RU2800691C2 - Anti-icing systems - Google Patents

Abstract

FIELD: anti-icing systems.

SUBSTANCE: invention relates to systems for heating conductive surfaces in aircraft (LA) and relates to the melting of ice formed on the surface of the conductive material of the aircraft. The system for heating the outer part of the aircraft contains two or more connecting strips located at a distance from each other and attached to the skin of the aircraft (volumetric medium). Each of the connecting strips contains a multilayer structure extending along the surface of the bulk medium, which, in combination with the bulk medium, forms a transmission line. The multilayer structure comprises a first dielectric layer over the bulk medium, a conductive layer over the first dielectric layer, a second dielectric layer over the conductive layer, and a conductive shielding layer over the second dielectric layer. Moreover, the power management system is connected to the conductive layer of each of the connecting strips and to the bulk medium, configured to heat the surface of the bulk medium by supplying electric current to the connecting strips.

EFFECT: achieved weight reduction, increased heating efficiency, safety and reliability.

26 cl, 60 dwg

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority from U.S. Patent Application No. 62/723,270, filed Aug. 27, 2018, the contents of which are hereby incorporated by reference in their entirety.

FIELD OF TECHNOLOGY

The present application relates to heating systems for conductive materials.

BACKGROUND OF THE INVENTION

Many conductive surfaces, such as automobiles, aircraft and satellites, are exposed to freezing and icing conditions on a daily basis. Accumulation of ice or water on the conductive surfaces of these structures can result in inefficient or unsafe operating conditions. For example, the accumulation of ice on the wings of an aircraft can lead to a decrease in lift and an increase in drag.

Many of these designs are not equipped with heating systems, or are equipped with heating systems that require the use of bulky electronic equipment or other types of equipment. The use of bulky devices in this industry is a problem.

DISCLOSURE OF THE INVENTION

This application describes technologies for heating conductive surfaces. These technologies typically use high frequency AC signals (eg, above 1 kHz) to generate current density in a target region of a conductive bulk medium (eg, conductive material), resulting in Joule heating of the medium.

Joule heating, also known as ohmic heating or resistive heating, is a process in which heat is generated when an electric current is passed through a conductor. The amount of heat generated by a conducting medium depends on the amount of current passing through the medium and the electrical resistance of the medium. Therefore, heat can be controlled (eg, increased or decreased) by adjusting current, voltage, resistance, or a combination thereof.

The resistance of a particular conductor can be increased by limiting the volume of the conductor in which the current can flow and by increasing the length along which the current flows. Embodiments of the present invention may be configured to heat a bulk medium by controlling the mechanisms of current generation (e.g., constriction, elongation, etc.) in a conductive medium (e.g., bulk medium, conductor): for example, using the skin effect and the effect proximity. Both effects are based on passing a high-frequency alternating current through a conducting medium that must be heated. The skin effect limits the flow of current by exploiting the tendency of the alternating current to distribute in the conductor such that the current density increases near the surface of the conductor and decreases towards the interior of the conductor. The proximity effect can be used to further limit the current flow in the conductor by placing another AC path close to the existing current flowing in the conductor. The proximity effect can also lengthen the current path.

For example, embodiments of the present invention are configured to increase the resistance of a bulk medium along a current path through the medium by narrowing the current along the path. Therefore, embodiments can provide improved heating efficiency in conductive media while still reducing the amount of current needed to generate heat. That is, by increasing the effective resistance of the conducting medium along a particular current path, Joule heating of the medium may require less current than would otherwise be required.

In general, according to the first aspect of the present invention, a system for heating a bulk medium includes two or more electrodes located at a distance from each other and connected to the bulk medium; and a power management system connected to the electrodes, wherein the power management system is configured to create an effective resistance of the bulk medium along the current path between the electrodes by generating a current density in the bulk medium, in which the power management system generates a current density in the depth of the bulk medium by adjusting the skin depth - a current layer along the current path, and in which the power management system generates the current density in the direction across the current path with the help of the power management system by adjusting the current proximity effect.

The second general aspect may be embodied in a system for heating a bulk medium, which includes two or more electrodes located at a distance from each other and connected to the bulk medium; and a power management system connected to the electrodes, wherein the power management system is configured to heat the bulk medium by generating a current density along the current path between the electrodes, which results in the creation of an effective resistance along the current path in the bulk medium, which is greater than the resistance of the bulk medium to constant current, in which the power management system generates the current density in the depth of the bulk medium by adjusting the depth of the current skin layer, and in which the power management system generates the current density in the direction across the current path by the power management system by adjusting the current proximity effect.

A third general aspect may be embodied in a system that includes two or more electrodes configured to be connected to a bulk medium; and a power management system configured to connect the electrodes and heat the bulk medium by generating a current density along the current path through the bulk medium between the electrodes, resulting in an effective resistance along the current path that is greater than the DC resistance of the bulk medium in which the system the power management system generates the current density in the depth of the bulk medium by adjusting the current skin depth, and in which the power management system generates the current density in the direction across the section of the current path using the power management system by adjusting the current proximity effect.

The fourth general aspect can be embodied in a system that includes two or more electrodes located at a distance from each other and connected to a bulk medium; a power management system connected to the electrodes and configured to generate an AC signal along the current path through the bulk medium between the electrodes at a frequency above 1 kHz and below 300 GHz; and a second current path located near the surface of the bulk medium and along the current path through the bulk medium.

The fifth general aspect may be embodied in a heating system that includes two or more electrodes spaced apart and connected to a bulk medium; a power management system connected to the electrodes and configured to generate an AC signal along a current path through the bulk medium to heat the bulk medium; and an impedance adjustment circuit connected between the heating control system and the electrodes and configured to adjust the impedance of the heating control system in accordance with the impedance of the bulk medium.

A sixth general aspect may be embodied in a heating system that includes two or more electrodes spaced apart and connected to a bulk medium, each of the two or more electrodes including a material having at least the same electrical conductivity. , as a bulk medium, and connected to the bulk medium in such a way as to reduce the contact resistance between the electrode and the bulk medium; and a power management system configured to be connected to the electrodes, wherein the power management system is configured to heat the bulk medium by generating a current density along the current path through the bulk medium between the electrodes, resulting in an effective resistance along the current path that is greater than the resistance volumetric medium to direct current, and the heating system generates the current density by adjusting the depth of the current skin layer along the current path.

A seventh general aspect may be embodied in an aircraft de-icing system that includes two or more electrodes spaced apart and connected to a portion of the aircraft; a power management system connected to the electrodes and configured to heat the volumetric medium by generating a current density along the current path through the volumetric medium between the electrodes by: generating an alternating current signal along the current path through the section of the aircraft between the electrodes with a frequency of 1 MHz to 50 MHz, moreover, the frequency causes the formation of the current density in the first direction by adjusting the depth of the skin layer of the current along the path of the current; and providing a second current path located along at least a section of the current path through the aircraft section and within 10 cm from the surface of the aircraft section, wherein the proximity of the second current path to the surface of the aircraft section causes the current density to be generated in a second different direction by adjusting the effect the proximity of the current along the section of the current path.

An eighth general aspect may be embodied in a system for heating the outer surface of a bulk medium. The system includes two or more connecting strips located at a distance from each other and attached to the bulk medium. Each of the connecting strips has a multilayer structure extending along the surface of the bulk medium, which, in combination with the bulk medium, forms a transmission line. The multilayer structure includes a first dielectric layer over the bulk medium, a conductive layer over the first dielectric layer, a second dielectric layer over the conductive layer, and a conductive shielding layer over the second dielectric layer. The power management system is connected to the conductive layer of each of the connecting strips and to the bulk medium. The power control system is configured to heat the surface of the bulk medium by supplying electric current to the connecting strips. In various embodiments, the volumetric medium may be the skin of an aircraft, a wind turbine blade, the roof of a building, or railroad tracks.

A ninth general aspect may be embodied in a system for heating the exterior of a structure, the structure being made of a non-conductive material. The design includes bulk conductive material embedded in it. The system includes two or more connecting strips located at a distance from each other and attached to the structure. Each of the connecting strips has a sandwich structure extending along the structure which, in combination with the bulk conductive material embedded in the structure, forms a transmission line. The multilayer structure includes a conductive layer overlying the bulk conductive material and a first dielectric layer between the bulk conductive material and the first conductive layer. The power management system is connected to the conductive layer of each of the connecting strips and to the structure. The power management system is configured to heat the surface of the structure by supplying electric current to the connecting strips. In various embodiments, the structure may be the skin of an aircraft, a wind turbine blade, the roof of a building, or railroad tracks.

The tenth general aspect can be embodied in a method for installing a system for heating a bulk medium. The method includes the step of obtaining connecting strips, where each connecting strip contains a multilayer structure, which includes a first dielectric layer, a conductive layer overlapping the first dielectric layer, a conductive shielding layer overlapping the conductive layer, and a second dielectric layer between the conductive layer and a conductive shielding layer. The method includes the step of attaching each of the connecting strips to the surface of the bulk medium at a distance from each other, wherein the first dielectric layer of each connecting strip is located between the bulk medium and the conductive layer. The method includes connecting a conductive layer of each of the connecting strips to a power management system configured to supply electric current to the connecting strips. In various embodiments, the volumetric medium comprises the skin of an aircraft, a wind turbine blade, a roof of a building, or railroad tracks.

The object of the present invention described in this application may be implemented so as to implement one or more of the following advantages. A less bulky and lighter electrical system can be used to heat the conductor. In addition, heating can be localized to the target area so as not to overheat the circuits of the heating system. The heating system may be more efficient, for example, by generating heat directly in the bulk medium itself (eg an aircraft wing) rather than in a heating element or heating layer attached to the bulk medium. The system can also use less current and voltage for heating, potentially improving safety and reliability. In some implementations, the voltage of the components may also be reduced. Installing or upgrading a system can be easier, faster, or cheaper. Maintenance of the system may be cheaper or easier. The system may not require intervention when installed in existing systems. The system can de-ice faster.

Detailed information about one or more embodiments of the object of the present invention are given in the attached drawings and in the following description. Other features, aspects and advantages of the subject matter of the present invention will become apparent from the description, drawings and claims.

BRIEF DESCRIPTION OF THE DRAWINGS

Fig. 1 is a schematic representation of an exemplary bulk medium heating system.

Fig. 2A-2B are schematic views illustrating an exemplary bulk medium heating system that uses the skin effect to concentrate current density in a first direction in a bulk conductor.

Fig. 3 is a graph illustrating increased current density concentration versus applied AC due to skin effect.

Fig. 4A-D are schematic diagrams illustrating exemplary bulk media heating systems that use the proximity effect to concentrate current density in the second direction in the bulk conductor.

Fig. 5A-B are graphical simulation results illustrating the increased current density concentration in the bulk conductor near the second conductor as a function of the distance between the conductors due to the proximity effect.

Fig. 6A is a schematic representation of an exemplary bulk medium heating system using an array of electrodes.

Fig. 6B-D are schematic representations of exemplary bulk media heating systems using various electrode devices.

Fig. 7 is a schematic diagram of an exemplary signal conversion unit including the main sub-units of conversion to standardized power and AC generation.

Fig. 8 is a schematic representation of an exemplary signal conversion unit including the main sub-units of power conversion, AC generation, and control.

Fig. 9A is a schematic of an exemplary power conversion sub-unit including a flyback converter and a common mode choke.

Fig. 9B is a schematic representation of an exemplary flyback converter.

Fig. 10A is a schematic of an exemplary AC generation subunit including a dual MOSFET class D amplifier, a temperature compensated crystal oscillator, and a gate driver.

Fig. 10B is a schematic representation of an exemplary class D switching amplifier.

Fig. 10C is a schematic of an exemplary AC generation subunit including a dual MOSFET class D amplifier, a temperature compensated crystal oscillator, a gate driver, and a low power conversion stage.

Fig. 11 is a schematic diagram of an exemplary control sub-unit including a microcontroller and a low power conversion stage.

Fig. 12 is a schematic diagram of an impedance adjustment circuit between a source and a load.

Fig. 13A-D are schematic illustrations of exemplary building blocks of an impedance adjustment circuit.

Fig. 14 is a schematic diagram of an exemplary adjustment circuit block including a passive adjustment sub-unit.

Fig. 15A is a schematic diagram of an exemplary regulation circuit block including an active regulation sub-block and a control sub-block.

Fig. 15B is a schematic diagram of an exemplary regulation circuit block including an active regulation sub-block, a low power conversion stage, and a control sub-block.

Fig. 16 is a schematic representation of cable stages in an exemplary heating system.

Fig. 17 is a schematic representation of an exemplary electrode for a heating system.

Fig. 18A is a schematic representation of an exemplary attachment between an electrode and a bulk medium by means of a solder joint.

Fig. 18B is a schematic representation of an exemplary attachment between the electrode and the bulk medium by means of rivets.

Fig. 18C is a schematic representation of an exemplary attachment between the electrode and the bulk medium by means of a sealing tape.

Fig. 18D is a schematic representation of an exemplary combined attachment between an electrode and a bulk medium.

Fig. 19 is a sectional view of an exemplary bonding strip for delivering high frequency heating signals to a bulk medium, in accordance with embodiments of the present invention.

Fig. 20 is an exemplary layout of the connecting strips of FIG. 19 on the wing of the aircraft.

Fig. 21 is a plan view of several exemplary bond strips to illustrate various conductive layer configurations in the bond strip.

Fig. 22A is a plot of the simulated current density generated in the aircraft skin by an exemplary bonding strip and the electric field density between the bonding strip and the aircraft skin.

Fig. 22B is a graph of the simulated current density generated in the aircraft skin illustrated in FIG. 22A.

Fig. 23 are schematic diagrams of arrangements of several exemplary conductive layer arrangements in a bonding strip.

Fig. 24A is a sectional view, taken along the line A-A', of the connecting strip according to the arrangement A in FIG. 23.

Fig. 24B is a sectional view, taken along the line B-B', of the connecting strip according to the layout B in FIG. 23.

Fig. 24C is a sectional view, taken along the line C-C', of the connecting strip according to the layout C and the layout D in FIG. 23.

Fig. 25A is a sectional view of an exemplary configuration for attaching a bonding strip to a bulk medium.

Fig. 25B is a sectional view of another exemplary configuration for attaching a bonding strip to a bulk medium.

Fig. 26A is a sectional view of a bonding strip with a double-sided adhesive backing prior to installation on a bulk medium; Fig. 26B is a sectional view of the connecting strip of FIG. 26A installed on a bulk medium.

Fig. 27A-27F are sectional views of various embodiments of embedded connecting strips.

Fig. 28 are schematic representations of an embodiment of a trunk connector.

Fig. 29 is a schematic representation of another embodiment of a trunk connector.

Fig. 30 is a block diagram of a first exemplary bulk medium heating system using bonding strips according to embodiments of the present invention.

Fig. 31 is a block diagram of a second exemplary bulk medium heating system using bonding strips according to embodiments of the present invention.

Fig. 32 is a block diagram of a third exemplary bulk medium heating system using bonding strips according to embodiments of the present invention.

The same elements are indicated throughout the various drawings by the same reference numerals and symbols.

IMPLEMENTATION OF THE INVENTION

The heating system of the present invention uses alternating current to increase the effective electrical resistance of conductive materials (eg aluminum, carbon fiber reinforced plastics) to facilitate their heating. In general, the heat generated in the conductive material can be used to melt ice formed on the surface of the conductive material. In addition, heat can be used to maintain an elevated temperature of conductive materials to prevent vapor deposition on the surface or to prevent water from freezing on the surface, as well as to prevent the accumulation of freezing precipitation (for example, snow, ice pellets, fog, freezing rain) on the surface. For example, heat generated in a conductive material may be propagated (eg, dissipated) throughout the conductive material. In addition, the heat generated can cause convection at the interface between the conductive material and some liquid on the surface, for example, to heat the liquid and prevent it from freezing.

Alternating current can be used to create a number of electromagnetic effects that increase the effective resistance of the conductive material, facilitating the generation of heat using Joule heating of the conductive material. These effects include skin effect, proximity effect, induction, eddy currents, hysteresis losses and dielectric losses. With regard to the skin effect, if the frequency of the current in the conductor is set to a sufficiently high value, most of the current will pass through the skin depth of the conductive material, which is much less than the geometric thickness of the conductive material. In addition, to create a proximity effect in the conductive material, a certain device geometry can be used which will further constrain the width of the current density and thereby further increase the effective resistance along the current path in the conductive material. The combination of these two effects can be used to increase the electrical resistance of a conductive material and, as a result, Joule heating.

For example, Joule heating is generally related to the heat generated when an electric current passes through a conductor. The heat generated in a particular conductive conductor is proportional to the resistance of the material times the rms value of the current amplitude squared:

The heat generated by the heating element is generally increased by increasing the current through the conductor and by providing heating elements having a relatively higher resistance. However, embodiments of the present invention implement Joule heating by effectively using certain electromagnetic phenomena (eg, skin effect and proximity effect) to limit the localized current density in the bulk medium. This current density limitation results in an increase in the effective resistance along the current path in the bulk medium. Although specific effects may differ in different materials having different geometries, the effective resistance for a given length along the current path through the bulk medium can generally be represented as follows:

where ρ is the resistivity of the material through which the current passes, l is the length of the current path, and A _eff is the limited cross-sectional area of the current density. Embodiments of the present invention use electromagnetic phenomena to reduce A _eff to an area smaller than the cross section of the bulk medium along the current path, thereby increasing the effective bulk medium resistance above the effective DC resistance of the bulk medium.

