 108 can be an intelligent server using machine learning and/or a neural network. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (for example, an intelligent home, an intelligent city, an intelligent car or healthcare) based on 5G communication technology or IoT-related technology.

[63] The electronic device according to the embodiment(s) of the present invention may be one of various types of electronic devices. Electronic devices may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to the embodiment of the invention, the electronic devices are not limited to those described above.

[64] It should be understood that the various embodiments of the disclosure and the terms used therein are not intended to limit the technological features set forth herein to specific embodiments and include various modifications, equivalents or substitutions for the corresponding embodiment. With respect to the description of the drawings, like reference numerals may be used to refer to like or related elements. It should be understood that the singular form of a noun corresponding to an item may include one or more elements unless the relevant context clearly indicates otherwise. As used herein, each of phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B or C" may include all possible combinations of the items listed together in the corresponding one of the phrases. When used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the respective component from another, and do not limit the components in another respect (e.g., importance or order). It should be understood that when an element (e.g., a first element) is referred to, with or without the term "operably" or "communicatively", as "associated with", "attached to", "connected to" or "connected to" another element (e.g., a second element), it means that the element can be connected to the other element directly (e.g., by wire), wirelessly, or through a third element.

[65] When used in embodiments of the disclosure, the term "module" may include a module implemented in hardware, software, or firmware, and may be used interchangeably with other terms such as "logic," "logical block," "part," or "circuit." A module may be a single component or a minimal unit or portion thereof adapted to perform one or more functions. For example, according to an embodiment, a module may be implemented as an application-specific integrated circuit (ASIC).

[66] Embodiments of the disclosure may be implemented as software (e.g., program 140) including one or more instructions stored on a storage medium (e.g., internal memory 136 or external memory 138) that is readable by a machine (e.g., electronic device 101). For example, a processor (e.g., processor 120) of a machine (e.g., electronic device 101) may cause at least one of the one or more instructions stored on the storage medium to be executed, with or without the assistance of one or more other components under the control of the processor. This enables the machine to operate with the ability to perform at least one function according to at least one activated instruction. The one or more instructions may include code generated by a compiler or code executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. In this case, the term "non-volatile" simply means that the storage medium is a tangible device and does not include a signal (such as an electromagnetic wave), but this term does not distinguish between where data is stored semi-permanently on the storage medium and where data is temporarily stored on the storage medium.

[67] According to an embodiment, the method according to various embodiments of the disclosure may be included and provided in a computer program product. Computer program products may be traded as goods between sellers and buyers. The computer program product may be distributed in the form of a computer-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)) or distributed (e.g., downloaded or uploaded) online through an application store (e.g., PlayStore™) or between two user devices (e.g., smartphones) directly. When distributed on a network, at least a portion of the computer program product may be temporarily generated or at least temporarily stored on a computer-readable storage medium, such as the memory of a manufacturer's server, an application store server, or a relay server.

[68] According to an embodiment, each component (e.g., a module or program) of the above-described components may include a single entity object or a plurality of entity objects. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, a plurality of components (e.g., modules or programs) may be combined into a single component. In such a case, according to various embodiments, the integrated component may still perform one or more functions of each of the plurality of components in the same or similar manner as they were performed by a corresponding one of the plurality of components before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more operations may be performed in a different order or omitted, or other operations may be added.

[69] In the detailed descriptions below, a length direction, a width direction, and/or a thickness direction of the electronic device may be mentioned, the length direction may mean the "Y-axis direction", the width direction may mean the "X-axis direction", and/or the thickness direction may mean the "Z-axis direction". In an embodiment, in connection with the direction in which an element is oriented, in addition to the orthogonal coordinate system illustrated in the drawings, "negative/positive (-/+)" may be mentioned together with it. For example, a front surface of the electronic device or housing may be defined "as a surface facing the +Z-axis direction", and a back surface thereof may be defined "as a surface facing the -Z-axis direction". In an embodiment, a side surface of the electronic device or housing may include a region facing the +X-axis direction, a region facing the +Y-axis direction, a region facing the -X-axis direction, and/or a region facing the -Y-axis direction. In an embodiment, the "X-direction" may have a meaning including both the "-X-direction" and the "+X-direction". The above is based on the orthogonal coordinate system illustrated in the drawings for the sake of brevity of descriptions, and it should be noted that the directions or descriptions of the elements do not limit the various embodiments disclosed in the disclosure.

[70] Fig. 2 is a front perspective view illustrating an electronic device (200) according to an embodiment of the disclosure. Fig. 3 is a rear perspective view illustrating the electronic device (200) shown in Fig. 2, according to an embodiment of the disclosure.

[71] Referring to Figs. 2 and 3, an electronic device 200 according to an embodiment may comprise a housing 310 including a first surface 210A (or front surface), a second surface 210B (or back surface), and a side surface 210C surrounding a space defined between the first surface 210A and the second surface 210B. In an embodiment, the housing may refer to a structure that forms a portion of the first surface 210A, the second surface 210B, and the side surface 210C in Fig. 2. According to an embodiment, at least a portion of the first surface 210A may be formed by a substantially transparent front plate 202 (e.g., a glass plate or a polymer plate including various covering layers). The second surface 210B can be formed by a substantially opaque back plate 211. The back plate 211 can be formed, for example, from coated or colored glass, ceramic, polymer or metal (for example, aluminum, stainless steel (STS) or magnesium) or from a combination of two or more of these materials. The side surface 210C can be formed by a side structure 218 (or a side frame structure) connected to the front plate 202 and to the back plate 211 and including metal and/or polymer. In an embodiment, the back plate 211 and the side structure 218 can be formed as a single unit and include the same material (for example, a metal material, such as aluminum).

[72] In the illustrated embodiment, the front plate 202 may include two first regions 210D that transparently and bendably extend from the first surface 210A to the back plate 211, on both long edges of the front plate 202. In the illustrated embodiment (see Fig. 3), the back plate 211 may include two second regions 210E that bendably and transparently extend from the second surface 210B to the front plate 202, on both long edges thereof. According to an embodiment, the front plate 202 (or the back plate 211) may include only one of the first regions 210D (or the second regions 210E). In an embodiment, some of the first regions 210D or the second regions 210E may not be included. In the above-described embodiments, when viewing the electronic device 200 from the side, the side structure 218 may have a first thickness (or width) for the side that does not include the first regions 210D or the second regions 210E, and may have a second thickness, which is less than the first thickness, for the side that includes the first regions 210D or the second regions 210E.

[73] According to an embodiment, the electronic device 200 may include at least one or more of the display 201, the audio modules 203, 207 and 214, the sensor modules 204, 216 and 219, the camera modules 205, 212 and 213, the key input device 217, the light emitting element 206 and the connector cavities 208 and 209. In an embodiment, at least one of the components (for example, the key input device 217 or the light emitting element 206) may be omitted from the electronic device 200, or the electronic device 200 may further include other components.

[74] The display 201 may be visually exposed for access, for example, through a large portion of the front plate 202. In an embodiment, at least a portion of the display 201 may be exposed for access through the first surface 210A and the front plate 202 forming the first regions 210D of the side surface 210C. In an embodiment, the edges of the display 201 may be formed substantially identical to the shape of the contour of the front plate 202 adjacent to them. In an embodiment, the interval between the outer edge of the display 201 and the outer edge of the front plate 202 may be formed substantially constant so as to expand the visually exposed area of the display 201.

[75] In an embodiment, the region of the display screen 201 may form a recess or an opening in its portion and may include at least one or more of the audio module 214, the sensor module 204, the camera module 205, and the light emitting element 206, which are aligned with the recess or opening. In an embodiment, at least one or more of the audio module 214, the sensor module 204, the camera module 205, the fingerprint sensor 216, and the light emitting element 206 may be included in the back surface of the region of the display screen 201. In an embodiment, the display 201 may be attached to or located near a touch sensing circuit, a pressure sensor capable of measuring the intensity of a touch (pressure), and/or a digitizer detecting a stylus pen based on a magnetic field. In an embodiment, at least a portion of the sensor modules 204 and 219 and/or at least a portion of the key input device 217 may be located in the first regions 210D and/or in the second regions 210E.