In some embodiments of the present invention, these electromagnetic phenomena can be used to increase the length of the current path through the bulk medium. For example, as described below with reference to FIG. 4D, the techniques described herein can be used to "guide" a current path along an indirect route (eg, a serpentine path) between two electrodes attached to a bulk medium. An indirect path may create a current path whose effective length ( l _eff ) is longer than the substantially direct path that would normally result from passing current between two electrodes in the absence of electromagnetic effects such as proximity effects. Thus, the systems described in this application can increase the length l of the current path to an effective length ( l _eff ) greater than the direct path that the current passes in the absence of various systems and conductor arrangements described in this application. Accordingly, such embodiments can increase the effective resistance ( R _eff ) both by limiting the effective cross-sectional area ( A _eff ) of the current passing through the bulk medium and by increasing the effective length ( l _eff ) that the current passes through the bulk medium, which further increases the effective resistance of the bulk medium above the effective resistance of the bulk medium to direct current. In such implementations, the effective resistance can be generally represented as follows:

Through the use of such techniques, embodiments of the present invention can provide high localized resistance in conductive bulk materials (eg, aluminum, copper, steel, and their alloys).

Skin effect in the context of the present application generally refers to the tendency of an alternating current to be unevenly distributed in a conductor such that the current density is greater near the surface of the conductor and decreases as the distance from the surface of the conductor increases. The intensity of the skin effect increases with increasing frequency of the current and the conductivity of the material through which the current passes. In some embodiments of the present invention, the skin effect can be controlled so that the electrical current flows mostly on the outer surface of the conductor (eg, "deep skin") at higher AC frequencies.

In general, the skin effect in a conductor can be represented by the following formula:

$$J=J_S{e}^{-(1+j)d/\delta }\text{with}\delta =\sqrt{\frac{2p}{\omega \mu }}\sqrt{\sqrt{1+{(p\omega \epsilon )}^2}+p\omega \epsilon }$$ ,

where J is the current density, J _s is the surface current density, d is the depth of the point at which the current density is calculated, δ is the skin depth, ρ is the resistivity of the conductor, ω is the angular frequency of the current, μ is the magnetic permeability of the conductor, ε - dielectric constant of the conductor. In the case of a cylindrical conductor having a base radius R, the current density can be further obtained as follows:

$$J=J_S\frac{J_0(\sqrt{\frac{-j\omega \mu }{p}}(R-d))}{J_0(\sqrt{\frac{-j\omega \mu }{p}}R)}$$ ,

where J ₀ is the zero-order Bessel function of the first kind.

In the case of a rectangular infinitely long and wide plate, through which the surface current passes, the surface effect can be represented by the following formula:

$$J=J_S\frac{sh(\sqrt{j\omega \sigma \mu }d)}{sh(\sqrt{j\omega \sigma \mu }e)}$$ ,

where J _s is the forced component of the surface current, σ is the plate conductivity, e is the plate thickness, and sh is the hyperbolic sine function. For example, in the graph shown in Fig. 3, which will be discussed in more detail below, shows an example of limiting the current density deep in the material (eg, deep in the skin layer) in a cylindrical conductor caused by a skin effect. As described above, such limitation of the effective cross section increases the effective resistance of the conductor.

For example, in the graph shown in Fig. 3, which will be discussed in more detail below, shows an example of current density limitation in the depth of the material (eg, in the depth of the skin layer) caused by the skin effect.

Proximity effect, in the context of the present application, generally refers to the effect of an alternating current flowing in a first current path (eg, in a conductor) on the density of an alternating current flowing in a second, nearby current path. For example, as shown in FIG. 5A-5B and described in more detail below, alternating current in the first current path causes a "narrowing" or limitation in the density of the alternating current in the second current path around the first current path. In embodiments of the present invention, for example, the density of a current passing through a bulk medium is "attracted" to another conductor carrying an alternating current when the conductor is placed near the current passing through the bulk medium. The degree and direction of current density limitation (e.g., concentration) caused by the proximity effect depends on several variables, including, for example, the distance between two or more AC paths, the direction of current flow in the individual current paths relative to each other, the frequency of the AC in the paths current and the magnitude of the individual current in the current paths.

For a better understanding, the heating system according to the present invention will be described with reference to the de-icing and de-icing system for the outer surface of an aircraft as an exemplary context. However, the heating system of the present invention may be used in other contexts, including, but not limited to, surface heating of other aircraft, drones, wind turbines, plants involved in cryogenic operations, heat pumps, automobiles, radio towers, railroad tracks, manned or unmanned military vehicles, rooftops or heating of other conductive surfaces where it is desirable to control the formation of ice and water. The heating system can be used for de-icing or de-icing. In some embodiments, the heating system may be used to heat less conductive materials, such as by applying a conductive layer over or within a non-conductive material. Such implementations may be used to heat road surfaces (eg, roadways), building materials, roofs, floors, or other low conductive or non-conductive materials.

De-icing in the context of this application generally refers to the removal of snow, ice or frost (collectively referred to as "ice") from a surface. In some embodiments, the heating system may only melt a portion of the ice present on the conductive surface. The ice can then be removed from the surface (eg, by sliding off the surface after the melting process has begun and breaking bonds between the ice and the surface).

Prevention of icing in the context of this application generally refers to the prevention of the formation or accumulation of snow, ice or frost (collectively referred to as "ice") on a surface. In some embodiments, the heating system maintains a surface temperature high enough to prevent ice from forming on the surface and to prevent ice buildup or buildup (e.g., due to freezing precipitation such as snow, frost, ice pellets, freezing rain, etc.) .

On FIG. 1 shows a block diagram of an exemplary heating system 100 for heating a bulk medium. Heating system 100 includes a power management system 104 coupled to electrodes 116 and 118. Electrodes 116 and 118 are coupled to a target region of bulk medium 102 (eg, a portion of an aircraft wing). The power management system 104 provides alternating current (for example, at a frequency of 1 kHz or higher) in a closed circuit through the wire (or path or cable) 106, through the bulk medium 102, and finally through the wire (or return path) 108. Direction 112 current through the wires is shown by a dotted arrow.

In some embodiments, heating system 100 may include, without limitation, power management system 104, electrodes 116 and 118, and special cables (eg, wires 108 and 106). In some embodiments, the heating system is configured to connect to electrodes 116 and 118. In some embodiments, the heating system is configured to connect to special cables (eg, 108 or 116). In some embodiments, power management system 104 may include, but is not limited to, a signal generation unit, a power supply, a signal conditioning unit, an impedance adjustment circuit, a control unit, and sensors, specific configurations of which are described in more detail below. As detailed below, in some embodiments, the impedance adjustment circuit is an impedance matching circuit.

In some embodiments, electrodes 116 and 118 are contact electrodes. For example, the electrodes 116 and 118 are physically connected to the bulk fluid 102 to supply electrical current from the power control system 104 to the bulk fluid. In some embodiments, electrodes 116 and 118 may be connected to bulk medium 102 while being electrically isolated from bulk medium 102. For example, in such embodiments, electrodes 116 and 118 may be the input and output of an inductor located near bulk medium 102 for inducing current in the bulk medium 102 due to the magnetic field.

The power control system 104 can supply a current at a high enough frequency (eg, above 1 kHz) to limit the flow of current in the z direction between the electrodes 116 and 118 by adjusting the skin effect, which results in a higher resistance of the bulk medium 102. For example, the control system 104 power can provide alternating current with a frequency of 1 kHz to 300 GHz. In some embodiments, the current frequency is between 10 kHz and 30 GHz. In some embodiments, the current frequency is between 100 kHz and 450 MHz. In some embodiments, the current frequency is in the range of 1 MHz to 50 MHz, 100 MHz to 150 MHz, 200 MHz to 300 MHz, 400 MHz to 500 MHz, or 800 MHz to 1 GHz.

In some embodiments, the return path 108 is located in close proximity to the surface of the bulk medium 102. The proximity of the return path 108 to the surface of the bulk medium can be used to control the proximity effect of current flowing between electrodes 116 and 118 and therefore further limiting current and increasing heating of the bulk medium. environment. In order to use the proximity effect to generate current flowing between electrodes 116 and 118, it is not necessary to use the current return path 108 from the heating system circuit itself. In some embodiments, another current path 122 (eg, from another circuit) may be located in close proximity (eg, at distance 120a) to bulk medium 102. For example, when the distance 120 or 120a from the current path 108 or 122 to the bulk medium 102 is small enough, the proximity effect can be used to further limit the passage of current through the bulk medium.

For example, to create a proximity effect, the distance 120 (or 120a) between the bulk medium and the path 108 (or 122) may be less than 1 m, or less than 50 cm, or less than 10 cm. if, in the case of an aircraft wing as a volumetric medium, the rib or spar of the aircraft is not on the return path 108/122), the distance 120 (or 120a) may be less than 25 cm or less than 10 cm.

Bulk media 102 may include materials such as, but not limited to, aluminum, metal alloys, carbon fiber, copper, silver, titanium, or steel. For example, the volumetric environment can be any part of an aircraft airframe (eg, the outer skin or surface of an aircraft, also known as the "skin" of an aircraft), such as the fuselage, wings, landing gear, tail, etc.

The electrodes (116 and 118) may include materials such as, without limitation, aluminum, silver, copper, their alloys, or other conductive materials. In some embodiments, the electrode material has at least the same electrical conductivity as bulk medium 102. In some embodiments, electrodes 116 and 118 may be located in electrode arrays. The electrodes may be connected to the bulk medium in various ways, such as to the top or bottom surface of the medium, or may be embedded in the medium.

Heating system 100 is configured to provide effective resistance in bulk medium 102 by generating a current density through the medium. In other words, in the case of an aircraft, the existing airframe of the aircraft will be used as part of the electrical circuit of the heating system. The heating system 100 generates current density by adjusting the skin effect, the proximity effect, or a combination of both to increase the effective resistance of the bulk medium 102 along the current path between the electrodes 116 and 118. In some cases, the proximity effect is also used to guide the current path, for example, as shown in FIG. . 4D, for heating the necessary sections of the bulk medium. The area of the bulk medium to be heated may be referred to as a "target heating site" or "target site".

In some embodiments, an alternating current with a frequency of 1 kHz or higher may be passed directly through the airframe of the aircraft. As a result, Joule heating will occur in the area of the airframe near the surface through which the current passes. In addition, the heat generated by the passage of current, due to thermal conduction, will be distributed throughout the volumetric medium 102.

With reference to FIG. 2A-2B, the heating system 100 generates a current density through the middle target area 102 by using a skin effect. As in Fig. 1, alternating current (in direction 212) is applied by electrodes 116 and 118 through the target area of bulk medium 102. FIG. 2A is a schematic diagram illustrating a profile (eg, side view) of current density 202 through a target region of bulk medium 102 without skin effect (eg, with a current frequency of less than 1 kHz). The current flows in the y direction (212), with most of the current flowing in the medium volume 102 indicated by the arrows. For example, the current has a depth 206 of about 2 mm, for example, over almost the entire thickness of the bulk medium. Thus, in FIG. 2A shows the operation of system 100 with little or no current density shaping due to skin effect.

Fig. 2B is a schematic representation of the current density profile 202 resulting from the application of alternating current of higher frequency (eg, above 1 kHz) through the electrodes. On FIG. 2B shows the operation of the system 100 while shaping the current density due to the skin effect. For example, due to the skin effect created by operating the high frequency heating system 100, the depth of the current density 202 flowing through the bulk medium 102 is limited in the z direction to a narrow region near the surface of the bulk medium 102. In addition, the effective resistance of the bulk medium 102 in the area of current flow is greatly increased so that Joule heating can occur in this area without overheating the rest of the circuit (eg wires, power supply, inverter, control circuit, electrodes). The effective resistance of the bulk medium to AC in the target area may be greater than the resistance of the bulk medium to direct current. For example, the effective resistance may be two or more orders of magnitude higher than the direct current resistance of the bulk medium.

Fig. 3 is a graph illustrating the concentration of current density (y-axis, scaled to 1) in the depth of the material (x-axis, scaled to 1) as a function of applied alternating current due to the skin effect. The current density decreases exponentially along the thickness (z-direction) of the medium. As the frequency increases from 1 kHz to 10 MHz, the current density becomes more concentrated near the surface of the bulk medium. Thus, the higher the frequency, the more pronounced the decrease. In other words, the skin effect limits the current density, causing current to flow through a thin layer near the surface of the bulk medium. Therefore, Joule heating will occur in this layer.

Fig. 4A is a schematic side view of a system 400 for using the proximity effect to further limit current density. As in Fig. 1, electrodes 116 and 118 are attached to the bulk medium 102 (eg, the target area of the airframe) and pass an AC signal (eg, at a frequency greater than 1 kHz) to create a current density (or path) 410 directed 412 through the medium. The return path 108 is located at a distance 120 from the current path (or density) 410 in the medium and has a direction 112 different from the direction 412. In some implementations, the return path 108 is electrically isolated from the bulk medium 102. For example, the return path 108 may be a wire or a cable located at a distance of 120 from the bulk medium 102. The return path 108 may be a wire or cable that completes the circuit of the system 400.

If the return path 108 is close enough to the current path 410 (eg, less than 50 cm), the alternating current in the return path 108 limits the current in the current path 410 in a direction transverse to the current flow path in the current path 410. In other words, placing the return path 108 close enough to the current path 410 results in a limitation of the current cross-sectional area in the current path 410. For example, with reference to FIG. 4A-4C, current is limited in two directions (eg, in the x direction and z direction as shown) between electrodes 116 and 118. For example, as shown in FIG. 4D, the proximity effect limits the current density 410 to either the x direction or the y direction depending on the direction of current flow. For example, if current flows in the x direction, the proximity effect limits the current in the y direction. For example, the proximity effect preferentially limits the current across the direction of current flow, while the skin effect preferentially limits the current density deep in the bulk medium (eg, in the z direction, as shown in FIGS. 2A and 2B). In some cases, the proximity effect may also complement the narrowing of the current density in depth (eg, in the z direction) of the bulk medium 102, for example, by enhancing the skin effect in implementations that use both the skin effect and the proximity effect. In some embodiments, the proximity effect may also be used to specify the direction of current flow through the bulk medium (eg, the path that current takes through bulk medium 102).

Fig. 4B-C are exemplary plan view diagrams of system 400. Electrodes 116 and 118 are attached to a target region of bulk medium 102 and pass an AC signal (eg, at a frequency greater than 1 kHz) to create a current density (or path) 410 directed 412 through the medium. The return path 108 is located in a different x-y plane (dashed line) than the plane of the current path 410 (or density) in the bulk medium 102. current path 410 through bulk medium 102. For example, in some embodiments, the direction 112 of current flow in return path 108 is opposite to the direction 412 of current flow in current path 410. If distance 120 from return path 108 to current path 412 is small enough (eg, less than 50 cm), current flowing between electrodes 116 and 118 in bulk medium 102 will be concentrated near the return path wire (eg, narrow in the y direction and in the direction z) due to the proximity effect, as shown in FIG. 4C. The greater the distance from the return path 108 to the bulk medium 102, the less the current path 412 in the bulk medium 102 is restricted, as shown in FIG. 4b.

Fig. 4D is an exemplary top view diagram of another embodiment of system 450. As in the previous system 100, the electrodes 116 and 118 are attached to the target area of the bulk medium 102. The return path 108 is located near the bulk medium 102 and in an x-y plane different from the plane of the current path 410 in the bulk medium 102. The embodiment shown demonstrates how you can use return path 108 (or another separate current path) to form current path 410 through bulk medium 102. For example, by placing a second current path (eg, a conductive wire or cable, such as return path 108) near volume medium 102, a proximity effect may be used both to limit the width of the current density across the current flow direction and to form the current path 410 in the bulk medium 102. FIG. 4D also shows that the proximity effect limits the current density along the current path 410 across the current flow direction. For example, in FIG. 4D, the current density along current path 410 is limited in a direction substantially perpendicular to the direction of current flow in each segment of path 410, and current path 410 in bulk medium 102 follows the shape of return path 108. In particular, in section A of current path 410, current is directed such that so that it flows in the x direction and the current density is limited in the y direction and the z direction. In section B of the current path 410, the current is directed to flow in the y direction and the current density is limited in the x direction and the z direction.

The ability to give the current path a more complex geometry due to the proximity effect, as shown in FIG. 4D can have a number of advantages. First, such a path geometry can be used to increase the effective length l of the current path. As described above, an increase in path length leads to an increase in resistance and hence an increase in Joule heating. Secondly, the geometry of the current path can be configured to direct current to strategic locations to heat them up. Third, current path geometry can be used to create hot spots (eg, hot spots) at sharp corners of the current path.

Due to the combination of the proximity effect and the skin effect, the effective resistance of the bulk medium to AC in the target area can be greater than the resistance of the bulk medium to DC. For example, the effective resistance may be two or more orders of magnitude higher than the direct current resistance of the bulk medium.

On FIG. 5A-B are graphical simulation results illustrating increased current density concentration in a target region of bulk conductor 102 near second conductor/path 108 as a function of distance 120 between conductors due to the proximity effect. The current in the bulk conductor and the second path is sufficient to create a proximity effect (for example, a frequency above 1 kHz or 10 MHz) as the distance 120 decreases. For example, when the distance 120 is 20 cm, the current density 410 remains approximately the same in the x-y plane, as shown in Fig. 5A. By reducing the distance of 120 to 2 cm, as shown in Fig. 5B, the proximity effect causes current 410 to "concentrate" or "limit" around return path 108 in the x-z plane. This is accomplished by having most of the current 410 concentrated in a narrow band along the bulk conductor and following the path of the second conductor (108) (eg, return path or other conductive wires). In other words, current 410 follows the path of least inductance rather than being distributed evenly throughout the bulk medium.

In some embodiments, a wire other than return path 108, shown as path 122 in FIG. 1. In this case, current fluctuations in this wire may or may not be controlled by the same system (eg, power management system 104) as paths 106 and 108. In this case, the proximity effect of wire 122 will depend on the distance from wire 112 to current path 412 in the bulk conductor. As with return path 108, wire 122 may be required to be sufficiently close (e.g., less than 50 cm) to path 412.

In general, power management system 104 supplies current to bulk medium 102 via electrodes (eg, 116 and 118) and special electrical conductors (eg, special wires or special cables) to form a closed circuit (see FIG. 1). These three components will be discussed in more detail below.

In some embodiments, electrodes 116 and 118 include an array of input and output electrodes as shown in FIG. 6A. The electrode system 600 includes three input electrodes 116(1)-(3) forming an electrode array 116 and three output electrodes 118(1)-(3) forming an electrode array 118 and forming adjacent current paths 410 in the bulk medium. Proximity effect due to current 112 in return wires 108 limits the current density 410 in the bulk medium as described above.

In general, electrodes of various geometries may be used to achieve the desired heating in target regions of bulk medium 102. For example, with reference to FIG. 6B, system 610 illustrates two electrode devices 116 and 118 used to deliver current through a target area of bulk medium 102 (with input/output wires 106 and 108). The electrode device 116 and 118 may be an array of one or more electrodes as shown in FIG. 6A. Fig. 6C-D are schematics of other electrode configurations 620 and 630, respectively, for heating target area(s) 120, such as on an aircraft wing. The electrode devices designated 116, 118, and 640 may be single electrodes or an array of one or more electrodes, as shown in FIG. 6A. Additional information on the shape and design of the electrodes is given below.

In some embodiments, the volumetric environment is the skin of an aircraft, and the targeted areas of heating include, without limitation: wings, fuselage, vertical stabilizers, horizontal stabilizers, windows, wingtips, windshield, control surfaces (flaps, ailerons, rudder, rudder heights, air brakes, etc.), nose/nose cone, landing gear, landing gear brakes, landing gear doors, engines and engine nacelles, air conditioning inlets and outlets, fuel tank vents, air pressure receivers, static pressure receivers, and others antennas, sensors and external signal lights, service panels. In other words, in some cases, the proposed technology may include the placement of electrodes on the inside of the airframe in one or more of the configurations shown in FIG. 6A-D. In some embodiments, the heating system 100 will provide Joule heating to portions of the target area, and then the thermal conductivity of the material may provide more "distributed" heating.

In general, power management system 104 includes a signal generation system configured to generate a high frequency (eg, greater than 1 kHz) AC electrical current signal and transmit it through the above target area of bulk medium 102. In some embodiments, in which the impedance of the target area is small (much less than 1 Ω in some cases), the signal generation system is configured to generate and maintain the necessary current level to effect Joule heating of the target area. In some cases, because the impedances of other parts of the system (eg, electrical or signal-carrying wires) are greater than zero, the high current flowing through those parts will produce unwanted Joule heating outside of the target area. For this reason, in some implementations, the signal generation system is designed such that high current is applied only in the vicinity of the target area.

In some embodiments, some or all of the elements/assemblies of the signal generation system, and the conductive assemblies/cables connecting them, are designed to minimize the unwanted power losses typically associated with the transmission of high current and high frequency electromagnetic signals.

In some embodiments, the signal generation system may be powered by existing power sources (eg, existing aircraft busbars). In some implementations, the system uses a special battery or a special power supply that is part of the system. For example, such special power sources may include, without limitation: fuel-fired electrical generators, solar-powered electrical generators, wind-powered electrical generators, gas-powered electrical generators, and so on. In some implementations, the signal generation system may be located in a circuit between a power source (eg, an existing bus bar, a dedicated battery, a dedicated power source) and the target area.

In addition, in some embodiments, the signal generation system may include control circuits and devices that exist as independent blocks and/or are embedded in a collection of other blocks that are part of the signal generation system.

In some embodiments, heating system 100 is used to heat multiple separate target areas. In such a case, each element or block of the heating system (e.g., signal conditioning block, impedance adjustment circuit, etc.) can either be centralized for the entire system, or can be distributed as a separate block or several blocks based on the target area. or a group of target areas. Centralization or distribution configurations can be used to improve system functionality, improve energy efficiency, reduce cost, comply with regulations, reduce weight, size, and complexity, among other things. For example, in some implementations, the signal conditioning block is centralized, while the impedance adjustment circuit is distributed on the basis of one or more blocks per target area. In some embodiments, the signal conversion unit is partially centralized and includes a centralized power conversion subunit and an AC generation subunit distributed at the rate of one or more subunits per target area or group of target areas. In some embodiments, the signal transform block is fully distributed, with each of its sub-blocks distributed on the basis of one or more sub-blocks per target area or group of target areas.

In some embodiments, the power management system 104 continuously supplies power to the target area 102 until the heating/deicing/anti-icing operation is completed. In some implementations, the system may turn power on and off (for example, using a control unit) in an improved/efficient manner to achieve the desired heat generation and distribution in the conductive material 102. For example, when the system is turned on, heat is generated at specific locations in the target area and transferred over the target area, "distributing" to the rest of the target area. When the system is turned off, the generated heat continues to spread through the target area.

In some embodiments, as an enhancement, the system may include different power levels for the on state and cycle through the off state and different power levels. In some embodiments, specific power levels may be achieved with a gradual increase/decrease in power as opposed to a single step increase or decrease in power. Such pulsed power management system operation modes may either be fully pre-programmed during system setup, or may be changed and dynamically improved based on feedback loops forming part of the system's control unit, as detailed below.

In some implementations in which the heating system includes multiple target areas, the pulsed power mode described above can be used asynchronously across all target areas so that all target areas will heat up in the required amount of time, with both overall averages, so the total instantaneous power levels will remain below a predetermined threshold. For example, in the case of an aircraft de-icing system that heats both wings, the fuselage, and the horizontal and vertical stabilizers, this staggered power delivery can be designed so that the system is turned on for only one target area at a time. In some embodiments, the staggered power-up mode may be as follows: turning on the system for the left wing, then the fuselage, then the right wing, then the vertical stabilizer, and then the horizontal stabilizer.

In some embodiments, improved timing may be used at each step to achieve the desired heat, average power, instantaneous power level, and acceptable heat distribution. In some implementations, similar to the mode described above, any subset of target areas can be heated at a given time.

In some embodiments, one or more blocks or elements specified as part of the design of the heating system have a casing. Such a housing can be designed for a single unit or for any combination of units. In some embodiments, enclosures are designed to meet environmental validation standards. For example, enclosures can be designed to meet criteria such as non-combustibility, weather protection, mounting and construction to provide protection from external shock and vibration, electrical isolation, protection against external electromagnetic interference and shielding of external electromagnetic interference radiation in closed circuits, as well as thermal unloading.

In some embodiments, some housings may be designed to use the structure of a heated object (eg, a bulk conductive material) as a heat sink. For example, one or more blocks of the heating system may be placed in metal or conductive structures installed so that they have a high thermal conductivity with respect to the bulk medium on which they are located. One possible advantage of this design is the heating of the bulk medium, as well as providing the necessary cooling of the electronic equipment. Another possible advantage of this design is to reduce the weight of the heating system (or device) by eliminating the need to provide a separate heat sink to dissipate losses. In some embodiments, target areas may be used as part of the heat sinks of the heating system units. Such use can improve the efficiency of the heating system, since the circuits of the heating system inevitably create heat losses that can be transferred to target areas for heating.

In some embodiments, various types of adhesives or fasteners may be used to secure the housing to the bulk medium. For example, one adhesive, used primarily to maintain mechanical rigidity, may be used to hold the casing in place, while another adhesive (or layer) may be used to provide a lower thermal impedance path for the casing's heat dissipation function.

In some embodiments, one or more units of the heating system may be configured to determine one or more measurements, including, but not limited to, voltage, current, temperature, forward power, and reflected power, measured on the unit's circuits, surrounding cables, other units, or targets. areas. In some implementations, such measurements can then be used to monitor the operating status of the block(s) and control their operation (using a feedback mechanism), including on/off, output levels, and internal control of switching and tuning parts to improve efficiency. (More detailed information about the control of switching and setting parts in the dynamic adjustment scheme is given below). Adjustable parameters may include power-to-load and/or current-to-load ratio, voltage control in the control circuit, and other appropriate signals.

In some implementations, the measurements described above used within the feedback loops may also include special ice sensors that may be installed at or near the target areas. Such sensors may be used, for example, to inform the heating system and/or the user of the completion status of deicing, and may also provide input to adjust power levels during the deicing and deicing steps. In some embodiments, ice sensors may also be used to detect system failures and/or maintenance needs.

In some embodiments, the heating system may include a protocol converter control unit (or "control unit" or "sub-control unit") that receives input from a user (which may be a pilot or co-pilot in the case of an aircraft anti-icing system) and/ or from system sensors and outputs control signals to other units. In some implementations, user input may include, without limitation, on/off state, de-icing/anti-icing/shutdown state, target temperatures for target areas, and target power output for target areas. In some embodiments, sensor inputs may include, but are not limited to, voltage, current, temperature, forward power and reflected power, impedance, data from ice sensors, safety latch, various aircraft logic blocks, information from avionics, and also other data. In some embodiments, the protocol converter control unit is centralized for the entire system. In some embodiments, it is distributed on the basis of one protocol converter control unit per target area or group of target areas.

In some implementations, user input may be transmitted to the control unit either by wire (for example, using data communication standards such as ARINC 429) or wirelessly (for example, using a Bluetooth or Wi-Fi low energy connection). ). In some implementations, the user input device may either be integrated into the heating system (e.g., integrated into on-screen controls in the cockpit in the case of an aircraft de-icing system) or may be a separate device, such as a touchscreen tablet (e.g., a separate tablet). , installed in the cockpit, or a special application installed on the pilot's tablet with a touch screen in the case of an aircraft anti-icing system).

In some embodiments, the power management system 104 includes a signal conditioning unit or circuit that or that converts a signal from an existing busbar or a dedicated battery or any other heating system power source into the required high frequency AC signal to generate current in the bulk environment. . For example, in the case of an aircraft, the signal conditioning unit may take the DC power available from the aircraft busbar and convert it to the required high frequency AC signal. In another example of an aircraft, the signal conditioning unit may receive power available from the aircraft bus as an AC signal and convert it to the desired high frequency AC signal. In some embodiments, the signal conditioning unit may take DC power available from a dedicated battery or from any dedicated power source (eg, forming part of a heating system) and convert it to the required high frequency AC signal. In some implementations, special batteries or power supplies may be built into the same housing and/or circuit board as the signal conditioning unit.

Fig. 7 is a schematic diagram of an exemplary signal conditioning block 700 for a power management system 104, including a standardized power conversion main sub-block 710 and an AC generation main sub-block 720 that precede another circuit 730 in the rest of the device 100. The power management system 104 may be powered by existing power supplies, as shown in FIG. 7.

Fig. 8 is a schematic diagram of an exemplary signal conversion unit 800 for a power management system 104, including a standardized power conversion subunit 810, an AC generation subunit 820, and a control subunit 830.

In some implementations, the standardized power conversion subunit takes power from existing power supplies or from the heating system battery and converts it to a standardized input signal, such as 250 VDC, to improve the performance of the AC generation subunit, as well as to increase the efficiency of power transfer signal conversion block.

In some implementations where existing busbars provide power as a 400 Hz, 115 VAC signal to the standardized power conversion subunit, the standardized power conversion subunit may include a flyback converter with an output filter such as a common mode choke, to prevent electromagnetic interference from entering or damaging the AC generation subunit. Fig. 9A is a schematic diagram of an exemplary power conversion sub-unit 900 including a flyback converter 910 and a common mode choke 920. FIG. 9B is a schematic of an exemplary flyback converter 910.

In some embodiments, the power conversion subunit is a bridge rectifier that converts AC power from existing power supplies to any desired DC voltage. In some embodiments, the power conversion subunit takes DC power from a battery or existing power supplies (eg, 28 V DC, as is typical for an aircraft) and converts it to another DC voltage or AC voltage. For example, DC voltage conversion may be preferred for powering control units and elements of the heating system, in which case possible voltage levels may include ±3.3 V, ±5 V, and/or ±12 V. Finally, in some implementations a power factor correction stage can be included in the design of the sub-unit for converting to a standardized power supply, depending on the power source. In some implementations, power factor correction may be used to correct the non-linear loading of the power supply, which may be necessary. Cascades of active and passive power factor correction are possible.

In some embodiments, the AC generation subunit takes the input power from the conversion subunit to standardized power and converts it to the desired high frequency AC signal. In some embodiments, the AC generation subunit is designed to improve the power transfer efficiency of the signal conditioning unit. In some embodiments, the AC generation subunit includes a power amplifier or an AC/RF generator.

In some implementations, the main power amplification stage of the power amplifier is either "linear" or "switching". Relevant trade-offs between these two architectures may include efficiency, power handling, and linearity. Exemplary linear amplifiers may include class A, class B, and class C amplifiers. Exemplary switching amplifiers may include class D, class E, and class F amplifiers. In some embodiments, linear amplifiers have high linearity and low efficiency compared to switching amplifiers. amplifiers. Low efficiency can mean more complex thermal management, higher component requirements, etc. Low linearity can mean higher harmonic content potentially causing regulatory compliance issues, lower efficiency, more complex physical and electrical layouts, etc.

In some embodiments, the AC generation subunit includes a full-bridge class D amplifier. For example, the amplifier design uses dual MOSFETs powered by a gate driver and a temperature-compensated crystal oscillator that generates the required frequency. Fig. 10A is a schematic diagram of an exemplary AC generation sub-unit 1000 including a dual MOSFET class D amplifier 1010, a temperature compensated crystal oscillator 1020, and a gate driver 1030. Fig. 10B is a theoretical schematic of an exemplary Class D amplifier using dual MOSFETs. In some implementations, a full-bridge architecture can provide differential (balanced) transmission capability as well as four times the output power for a given bus voltage level at a given load compared to a half-bridge architecture. Differential gearing can also be important in terms of compliance with radiation regulations under the balanced load conditions represented by the intended wing design. In addition, in some implementations, Class D architectures may have higher switch utilization than other switching architectures.

In some implementations in a class D architecture with single frequency transmission, many of the input parameters can be changed to achieve improved output parameters. An exemplary input parameter includes a dead time. Exemplary output parameters include efficiency, component peak voltages, etc.

In some implementations, Class D architectures may have high switch utilization and all-silicon component implementations, making them suitable for potential ASIC development. In such designs, it is possible to implement a system-on-chip in which all control components and power electronics are either on a single chip or in a multi-chip package. In some embodiments, a class D architecture has distributed modules housing systems on a chip and supporting circuitry attached to various, distributed locations on a given aircraft element.

Other implementations use other switching designs, such as single-switch architectures, such as class E or class F. In some implementations, such architectures may have higher switching frequency implementations in which a high-side gate driver is difficult or impracticable to implement. . In some implementations, single-switch architectures may be used instead of Class D implementations as frequency increases due to the potential limitations of Class D implementations at these frequencies.

In some implementations, harmonic reduction and elimination techniques may be used with switching amplifiers to mitigate the negative effects of the harmonic distortion inherent in some switching architectures. For example, changing the signal's basic duty cycle, dampening pulses, and other technologies can be used to eliminate harmonics during signal generation.

In some embodiments, the AC generation subunit includes transistors, including silicon MOSFETs. In some embodiments, the transistors are gallium nitride (GaN) MOSFETs. In some embodiments, GaN transistors have the following preferred properties: on-state resistance, turn-on gate charge, and reverse recovery charge. In some embodiments, GaN is suitable for higher frequencies.

In some implementations, the standardized power conversion subunit further includes a low power conversion stage, such as a linear regulator, to obtain power from existing power supplies and convert it to a suitable power input for the elements driving the AC generation subunit, such as , gate drivers or crystal oscillators. Fig. 10C is a schematic of an exemplary AC generation subunit 1050 including a dual MOSFET class D amplifier 1010, a temperature compensated crystal oscillator 1020, a gate driver 1030, and a low power conversion stage 1050.