[76] The audio modules 203, 207 and 214 may include, for example, a cavity 203 for a microphone and cavities 207 and 214 for a speaker. The cavity 203 for a microphone may include a microphone arranged therein so as to receive external sound, and in an embodiment, a plurality of microphones may be arranged therein with the ability to detect the direction of sound. The cavities 207 and 214 for a speaker may include a cavity 207 for an external speaker and a cavity 214 for a telephone call receiver. In an embodiment, the cavities 207 and 214 for a speaker and the cavity 203 for a microphone are implemented as a single cavity, or a speaker may be included without the cavities 207 and 214 for a speaker (for example, a piezo speaker).

[77] The sensor modules 204, 216 and 219 may generate an electrical signal or a correspondence of a data value, such as an internal operating state or a state of the external environment of the electronic device 200. The sensor modules 204, 216 and 219 may include, for example, a first sensor module 204 (for example, a contactless sensor) and/or a second sensor module (for example, a fingerprint sensor), which are located on the first surface 210A of the housing 210e and/or a third sensor module 219 (for example, an HRM sensor) and/or a fourth sensor module 216 (for example, a fingerprint sensor), which are located on the second surface 210B of the housing 210. The fingerprint sensor may be located not only on the first surface 210A (for example, the display 201) of the housing 210, but also on the second surface 210B. The electronic device 200 may further include at least one of the sensor modules 176 of Fig. 1, such as a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip force sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and a light sensor.

[78] The camera modules 205, 212 and 213 may include, for example, a first device 205 with a camera located on the first surface 210A of the electronic device 200, and a second device 212 with a camera and/or a flash 213 located on the second surface 210B. The camera modules 205 and 212 may include one or more lenses, an image sensor and/or an image signal processor. The flash 213 may include, for example, a light-emitting diode or a xenon lamp. In an embodiment, two or more lenses (for example, an infrared camera lens, a wide-angle lens and a telephoto lens) and image sensors may be located on one surface of the electronic device 200.

[79] The key input device 217 may be located on the side surface 210C of the housing 210. In an embodiment, the electronic device 200 may not include part or all of the above-mentioned key input device 217, and the key input device 217 that is not included may be implemented in another form, for example, as a programmable key on the display 201. In an embodiment, the key input device may include a sensor module 216 located on the second surface 210B of the housing 210.

[80] The light emitting element 206 may be located, for example, on the first surface 210A of the housing 210. The light emitting element 206 may provide, for example, state information of the electronic device 200 in the form of light. In an embodiment, the light emitting element 206 may provide a light source that interacts, for example, with the operation of the camera module 205. The light emitting element 206 may include, for example, a light emitting diode, an IR light emitting diode, and a xenon lamp.

[81] The connector cavities 208 and 209 may include, for example, a first connector cavity 208 capable of receiving a connector (e.g., a USB connector) for transmitting/receiving power and/or data to/from an external electronic device, and/or a second connector cavity 209 (e.g., a headphone jack) capable of receiving a connector for transmitting/receiving an audio signal to/from an external electronic device.

[82] Fig. 4 is an exploded perspective view illustrating the electronic device 200 shown in Fig. 2, according to an embodiment of the disclosure.

[83] Referring to Fig. 4, an electronic device 300 (e.g., an electronic device 200 of Fig. 2 or of Fig. 3) may include a side structure 310 (e.g., a side structure 218 of Fig. 2), a first support member 311 (e.g., a bracket), a front plate 320 (e.g., a front plate 202 of Fig. 2), a display 330 (e.g., a display 201 of Fig. 2), a printed circuit board 340 (e.g., a printed circuit board (PCB), a printed circuit board assembly (PBA), a flexible PCB (FPCB), or a rigid flexible PCB (RFPCB)), a battery 350, a second support member 360 (e.g., a back case), an antenna 370, and a back plate 380 (e.g., a back plate 211 of Fig. 3). In an embodiment, in the electronic device 300, at least one of the components (for example, the first support element 311 or the second support element 360) may be omitted, or other components may be additionally included. At least one of the components of the electronic device 300 may be identical or similar to at least one of the components of the electronic device 200 in Fig. 2 or in Fig. 3, and a redundant description thereof is omitted below.

[84] The first support element 311 may be located in the electronic device 300 so as to be connected to the side structure 310 or may be formed as a single unit with the side structure 310. The first support element 311 may be formed, for example, from a metallic material and/or a non-metallic material (for example, a polymer). The display 330 may be connected to one surface of the first support element 311, and the printed circuit board 340 may be connected to another surface of the first support element 311. The processor, the memory device, and/or the interface may be mounted on the printed circuit board 340. The processor may include, for example, one or more of a central processor, an application processor, a graphics processor, an image signal processor, a sensor hub processor, or a communication processor.

[85] The storage device may include, for example, a volatile storage device or a non-volatile storage device.

[86] The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect, for example, the electronic device 300 to an external electronic device and may include a USB connector, an SD card/MMC connector, or an audio connector.

[87] The battery 350, which is a device for supplying power to at least one component of the electronic device 300, may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 350 may be located on a substantially identical plane, for example, with the printed circuit board 340. The battery 350 may be located as a single unit inside the electronic device 300 or may be detachably located on the electronic device 300.

[88] The antenna 370 may be located between the back plate 380 and the display 350. The antenna 370 may include, for example, an antenna supporting the near field communication (NFC) standard, a wireless charging antenna and/or an antenna supporting the magnetic secure transmission (MST) standard. The antenna 370 may perform short-range communication, for example, with an external electronic device or may wirelessly transmit/receive power required for charging to/from an external device. In an embodiment, the antenna structure may be formed with a portion of the side structure 310 and/or the first support member 311, or with a combination thereof.

[89] In the following detailed descriptions, it should be noted that reference may be made to the electronic devices 101, 102, 104, 200 or 300 in the previous embodiment, and identical reference numerals shall be assigned to components that may be understood from the previous embodiment or omitted, and their detailed descriptions may also be omitted.

[90] Fig. 5 is a rear top view illustrating an electronic device 400 (e.g., the electronic device 101, 102, 104, 200 or 300 of Figs. 1-4) according to an embodiment of the disclosure. Fig. 6 is a cross-sectional view of a portion of the electronic device 400 of Fig. 5, along A-A', according to an embodiment of the disclosure. Fig. 7 is a view illustrating an optical path of a lens assembly 500 in the electronic device 400 according to an embodiment of the disclosure.

[91] Referring to Figs. 5 and 6, the electronic device 400 according to an embodiment of the disclosure may include a camera window 385 located on one surface thereof (e.g., on the second surface 210B of Fig. 3). In an embodiment, the camera window 385 may form part of the back plate 380. In an embodiment, the camera window 385 may be attached to the back plate 380 via a decorative element 389, and when viewed from the outside, the decorative element 389 may be open for access in the shape of a circumference of the periphery of the camera window 385. According to an embodiment, the camera window 385 may include several transparent regions 387, and the electronic device 400 may receive external light or emit light outward through at least one of the transparent regions 387. For example, the electronic device 400 may include at least one camera module 500 (for example, camera modules 180, 205, 212 and 213 of Figs. 1-3) arranged such that it corresponds to at least some of the transparent regions 387, and at least one light source (for example, an infrared light source) arranged such that it corresponds to other parts of the transparent regions 387. In an embodiment, the lens assembly 500 or the light source may receive external light or emit light outside the electronic device 400 through one of the transparent regions 387. In an embodiment, the electronic device 400 and/or the lens assembly 500 may further include a camera support element 381. The camera support element 381 may allow at least one of the lens assembly 500 and/or other lens assemblies (e.g., a wide-angle camera, an ultra-wide-angle camera, and/or a close-up camera) adjacent to it to be positioned or secured within the back plate 380 or the camera window 385. In an embodiment, the camera support element 381 may actually be a portion of the first support element 311 and/or the second support element 360 of Fig. 4.

[92] According to an embodiment, the electronic device 400 may include, as a lens assembly 500 or a light-receiving element, at least one of a wide-angle camera, an ultra-wide-angle camera, a close-up camera, a telephoto camera, or an infrared photodiode, and may include a flash (e.g., flash 213 in Fig. 3) or an infrared laser diode as a light source or a light-emitting element. In an embodiment, the electronic device 400 may be configured to, using the infrared laser diode and the infrared photodiode, emit an infrared laser toward a subject and receive an infrared laser reflected by the subject to thereby detect a distance or depth to the subject. In an embodiment, the electronic device 400 may be configured to photograph an image of the subject using one or a combination of two or more of the cameras and provide illumination for the subject using the flash if necessary.