In some embodiments, the AC generation subunit is located near the target area. A possible advantage of this design is to limit the losses and emissions that occur when passing AC from the AC generation subunit through the control circuit to the target area. In some embodiments, the power conversion subunit may be located near the AC generation subunit, or near an existing power source or dedicated battery. When the power conversion sub-unit is located closer to the AC generation sub-unit, it can be combined with the AC generation sub-unit, potentially reducing the number of modules in the system and its complexity. When the power conversion subunit is located closer to an existing power supply or dedicated battery, it may be designed to improve power transfer (including efficiency and EMI reduction) from the power supply or battery to the AC generation subunit. For example, when an existing power supply provides 400 Hz, 115 VAC power, the standardized power conversion subunit may include an AC/DC converter that converts the power supply voltage to 250 VDC, which reduces electromagnetic interference that can be caused by AC current, and improves efficiency by increasing the voltage and reducing the amount of current transferred from the standardized power conversion sub-unit to the AC generation sub-unit.

In some implementations, the control sub-block controls the signal conditioning block state, on/off, output power, frequency, and other parameters based on the appropriate input data available in the application for which the device is designed (heating system), by outputting control signals to other sub-blocks signal conditioning, including the conversion to standardized power sub-unit, as well as the drivers of the AC generation sub-unit. In the example of a heating system for de-icing and de-icing an aircraft, in some embodiments, data input may include manual input by the pilot via a switch in the cockpit, temperature from temperature sensors inside and outside the airframe, undercarriage compression status from a safety latch, various logic blocks aircraft, information from radio-electronic equipment, feedback from the device itself (heating system), as well as other data. In some implementations, the control subunit includes a microcontroller supervisor powered by a low power conversion stage, such as a linear regulator that draws power from existing power supplies and converts it to a suitable power input, and outputs control signals to the conversion subunit to standardized power and AC generation sub-unit. Fig. 11 is a schematic diagram of an exemplary control subunit 1100 including a microcontroller 1110 and a low power conversion stage 1120.

In some embodiments, for example, in the case of an upgraded aircraft de-icing heating system, the signal conditioning unit may be installed near accessible busbars in a centralized location. This can reduce installation complexity, installation time, and unit costs. In some implementations, the signal conditioning unit is decentralized and installed closer to the target areas. This can reduce the distance the AC signal must travel between the signal conditioning unit and the target areas, potentially reducing the cost associated with signal EMI shielding and cabling requirements for such an AC signal.

In some embodiments, the heating system has an impedance control circuit configured to adjust the output impedance of the heating system to desired levels. For example, the impedance adjustment circuit may be configured to adjust the output impedance of the heating system in accordance with the input impedance of the bulk medium to be heated. For example, the impedance adjustment circuit may be configured to adjust the impedances between the heating system outlet and the bulk fluid inlet so that they are within a desired range relative to each other. In some embodiments, the impedance adjustment circuit is configured to adjust the output impedance of the heating system in accordance with the impedance of the bulk medium. In other words, the matching circuit is configured to match the output impedance of the signal conditioning unit (the "source") to the impedance of the target area (the "load") within reasonable engineering tolerances. In some implementations, matching source and load impedances includes adjusting the source impedance of the heating system so that it is complex conjugate to the impedance of the bulk medium. In some embodiments, the impedance control circuit is adjusted so that the output impedance of the heating system is within 10-30% of the impedance of the bulk medium to be heated.

Fig. 12 is a conceptual schematic of an adjustment circuit 1200 between source 1210 and load 1220. FIG. 12 shows an adjustment circuit that receives input power from a signal conditioning unit (a "source") through an input port whose impedance is adjusted to match the output signal of a signal conditioning unit, and outputs power to target areas (a "load") through an output port whose impedance is adjusted according to target areas.

In general, in the case of an AC signal, when the output impedance of the source does not match the impedance of the load, part of the signal transmitted from the source to the load is reflected back to the source rather than passing through the load. In some implementations, the impedance adjustment circuit can provide a number of benefits by preventing signal reflection and voltage standing wave buildup, including:

- Decrease voltage when there is a possibility of heating and electric arc

- Improving the efficiency of the heating system

- Reducing the total output power required from the signal conditioning unit, and therefore reducing the size, weight and cost of the signal conditioning unit

- Reduced load on system components

- Improved reliability

- Reduced temperature gradients in cabling and bulk environments.

In some implementations, the output impedance of the signal conditioning block is higher than the impedance of the target areas. In this case, the adjustment circuit converts the relatively high voltage, low current power from the signal conditioning unit into a relatively low voltage, high current power supplied to the target areas. In embodiments, this means that the high current is applied only after the regulation circuit and thus closer to the target area, which reduces the Joule loss in the rest of the signal conditioning block and improves the overall efficiency of the heating system.

In various implementations, the adjustment scheme may be either centralized or distributed across all target areas. The distribution of regulation circuitry can allow cabling to serve as a filter, potentially reducing peak voltage, peak current, and/or thermal effects on any given component. Distribution can also add modularity to the system design, which can improve ease of maintenance/part replacement. In addition, distribution has the potential to exclude sensitive equipment and/or explosive areas, such as fuel tanks, from the system.

In addition, in some implementations, the control circuit can be balanced by including additional capacitive components and grounding the midpoints of symmetry in the circuit. When driven from a fully differential source, circuit balancing can provide high common-mode rejection and better noise immunity. In some implementations, this balance is not achieved and the end of the return path of the control circuit is at circuit ground.

In general, in some embodiments, control circuits may include passive electronic components located in certain building block configurations. For example, these building block configurations may include transformers, L-shaped circuits, π-shaped circuits, T-shaped circuits, and other configurations. Fig. 13A-D are schematic illustrations of exemplary building blocks of an impedance adjustment circuit.

In some embodiments, the heating system control circuitry includes a passive control sub-unit. Fig. 14 is a schematic diagram of an exemplary control circuit block 1400 including a passive control sub-block 1410. In some embodiments, the passive adjustment subunit may include one or more of the building block configurations described above, as well as other configurations put together. In some embodiments, the passive electronic components of the passive adjustment subunit are selected for high performance, for example, to improve the efficiency of the circuit.

In some embodiments, the heating system control circuit may be configured to have a high quality score or a low quality score. High quality control circuits can be used to filter harmonics in the signal. Filtering may be preferred in the design of a switching amplifier, since in this case the harmonic content may be higher than in the case of a linear amplifier. However, circuits with a high quality score may be more sensitive to part tolerances, operational environmental changes, assembly variations, and any other changes to the system. Thus, systems with a high quality score can lead to practical problems in the implementation of the systems. For example, if in the case of an aircraft wing anti-icing system, the system has a high quality factor, the impedance control circuit settings may be misaligned due to minor perturbations (eg, flap movement), causing the possibility of failure. Reduction of harmonics beyond the fundamental drive frequency may be advantageous for official certification as well as for practical design problems, including spurious content in the design, overvoltage of components (either at peak loads or at average loads), instability of the control algorithm, etc. d. In some cases, these sensitivity issues can be reduced or even eliminated by using dynamically tuned elements.

In some embodiments, the heating system control circuit design may be based on transmission line control concepts. For example, the cabling at the input and/or output of the control circuit can be considered as part of the control circuit. In some implementations, proper impedance adjustment can be achieved by selecting the correct materials, form factor, sizes, and cable lengths.

In some embodiments, the heating system control circuit is a dynamic control circuit including an active control sub-block and a control sub-block. Fig. 15A is a schematic diagram of an exemplary control circuit block 1500 including an active control sub-block 1510 and a control sub-block 1520. In some embodiments, the active control subunit includes one or more control circuit configurations under the control of the control subunit. In some embodiments, the passive electronics of the active control subunit are selected for high performance, for example, to improve circuit efficiency. In some implementations, the control subblock receives input from the signal transmitted and received from target areas (such as forward power, reflected power, or voltage standing wave ratio) and dynamically controls the active adjustment subblock to adjust the impedance tuning in real time. For example, such control can be achieved by adjusting the elements included in the design of the active control sub-unit. For example, dynamically tuned elements may include tuned capacitors and/or tuned inductors. In addition, examples of tunable elements include: point diodes, barium strontium titanate capacitors, separate tuning capacitors, varactor diodes, microelectromechanical systems, ferroelectric varactors, ferromagnetic components, yttrium iron garnet filters, etc. Some examples that may be considered in evaluating such devices include: operating frequency range, DC voltage setting, control signal linearity setting, control complexity, capacitance/inductance setting ratio, setting speed, quality factor (Q), service life at switching, packaging cost, power handling, power consumption, breakdown voltage, linearity, 3rd order interception, integration capability, etc.

In some implementations, the use of a feedback control unit between the target areas and the adjustment circuit may allow the circuit to adapt to any external changes that may affect the impedance of the target area or the output impedance of the signal conditioning unit, including changes in temperature, geometry of the target areas, system location. heating, system environment and target areas and other parameters. In some embodiments, the regulation circuitry further includes a low power conversion stage, such as a linear regulator, drawing power from existing power supplies and converting it to a suitable power input for the control subunit. Fig. 15B is a schematic diagram of an exemplary adjustment circuit block 1550 including an active adjustment subunit 1510, a low power conversion stage 1560, and a control subunit 1520.

In some implementations, specific impedance measurements can be made in target areas for all configurations and environmental conditions covering a range of possible situations when using a heating system. These measurements may allow the development of a dynamic adjustment circuitry adapted to the smallest impedance range that allows adequate impedance adjustment for the entire range of the above situations. In some embodiments, this design is achieved by using algorithmic optimization or computer simulation to improve system efficiency while reducing the weight, complexity, and cost of the control circuit.

In some embodiments, the heating system may use special cables specially designed or selected at each stage to improve efficiency and shield the power signal to the target areas. Fig. 16 is a schematic representation of cable stages in an exemplary heating system. In various embodiments, the stages of cables in the heating system can be made taking into account the features, including cables between the power sources 1620 and the signal converter 1610 (the first stage 1630 cables), the cables in the signal converter between the conversion sub-unit 1640 to standardized power and the generation sub-unit 1650 AC (second stage 1660 cables), cables between block 1610 signal conversion and circuit 1670 adjustment (third stage 1680 cables), as well as cables between circuit 1670 regulation and target areas 1690 (fourth stage 1695 cables).

In general, when designing special cables in a heating system, it is important to take into account various design features. In some implementations, it is important to consider thermal features. For example, in some embodiments, the cable connecting the control circuit to the target area (or in some cases passing near the target area and returning to the control circuit) is fixed to provide increased heat flow from the cable to the target area. This is advantageous if some of the heat generated by current flow through the cables (which would otherwise be lost) is recovered and transferred to the target area, whose task is to generate heat, which increases the efficiency of the system.

In some embodiments, cables may be routed near the target area using fasteners. In such cases, thermal compound with improved thermal conductivity can be used to improve thermal contact to fill air gaps at the interface between cables, fasteners, and the target area.

In some embodiments, cables are attached directly to the target area. In such cases, a higher thermal conductivity adhesive may be used to secure the cable to the contact area to improve thermal contact. In addition, thermal paste with higher thermal conductivity can be used to fill some or all of the remaining air gaps between the cable and the target area.

In some implementations, cables with different cross-sectional geometries, as well as different form factors, may be used, depending on the units, target areas, or power supplies to which the cables are connected. In some embodiments, the cable includes only the main conductor with or without a protective sheath (including for electrical insulation and/or protection from the environment, eg, corrosion, humidity, extreme temperatures, friction). This configuration may be preferred for parts of the system that will carry a DC signal or that will deliver the signal to the target area.

In some embodiments, the cable is a coaxial cable. The coaxial cable may include a shield that can reduce EMI emissions when transmitting an AC signal and can protect against EMI surrounding the system when transmitting any signal.

In some embodiments, the cable is a triaxial cable. This design may be advantageous for EMI protection and isolation in any signal transmission, and in particular in balanced signal transmission, for example, at the output of a balanced implementation of the control circuit block.

In some embodiments, the cable is a twinaxial cable. This design can have the same benefits as a triaxial cable.

In some implementations, cables with different cross-sectional geometries may be used depending on the units, target areas, or power supplies to which the cables are connected.

In some embodiments, the cable conductor(s) has a circular cross section. This design has the advantage of relatively low manufacturing cost (low one-time design costs) in the coax/triax/twinax form factor.

In some embodiments, the cross section of the cable is flat and/or rectangular. For example, this cross section may be the preferred cable geometry at the last stage of the system, where the cable conducts current to the target area. At this stage, the rectangular shape can reduce the effect of proximity and skin effects on the current flowing through the cable, resulting in lower losses and higher system efficiency. In addition, such a geometry can reduce the total amount of conductive material of the cable and therefore reduce the weight of the system, which is an important aspect in the case of an aircraft anti-icing system.

In some implementations, depending on the particular input and output current and signals carried on the cable, as well as depending on the geometry of the cross section and other factors, the size of the cross section can be chosen to limit operating temperatures to a certain range (for example, in according to and depending on the materials used for the manufacture of the cable), as well as to reduce weight and size.

In some implementations, different cable shield types (and cross-sectional geometries) may be used depending on the units, target areas, or power supplies to which the cables are connected.

In some embodiments, the cable is not shielded. This is most preferred in stages that carry direct current (and hence have lower EMI requirements) and where there is no need for a return path (e.g., a later stage of the system in an implementation where the target area is reversed, and a nearby cable supplies this current to the target area).

In some implementations, single shielding is used. This is preferred, for example, when a single layer of shielding is sufficient to meet EMI/EMC requirements as well as other environmental requirements.

In some implementations, double shielding is used. This adds another shielding layer, which, for example, can further reduce the emission of electromagnetic interference and reduce the sensitivity of the cable to electromagnetic interference.

In some embodiments, shielding with three or more layers is used. In this case, additional shielding layers are added, similar to those indicated above.

In some embodiments, for a given target area, the cables carrying current to that area may follow different possible paths.

In some embodiments, the cables simply follow approximately straight paths from one side of the target area to the other. In some cases, these paths may be parallel. In some embodiments, the cables may run diagonally through the target area, crossing each other at different locations in the target area. This, for example, provides more uniform heat generation over the entire surface of the target area and allows relatively hot spots to be created at the desired locations where cables cross each other.

In some embodiments, the cables run in a zigzag path, a serpentine path, or a path that can be modeled with 2D spline curves. This design improves the efficiency of the system by lengthening the path that the current passes through the target area and hence further increasing the effective resistance. This, for example, makes it possible to achieve higher efficiency, lower current and more stable impedance control in the system.

In some embodiments, cable path designs are based on a combination of the above as well as others.

In some embodiments, depending on the design, stage and purpose of the cable, different materials can be used in its manufacture.

Depending on local voltage, current, temperature, power, bend radius and wear resistance requirements, among other criteria, cable conductor materials can be selected to improve efficiency, improve electrical conductivity, reduce weight, cost and size, and improve thermal performance.

In some embodiments, the conductor material may be copper, silver, aluminum, carbon fiber, titanium, or an alloy thereof. In some embodiments, the conductor is made from any of the above materials and coated with other materials, such as silver plating, to improve the conductivity of the conductor sheath.

In some embodiments, the conductors may be made from monolithic materials or may be stranded. For example, in some embodiments, all of the strands could be insulated from each other using an insulating coating, such as enamel. For example, a litz wire can be used to reduce skin and proximity effects in a cable.

In some implementations (for example, in the case of coaxial / triaxial / twinaxial cables), depending on the requirements for local voltage, current, temperature, power, bending radius and wear resistance, as well as other criteria, cable dielectric materials can be selected to improve such parameters. such as efficiency (for example, by reducing dielectric losses), weight, cost, flexibility, maximum voltage tolerance, maximum power tolerance, temperature rating (by withstanding higher temperatures, and/or higher heat capacity, and/or lower dielectric losses, and/or better thermal conductivity of the cable).

In some implementations that use transmission line trim in the control circuit block, the associated cables may use dielectric materials also selected to achieve the desired impedance levels. Exemplary materials include polyethylene and Teflon based materials, as well as other materials.

In some implementations, depending on the requirements for local voltage, current, temperature, power, bend radius and wear resistance, and other criteria, cable sheath materials are selected to improve parameters such as weight, cost, flexibility, maximum voltage tolerance, temperature rating and thermal conductivity in relation to nearby heatsinks (for example, the target area when it is used as a heatsink).

In some implementations, when using transmission line adjustment within the adjustment scheme, the length of the cable used for impedance adjustment, in addition to dielectric materials, can be adjusted to achieve the target impedance level. For example, a cable carrying current to a target area is used as part of a transmission line adjustment system, whereby its length is increased to adjust the impedance, and the cable is wound locally to take up less space.

In some implementations, specific fastening techniques may be used to route cables through the system structure. Such technologies can be chosen to improve such parameters as installation cost and time, system weight (by reducing the required wire length and fastener weight), as well as to improve the required electromagnetic effects and heat transfer of cables near the target area.

In some embodiments, the fastener is chosen to reduce the distance between the cable supplying power to the target area and the target area. This design can create a more pronounced proximity effect. In some implementations, in the case of a small distance between the cable and the target area, conventional designs of cable fasteners can be chosen.

In some embodiments, fasteners are also used to increase thermal conductivity from cables to the target area.