[93] According to an embodiment, a wide-angle camera, an ultra-wide-angle camera, or a close-up camera of the camera may have a shorter length in a direction along the optical axis of the lens compared to a telephoto camera (e.g., lens assembly 500). For example, the lens(es) 423a, 423b, or 423c of the telephoto camera (e.g., lens assembly 500), which has a relatively long focal length, may have an overall length that is longer than the overall length of the other cameras. The "overall length" may be a distance from the side surface of the object of the first lens on the object side to the imaging surface of the image sensor 411. Similar to the embodiment (e.g., lens assembly 600 of FIG. 8) described below, when another optical element(s) (e.g., a mirror or a prism) is disposed between the lens(es) and the image sensor, the "overall length" may be a distance from the side surface of the object of the first lens on the object side to the surface on the sensor side of the first lens on the image sensor side. In an embodiment, although the lens(es) of the wide-angle camera, the ultra-wide-angle camera or the close-up camera are arranged along the thickness direction (for example, the thickness measured in the Z-axis direction in Fig. 4 or 6) of the electronic device 400, the effect on the thickness of the electronic device 400 may be very small. For example, the wide-angle camera, the ultra-wide-angle camera or the close-up camera may be arranged in the electronic device 400 in such a way that the direction in which the light falls from the outside onto the electronic device 400 and the direction of the optical axis of the lens are substantially identical. In an embodiment, compared to the wide-angle camera, the ultra-wide-angle camera or the close-up camera, the lens assembly 500 (for example, a telephoto camera) has a small angle of view, but may be useful for capturing a subject at a greater distance and may include a greater number of lenses 421a, 423a, 423b and 423c. For example, when the lens(es) 423a, 423b or 423c of the lens assembly 500 is arranged in the thickness direction (for example, in the Z-axis direction) of the electronic device 400, the thickness of the electronic device 400 may increase, or a significant portion of the lens assembly 500 may protrude beyond the electronic device 400. In an embodiment of the disclosure, the lens assembly 500 may include at least one refractive element 413 or 415 for reflecting or refracting the incident light IL in another direction. When implementing the telescopic function, the lens(es) 423a, 423b or 423c may be arranged with the ability to be moved forward or backward in the direction of incidence of light or in the direction of movement of the reflected or refracted light, thereby suppressing or reducing the increase in the thickness of the electronic device 400.

[94] Referring to Figs. 6 and 7, a folded camera (e.g., lens assembly 500) may include a first refractive element 413, a second refractive element 415, an image sensor 411, and/or at least a lens system (e.g., a second lens 423a, 423b, or 423c) or a second lens group 423 including a dummy element 423d. A "folded camera" may be useful in expanding the range of adjustment of the focal length. For example, a folded camera may have a reflective element, such as a prism or a mirror, arranged such that, regardless of the direction of incident external light, the direction or placement of the lenses can be freely designed. Such an increase in the degree of freedom regarding the design of the direction of placement of the lenses in the folded camera makes it possible to implement a compact telephoto camera that can be combined with a wide-angle camera and mounted in an electronic device. In an embodiment, at least one optical element may be configured to direct or focus the light RL1 reflected or refracted by the first refractive element 413 into the second refractive element 415 and prevent the light RL1 reflected or refracted by the first refractive element 413 from directly falling on the image sensor.

[95] According to an embodiment, the first refractive element 413 may include, for example, a prism, a mirror, or a reflective element including a mirror for reflecting light. For example, the first refractive element 413 may be formed from a prism including at least one mirror. In an embodiment, the first refractive element 413 may reflect or refract light IL incident in a first direction D1 in a second direction D2 intersecting the first direction D1. The first direction D1 may mean a direction in which the light IL is incident from the outside on the electronic device 400 or the lens assembly 500 through one of the transparent regions 387 of Fig. 5, for example, when photographing a subject. In an embodiment, the first direction D1 may mean a shooting direction, a subject direction, an oriented direction of the lens assembly 500, or a direction parallel thereto. In an embodiment, the first direction D1 may be parallel to the thickness direction or the Z-axis direction of the electronic device 400.

[96] According to an embodiment, the second refractive element 415 may include, for example, a prism, a mirror, or a reflective element including a mirror for reflecting light. For example, the second refractive element 415 may be formed from a prism including at least one mirror. For example, at least one surface of the second refractive element 415 may be formed from a prism including a mirror. In an embodiment, the second refractive element 415 may reflect or refract the light RL1 reflected or refracted by the first refractive element 413 and incident along the second direction D2, in the third direction D3 intersecting the second direction D2. The third direction D3 may be substantially perpendicular to the second direction D2. For example, the third direction D3 may mean a direction parallel to the Z-axis direction. However, the embodiment of the disclosure is not limited to this, and the third direction D3 may be the second direction D2 or a direction inclined relative to the X-Y plane, depending on the placement and specifications of the lens assembly 500 or the second refractive element 415 in the electronic device 400. In the embodiment, the third direction D3 may be substantially parallel to the first direction D1.

[97] According to an embodiment, the image sensor 411 may be configured to detect the light RL2 that is reflected or refracted by the second refractive element 415 and then incident along the third direction D3. For example, the light IL incident from the outside may be detected by the image sensor 411 through the first refractive element 413 and the second refractive element 415 and the electronic device 400, or the lens assembly 500 may obtain an image of a subject based on a signal or information detected through the image sensor 411. In an embodiment, the image sensor 411 may be located substantially parallel to the X-Y plane. For example, when the lens assembly 500 has an image stabilization function of shifting the image sensor 411, the image sensor 411 may move horizontally from a plane perpendicular to the first direction D1 or the third direction D3.

[98] According to an embodiment, when the image stabilization operation is performed, the image sensor 411 may be shifted in the length direction (for example, in the Y-axis direction) or in the width direction (for example, in the X-axis direction) of the electronic device 400. For example, the image sensor 411 may be disposed on a plane perpendicular to the first direction D1 or the third direction D3 such that, in an electronic device having a small thickness (for example, a thickness of approximately 10 mm or less), it may be easy to increase the size of the image sensor 411, and/or it may be easy to provide space for the image stabilization operation. In an embodiment, when the lens unit 500 is used as a telephoto camera, since the image stabilization function is mounted thereon, it is possible to further improve the quality of the captured image. In an embodiment, when the image sensor 411 is deployed, the performance of the lens unit 500 may be further increased.

[99] According to an embodiment, the lens assembly 500 may further include a first lens group 421 including a lens system (e.g., at least one first lens 421a or 421b) for directing or focusing light IL incident in the first direction D1 into the first refractive element 413. In an embodiment, the first lens group 421 or the first lens (e.g., the first lens 421a) located on the object side of the lens assembly 500 may have a positive refractive power. For example, the first lens 421a may be configured to focus or align light IL incident from the outside into the first refractive element 413, such that the optical system leading from the first lens 421a to the image sensor 411 can be miniaturized. According to an embodiment, the first lens group 421 may further include an additional first lens(es) 421b for focusing or combining light incident from outside.

[100] According to an embodiment, the second lens group 423 may include a dummy element 423d and a light-blocking element 425. For example, the dummy element 423d may be located, for example, in the lens assembly 500 or in the electronic device 400 and may have a cylindrical shape extending along the second direction D2 and may transmit light RL1 moving along the second direction D2. In an embodiment, the dummy element 423d may be one of the lenses having a positive or negative refractive power. In an embodiment, the dummy element 423d may be a component formed integrally with one of the second lenses 423a, 423b and 423c or with the second refractive element 415.

[101] According to an embodiment, the light-blocking element 425 may be formed or disposed on at least a portion of the outer peripheral surface of the dummy element 423d, absorbing scattering or reflection of light. For example, the light-blocking element 425 may be formed by etching or treating with a black varnish and/or printing or depositing a reflective layer on at least a portion of the outer peripheral surface of the dummy element 423d. In an embodiment, the light reflected or refracted by the first refractive element 413 may be partially absorbed, scattered or reflected by the light blocking element 425. In an embodiment, the light blocking element 425 may substantially block the light reflected or refracted by the first refractive element 413 from directly falling on the image sensor 411 without passing through the second lens group 423 and/or the second refractive element 415. For example, light (e.g., light following a path indicated by "IL", "RL1" or "RL2" in Fig. 7) sequentially through the first direction D1, the second direction D2 and/or the third direction D3 in the lens assembly 500 may fall on the image sensor 411, and light traveling along another path may be substantially blocked from falling on the image sensor 411.

[102] According to an embodiment, at least one of the second lenses 423a, 423b and 423c may move back and forth between the first refractive element 413 and the second refractive element 415 along a substantially identical axis with the second direction D2. For example, the electronic device 400 (for example, the processor 120 of Fig. 1) or the lens assembly 500 may perform the adjustment of the focal length or focusing by moving back and forth at least one second lens 423a, 423b or 423c based on a substantially identical axis with the second direction D2. A miniaturized electronic device, such as a smartphone, may have a thickness of approximately 10 mm, in which case a limitation may be provided with respect to the range in which the lens can move back and forth in its thickness direction.

[103] According to an embodiment, the second direction D2 may be substantially parallel to the length direction (for example, the Y-axis direction in FIG. 4), the width direction (for example, the X-axis direction in FIG. 4) and/or the X-Y plane, and the range in which at least one second lens 423a, 423b or 423c can move back and forth may be large, compared to a general wide-angle camera that moves back and forth in the Z-axis direction for focusing. For example, as the telephoto performance in the lens assembly 500 is improved by moving at least one second lens 423a, 423b or 423c back and forth along a substantially identical axis with the second direction D2, the degree of freedom in design may be increased while providing a space that can move back and forth for focusing or adjusting the focal length.

[104] According to an embodiment, the electronic device 400 and/or the lens assembly 500 may further include an infrared blocking filter 419. In an embodiment, the infrared blocking filter 419 may block light of an infrared or near infrared wavelength range from falling on the image sensor 411 and may be located at a specific location in the optical path between the first lens 421a and the image sensor 411. In an embodiment, the infrared blocking filter 419 is located in a position close to the image sensor 411, for example, between the image sensor 411 and the second refractive element 415, thereby suppressing or preventing visual exposure to the outside of the infrared blocking filter 419. In an embodiment, the first refractive element 413, the second refractive element 415 and/or at least one optical element (for example, the second group 423 of lenses) can include an infrared blocking coating layer, and in this case, the infrared blocking filter (419) can be omitted. In an embodiment, an infrared blocking cover layer may be provided on at least one of the side surface of the image sensor and the side surface of the object for the dummy element 423d or the second refractive element 415. Accordingly, the image sensor 411 can detect light substantially through the infrared blocking filter 419 (or the infrared blocking cover layer).

[105] The refractive elements 413 and 415 of the disclosure may be selectively designed according to the design of the lens assembly 500. For example, in an embodiment, the refractive element (for example, the second refractive element 415 of Fig. 6) may have a triangular prismatic shape. In an embodiment, the refractive element (for example, the second refractive element 415 of Fig. 7) may have a trapezoidal prismatic shape. The shapes of the refractive elements 413 and 415 are not limited to the designs illustrated in the disclosure. For example, if the refractive elements 413 and 415 reflect, refract, or transmit light, the refractive elements 413 and 415 may have designs other than a triangular prism or a trapezoidal prism. In an embodiment, the refractive elements 413 and 415 may be arranged in various types. For example, the refractive element (for example, the second refractive element 415 of Fig. 6) can be configured with a prism. For example, the refractive element (for example, the second refractive element 415 of Fig. 7) can be configured with a mirror. For example, the refractive elements 413 and 415 can include a substantially transparent material. For example, the refractive elements 413 and 415 can be made of glass.

[106] Fig. 8 is a view illustrating a lens assembly 600 according to an embodiment of the disclosure. Fig. 9 is a view illustrating a first optical element R1 of the lens assembly 600 of Fig. 8 according to an embodiment of the disclosure. Fig. 10 is a view illustrating an image forming surface img of an image sensor S and an emission surface F2 of the first optical element R1 in the lens assembly 600 of Fig. 8 according to an embodiment of the disclosure.

[107] Referring to Figs. 8-10, the lens assembly 600 (e.g., the camera modules 180, 205, 212 and 213 of Figs. 1-3 and/or the lens assembly 500 of Fig. 6) may include at least two lenses L1, L2, L3, L4 and L5, an image sensor S and at least one optical element R1 (hereinafter referred to as the “first optical element R1”) disposed between the image sensor S and the at least two lenses (hereinafter referred to as the “lenses (L1, L2, L3, L4 and L5)”). According to an embodiment, the lens assembly 600 may further include a second optical element R2 (for example, the first refractive element 413 of Fig. 6 or 7) aligned with the first optical element R1 (for example, the second refractive element 415 of Fig. 6 or 7), and the lenses L1, L2, L3, L4 and L5 are arranged therebetween. The first optical element R1 can receive light condensed or directed by the lenses L1, L2, L3, L4 and L5, and reflect, refract or direct the light in the direction of the image sensor S. The second optical element R2 can receive external light and then reflect or refract the light to direct the light in the direction in which the lenses L1, L2, L3, L4 and L5 are aligned (for example, in the direction along the first optical axis O1). For example, when the second optical element R2 is not turned on, the lens assembly 600 can receive external light incident in the direction ID1, and when the second optical element R2 is turned on, the lens assembly 600 can receive external light from the direction ID2, which is different from the direction ID1.

[108] According to an embodiment, the lens assembly 600 may further include an infrared blocking layer IFL (or an infrared blocking cover layer). For example, the infrared blocking layer IFL may be located on one of the incidence surface F1 and the emission surface F2 of the first optical element R1. In an embodiment, the infrared blocking layer IFL may be provided on any of the surfaces of the first optical element R1 or on any of the lenses L1, L2, L3, L4 and L5. According to an embodiment, the lens assembly 600 may further include an infrared blocking filter independent of the first optical element R1 and/or the lenses L1, L2, L3, L4 and L5. In this case, the infrared blocking layer IFL may be excluded.

[109] According to an embodiment, at least two (e.g., five) lenses L1, L2, L3, L4, and L5 may be sequentially arranged along a direction along the first optical axis O1. In an embodiment, the first optical axis O1 may be provided substantially parallel to the front surface (e.g., the first surface 210A of FIG. 2) or the back surface (e.g., the second side 210B of FIG. 3) of the electronic device (e.g., the electronic device 101, 200, 300, or 400 of FIGS. 1-6). For example, even if the thickness of the electronic device 400 is reduced, the degree of freedom in design may be high in the number and arrangement of the lenses L1, L2, L3, L4, and L5. According to an embodiment, the electronic device 400 (for example, the processor 120 of Fig. 1) and/or the lens assembly 600 can move at least one of the lenses L1, L2, L3, L4 and L5 along a direction along the first optical axis O1. For example, the operation of adjusting the focal length or focusing can be performed by moving at least one of the lenses L1, L2, L3, L4 and L5 along a direction along the first optical axis O1. In an embodiment, as the electronic device 400 (for example, the processor 120 of Fig. 1) and/or the lens assembly 600 moves at least one of the lenses L1, L2, L3, L4 and L5 in a direction substantially perpendicular to the first optical axis O1, thereby performing an image stabilization operation. "Moving in a direction substantially perpendicular to the first optical axis O1" may be understood, for example, to mean that the lens(es) L1, L2, L3, L4 or L5 move along at least two directions on a plane substantially perpendicular to the first optical axis O1. "At least two directions" may mean, for example, a direction perpendicular to each other.

[110] According to an embodiment, the image sensor S may be configured to cause the lens assembly 600 and/or the electronic device 400 including the same to acquire an image of a subject by receiving light directed and/or condensed through the lenses L1, L2, L3, L4 and L5 and/or the first optical element R1. In an embodiment, the imaging surface img of the image sensor S may be arranged in a direction intersecting the first optical axis O1. For example, the imaging surface img of the image sensor S may be arranged such that it forms an acute angle and/or an obtuse angle with the first optical axis O1. In an embodiment, when it is considered that "the imaging surface img may be arranged in a direction intersecting the first optical axis O1", it is obvious that the imaging surface img is arranged such that it is inclined with respect to the X-axis, the Y-axis and/or the Z-axis in Figs. 2-6. In an embodiment, since the image sensor S can be arranged in different directions relative to the alignment directions of the lenses L1, L2, L3, L4 and L5, the degree of freedom in design can be increased in manufacturing the lens assembly 600 and/or the electronic device 400 including it.