In some embodiments, fastener materials are selected to reduce the weight and cost of the system. This can be achieved, for example, by using composite materials. In some embodiments where fasteners are also used to deliver heat to the target area, materials are also chosen to increase thermal conductivity (metals, for example, typically have relatively high thermal conductivity).

In some embodiments, the adhesives used to secure the fasteners to the attachment areas are selected to increase strength and provide long-term attachment to the target area. The strength of the adhesive is particularly advantageous when the bonding area is relatively small and the mechanical constraints imposed on the bonding area are relatively high. In addition, in some embodiments where fasteners are used to transfer heat from the cable to the target area, an adhesive is also selected to increase thermal conductivity.

Finally, in some embodiments where fasteners are used to transfer heat from the cable to the target area, the air gaps in the area between the cable, the fasteners, and the target area are filled with thermal paste having sufficient thermal conductivity to provide improved heat flow from the cable to the target area.

In some embodiments, cables are attached directly to surrounding structures, such as a bulk environment, using an adhesive, which allows for better heat transfer from the cable to the structure to which it is attached. Adhesives are selected based on criteria similar to those used for fasteners.

In some embodiments, cable assemblies are designed to divide a given cable path into a group of two or more separate branches. This is, for example, preferred in embodiments in which one regulation circuit supplies current to a group of several target areas. In such embodiments, one cable may be the only output of the control circuit, and as it approaches the target areas, the cable may split into separate branches, each of which supplies current to the target areas. In some embodiments, such separation can be achieved by dividing a given conductor strand into several smaller strands, by distributing a subset of strands to each of the individual spurs when the split cable has a stranded conductor, or by using a power divider. A power divider can be used to control the amount of current, voltage and power supplied to each of the taps into which the cable is divided.

Similarly, in some embodiments, two or more cables may be connected to form a smaller number of cables that combine the signals from all connected cables. Such a connection can be achieved by connecting given conductor strands to other strands, by rearranging different subsets of strands into new stranded cables, or by using a power combiner (eg, a device similar to a power divider but used in the opposite way). A power combiner can be used to control the amount of current, voltage, and power supplied to each of the spurs into which the cables are connected.

In some embodiments, each cable rung in the heating system has unique cable design features.

In some embodiments, the first stage of cabling is selected to efficiently transfer power from the power supplies to the standardized power conversion subunit. In some embodiments where the power supplies provide DC electrical current, the first stage of cables includes a stranded copper wire insulated with a suitable material, the overall equivalent gauge of which is suitable for the power, voltage, and current supplied to the standardized power conversion subunit. In some implementations where the power supplies provide a 400 Hz, 115 VAC signal, the first stage of cables includes stranded and stranded copper wire insulated with a suitable material, the overall equivalent gauge of which is suitable for the power, voltage, and current supplied to the subunit. conversion to standardized nutrition.

In some embodiments, the second run of cables is selected to efficiently transfer power from the standardized power conversion subunit to the AC generation subunit. In some implementations in which the power conversion subunit provides power as a 250 VDC signal, the second stage of cables includes stranded copper wire insulated with a suitable material, the overall equivalent gauge of which is suitable for the power, voltage, and current supplied to the subunit conversion to standardized power.

In some embodiments, the third stage of cables is selected and adapted to efficiently carry the high frequency AC power signal from the output of the signal conditioner to the control circuit. For example, the cable can be designed to reduce ohmic and electromagnetic losses caused by high signal frequency and can be shielded from external interference that can compromise signal integrity, as well as to prevent signal leakage from the cable that can affect surrounding equipment and materials. . In some embodiments, the third stage of cables is a high power and high frequency transmission line in the form of a special coaxial cable. In some implementations, the coaxial cable includes a core conductor carrying the input signal of the control circuit, and which is made of stranded copper wire of sufficiently large outer diameter to allow power to be transmitted with less ohmic loss, a dielectric material surrounding the core, selected to improve electrical isolation and withstand high voltage and temperature ranges, a shield conductor providing a signal return path to the AC generation sub-unit, made of stranded and braided copper wire of a sufficiently large equivalent gauge to allow power to be transmitted with less ohmic loss, the first casing, an insulating conductive shield selected to withstand high voltage and temperature ranges, an outer shield similar to the conductive shield but not directly conducting current and used to shield the cable from external interference and to prevent leakage, and finally a second jacket similar to the first jacket and insulating external screen.

In some embodiments, the fourth stage of cables is selected and adapted to efficiently carry the high frequency, high current AC power signal from the control circuit to the target areas. In some implementations, this cable is configured to adjust the impedance between the control circuit and target areas to reduce ohmic and electromagnetic losses caused by high signal frequency, and can be shielded from external interference that can compromise signal integrity, as well as to prevent signal leakage from cable, which may affect the surrounding equipment and materials. In some implementations, the fourth stage of cables is a high power, high frequency, and high current transmission line in the form of a special coaxial cable, similar to the implementation described above for the third stage of cables, with the exception of larger sections and diameters of conductors and additional silver coating of the same conductors to improve high current performance and further reduce ohmic losses. In some embodiments, the fourth stage of cables is further adapted on a litz wire basis. The purpose of this design is to reduce proximity and skin effect losses in cables by making conductors from materials thinner than skin depth, separately insulated (e.g. using an enamel coating) and twisted or woven with perfect symmetry.

In general, the electrodes include a material through which the current will enter and leave the target region of the bulk medium. In some implementations, a connector is used to connect the electrodes to the bulk medium. Connector refers to a fixture that connects the electrodes to the bulk medium. In some embodiments, the electrodes and connectors are configured to reduce the contact resistance between the electrodes and the bulk medium. In other words, the electrodes are configured to average the potential difference occurring in the target area for a given return path. If this contact resistance is higher than the resistance of the target area between the two electrodes, more heating will occur at the points of contact than along the target area, all other things being equal, reducing the efficiency of the heating system. In some embodiments, for similar reasons, the electrodes and connectors are configured to reduce the contact resistance between the electrodes and the wires (or cables) of the heating system. In some embodiments, the electrodes and connectors may also be configured to reduce electromagnetic losses (eg, electromagnetic radiation).

In some embodiments, electrode design features for solving one or more of the above objectives include: (1) selecting an electrode material that is highly conductive, and (2) increasing the "real" contact area between the electrodes and the bulk medium, as well as between the electrodes and wires. The "real" contact area refers to the subtle contact between metals or between materials whereby current flows from one material to another, often referred to as "points of conductive contact". In some embodiments, the connectors are also configured to accomplish these tasks.

In some embodiments, the electrode material may include silver, copper, aluminum, carbon fiber, titanium, or an alloy thereof.

In some embodiments, the electrodes are part of the cables used to transmit current to the bulk medium.

In some embodiments, the geometry of the electrodes is made in accordance with a particular target area, and/or to reduce the contact resistance between the electrodes and the bulk medium, and/or to reduce electromagnetic losses.

In some embodiments, the electrodes may be circular in shape.

In some embodiments, the electrodes are in the form of the ends of cables used to supply current to the bulk medium.

In some embodiments, linear electrodes are used (eg, rectangular electrodes that are longer than wide).

In some implementations, electrodes are used in the form of two-dimensional spline curves of small thickness (in the third spatial dimension).

In some embodiments, the cable conductor may be connected to the target area by being clamped between the connector plate and the target area. For example, the portion of the side of the connector plate in contact with the target area may be milled. The cable conductor, through which the connection to the target area is realized, can be located in this milled area. This configuration allows the electrode connector plate to be pressed or glued under which the cable conductor resides without the need to bend the connection to ensure proper attachment to the target area.

In general, various implementations and design features of electrodes and connectors are envisaged.

Fig. 17 is an illustration of an exemplary stud electrode 1700 for heating system 100. The electrode includes a circular ground stud coupled to a disk 1710 made of a conductive material (eg, aluminum) on which a threaded conductive material 1720 (eg, aluminum) is mounted.

In some embodiments, the cable conductor connected to the target area via electrode 1700 is evenly wrapped around the threaded conductive material 1720, covering a significant portion of the surface area of both the threaded conductive material and the disk. In some embodiments, a nut and washer may be used to press the conductor against disc 1710 on threaded material 1720, resulting in a larger contact area and less contact resistance.

In some embodiments, the air gaps between the washer, cable, and disc 1710 are filled with electrically conductive and/or thermally conductive thermal grease, which provides improved thermal and/or electrical conductivity from the cable to the stud 1700.

In some embodiments, the stud electrode 1700 is attached to the target area using a specially selected adhesive that has sufficient electrical and thermal conductivity to transfer heat and electrical signal from the cable to the target area. In some embodiments, the adhesive also has sufficient strength to withstand the torque generated by the nut and washer.

In some embodiments, the connector is a U-shaped fixture attached to the bulk medium and the electrodes such that significant compression resistance is created between the electrode and the bulk medium.

In some embodiments, electrode and connector materials may be selected to reduce their weight. In some embodiments, the electrode material is selected to improve electrical and/or thermal conductivity through the material in addition to weight reduction. Improved conductivity may be advantageous for electrode designs where the current flowing from the cable to the target area passes through the electrode (eg, round stud, single plate design).

In some embodiments, special housings may be included in the connector and electrode design. For example, such enclosures may be selected for environmental evaluation, including criteria such as thermal relief and/or thermal insulation, electrical insulation, EMI shielding, corrosion protection, vibration and shock resistance, durability, protection against external pollution and precipitation.

In general, various adhesion configurations (and combinations thereof) are contemplated between electrodes and/or connectors and the bulk medium. In some embodiments, the configurations reduce contact resistance between the electrodes and the bulk medium and/or reduce electromagnetic losses.

In some embodiments, the electrodes are connected to the bulk medium using a solder joint. Fig. 18A is a schematic exemplary attachment 1800 between an electrode 1802 and a bulk medium target region 102 that is part of a larger bulk medium 1806 via a solder joint. To obtain a solder joint 1804 soldering material is used. For example, a low temperature filler metal (eg, AL 802) can be used to solder the electrodes to the target area to obtain a low contact resistance. In some embodiments, to reduce oxidation (formation of a layer of aluminum oxide at the soldering site), the brazing solder is coated with a flux. Flux is a material that dissolves oxides at high temperatures and prevents re-oxidation of the surface prior to the application of filler metal to the surface.

In some embodiments, the electrodes and the target area are connected to each other under the influence of pressure and temperature. For example, in some embodiments, a compressive force is applied between the electrodes and the target area. Without being limited by theory, a compressive force can decrease the contact resistance between the electrodes and the bulk medium according to the following formula:

where ρ is the electrical resistivity of the contact materials, H is the Vickers hardness of the softer of the contact surfaces, and F is the compressive or contact force.

In some embodiments, a compressive force may be applied to connect the electrodes and the bulk medium using a mechanical fastening connector. Fig. 18B is a schematic representation of an exemplary attachment configuration 1820 between electrode 1802 and target area 102 that is part of a larger bulk medium 1806. Solid rivets 1822 are used to apply a compressive force to connect the electrode to the target area.

In some embodiments, a compressive force may be applied using a vacuum tape or similar item capable of sealing the connection between the electrodes and the target area. Fig. 18C is a schematic of an exemplary attachment configuration 1840 between the electrode 1802 and the target area 102, which is part of the larger volume medium 1806. A sealing tape 1842 is used to connect the electrode and the target area. a device that brings them together and creates a compressive force.

In some embodiments, a compressive force may be applied using clamps that clamp the electrode and the target area and increase the pressure at the interface, such as using clamps.

In some embodiments, the compressive force may be applied using magnets or magnetized surfaces. In some embodiments, either the electrode surface or the surface of the target area is magnetized, which provides an attractive force between the magnets and the electrode and/or contact area, resulting in the necessary compressive force. In some embodiments, two or more magnets are used and the electrode and the target area are located between them, which provides an attractive force between the magnets, resulting in the necessary compressive force. In some embodiments, the surface of the electrode is magnetized as well as the surface of the target area, which provides an attractive force between the electrode and the target area, resulting in the necessary compressive force.

In some embodiments, a compressive force is applied by an external or internal clamp connector that adheres to or near the surface of the target area and converts the adhesive force into the required compressive force. In some embodiments, adhesives (eg, curing adhesives) may be used in combination with clamp connectors.

In some embodiments, the electrodes may be partially or completely embedded in the bulk environment using one of the above methods or alternative technology.

In some embodiments, a conductive material (eg, graphene) is located between the electrodes and the target area.

In some embodiments, the connector material used to connect the electrode to the target area is an adhesive chosen for strength, which provides long-term attachment to the target area. The strength of the adhesive may be advantageous when the attachment area is relatively small and the mechanical constraints imposed on the attachment area are relatively high (eg, in the case of a U-stud electrode). In one embodiment, when the electrode must remain stationary for the adhesive to cure after application, internal or external disposable devices using adhesives and mechanical force can be used to hold the electrode in place.

In some embodiments, the connector material used to connect the electrode to the target area is also selected to provide higher thermal and/or electrical conductivity to provide improved heat and current flow from the cable to the target area. For example, higher conductivity may be considered when the electrode used is attached such that the adhesive is in the path of electrical current from the cable/electrode to the target area (eg, in the case of a round stud electrode and a single plate electrode). To this end, in some embodiments, nanomaterials (eg, carbon nanotubes) are located between the electrodes and the bulk medium. In some embodiments, the surface of the electrodes and the portion of the surface of the bulk medium that will be in contact with the electrodes (eg, the target area) may be treated to increase the "real" area of contact between them.

In some embodiments, and in combination with the above embodiments, as well as other embodiments, the connector, the electrodes, and a portion of the target area are coated with a material that reduces or eliminates electromagnetic losses.

In some embodiments, any combination of the above methods is used with any implementation of the electrode and connector. For example, Fig. 18D is a schematic representation of an exemplary combined mount 1860 between electrode 1802 and target region 102 of bulk medium 1806. The mount includes a solder joint 1804 and solid rivets 1822.

In some implementations, no connectors/cables may be needed in the system because no physical contact is required to generate the required current. In this case, in some implementations, the return signal path may be an additional piece of wire leading back to the control circuit.

Embodiments of the heating system described herein can be used as a de-icing/anti-icing device to melt ice on an aircraft surface by applying high frequency AC current to a target area of the aircraft skin/airframe (e.g., to provide Joule heating). The heat generated in the target area of the airframe is transferred to the surface of the airframe and then transferred by convection through the airframe/ice interface to the ice. In some embodiments, the ice melts completely. In some embodiments, some of the ice (the layer in direct contact with the airframe) melts, causing a layer of water to form between the ice and the airframe, whereby the ice may slide or be mechanically removed from the airframe. In some embodiments, the heating is carried out before the appearance of ice, which prevents its formation.

In some embodiments, after the ice has melted, high frequency AC current is continued to maintain Joule heating of the airframe, which is transferred to water formed/remaining on the surface by conduction and convection.

On FIG. 19-32 examples of units for transmission and supply of electromagnetic energy in systems for heating a bulk medium are presented. The nodes (referred to in this application as "connecting strips") are configured to function similarly to transmission lines in combination with the bulk conductive medium to which they are attached. For example, in some embodiments, the design of the interconnecting strips causes the bulk medium itself to conduct current in a manner similar to the current flowing through a transmission line. The connecting strips can provide electromagnetic transmission of AC signals from the lines to the bulk medium, thereby generating appropriate current signals in the bulk medium. Thus, in essence, it can be said that the construction of the connecting strip results in the volume medium (in combination with the connecting strip) serving as a transmission line, or alternatively results in the volume medium and the connecting strips together forming a system. , which behaves like a transmission line, and which can be analyzed and designed as such.

For example, as discussed above, embodiments of the present invention may be configured to effect heating of a bulk medium by controlling the mechanisms for generating (eg, constricting, elongating, etc.) current in a conductive medium (eg, bulk medium, conductor): for example, using surface effect and proximity effect. Both effects are based on passing a high-frequency alternating current through a conducting medium that must be heated. The skin effect limits the flow of current by exploiting the tendency of the alternating electric current to distribute in the conductor such that the current density is greatest near the surface of the conductor and decreases towards the interior of the conductor. The proximity effect can be used to further restrict the current flow in the conductor by placing another AC path close to the existing current path in the conductor. The proximity effect can also lengthen the current path. Connecting strips can be used to create and manage such effects in addition to the systems and processes discussed above. For example, interconnect strips can be used with the various power management systems described above.

Fig. 19 is a sectional view of an exemplary connector strip 1900. The connector strip 1900 can be used to apply high frequency current signals to a bulk medium, such as an aircraft skin 1902, to heat the bulk medium. The bonding strip 1900 has a sandwich construction that includes a first dielectric layer 1908 over the bulk medium 1902, a conductive layer 1904 over the first dielectric layer 1908, a second dielectric layer 1908 over the conductive layer 1904, and a conductive shield layer 1906 over the second dielectric layer 1908.