[111] According to an embodiment, the optical elements R1 and R2 may reflect and/or refract light incident on them to change the direction of movement of the light. For example, since at least one optical element (e.g., the first optical element R1) may be configured to be located between the lenses L1, L2, L3, L4 and L5 and the image sensor S, the degree of freedom in design may be increased in the arrangement of the lenses L1, L2, L3, L4 and L5 and the image sensor S. In an embodiment, when a plurality of optical elements are located between the lenses L1, L2, L3, L4 and L5 and the image sensor S, the first optical element R1 may mean the optical element located closest to the image sensor S.

[112] According to an embodiment, the first optical element R1 may be located between the lenses L1, L2, L3, L4 and L5 and the image sensor S, and may receive light incident through the lenses L1, L2, L3, L4 and L5 along a direction along the first optical axis O1. In an embodiment, the first optical element R1 may reflect and/or refract the light incident through the lenses L1, L2, L3, L4 and L5 at least twice along a direction along the first optical axis O1, thereby emitting light along a direction of a second optical axis O2 intersecting the first optical axis O1. The second optical axis O2 may actually be understood as an optical axis of the image sensor S or the imaging surface img. In the illustrated embodiment, the second optical axis O2 is roughly illustrated for convenience of description, and the embodiment(s) of the disclosure are not limited thereto. It should be noted that the second optical axis O2 may be defined differently depending on the embodiment and/or design of the lens assembly 600 that is actually to be manufactured.

[113] According to an embodiment, the first optical element R1 may include a prism. In an embodiment, the first optical element R1 may include a first surface (e.g., an incidence surface F1) aligned such that it faces at least two lenses (e.g., lenses L, L2, L3, L4 or L5) on the first optical axis O1. The incidence surface F1 may, for example, be perpendicular to the first optical axis O1. However, it should be noted that the embodiment(s) of the disclosure are not limited to this. For example, the additional optical element may be located, or the incidence surface F1 may be located, at an angle relative to the first optical axis O1 according to the specifications of the first optical element R1.

[114] According to an embodiment, the first optical element R1 may include a second surface (for example, an emission surface F2) facing the image sensor S. For example, the emission surface F2 may be connected to the incidence surface F1 in such a way that it is inclined so as to form a first angle Ang-p1 relative to the incidence surface F1. In an embodiment, the emission surface F2 may provide a total reflection environment for incident light (for example, for light incident on the incidence surface F1 along a direction along the first optical axis O1). For example, the emission surface F2 is arranged in such a way that it is inclined at a predetermined angle relative to the first optical axis O1 in order to reflect (or refract) the incident light due to this. When providing a total reflection environment, the tilt angle of the emission surface F2 relative to the first optical axis O1 is hereinafter described with reference to equations that are described below. In this regard, the emission surface F2 may at least partially function as a reflector in the first optical element R1.

[115] According to the embodiment, the first optical element R1 may include a reflective surface F3 that connects the emission surface F2 and the incidence surface F1. For example, the reflective surface F3 may be connected to the emission surface F2 in a state of forming a second angle Ang-p2 and may be connected to the incidence surface F1 in a state of forming a third angle Ang-p3. In the embodiment, when the reflective surface F3 is located substantially parallel to the first optical axis O1, the inclination angle of the emission surface F2 relative to the first optical axis O1 may be set as the second angle Ang-p2.

[116] According to an embodiment, the light reflected by the emitting surface F2 in the first optical element R1 is reflected (or refracted) again by the reflective surface F3 and then can be emitted to the outside through the emitting surface F2. For example, when the angle of incidence with respect to the emitting surface F2 is less than a predetermined angle, the emitting surface F2 in the first optical element R1 can provide an environment with total reflection, and when the angle of incidence is greater than a predetermined angle, the emitting surface F2 can transmit the light. Thus, the light incident on the first optical element R1 can be reflected (or refracted) in the first optical element R1 at least twice and directed to the image sensor S through the emitting surface F2. In an embodiment, when the lens assembly 600 has a structure including an infrared blocking layer IFL, the infrared blocking layer IFL can be disposed on at least a portion of the surface of the first optical element R1 (for example, the incidence surface F1 and/or the emitting surface F2). The position and size of the infrared blocking layer IFL can be selected in various ways taking into account the light path passing through the first optical element R2. In an embodiment, the infrared blocking layer IFL can be located on at least one of the incidence surface F1 and the emission surface F2.

[117] According to an embodiment, the electronic device 400 (for example, the processor 120 in Fig. 1) and/or the lens assembly 600 may perform an image stabilization function or a subject tracking function by rotating or tilting at least one of the optical elements R1 and R2 (for example, the first optical element R1) relative to the first optical axis O1. The "tilting operation" may be understood, for example, as an operation of rotating the first optical element R1 based on an arbitrary axis intersecting the first optical axis O1. The central axis of the tilting operation may be configured in various ways according to the design of the lens assembly 600 and/or the electronic device 400 to be actually manufactured.

[118] According to an embodiment, the second optical element R2 (e.g., the first refractive element 413 of Fig. 6) may be located in front of the lenses L1, L2, L3, L4, and L5. For example, the direction in which light is incident on the electronic device 400 and/or the lens assembly 600 may be different from the direction of the first optical axis O1. As described above, when the components that are described above and/or that are described below with respect to the lens assembly 600 of Fig. 8 are satisfied, other components of the embodiments disclosed herein (e.g., the first lens group 421, the first refractive element 413, the dummy element 423d, and/or the light-blocking element 425 of Fig. 6) may be selectively combined to implement additional embodiments.

[119] According to an embodiment, the lens assembly described above and/or described below (e.g., the lens assembly 600, 700, and 800 in Fig. 8, 11, and/or Fig. 13) may satisfy the condition of Equation 1 below.

[120] equation 1

[121] Herein, "img-X" represents the length of the longer side of the horizontal/vertical lengths of the imaging surface img of the image sensor S; and "w" represents the length of the longer side of the horizontal/vertical lengths of the emitting surface F2 facing the image sensor of the surfaces of the optical element (hereinafter in this document, "the first optical element") closest to the image sensor of the at least one optical element. In an embodiment, the longer side of the emitting surface F2 indicated by "w" in FIG. 9 may be understood as the longer side of a region through which light incident on the image sensor S passes of the emitting surfaces F2 of FIG. 9. For example, the region indicated by "F2E" in FIG. 10 for the emitting surfaces F2 may be a region through which light incident on the image sensor S passes. In an embodiment, the area or size of the region referred to as "F2E" may be smaller than the surface (e.g., the emission surface F2 of Fig. 9) of the first optical element R1.

[122] According to an embodiment, the longer side of the imaging surface img, "img-X", may be located substantially parallel to the length direction (e.g., the Y-axis direction in Fig. 4) or the width direction (e.g., the X-axis direction in Fig. 4 or Fig. 6) of the electronic device. In an embodiment, the longer side of the emission surface F2, "w", may be located such that it corresponds to the longer side of the imaging surface img, "img-X". For example, "w", which is the longer side of the emission surface F2, may be located substantially parallel to the length direction (e.g., the Y-axis direction in Fig. 4) or the width direction (e.g., the X-axis direction in Fig. 4 or Fig. 6) of the electronic device. In an embodiment, the shorter side of the horizontal/vertical lengths of the imaging surface img or the shorter side of the horizontal/vertical lengths of the emitting surface F2 may be arranged substantially parallel to the thickness direction of the electronic device (for example, the Z-axis direction in Fig. 4 or in Fig. 6). For example, since the lens unit is arranged in a miniaturized electronic device, an increase in the thickness of the electronic device that may occur due to the size of the image sensor S or the first optical element R1 can be suppressed. According to an embodiment, the longer sides of the imaging surface img and the emitting surface F2 may be arranged substantially parallel to the XY plane of the electronic device, and the shorter sides of the imaging surface img and the surface F2 may be arranged such that it is inclined relative to the XY plane of the electronic device. For example, even if the shorter sides of the imaging surface img and the emitting surface F2 are longer than the thickness of the electronic device, it may be easy to arrange the image sensor S or the first optical element R1 in the electronic device. This may be possible by increasing the degree of freedom in designing the path through which light is refracted and/or reflected by using the first optical element R1.

[123] According to an embodiment, compared to the longer sides of the imaging surface img and the emission surface F2, the length or width of the electronic device may be significantly larger. For example, since the longer sides of the imaging surface img and the emission surface F2 may be manufactured in such a way that they are approximately several mm, and the length or width of the electronic device may be approximately 50 mm or more, it may be easy to increase the size of the image sensor S or the first optical element R1. In an embodiment, when the longer sides of the imaging surface img and the emission surface F2 are arranged parallel to the XY plane of the electronic device, and the shorter sides of the imaging surface img and the emission surface F2 are arranged at an angle relative to the XY plane of the electronic device, the limitations that may arise due to the thickness of the electronic device may be simplified, so that it may be easy to increase the lengths of the shorter sides of the imaging surface img and the emission surface F2.

[124] According to an embodiment, when the value according to equation 1 becomes less than about 1.2, stray light may increase in the acquired image. Here, "stray light" may be understood as incident light moving along a path other than the specified path. For example, as stray light increases, the quality of the acquired image may deteriorate. Such stray light may be generated by unintentional reflection or refraction in the lens assembly 600. In an embodiment, when the value according to equation 1 is greater than about 2.5, the overall length of the lens becomes short, so that it may be difficult to implement the lens assembly 600 having good optical performance. For example, when the condition according to equation 1 is satisfied, the lens assembly 600 may have an overall length of lenses of an appropriate size and good optical performance in suppressing stray light.

[125] According to an embodiment, the lens assembly 600 may further include an anti-reflection coating layer located on at least one of the incidence surface F1 or the emission surface F2 of the first optical element R1. For example, reflection or refraction that occurs when light passes through the incidence surface F1 or the emission surface F2 may be suppressed. In an embodiment, reflection or refraction on the incidence surface F1 (or the emission surface F2) may result in scattered light. For example, the scattered light may be suppressed by disposing the anti-reflection coating layer on at least one of the incidence surface F1 or the emission surface F2. In an embodiment, when the infrared blocking layer (IFL) is disposed on either the incidence surface (F1) or the emission surface (F2), the anti-reflection coating layer may be disposed on the other of the incidence surface (F1) or the emission surface (F2).

[126] According to an embodiment, the lens assembly described above and/or below (e.g., the lens assembly 600, 700, and 800 of Fig. 8, 11, and/or Fig. 13) may satisfy the condition of the following equation 2.

[127] equation 2

15≤Ang-min≤50

[128] Herein, "Ang-min" represents the smallest angle of the angles formed by two adjacent surfaces of the first optical element R1, and may be the second angle Ang-p2 in the first optical element R1 illustrated in Fig. 9. According to an embodiment, when the value of Equation 2 is less than an angle of approximately 15 degrees, the size of the first optical element R1 increases, which may make it difficult to realize the electronic device (for example, the electronic device 101, 102, 104, 200, 300 and 400 in Figs. 1-6) or the lens assembly 600 more compact. In an embodiment, when the value of Equation 2 is greater than an angle of approximately 50 degrees, it may be difficult to create a total reflection environment for reflecting or refracting incident light at least twice in the first optical element R1.

[129] According to an embodiment, the incidence surface F1 and the reflective surface F3 may be configured to form a substantially right angle, and in this case, the reflective surface F3 may be substantially parallel to the first optical axis O1. In an embodiment, when the incidence surface F1 and the reflective surface F3 are configured to form a substantially right angle, the emission surface F2 may be configured to satisfy the condition represented by equation 2 with respect to the reflective surface F3. In an embodiment, when the incidence surface F1 and the reflective surface F3 are arranged such that they form a substantially right angle, the second angle Ang-p2 between the emission surface F2 and the reflective surface F3 may be approximately 25~35 degrees. In the embodiment, the first angle Ang-p2 between the incidence surface F1 and the emission surface F2 may satisfy the condition represented by equation 2.

[130] According to an embodiment, the lens assembly described above and/or below (e.g., the lens assembly 600, 700, and 800 of Fig. 8, 11, and/or Fig. 13) may satisfy the condition of Equation 3 for the following Vd-1, which is the Abbe number of the first optical element R1.

[131] equation 3

25≤Vd-1≤95

[132] According to an embodiment, the first optical element R1 is located between the lenses L1, L2, L3, L4 and L5 and the image sensor S (e.g., the imaging surface img), which may affect the curvature or chromatic aberration. In an embodiment, when the Abbe number, Vd-1, of the first optical element R1 is greater than about 95 degrees, it may be useful to correct the aberration in the lens unit, but its strength is reduced, which may lead to the optical element (e.g., the first optical element R1) being easily deformed or damaged during the assembly process or during the manufacturing process, transportation and/or storage before assembly. In an embodiment, when the Abbe number, Vd-1, of the first optical element R1 is less than about 25, the risk of damaging the electronic device is reduced, but it may be difficult to control the aberration. For example, when the condition of Equation 3 for the Abbe number, Vd-1, is satisfied, the first optical element R1 can facilitate the control of the aberration of the lens assembly 600 without being easily damaged by the external environment.

[133] According to an embodiment, the lens assembly described above and/or below (e.g., the lens assembly 600, 700, and 800 of Figs. 8, 11, and/or Fig. 13) may satisfy the condition of Equation 4 below for the field of view (FOV).

[134] equation 4

5≤FOV≤35

[135] According to an embodiment, when the FOV is greater than about 35 degrees, the focal length of the lens assembly 600 is shortened, so that it may be difficult to arrange the first optical element R1 between the lenses L1, L2, L3, L4 and L5 and the image sensor S (for example, the imaging surface img). In an embodiment, when the FOV is less than about 5 degrees, as the focal length of the lens assembly 600 increases, the lens assembly 600 may also be rotated. For example, when the FOV is less than about 5 degrees, it may be difficult to mount the lens assembly 600 on a miniaturized electronic device (for example, on the electronic devices 101, 102, 104, 200, 300 and 400 in Figs. 1-6). In an embodiment, when the lens assembly 600 satisfies the condition of equation 4 for the FOV, good telephotographic performance can be provided.

[136] Table 1 below roughly illustrates the values of equations 1-4 described above in the lens assemblies 600, 700 and 800 according to the embodiment(s) of Figs. 8, 11 and/or 13, which are described above or described below. According to the embodiment, by satisfying the conditions represented by equations 1-4 described above, the lens assemblies 600, 700 and 800 become more compact, thereby providing good optical performance. In the embodiment, when the lens assemblies 600, 700 and 800 satisfy the conditions of equations 1-4 described above, the lens assemblies become smaller, and thereby the degree of freedom in design can be increased in the placement of the lens and/or the image sensor.

[137] Table 1

Equation 1 Equation 2 Equation 3 Equation 4 The embodiment of FIG. 8 1.85 30 64.2 21.3 The embodiment of FIG. 11 1.63 30 64.2 18.9 The embodiment of FIG. 13 1.37 45 64.2 18.9

[138] In the following embodiment(s), identical reference numbers in the drawings are assigned to components that can be understood through the preceding embodiments or are omitted, and a detailed description thereof may also be omitted.

[139] Fig. 11 is a view illustrating a lens assembly 700 according to an embodiment of the disclosure. Fig. 12 is a view illustrating an image forming surface of an image sensor and an emission surface of a first optical element in the lens assembly of Fig. 11 according to an embodiment of the disclosure.

[140] Referring to Figs. 11 and 12, a lens assembly 700 (e.g., lens assembly 500 of Fig. 6) may include at least two (e.g., four) lenses L1, L2, L3, or L4, an image sensor S, and/or a first optical element R1, wherein the first optical element R1 may be located between the lenses L1, L2, L3, or L4 and the image sensor S. In an embodiment, the lens assembly 700 may satisfy the above-described specifications or conditions represented by equations 1-4. In an embodiment, the second optical axis O2 (e.g., the optical axis of the image sensor S) may be substantially parallel to the first optical axis O1.