The first dielectric layer 1908 has a thickness D ₁ . The conductive layer 1904 has a thickness D ₂ . The second dielectric layer 1908 has a thickness D ₃ . The conductive shield layer 1906 has a thickness D ₄ . The total thickness of the connecting strip 1900 is designated D ₅ . The conductive layer 1904 may be made of conductive materials, including, but not limited to, copper, copper alloys (such as brass or bronze), silver, silver alloys, aluminium, aluminum alloys, titanium, titanium alloys, chromium, nickel, nickel alloys, cobalt alloys, stainless steel, graphite, or combinations thereof. The conductive shield layer 1906 may be made of conductive materials including, but not limited to, copper, copper alloys (such as brass or bronze), silver, silver alloys, aluminium, aluminum alloys, titanium, titanium alloys, chromium, nickel, nickel alloys, cobalt alloys, stainless steel, graphite, or combinations thereof. In some embodiments, the conductive shield layer 1906 may be in the form of a metal foil (eg, copper foil or aluminum foil) or a woven metal layer. The dielectric layers 1908 may be made from dielectric materials including, but not limited to, Kapton, Mylar, polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), rubber, or combinations thereof.

In some embodiments, the bonding strip 1900 includes a protective layer over a conductive shield layer. For example, the protective layer may include, without limitation, one or more layers of polyurethane, polyfluoride, paint, paint replacement film, sealant, or combinations thereof.

As illustrated in FIG. 20, connecting strips 1900 may be located on the surface of a bulk medium, such as the skin 2000 of an aircraft (eg, wing), to supply electrical current to the bulk medium and heat the bulk medium by generating and generating current in the bulk medium. The connecting strips 1900 extend along the surface of the skin of the aircraft 2000 and are located at a distance from each other. In some embodiments, one or more bond strips 1900 include a short circuit termination that electrically connects at least a portion of the bond strip (e.g., conductive layer 1904) to bulk media 1902. For example, bond strip 1900 may terminate with an electrode, such as electrodes , discussed above, to form a closed circuit (e.g., a short circuit) between the conductive layer 1904 contained therein and the bulk medium 1902. ). In some embodiments, one or more connecting strips 1900 terminate in an open circuit. Open termination means that the termination end of the connecting strip 1900 is left in an open circuit; not connected to electrical ground via bulk medium 1902 or the conductive shield layer of interconnect strip 1900. In some embodiments, one or more interconnect strips 1900 terminate in an impedance adjustment component (e.g., circuit element) connected between interconnect strip 1900 and bulk medium 1902. For example, connecting strip 1900 may be terminated with capacitive, resistive, or inductive termination. For example, a circuit element such as a capacitor, inductor, or resistor may be connected between the conductive layer 1904 of the connecting strip 1900 and the bulk medium 1902.

With reference to FIG. 19 and 20, a power management system (eg, power management system 104 described above) is connected to one end of each of the connecting strips to supply electrical current to each strip. For example, a power supply line from a power management system may be connected to the conductive layer of each conductive strip 1900, and one or both of the bulk media 1902 (eg, aircraft skin 2000) may be connected to an electrical ground.

The power management system supplies AC to each conductive strip 1900. For example, the power management system can supply AC at a frequency of 1 kHz to 450 MHz. In some implementations, the frequency is from 1 MHz to 450 MHz. In some implementations, the frequency is from 1 kHz to 1 MHz. The power management system may be configured to supply between 0.1 A and 200 A AC to each interconnect strip 1900. For example, the power management system power supply and the electrical arrangement of the interconnect strips 1900 may be configured to supply a desired amount of current (for example, , from 0.1 A to 200 A) per connection strip 1900. As a general example, if the connection strips 1900 are connected in series to the power management system, a 100 A power supply can be used to supply a current of 100 A to each connection strip 1900 If ten interconnect strips 1900 are connected in parallel to the power management system, a 100 A power supply can be used to supply 10 A of current to each interconnect strip 1900. Note that this example assumes that the impedances of the interconnect strips are equal. As discussed below, the impedance of the interconnect strips 1900 can be configured in various ways to control the distribution of current between the interconnect strips, as may be desired or required in particular heating applications.

An alternating current to heat the aircraft skin 1902 is applied through conductive layer 1904. An alternating current applied through conductive layer 1904 generates (eg, by electromagnetic capacitive and inductive coupling) a corresponding current in aircraft skin 1902, as shown in FIG. 22A-22B. On FIG. 22A-22B are graphs resulting from electromagnetic finite element analysis simulating the operation of an exemplary bond strip 1900 attached to a conductive bulk medium 1902. The graph of FIG. 22A depicts a bulk medium 1902 (eg, modeled as the skin of an aircraft), a conductive layer 1904, and a conductive shield layer 1906. FIG. 22B, the individual components of the connecting strip 1900 are not shown, and only the connecting strip 1900 (illustrated generally) and the bulk medium 1902 are indicated. The area indicated by 2206 in both graphs represents the background medium (eg, atmosphere). Both graphs show the reduced density (in A/m ² ) of the current induced in the bulk medium 1902, indicated by the shaded region 2204. The current density in the bulk medium 1902 is maximum in a narrow region 2204 near the surface of the bulk medium 1902. Fig. 22A shows the reduced electric field strength (light gray area 2202) in the dielectric layers of the interconnect strip 1900. It should be noted that the conductive shield layer 1906 shields the environment 2206 from electric fields generated by the current passing through the conductive layer 1904, for example, to reduce or exclusion of electromagnetic radiation and to protect the connecting strip 1900 from external electromagnetic interference. The bulk medium 1902 also serves as a shielding layer, for example by minimizing or blocking electrical fields. Thus, the conductive shield layer 1906 and bulk medium 1902 in embodiments of bond strip 1900 may serve to contain electrical fields in bond strip 1900 (eg, between conductive shield layer 1906 and bulk medium 1902). This effect reduces or eliminates electromagnetic interference between the heating system and other nearby electrical components. Embodiments of interconnect strip 1900 in combination with bulk media 1902 can provide comparable performance to stripline transmission lines.

With reference to FIG. 19, the heating effect of the conductive strips 1900 on the bulk medium, as well as the impedance of each conductive strip 1900, can be controlled by changing characteristics of the conductive strip, such as, for example, the thickness of the various layers 1904, 1906, and 1908; conductive layer width; layout of the conductive layer; the materials of each layer, including their dielectric constants and conduction properties; or by adding impedance adjustment components (such as capacitors, inductors, and resistors). In addition, the heating effect of the current generated in the bulk medium 1902 can also be changed by changing these characteristics, which also serve to adjust the proximity effect and path of the heating current through the bulk medium 1902, as discussed above.

For example, each of the layers 1904, 1906, 1908 may have a respective thickness (D ₁ -D ₄ ), typically in the range of 0.1 mil to 1 inch, or in some embodiments, 0.5 mil to 10 mil. In some embodiments, the bonding strip 1900 may have different distances separating the conductive layer 1904 from the bulk medium 1902 and separating the conductive layer 1904 from the conductive shielding layer 1906. In some embodiments, these distances are related by a relationship. For example, the connecting strip 1900 may be formed such that the relative thickness D ₁ and the relative thickness D ₃ of the dielectric layer 1908 are related. For example, in some embodiments, the D ₁ :D ₃ ratio may range from 1:1 to 1:5. in other embodiments, the ratio D ₁ :D ₃ may range from 1:1 to 5:1, for example, to obtain the desired current density and/or impedance value for a given application. In one exemplary embodiment, D ₁ is 3 mil, D ₂ is 1 mil, D ₃ is 3 mil, and D ₄ is 1 mil. In another exemplary embodiment, D ₁ is 7.2 mils, D ₂ is 1.4 mils, D ₃ is 2.4 mils, and D ₄ is 1.4 mils. In another embodiment, D ₁ is 1000 mils, D ₂ is 50 mils, D ₃ is 500 mils, and D ₄ is 50 mils. In another embodiment, D ₁ is 10 mils, D ₂ is 2.5 mils, D ₃ is 50 mils, and D ₄ is 2.5 mils. In yet another example, D ₁ is 2.4 mils, D ₂ is 1.4 mils, D ₃ is 7.2 mils, and D ₄ is 1.4 mils. In a further example, D ₁ is 17.6 mils, D ₂ is 9.8 mils, D ₃ is 24.5 mils, and D ₄ is 9.8 mils. In yet another example, D ₁ is 100 mils, D ₂ is 20 mils, D ₃ is 250 mils, and D4 is 20 mils. In yet another example, D ₁ is 5.5 mils, D ₂ is 2.5 mils, D ₃ is 9.0 mils, and D ₄ is 2.5 mils. In another additional example, D ₁ is 1.5 inches, D ₂ is 0.25 inches, D ₃ is 2.2 inches, and D ₄ is 0.25 inches. In yet another example, D ₁ is 3.8 mils, D ₂ is 2 mils, D ₃ is 3.8 mils, and D ₄ is 2 mils. In yet another example, D ₁ is 2.9 mils, D ₂ is 1.5 mils, D ₃ is 5.8 mils, and D ₄ is 2.5 mils. In a further example, D ₁ is 5 mils, D ₂ is 2.5 mils, D ₃ is 25 mils, and D ₄ is 1.5 inches. In yet another example, D ₁ is 11 mils, D ₂ is 3 mils, D ₃ is 5.5 mils, and D ₄ is 3 mils. In yet another example, D ₁ is 21 mils, D ₂ is 1.5 mils, D ₃ is 7 mils, and D ₄ is 2.5 mils. In a further example, D ₁ is 10 mils, D ₂ is 2.5 mils, D ₃ is 2 mils, and D ₄ is 2.5 inches. In another additional example, D ₁ is 4.5 inches, D ₂ is 0.25 inches, D ₃ is 1.5 inches, and D ₄ is 0.25 inches. In another exemplary embodiment, D ₁ is 3 mil, D ₂ is 1 mil, D ₃ is 3 mil, and D ₄ is 1 mil. In yet another example, D ₁ is 10.2 mils, D ₂ is 3.5 mils, D ₃ is 40.8 mils, and D ₄ is 2.5 mils. In yet another example, D ₁ is 4.8 mils, D ₂ is 0.5 mils, D ₃ is 14.4 mils, and D ₄ is 0.5 mils. In yet another example, D ₁ is 15 mils, D ₂ is 1.4 mils, D ₃ is 3 mils, and D ₄ is 1.4 mils. In yet another example, D ₁ is 113 mils, D ₂ is 10 mils, D ₃ is 28.25 mils, and D ₄ is 10 mils. In yet another example, D ₁ is 127 mils, D ₂ is 5 mils, D ₃ is 254 mils, and D ₄ is 10 mils. In yet another example, D ₁ is 53 mils, D ₂ is 12 mils, D ₃ is 159 mils, and D ₄ is 12 mils. In yet another example, D ₁ is 13 mils, D ₂ is 1.4 mils, D ₃ is 2.6 mils, and D ₄ is 1.4 mils. In yet another example, D ₁ is 23 mils, D ₂ is 4 mils, D ₃ is 46 mils, and D ₄ is 4 mils. In yet another example, D ₁ is 11.5 mils, D ₂ is 2.8 mils, D ₃ is 57.5 mils, and D ₄ is 2.8 mils. In yet another example, D ₁ is 10 mils, D ₂ is 1.4 mils, D ₃ is 2.5 mils, and D ₄ is 1.4 mils.

In addition, the width of the conductive layer 1904 can typically be in the range of a few inches or a few mils. On FIG. 21 is a top view of several exemplary bond strips (Examples 1-9) to demonstrate various configurations of conductive layer 1904 in bond strip 1900. It should be noted that for purposes of illustration, bond strips 1900 in FIG. 21 are illustrated without layers located above the conductive layer 1904 (eg, without the second dielectric layer and the conductive shield layer). The cross-sectional area of the conductive layer 1904 may vary along its length. For example, the width of the conductive layer 1904 may vary along its length to adjust the impedance of the connecting strip 1900 and in some cases to adjust the current density in the bulk medium and the conductive layer. Examples 1-9 illustrate several exemplary variations in the width of the conductive layer 1904 of the connecting strip 1900. For example, the width of the conductive layer 1904 across the connecting strip 1900 may vary from a maximum width to a minimum width. In some embodiments, the maximum width is only 1.5 times the minimum width. In other implementations, the maximum width is 100 times the minimum width. For example, the conductive layer 1904 shown in Example 1 may be 1.5 inches wide at its widest point (eg, at the top end) and 1 inch at its narrowest point (eg, at the bottom end). In another example, the conductive layer 1904 shown in Example 1 may be 1 inch wide at its widest point (eg, top end) and 10 mils at its narrowest point (eg, bottom end).

In some implementations, the thickness of the conductive layer 1904 may vary along its length. For example, the width of the conductive layer 1904 may vary along its length to adjust the impedance of the connecting strip 1900. In some embodiments, the thickness, width, and material of the conductive layer 1904 may vary along its length.

In some implementations, the impedance of the interconnect strip 1900 may be adjusted by adding impedance adjustment components (eg, capacitors, inductors, and resistors) at one or more locations along the length of the conductive layer 1904. For example, the conductive layer may be divided into multiple segments along the length, with In this, one or more impedance adjustment components connect the segments. For example, with reference to the connecting strip from Example 4 in FIG. 21, conductive layer 1904 may be divided into two segments at region 2102, and an impedance adjustment component (eg, a capacitor, inductor, resistor, or combination thereof) may be electrically connected between each segment. Alternatively or in addition, an impedance adjustment component may be connected to the conductive layer as a shunt between the conductive layer 1904 and either the bulk medium 1902 or the conductive shield layer 1906.

In some embodiments, the width, thickness, or both of the conductive shield layer 1906 may vary along the length of the bond strip 1900. In some embodiments, the width, thickness, or both of the dielectric layers 1908 may vary along the length of the bond strip 1900. For example, in some embodiments Realizations of the cross-sectional area of the conductive layer 1904, the dielectric layers 1908, and the conductive shield layer 1906 may vary along the length of the strip 1900.

On FIG. 23 shows schematic diagrams of layouts (Layouts A-E) of several exemplary arrangements of a conductive layer 1904 in a bond strip 1900. Initially, in a linear arrangement (as shown in FIG. 21), the conductive layer 1904 runs linearly along the length of the bond strip 1900. Layouts A-E illustrate connecting strips 1900 whose conductive layer 1904 is positioned to follow a non-linear pattern or path. In particular, in the examples in FIG. 23 shows the conductive layer 1904 arranged in various serpentine patterns. The serpentine patterns illustrated provide for the placement of segments of the conductive layer 1904 adjacent to each other in the direction of the width of the interconnect strip 1900. This arrangement allows the overall length of the interconnect strip 1900 to be reduced while maintaining the desired overall length of the conductive layer 1904. In some applications, keeping the length of the conductive layer 1904 relatively constant in different connecting strips 1900 helps maintain the same impedance between connecting strips 1900 of different lengths. For example, in each of Arrangements A and B, the conductive layer 1904 may have the same overall length. However, the overall length of the interconnect strip 1900 in Layout B can be reduced to half the length of the interconnect strip 1900 with a conductive layer in a linear arrangement (eg, as illustrated in FIG. 21). Similarly, the total length of the connecting strip 1900 in Arrangement C can be reduced to one third of the length of the connecting strip 1900 with a conductive layer in a linear arrangement. In addition, shorter connecting strips 1900 can be placed in areas of the aircraft body with limited space. For example, connecting strips 1900 with a conductive layer arranged according to Layouts A-E can be placed in narrow areas of the wing (for example, on wing tip fairings) in which an overly long connecting strip 1900 with a linear placement of the conductive layer cannot be installed.

Each Layout A-E illustrates a bonding strip 1900 having a conductive layer 1904 located along a non-linear path from the input end 2302 to the terminal end 2304. Layout A illustrates a bonding strip 1900 with a conductive layer 1904 arranged in a double overlap. The conductive layer 1904 in Layout A includes two segments adjacent to each other, for example, along a U-shaped path from the input end 2302 to the terminal end 2304. In FIG. 24A shows a sectional view, taken along the line A-A', of the connecting strip 1900 according to the Arrangement Plan A.

Layout B illustrates a bonding strip 1900 with a conductive layer 1904 arranged in a triple overlap. The conductive layer 1904 in Layout B includes three segments adjacent to each other, for example, along an S-shaped path from the input end 2302 to the terminal end 2304. In FIG. 24B shows a sectional view, taken along the line B-B', of the connecting strip 1900 according to the layout Scheme B.

Layouts C and D illustrate bonding strips 1900 with conductive layer 1904 in various quadruple overlap arrangements. The conductive layer 1904 in each of Arrangements C and D includes four segments adjacent to each other. In Arrangement C, the conductive layer segments 1904 are arranged, for example, along an M-shaped path (or W-shaped path) from the input end 2302 to the terminal end 2304. In Arrangement D, the conductive layer segments 1904 are arranged, for example, in a double overlay folded along itself. A similar technique can also be applied to the triple configuration by folding the conductive layer 1904 along itself. On FIG. 24C shows a sectional view, taken along line C-C', of a connecting strip 1900 according to Layout Scheme C and Layout Scheme D.

Layout Diagram E illustrates a more general arrangement of the conductive layer 1904. For example, Layout Diagram E illustrates an example of a conductive layer 1904 with multiple segments of different widths adjacent to each other. In addition, in some implementations, the conductive layer 1904 may include internal connections 2306 between the segments at various locations between the segments, as shown in the Location Diagram E. In some implementations, the interconnect strip 1900 may also include a plurality of signal inputs 2302.