[141] According to an embodiment, the first optical element R1 may include an incidence surface F1, an emission surface F2, and/or reflective surfaces F31, F32, F33, and F34. For example, light incident through the incidence surface F1 may be reflected or refracted four times in the first optical element R1. In an embodiment, some of the reflective surfaces F31, F32, F33, and F34 may be located on a substantially identical plane with the incidence surface F1 or the emission surface F2. For example, of the reflective surfaces F31, F32, F33, and F34, the first reflective surface F31 and the fourth reflective surface F34 may be located at an angle relative to the incidence surface F1 and/or the emission surface F2, the second reflective surface F32 may be located on the identical plane with the incidence surface F1, and the third reflective surface F33 may be located on the identical plane with the emission surface F2. For example, the incidence surface F1, the emission surface F2 and/or the reflecting surfaces F31, F32, F33 and F34 are defined; however, they mean regions or points in which light is transmitted, reflected and/or refracted in the first optical element R1, and at least one of the reflecting surfaces F31, F32, F33 and F34 can be designed to form an identical plane with the incidence surface F1 or with the emission surface F2.

[142] According to an embodiment, the light condensed by the lenses L1, L2, L3 and L4 may be incident (IL) on the incidence surface (F1) along the direction along the first optical axis (O1) and may be sequentially reflected or refracted by the first reflective surface F31, the second reflective surface F32, the third reflective surface F33 and/or the fourth reflective surface F34 in the first optical element R1. In an embodiment, the light reflected or refracted by the fourth reflective surface F34 may be emitted (EL) through the emission surface F2 and directed to the image sensor S. In an embodiment, the angle, Ang-min, satisfying the condition of Equation 2 may be the angle between the incidence surface F1 and the first reflective surface F31 and/or the angle between the emission surface F2 and the fourth reflective surface F34.

[143] Fig. 13 is a view illustrating a lens unit 800 according to an embodiment of the disclosure. Fig. 14 is a view illustrating an image forming surface img of an image sensor S and an emission surface F2 of a first optical element R1 in the lens unit 800 of Fig. 13 according to an embodiment of the disclosure.

[144] Referring to Figs. 13 and 14, a lens assembly 800 (e.g., lens assembly 500 of Fig. 6) may include at least two (e.g., four) lenses L1, L2, L3, and L4, an image sensor S, and/or a first optical element R1, wherein the first optical element R1 may be located between the lenses L1, L2, L3, and L4 and the image sensor S. In an embodiment, the lens assembly 800 may satisfy the above-described specifications or conditions represented by equations 1-4. In an embodiment, the second optical axis O2 (e.g., the optical axis of the image sensor S) may be substantially parallel to the first optical axis O1.

[145] According to an embodiment, the first optical element R1 may include an incidence surface F1, an emission surface F2, and/or reflective surfaces F31 and F32. For example, light incident through the incidence surface F1 may be reflected or refracted at least twice in the first optical element R1. In an embodiment, the incidence surface F1 and the emission surface F2 may be located on a substantially identical plane on the first optical element R1 and understood as different regions. In an embodiment, the reflective surfaces F31 and F32 may be located at an angle relative to the incidence surface F1 and/or the emission surface F2, and may be substantially inclined in opposite directions relative to each other.

[146] According to an embodiment, the light condensed by the lenses L1, L2, L3 and L4 may be incident (IL) on the incidence surfaces (F1) along the direction along the first optical axis (O1) and may be sequentially reflected or refracted by the first reflective surface F31 and/or the second reflective surface F32 in the first optical element R1. In an embodiment, the light reflected or refracted by the second reflective surface F32 may be emitted (EL) through the emission surface F2 and directed to the image sensor S. In an embodiment, the angle, Ang-min, satisfying the condition of Equation 2 may be the angle between the incidence surface F1 and the first reflective surface F31 and/or the angle between the emission surface F2 and the second reflective surface F32.

[147] A lens assembly according to an embodiment of the disclosure (e.g., camera module 180, 205, 212, or 213 in Figs. 1-3 or lens assembly 500, 600, 700, or 800 in Figs. 6, 8, 11, and/or 13) may include at least one optical element (e.g., first optical element R1 in Figs. 8, 11, and/or 13) located between the lens(es) and the image sensor (e.g., image sensor S in Figs. 8, 11, and/or 13), which may allow a light path leading to the image sensor S to be freely designed. For example, the placement direction of the imaging surface (e.g., imaging surface img in Fig. 8) of the image sensor S may be designed in various ways relative to the placement of the lenses (e.g., lenses L1, L2, L3, L4, and L5 in Fig. 8). Accordingly, it is easy to mount a lens assembly having high optical performance in a miniaturized and lightweight electronic device such as a smartphone (for example, in the electronic device 101, 102, 104, 200, 300 or 400 in Figs. 1-6). In an embodiment, by arranging an additional optical element (for example, the first refractive element 413 in Fig. 6) before arranging the lenses, it is possible to arrange the lenses in the length direction (for example, in the Y-axis direction in Fig. 5) and/or in the width direction (for example, in the X-axis direction in Fig. 5) of the electronic device. For example, the degree of freedom in designing in the number and arrangement of lenses can be increased in a miniaturized electronic device. In an embodiment, when the lenses are arranged in the length direction or in the width direction of the electronic device, it can be easy to provide space for moving the lenses back and forth in the direction along the optical axis (for example, the first optical axis O1 in Fig. 8). For example, it may be easy to improve the optical performance (for example, the telephoto performance) of the lens unit by providing an environment that allows the implementation of a focal length adjustment operation and/or a focus adjustment operation. In an embodiment, the size of the light-emitting surface of the first optical element (for example, the region through which the light incident on the image sensor passes) may be controlled relative to the imaging surface img, thereby suppressing the formation of scattered light and ensuring the implementation of good optical performance in the lens unit.

[148] The effects that can be obtained by the disclosure are not limited to the effects described above, and other effects not described above can be clearly understood by those skilled in the art to which the disclosure pertains based on the description below.

[149] As described above, according to an embodiment of the disclosure, a lens assembly (e.g., camera module 180, 205, 212, or 213 in Figs. 1-3 or lens assembly 500, 600, 700, or 800 in Figs. 6, 8, 11, and/or 13) may include at least two lenses (L1, L2, L3, L4, and L5 in Fig. 8) aligned along a direction of a first optical axis (O1) (e.g., first optical axis O1 in Fig. 8); an image sensor (e.g., image sensor S in Fig. 8) configured to receive light directed or condensed through the at least two lenses; and at least one optical element (for example, the first optical element R1 in Fig. 8) located between at least two lenses and the image sensor with the ability to receive light incident through the at least two lenses and refract or reflect the light at least twice and then direct or emit the light to the image sensor. In an embodiment, the lens assembly may satisfy the following conditional equation 1 and conditional equation 2.

[150] conditional equation 1

[151] 1.2≤w/img-X≤2.5

[152] conditional equation 2

[153] 15≤Ang-min≤40

[154] In this document, "img-X" represents a length (e.g., see Fig. 10) of a longer side of the horizontal/vertical lengths of an imaging surface (img) of an image sensor; "w" represents a length of a longer side of the horizontal/vertical lengths of an emitting surface (e.g., an emitting surface F2 in Fig. 9 or a region indicated as "F2E" in Fig. 10) facing the image sensor, of the surfaces of an optical element (hereinafter in this document, "the first optical element") closest to the image sensor of the at least one optical element; and "Ang-min" represents a smallest angle (e.g., a second angle indicated by "Ang-p2" in Fig. 9) of the angles formed by two adjacent surfaces of the first optical element.

[155] According to an embodiment, the first optical element may satisfy the following conditional equation 3 for the dispersion value Vd-1:

[156] conditional equation 3

[157] 25≤Vd-1≤95

[158] According to an embodiment, the first optical element comprises an anti-reflection coating layer formed on at least one of an incidence surface (e.g., an incidence surface F1 in Fig. 9) facing the at least two lenses and an emission surface (e.g., an emission surface F2 in Fig. 9 or a region indicated by "F2E" in Fig. 10).

[159] According to an embodiment, the first optical element may include an infrared blocking coating layer formed on at least one of the incidence surface facing the at least two lenses and the emission surface.

[160] According to an embodiment, the lens assembly may satisfy the following conditional equation 4 for the field of view (FOV).

[161] conditional equation 4

[162] 5≤FOV≤35

[163] According to an embodiment, the lens assembly as described above may be configured to move at least one of the at least two lenses along a direction along the first optical axis to thereby perform a focusing function.

[164] According to an embodiment, the lens assembly as described above may be configured to move at least one of the at least two lenses along a direction perpendicular to the first optical axis to thereby perform an image stabilization function.

[165] According to an embodiment, the lens assembly as described above may be configured to move or rotate at least one optical element to thereby perform an image stabilization function or a subject tracking function.