On FIG. 25A shows a sectional view of an exemplary configuration for attaching a bonding strip 1900 to a bulk medium 1902. In particular, FIG. 25A shows a bottom mount configuration. In a bottom mounting configuration, the adhesive material 2502 is located between the bottom surface of the bonding strip 1900 (e.g., bottom dielectric layer) and the surface of the bulk medium 1902. For example, the adhesive material can be, without limitation, a layer of double-sided adhesive (e.g., double-sided adhesive tape), resin or epoxy resin.

On FIG. 25B shows a sectional view of another exemplary configuration for attaching a bonding strip 1900 to a bulk medium 1902. In particular, FIG. 25B shows a top mounting configuration. In a top-mount configuration, an adhesive layer 2504 is applied over the bonding strip 1900 to secure the bonding strip 1900 to the skin 1902 of the aircraft. The adhesive layer 2504 may be, for example, an adhesive coating, adhesive film or tape.

Fig. 26A is a sectional view of the bonding strip 1900 with the double-sided adhesive backing prior to installation on the bulk medium 1902, and FIG. 26B is a sectional view of the connecting strip 1900 of FIG. 26A installed on bulk media 1902. In some embodiments, such as in a bottom-mount configuration, bonding strip 1900 includes an adhesive backsheet 2608. The adhesive backsheet may be made of a double-sided adhesive material (eg, double-sided adhesive tape). In such embodiments, the double-sided adhesive material may serve as the bottom dielectric layer (eg, bottom dielectric layer 1908 in FIG. 19). In some embodiments, the adhesive backing layer 2608 may be, for example, an adhesive coating or adhesive film applied to the bottom surface of the bottom dielectric layer 1908. Prior to installation, the bonding strip 1900 with the adhesive backing layer 2608 may include a protective layer 2610 over the adhesive backing layer. 2608. The protective layer 2610 may be, for example, a tear-off layer. For example, the backsheet 2610 may protect the adhesive backsheet 2608 prior to installation. During installation, the protective layer 2610 can be removed from the adhesive backing layer 2608, exposing the adhesive surface so that the bonding strip 1900 can be attached to the surface of the bulk medium 1902.

In some embodiments, one or more adhesive layers 2604 and 2606 may be included to attach the dielectric layer 1908 to the conductive layer 1904 and/or to attach the conductive shield layer 1906 to the dielectric layer 1908. In some embodiments, the bonding strip 1900 includes a protective layer 2602 over a conductive shield layer 1906. For example, the shield layer 2602 may include, without limitation, one or more layers of polyurethane, polyfluoride, paint, paint replacement film, sealant, or combinations thereof.

In some applications it may be necessary to heat a non-conductive bulk medium. In such situations, the heating systems and connecting strips described in this application can be modified to heat a non-conductive bulk medium. For example, an embedded layer can be used to heat a non-conductive bulk medium with a heating system using connecting strips.

On FIG. 27A-27F show sectional views of various embodiments of embedded connecting strips. On FIG. 27A shows a connecting strip 2700 similar to the connecting strip 1900 in FIG. 19. Like the bonding strip 1900, the bonding strip 2700 has a multilayer construction that includes a first dielectric layer 1908 over the bulk medium 1902, a conductive layer 1904 over the first dielectric layer 1908, a second dielectric layer 1908 over the conductive layer 1904, and a conductive shield layer 1906. over the second dielectric layer 1908, and optionally a protective layer 2706 over the conductive shield layer 1906. The protective layer 2706 is similar to the protective layer 2602 described above. The connecting strip 2700 differs from the connecting strip 1900 in that it is attached to the surface of the non-conductive bulk medium 2702, and the non-conductive bulk medium 2702 includes a bulk conductive material 2704 embedded therein. For example, the bulk conductive material 2704 may be in the form of a metal foil, a metal tape, or a braided metal layer embedded in a non-conductive bulk medium 2702. For example, the non-conductive bulk medium 2702 may be a laminate (e.g., carbon fiber, fiberglass, or kevlar) with conductive bulk material 2704 sandwiched between layers of non-conductive bulk medium 2702. Bulk conductive material 2704 may be made of conductive materials including, but not limited to, copper, copper alloys (such as brass or bronze), silver, silver alloys, aluminium, aluminum alloys, titanium, titanium alloys, chromium, nickel, nickel alloys, cobalt alloys, stainless steel, graphite, or combinations thereof.

In each of the examples illustrated in FIG. 27A-27F, an alternating current passing through the conductive layer 1904 of the connecting strip 2700 generates a heating current in the bulk conductive material 2704, and not in the non-conductive bulk media 2702. The heat generated in the bulk conductive material 2704 is then transferred to the non-conductive bulk media 2702 (for example, due to heat conduction). In some examples, if the non-conductive bulk medium has some electrical conductivity, heat will also be generated in the non-conductive region in addition to the layer of bulk conductive material.

On FIG. 27B shows an embodiment of an interconnect strip 2700 that includes only a protective layer 2706, a conductive layer 1904, and a dielectric layer 1908. The interconnect strip 2700 is configured such that the protective layer 2706 is located over the conductive layer 1904 and the conductive layer 1904 is positioned over the dielectric layer 1908. The dielectric layer 1908 is separated from the embedded conductive bulk material 2704 by a portion of the non-conductive bulk medium 2702.

On FIG. 27C shows an embodiment of a bonding strip 2700 that includes a conductive layer 1904 embedded in a non-conductive bulk medium 2702. The bonding strip 2700 of FIG. 27C includes a protective layer 2706, a conductive shield layer 1906, a dielectric layer 1908, and a conductive layer 1904. The connecting strip 2700 is arranged such that the protective layer 2706, the conductive shield layer 1906, and the dielectric layer 1908 are located on top of the conductive layer 1904. The conductive layer 1904 is embedded into the non-conductive bulk media 2702 and is separated from the conductive bulk material 2704 by a portion of the non-conductive bulk media 2702. For example, each of the conductive layer 1904 and the conductive bulk material 2704 may be located between different layers of the non-conductive bulk media 2702.

On FIG. 27D shows a variant of the connecting strip 2700 illustrated in FIG. 27C, but without the protective layer 2706, the conductive shield layer 1906, and the dielectric layer 1908.

On FIG. 27E shows a variant of the connecting strip 2700 illustrated in FIG. 27D but with the conductive layer 1904 and conductive bulk material 2704 in reverse. That is, in the interconnect strip 2700 arrangement illustrated in FIG. 27E, the conductive bulk material 2704 is located closer to the surface of the non-conductive bulk medium 2702 than the conductive layer 1904.

On FIG. 27F shows an embodiment of a connector strip 2700 that includes a conductive layer 1904 and a conductive shield layer 1906 embedded in a non-conductive bulk medium 2702. In the connector strip 2700 arrangement illustrated in FIG. 27F, portions of non-conductive bulk media 2702 (e.g., non-conductive bulk media layers 2702) separate conductive layer 1904 from conductive shield layer 1906 and from conductive bulk material 2704. shown in FIG. 19.

On FIG. 28 shows schematic representations of one embodiment of a connector strip 2802. Schematic representation 2805 is a schematic diagram of a connector 2802. Connector 2802 includes a built-in impedance adjustment circuit 2804. An impedance adjustment circuit 2804 is electrically connected between the input signal interface 2806 and the connecting strip 1900. For example, the input signal interface 2806 may be a coaxial cable connection. The input terminal 2810 of the input signal interface 2806 (for example, the center wire of connecting the coaxial cable) is connected to the conductive layer 1904 of the connecting strip 1900 by wire 2808. and/or to the conductive shield layer 1906 of the connecting strip 1900 by one or more wires 2812.

The impedance adjustment circuit 2804 is configured to adjust the input impedance of the connecting strip 1900 to a desired level, which is measured at the signal input interface 2806. The impedance adjustment circuit 2804 may be a fixed or variable impedance adjustment circuit. For example, the impedance adjustment circuit 2804 may be implemented as one of the impedance adjustment circuits described above with reference to FIG. 12-15B. In the schematic representation 2850, the impedance adjustment circuit 2804 is implemented as a shunt capacitor C ₁ between ground connected to the conductive shield layer 1906 of the connecting strip 1900 and/or to the bulk medium 1902 (or bulk conductive material 2704 if implemented for a non-conductive bulk medium).

On FIG. 29 shows schematic representations of another embodiment of a connector strip 2902. Connector 2902 includes two input signal interfaces 2906A and 2906B, for example, for connecting multiple connector strips 1900 in series to each other. Schematic representation 2905 is a schematic diagram of a connector 2902. Connector 2902 includes a built-in impedance adjustment circuit 2904. The impedance adjustment circuit 2904 includes serial shunt impedance adjustment components 2904A, 2904B, 2904C electrically connected between signal input interfaces 2906A, 2906B and interconnect strip 1900. For example, signal input interfaces 2906A and 2906B may be coaxial cable connections. The respective input terminals 22910 of the signal input interfaces 2906A, 2906B are connected to the conductive layer 1904 of the connecting strip 1900 and to each other by wire 2808. layer 1906 connecting strip 1900 with one or more wires 2912.

In the schematic representation 2950, the impedance adjustment circuit 2804 is implemented as a series capacitor C ₁ and two shunt capacitors C ₂ , C ₃ between ground connected to the conductive shielding layer 1906 of the connecting strip 1900 and/or to the bulk medium 1902 (or the bulk conductive material 2704 in case of implementation for a non-conductive bulk medium).

Fig. 30 is a block diagram of a first exemplary bulk medium heating system 3000 using bonding strips 1900 according to embodiments of the present invention. The heating system 3000 includes a plurality of connecting strips 1900 spaced apart and attached to a bulk medium 1902 (eg, an aircraft wing). Each interconnect strip 1900 is connected to a power management system 3002. Power management system 3002 may be implemented according to any of the power management system 104 implementations discussed above. The power management system 3002 supplies AC power to each strip.

One end of each interconnect strip 1900 (referred to in this application as the "input end") is connected to the power management system 3002 via connector 3004. In the illustrated example, the opposite end of each interconnect strip 1900 (referred to in this application as the "terminal end") has either an open termination 3006 or closed termination 3008. The connecting strips 1900 are arranged in an alternating manner, with each adjacent pair of connecting strips 1900 having a different type of termination. For example, one bond strip 1900 in each adjacent pair is provided with an open termination 3006 at the termination end, while the other bond strip 1900 in the pair is provided with a closed termination 3008. Open terminations 3006 means that the termination end of the interconnect strip 1900 is left in open circuit. ; not connected to electrical ground through bulk medium 1902 or conductive shield layer of interconnect strip 1900. In some implementations, closed terminations 3008 are short circuits between the conductive layer of interconnect strip 1900 and bulk medium 1902 and/or conductive shield layer of interconnect strip 1900. B In some embodiments, closed terminations 3008 are capacitive terminations, with a capacitor connected between the conductive layer of interconnect strip 1900 and electrical ground. For example, a capacitor is connected between the conductive layer of the interconnect strip 1900 and either the bulk medium 1902 or the conductive shield layer of the interconnect strip 1900. In some implementations, the closed terminations 3008 are inductive terminations, with a inductor. For example, an inductor is connected between the conductive layer of the interconnect strip 1900 and either the bulk medium 1902 or the conductive shield layer of the interconnect strip 1900. resistor connected. For example, a resistor is connected between the conductive layer of the connecting strip 1900 and either the bulk medium 1902 or the conductive shielding layer of the connecting strip 1900.

Complementary termination types may be applied to adjacent interconnect strips 1900 to provide the required input impedance to the power management system 3002, to provide the required heat distribution in the bulk environment 1902, or to perform both functions. For example, interconnect strips 1900 may be installed on bulk media 1902 such that adjacent interconnect strips 1900 have complementary termination types. For example, terminations of adjacent interconnect strips 1900 may alternate between open terminations 3006 and short circuit terminations (eg, closed termination 3008 implemented as short circuits). In another example, the terminations of adjacent interconnect strips 1900 may alternate between closed termination 3008 implemented as capacitive terminations and closed termination 3008 implemented as inductive terminations.

Fig. 31 is a block diagram of a second exemplary bulk medium heating system 3100 using bonding strips 1900 according to embodiments of the present invention. The heating system 3100 is similar to the heating system 3000 described above, with the addition of a control system 3102 configured to control the variable terminations 3106 attached to the terminus end of each connecting strip 1900. The variable terminations 3106 include a switchable termination. In some embodiments, variable terminations 3106 are configured to switch between a shorted termination and an open termination. For example, variable terminations 3106 include a controllable switch connected between the conductive layer of interconnect strip 1900 and electrical ground. The controlled switch can be implemented as an electronic switch (eg transistor, power diode, thyristor, silicon controlled rectifier, etc.) or a mechanical switch (eg relay). For example, a controlled switch is connected between the conductive layer of the connecting strip 1900 and either the bulk medium 1902 or the conductive shielding layer of the connecting strip 1900. The output of the control system is connected to the control terminal of the controlled switch.

The termination of each interconnect strip 1900 can be switched between open circuit and short circuit by opening and closing a controlled switch (or turning an electronic switch on and off). For example, the control system 3102 controls the operation of the variable terminations 3106 of the interconnect strip 1900 by operating a controlled switch to change the type of termination of the interconnect strip 1900 as needed to heat the bulk medium 1902. In some embodiments, the control system 3102 may independently control each variable termination 3106 connecting strip. In some embodiments, the control system 3102 may synchronously control the variable terminations 3106 of a group (eg, a pair or larger group) of trunks. In some embodiments, the control system 3102 may control the switching of the variable terminations 3106 of one or more interconnect strips 1900 at regular intervals, such as according to a regular duty cycle. The duty cycle for switching variable terminations 3106 can range from 0.01 Hz to 100 Hz.

In some implementations, the control system 3102 controls the variable terminations 3106 by alternately switching between open and closed terminations. For example, the control system 3102 switches half of the variable terminations 3106 to short circuit terminations and half of the variable terminations 3106 to open terminations in the first half of the duty cycle. Then, in the second half of the duty cycle, the control system 3102 switches the variable terminations 3106 so that the terminations switched to open terminations are switched to closed terminations, and vice versa. The duty cycle for switching variable terminations 3106 can range from 0.01 Hz to 100 Hz.

In some implementations, the variable terminations 3106 of each pair of adjacent interconnect strips 1900 are controlled to maintain the opposite termination type. That is, the control system 3102 controls the variable terminations 3106 such that the termination of one interconnect strip 1900 in each adjacent pair is configured as an open circuit, and the termination of the other interconnect strip 1900 in the pair is configured as an open circuit, with the terminations interleaved in every half of the working cycle.

Control system 3102 may be a computing device with one or more processors or microcontrollers configured to control the operation of variable terminations 3106. For example, control system 3102 includes a memory that stores instructions (eg, program code) that, when executed, control system causes the control system 3102 to provide appropriate control signals to the controlled switches in the variable terminations 3106. In some embodiments, the power management system 3002 and the control system 3102 may be combined into a common power management and control system.

In some embodiments, variable terminations 3106 are configured to switch between capacitive termination and inductive termination. For example, a controllable switch may be configured to switch between connecting the conductive layer of interconnect strip 1900 to a capacitor that is connected to ground, or connecting the conductive layer of interconnect strip 1900 to an inductor that is connected to ground. As noted above, the ground may be through either the bulk medium 1902 or the conductive shield layer of the interconnect strip 1900. In addition, in such implementations, the control system 3102 may operate as described above to alternately switch the variable terminations 3106 between conductive and inductive. end loads.

In other implementations, the variable terminations 3106 can be modified to switch between different types of terminations, for example, between open terminations and capacitive terminations, between short-circuited terminations and inductive terminations, between open-circuited terminations and inductive terminations, between short-circuited terminations terminations and capacitive terminations, between open terminations and resistive terminations, between short circuit terminations and resistive terminations, or other combinations thereof.

Fig. 32 is a block diagram of a third exemplary bulk medium heating system 3200 using bonding strips according to embodiments of the present invention. The heating system 3200 is configured to alternately actuate adjacent connecting strips 1900. The heating system 3200 is similar to the heating system 3000 described above, with the addition of a control system 3202 configured to actuate switchable connectors 3204 attached to the input end of each connecting strip 1900 The switchable connectors 3204 include a controllable switch operable to connect an appropriate connector strip 1900 to and from the power management system 3002. The controlled switch can be implemented as an electronic switch (eg transistor, power diode, thyristor, silicon controlled rectifier, etc.) or a mechanical switch (eg relay). For example, a controlled switch is connected between the conductive layer of the connecting strip 1900 and the input terminal of the switchable connector 3204. The output of the control system is connected to the control terminal of the controlled switch.

The control system 3202 controls the operation of the switchable connector 3204 to alternately connect and disconnect the connecting strips 1900 from the power management system 3002, effectively connecting and disconnecting the connecting strips 1900. For example, the control system 3202 can control the switching connectors 3204 to alternately connect and disconnect the connecting strips 1900. For example , the control system 3202 controls the operation of the switchable connectors 3204 of the trunk 1900 by operating a controlled switch to connect or disconnect the trunk 1900 as needed to heat the bulk medium 1902. In some implementations, the control system 3102 may independently control each variable termination 3106 of the trunk. In some embodiments, the control system 3102 may synchronously control the variable terminations 3106 of a group (eg, a pair or larger group) of trunks. In some embodiments, the control system 3102 may control the switching of the variable terminations 3106 of one or more interconnect strips 1900 at regular intervals, such as according to a regular duty cycle. The duty cycle for switching variable terminations 3106 can range from 0.01 Hz to 100 Hz. In some implementations, the control system 3202 turns on interconnect strips 1900 with open terminations 3006 and disconnects interconnect strips 1900 with closed terminations 3008 in the first half of the duty cycle. Then, in the second half of the operating cycle, the control system 3202 toggles the switchable connectors 3204 to disconnect the connecting strips 1900 with open terminations 3006 and connect the connecting strips 1900 with closed terminations 3008.