[166] According to an embodiment, the lens assembly as described above may further include a second optical element (e.g., the second optical element R2 in Fig. 8) aligned with at least one optical element in a direction along the first optical axis, wherein at least two lenses are arranged therebetween. In an embodiment, the second optical element may be configured to receive light incident from a direction (e.g., from the direction ID2 in Fig. 8) different from the direction of the first optical axis, and refract or reflect the light in the direction of the first optical axis to thereby direct the light into the at least two lenses.

[167] According to an embodiment, the first optical element may further include an incidence surface facing the at least two lenses. In an embodiment, the first optical element may be configured to reflect or refract light incident on the incidence surface at least twice between the incidence surface and the emission surface.

[168] According to an embodiment, the first optical element may further include a reflective surface (for example, the reflective surface F3 in Fig. 9) arranged such that it is inclined relative to the emission surface. In an embodiment, the emission surface and the reflective surface may reflect or refract light incident on the incidence surface in the first optical element. In an embodiment, the light reflected or refracted at least twice in the first optical element is directed or emitted to the image sensor through the emission surface.

[169] According to an embodiment, the lens assembly as described above has a configuration in which at least one of the angle formed between the incident surface and the reflective surface or the angle formed between the reflective surface and the emission surface can satisfy the conditional equation 2.

[170] According to an embodiment, the first optical element may include a prism.

[171] According to an embodiment of the disclosure, an electronic device (e.g., electronic device 101, 102, 104, 200, 300, or 400 in Figs. 1-6) may include a lens assembly (e.g., camera module 180, 205, 212, or 213 in Figs. 1-3 or lens assembly 500, 600, 700, or 800 in Figs. 6, 8, 11, and/or 13)); a memory device (e.g., memory device 130 in Fig. 1) storing instructions for acquiring an image; and a processor (e.g., processor 120 in Fig. 1) configured to execute the instructions for acquiring an image by receiving external light using the lens assembly. In an embodiment, the lens assembly may include at least two lenses (e.g., lenses L1, L2, L3, L4, and L5 in Fig. 8) aligned along a direction along the first optical axis; an image sensor (e.g., image sensor S in Fig. 8) configured to receive light directed or condensed through the at least two lenses; and at least one optical element (e.g., first optical element R1 in Fig. 8) located between the at least two lenses and the image sensor with the ability to receive light incident through the at least two lenses and refract or reflect the light at least twice and then direct or emit the light to the image sensor. In an embodiment, the lens assembly may satisfy the following conditional equation 5 and conditional equation 6.

[172] conditional equation 5

[173] 1.2≤w/img-X≤2.5

[174] conditional equation 6

[175] 15≤Ang-min≤40

[176] In this document, "img-X" represents a length (e.g., see Fig. 10) of a longer side of the horizontal/vertical lengths of an imaging surface (img) of an image sensor; "w" represents a length of a longer side of the horizontal/vertical lengths of an emitting surface (e.g., an emitting surface F2 in Fig. 9 or an emitting surface F2E in Fig. 10) facing the image sensor, of the surfaces of an optical element (hereinafter in this document, "the first optical element") closest to the image sensor of the at least one optical element; and "Ang-min" represents a smallest angle (e.g., a second angle indicated by "Ang-p2" in Fig. 9) of the angles formed by two adjacent surfaces of the first optical element.

[177] According to an embodiment, the processor may be configured to move at least one of the at least two lenses along a direction along the first optical axis to thereby perform a focusing function.

[178] According to an embodiment, the processor may be configured to move at least one of the at least two lenses along a direction perpendicular to the first optical axis to thereby perform an image stabilization function.

[179] According to an embodiment, the processor may be configured to move or rotate at least one optical element to thereby perform an image stabilization function or a subject tracking function.

[180] According to an embodiment, the first optical element may satisfy the following conditional equation 7 for the dispersion value Vd-1.

[181] conditional equation 7

[182] 25≤Vd-1≤95

[183] According to an embodiment, the lens assembly may satisfy the following conditional equation 8 for the field of view (FOV).

[184] conditional equation 8

[185] 5≤FOV≤35

[186] According to an embodiment, the first optical element may include an infrared blocking coating layer formed on at least one of the incidence surface (e.g., the incidence surface F1 in Fig. 9) facing the at least two lenses and the emission surface.

[187] It should be obvious to those skilled in the art that the contact structure of the camera module and the electronic device comprising it according to the disclosure as described above is not limited to the above-described embodiments and the embodiments shown in the drawings, and various changes, modifications or variations can be made thereto without departing from the scope of the present disclosure.

Claims (35)

1. Lens assembly (500; 600; 700 and 800), containing: at least two lenses (L1, L2, L3, L4 and L5) aligned along the direction of the first optical axis (O1); an image sensor (S) configured to receive light directed or condensed through at least two lenses; and at least one optical element (R1) located between at least two lenses and an image sensor, wherein at least one optical element is configured to receive light incident through at least two lenses and refract or reflect the light at least twice so as to direct or emit light into the image sensor, wherein the lens assembly is designed to satisfy the following conditional equation 1 and conditional equation 2, conditional equation 1 1.2≤w/img-X≤2.5 conditional equation 2 15≤Ang-min≤40, where img-X represents the length of the longer side of the horizontal/vertical lengths of the imaging surface (img) of the image sensor, w represents the length of the longer side of the horizontal/vertical lengths of the surface (F2 or F2E) of the emission of the first optical element of at least one optical element that is closest to the image sensor, wherein the emission surface faces the image sensor, and Ang-min represents the smallest angle formed by two adjacent surfaces of the first optical element. 2. The lens assembly according to claim 1, wherein the first optical element is configured to satisfy the following conditional equation 3 for the dispersion value Vd-1: conditional equation 3 25≤Vd-1≤95. 3. A lens assembly according to any one of claims 1, 2, wherein the first optical element comprises an anti-reflective coating layer formed on at least one of the incidence surface (F1) facing the at least two lenses and the emission surface. 4. A lens assembly according to any one of claims 1-3, wherein the first optical element comprises an infrared blocking coating layer (IFL) formed on at least one of the incident surface facing the at least two lenses and the emission surface. 5. A lens assembly according to any one of paragraphs 1-4, wherein the lens assembly is configured to satisfy the following conditional equation 4 for the field of view (FOV): conditional equation 4 5≤FOV≤35. 6. A lens assembly according to any one of claims 1-5, wherein the lens assembly is configured to move at least one of the at least two lenses along the first optical axis so as to perform a focusing function. 7. A lens assembly according to any one of claims 1-6, wherein the lens assembly is configured to move at least one of the at least two lenses along a direction perpendicular to the first optical axis so as to perform an image stabilization function. 8. A lens assembly according to any one of claims 1-7, wherein the lens assembly is configured to move or rotate at least one optical element so as to perform the display of at least one of the stabilization function and the subject tracking function. 9. A lens assembly according to any one of paragraphs 1-8, further comprising a second optical element (R2) aligned with at least one optical element along the first optical axis, wherein at least two lenses are located between them, wherein the second optical element is configured to receive light incident from a direction (ID2) different from the direction of the first optical axis and to refract or reflect the light in the direction of the first optical axis so as to direct the light into at least two lenses. 10. A lens assembly according to any one of claims 1 to 9, wherein the first optical element further comprises an incidence surface facing at least two lenses, and wherein the first optical element is configured to reflect or refract light incident on the incidence surface at least twice between the incidence surface and the emission surface. 11. The lens assembly according to claim 10, wherein the first optical element further comprises a reflective surface (F3) located such that it is inclined relative to the emitting surface, wherein the emitting surface and the reflecting surface are designed to reflect or refract light incident on the incident surface in the first optical element, and wherein the light reflected or refracted at least twice in the first optical element is directed or emitted into the image sensor through the emission surface. 12. The lens assembly according to claim 11, wherein at least one of the angle between the incident surface and the reflecting surface or the angle between the reflecting surface and the emitting surface satisfies conditional equation 2. 13. A lens assembly according to any one of claims 1-12, wherein the first optical element comprises a prism. 14. An electronic device (101; 102; 104; 200; 300 and 400) comprising a lens assembly (500; 600; 700 and 800) according to any one of paragraphs 1-13; a storage device that stores instructions for producing an image; and a processor (120) configured to execute instructions for obtaining an image by receiving external light using the lens assembly.