Control system 3202 may be a computing device with one or more processors or microcontrollers configured to control the operation of variable terminations 3106. For example, control system 3202 includes a memory that stores instructions (eg, program code) that, when executed, control system causes the control system 3202 to provide appropriate control signals to the controlled switches in the variable terminations 3106. In some embodiments, the power management system 3002 and the control system 3202 may be combined into a common power management and control system.

In the context of this application, the expressions "perpendicular" or "substantially perpendicular" or "at right angles" or "essentially at right angles" refer to the relative position of two elements (for example, lines, directions, axes, planes, surfaces or components) that forms an angle of ninety degrees within design or measurement tolerances. For example, directions may be considered perpendicular if the angle between the directions is within a tolerance of ninety degrees (eg, ±1-2 degrees).

Although the present application contains many specific details of embodiments, they should not be considered as limiting the scope of any invention or the scope of what may be claimed, but as descriptions of features that may be specific to particular embodiments of particular inventions. Some of the features described in this application in the context of separate implementation options, can also be implemented in combination in one embodiment. Conversely, various features described in the context of one embodiment may also be implemented in multiple embodiments individually or in any suitable subcombination. In addition, although the features may be described above as operating in certain combinations and even initially claimed as such, one or more features from the claimed combination may in some cases be excluded from the combination, and the claimed combination may be directed to a subcombination or subcombination variation.

Similarly, although the operations are illustrated in the drawings in a specific order, this should not be understood as a requirement that such operations must be performed in the particular order shown or in sequential order, or that all illustrated operations must be performed to achieve the desired result. In certain circumstances, multitasking and parallel processing may be preferred. In addition, the separation of the various modules and system components in the embodiments described above should not be understood as requiring such separation in all implementations, and it should be understood that the software components and systems described can generally be combined in a single software and/or hardware product or packaged in a variety of software and/or hardware products.

The specific embodiments of the object of the present invention have been described above. Other implementation options are within the scope of the following claims. For example, the steps in the claims may be performed in a different order and still achieve the desired results. As one example, the processes illustrated in the accompanying drawings do not necessarily require the particular order shown or sequential order to achieve the desired result. In some cases, multitasking and parallel processing may be preferred.

The following embodiments are also innovative in addition to the embodiments of the appended claims and the embodiments described above:

Embodiment 1 is a system for heating the outer surface of a bulk medium, the system comprising: two or more connecting strips located at a distance from each other and attached to the bulk medium, each of the connecting strips containing a multilayer structure extending along the surface of the bulk medium, which, in combination with the bulk medium, forms a power line, the multilayer structure comprising: a first dielectric layer over the bulk medium, a conductive layer over the first dielectric layer, a second dielectric layer over the conductive layer, and a conductive shielding layer over the second dielectric layer; and a power management system connected to the conductive layer of each of the connecting strips and to the bulk medium, the power management system being configured to heat the surface of the bulk medium by applying electric current to the connecting strips.

Embodiment 2 is the system of Embodiment 1 in which the power management system is configured to supply electrical current to the connecting strips at an AC frequency of 1 kHz to 450 MHz.

Embodiment 3 is a system according to any of Embodiments 1 or 2 in which the conductive layer is located within 1 inch of the bulk medium.

Embodiment 4 is a system according to any of the previous embodiments in which the power management system is configured to supply 0.1 A to 200 A AC per interconnect strip.

Embodiment 5 is a system according to any of the previous embodiments, in which the conductive layer of at least one of the connecting strips is arranged in a serpentine pattern in which the conductive layer segments are arranged next to each other.

Embodiment 6 is a system according to any of the previous embodiments, in which the conductive layer is separated from the bulk medium by a first distance, in which the conductive shield layer is separated from the conductive layer by a second distance, and in which the ratio between the first distance and the second distance is in range from 1:1 to 1:5.

Embodiment 7 is a system according to any one of Embodiments 1-5, wherein the conductive layer is separated from the bulk medium by a first distance, wherein the conductive shield layer is separated from the conductive layer by a second distance, and wherein the ratio between the first distance and the second distance is in the range from 5:1 to 1:5.

Embodiment 8 is a system according to any one of Embodiments 1-5, in which the conductive layer is separated from the bulk medium by a first distance, in which the conductive shield layer is separated from the conductive layer by a second distance, and in which the ratio between the first distance and the second distance is in the range from 1:1 to 5:1.

Embodiment 9 is a system according to any one of Embodiments 1-5, wherein the first dielectric layer has a first thickness, wherein the second dielectric layer has a second thickness, and wherein the ratio between the first thickness and the second thickness is in the range of 1:1 up to 1:5.

Embodiment 10 is a system according to any one of Embodiments 1-5, wherein the first dielectric layer has a first thickness, wherein the second dielectric layer has a second thickness, and wherein the ratio between the first thickness and the second thickness is in the range of 1:1 up to 5:1.

Embodiment 11 is a system according to any of the previous embodiments, wherein the conductive layer of at least one of the connecting strips has a width across the conductive layer that varies along the length of the conductive layer.

Embodiment 12 is the system according to Embodiment 11, in which the conductive layer of at least one of the connecting strips has a width across the conductive layer that varies along the length of the conductive layer, in which the width across the conductive layer varies from a maximum width to a minimum width, and in which the maximum width is from 1.5 to 100 times the minimum width.

Embodiment 13 is a system according to Embodiment 11 in which the width across the conductive layer varies from the maximum width to the minimum width, and in which the maximum width is 1.5 to 100 times the minimum width.

Embodiment 14 is a system according to any of the previous embodiments, wherein the conductive layer of at least one of the connecting strips comprises a plurality of segments with one or more circuit elements connected between each pair of segments.

Embodiment 15 is the system of Embodiment 14 in which one or more circuit elements comprise capacitors.

Embodiment 16 is a system according to any of the previous embodiments, wherein the conductive layer of at least one of the connecting strips has a thickness that varies along the length of the conductive layer.

Embodiment 17 is a system according to any of the previous embodiments, in which the bulk medium forms a second shielding layer for the power line formed in combination with each of the connecting strips.

Embodiment 18 is a system according to any of the previous embodiments, wherein the conductive layer and the conductive shield layer each comprise at least one copper, silver, or aluminum material.

Implementation 19 is a system according to any of the previous implementations, in which the conductive layer contains titanium.

Embodiment 20 is a system according to any of the previous embodiments, wherein the conductive shield layer comprises at least one copper foil, aluminum foil, or braided shield material.

Embodiment 21 is a system according to any of the previous embodiments, wherein each of the first dielectric layer and the second dielectric layer contains at least one Kapton or Mylar material.

Embodiment 22 is a system according to any of the previous embodiments, wherein the first dielectric layer and the second dielectric layer comprise at least one polyethylene terephthalate (PET), polytetrafluoroethylene (PTFE), or rubber material.

Embodiment 23 is a system according to any of the previous embodiments, wherein the sandwich structure further comprises a protective layer over a conductive shield layer.

Implementation 24 is a system according to any of the previous implementations, in which the first dielectric layer contains an adhesive material.

Embodiment 25 is a system according to any of the previous embodiments, wherein the sandwich structure further comprises: a first adhesive layer between the conductive layer and the second dielectric layer and a second adhesive layer between the second dielectric layer and the conductive shield layer.

Embodiment 26 is a system according to any of the previous embodiments, in which each connecting strip comprises a first end and a termination end, in which the conductive layer of each connecting strip is connected to a power management system at the first end, and in which at least one of the connecting strips strips contains an electrically conductive path to electrical ground at the terminal end.

Embodiment 27 is the system of Embodiment 26 in which the electrical ground contains a bulk medium.

Embodiment 28 is a system according to Embodiment 26, wherein the electrical ground comprises a conductive shield layer of at least one bond strip.

Embodiment 29 is a system according to any of the previous embodiments, in which each connection strip comprises a first end and a termination end, in which the conductive layer of each connection strip is connected to a power management system at the first end, and in which at least one of the connection strips strips contains an open circuit between the conductive layer and electrical ground at the terminal end.

Embodiment 30 is the system of Embodiment 29 in which the electrical ground contains a bulk medium.

Embodiment 31 is the system according to Embodiment 29, in which the electrical grounding comprises a conductive shielding layer of at least one connecting strip.

Embodiment 32 is a system according to any of the previous embodiments, in which each connecting strip comprises a first end and a termination end, in which the conductive layer of each connecting strip is connected to a power management system at the first end, and in which at least one of the connecting strips strips contains a circuit element connected between the conductive layer and electrical ground at the terminal end, and the circuit element contains at least one of a capacitor, inductor or resistor.

Embodiment 33 is the system of Embodiment 32 in which the electrical ground contains a bulk medium.

Embodiment 34 is the system of Embodiment 32, wherein the electrical ground comprises a conductive shield layer of at least one bond strip.

Embodiment 35 is a system according to any of the previous embodiments, in which each interconnect strip comprises a first end and a termination end, in which the conductive layer of each interconnect strip is connected to a power management system at the first end, in which the first interconnect strip in each adjacent pair of the connecting strips in turn comprises an open circuit between the conductive layer and electrical ground at the terminating end, and wherein the second connecting strip in each adjacent pair of connecting strips in turn comprises an electrically conductive path to electrical earth at the terminating end.

Embodiment 36 is a system according to embodiment 34 in which the electrical ground contains a bulk medium.

Embodiment 37 is the system of Embodiment 34 in which the electrical grounding comprises a corresponding conductive shield layer of the first and second bond strips.

Embodiment 38 is the system of Embodiment 34 wherein the power management system is operable to alternately switch between energizing a first bond strip in each adjacent pair of bond strips and energizing a second bond strip in each adjacent pair of bond strips.

Embodiment 39 is a system according to any of the previous embodiments, in which each interconnect strip comprises a first end and a termination end, in which the conductive layer of each interconnect strip is connected to a power management system at the first end, in which the first interconnect strip in each adjacent pair of the connecting strips in turn comprises a capacitor connected between the conductive layer and electrical ground at the terminal end, and in which the second connecting strip in each adjacent pair of connecting strips in turn contains an inductor connected between the conductive layer and electrical ground at the terminal end.

Embodiment 40 is the system of Embodiment 39 in which the electrical ground contains a bulk medium.

Embodiment 41 is the system according to Embodiment 39, in which the electrical grounding comprises a corresponding conductive shield layer of the first and second connecting strips.

Embodiment 42 is the system of Embodiment 39, wherein the power management system is configured to alternately switch between supplying electrical current to a first bond strip in each adjacent pair of interconnect strips and supplying electrical current to a second interconnect strip in each adjacent pair of interconnect strips.

Embodiment 43 is a system according to any of the previous embodiments, in which each connection strip includes a first end and a termination end, in which the conductive layer of each connection strip is connected to a power management system at the first end, and in which each connection strip contains a switch, connected at the terminal end between the conductive layer and the bulk medium and/or the conductive shielding layer, wherein, when in the first state, the switch forms an open circuit between the conductive layer and the bulk medium or the conductive shielding layer, and when in the second state, the switch forms a closed circuit between the conductive layer and electrical grounding.

Embodiment 44 is the system of Embodiment 43 in which the electrical ground is a bulk medium.

Embodiment 45 is the system of Embodiment 43 in which the electrical ground is a conductive shield layer.

Embodiment 46 is a system according to any of the previous embodiments in which two or more connecting strips are electrically connected to each other in parallel.

Embodiment 47 is a system according to any of the previous embodiments in which two or more connecting strips are electrically connected to each other in a serial manner.

Embodiment 48 is a system according to any of the previous embodiments, wherein the volumetric medium comprises a volumetric medium, a wind turbine blade, a building roof, or railroad tracks.

Embodiment 49 is a system for heating the exterior of a structure, the system comprising: a structure to be heated, the structure being made of a non-conductive material and having a bulk conductive material embedded therein; two or more connecting strips spaced apart and attached to the structure, each of the connecting strips comprising a multilayer structure extending along the structure which, in combination with a bulk conductive material embedded in the structure, forms a transmission line, the multilayer structure comprising : a conductive layer overlapping the conductive material and a first dielectric layer between the bulk conductive material and the first conductive layer; and a power management system connected to the conductive layer of each of the connecting strips and to the structure, the power management system being configured to heat the outside of the structure by supplying electric current to the connecting strips.

Embodiment 50 is the system of claim 49, in which each bonding strip extends along the surface of the structure, and in which the sandwich structure further comprises a protective layer over the conductive layer.

Embodiment 51 is the system according to item 49, in which each connecting strip extends along the surface of the structure, and in which the multilayer structure further comprises: a conductive shield layer over the conductive layer, a second dielectric layer between the conductive layer and the conductive shield layer, and a protective layer over the conductive layer. shielding layer.

Embodiment 52 is the system according to item 49, in which a section of each connecting strip extends along the surface of the structure, in which the conductive layer is embedded in the structure, in which the structure section forms the first dielectric layer, and in which the multilayer structure further comprises: a conductive shield layer over a conductive layer, a second dielectric layer between the conductive layer and the conductive shield layer, and a protective layer over the conductive shield layer.

Embodiment 53 is the system according to item 49, in which the conductive layer is embedded in the structure, in which the first portion of the structure forms the first dielectric layer, and in which the multilayer structure further comprises: a conductive shield layer embedded in the structure and overlapping the conductive layer, and a second a dielectric layer formed by the second section of the structure and located between the conductive layer and the conductive shielding layer.

Embodiment 54 is the system of claim 49 in which the conductive layer is embedded in the structure and in which the structure portion forms the first dielectric layer.

Embodiment 55 is a system according to any one of embodiments 49-54 wherein the power management system is configured to supply electrical current to the connecting strips at an AC frequency of 1 kHz to 450 MHz.

Embodiment 56 is a system according to any of embodiments 49-55 in which the conductive layer is located within 1 inch of the bulk conductive material.

Embodiment 57 is a system according to any one of Embodiments 49-56 wherein the power management system is configured to supply 0.1 A to 200 A AC per interconnect strip.

Embodiment 58 is a system according to any one of Embodiments 49-57 wherein the conductive layer of at least one of the connecting strips is arranged in a serpentine pattern in which the conductive layer segments are adjacent to each other.

Embodiment 59 is a system according to any one of Embodiments 51-53, in which the conductive layer is separated from the bulk conductive material by a first distance, in which the conductive shield layer is separated from the conductive layer by a second distance, and in which the ratio between the first distance and the second distance ranges from 1:1 to 1:5.

Embodiment 60 is a system according to any one of Embodiments 51-53, in which the conductive layer is separated from the bulk conductive material by a first distance, in which the conductive shield layer is separated from the conductive layer by a second distance, and in which the ratio between the first distance and the second distance ranges from 1:1 to 5:1.

Embodiment 61 is a system according to any one of Embodiments 49-60, wherein the conductive layer of at least one of the connecting strips has a width across the conductive layer that varies along the length of the conductive layer.

Embodiment 62 is the system of Embodiment 61 in which the width across the conductive layer varies from the maximum width to the minimum width, and in which the maximum width is 1.5 to 100 times the minimum width.

Embodiment 63 is a system according to any one of embodiments 49-62, wherein the conductive layer of at least one of the connecting strips comprises a plurality of segments with one or more circuit elements connected between each pair of segments.

Embodiment 64 is a system according to embodiment 63 in which one or more circuit elements contain capacitors.

Embodiment 65 is a system according to any one of Embodiments 49-64, wherein the conductive layer of at least one of the connecting strips has a thickness that varies along the length of the conductive layer.

Embodiment 66 is a system according to any one of embodiments 49-65, wherein the bulk conductive material forms a second shield layer for the power line formed in combination with each of the connecting strips.

Embodiment 67 is a system according to any one of Embodiments 51-53, wherein the conductive layer and the conductive shield layer each comprise at least one copper, silver, or aluminum material.

Embodiment 68 is a system according to any of Embodiments 49-67 wherein the conductive layer contains titanium.

Embodiment 69 is a system according to any one of Embodiments 51-53, wherein the conductive shield layer comprises at least one copper foil, aluminum foil, or braided shield material.

Embodiment 70 is a system according to any one of Embodiments 49-69, in which each interconnect strip comprises a first end and a termination end, in which the conductive layer of each interconnect strip is connected to a power management system at the first end, and in which at least one of the connecting strips contains an electrically conductive path connected between the conductive layer and the bulk conductive material at the terminal end.

Embodiment 71 is a system according to any one of Embodiments 49-70, in which each interconnect strip comprises a first end and a termination end, in which the conductive layer of each interconnect strip is connected to a power management system at the first end, and in which at least one of the connecting strips contains an open circuit between the conductive layer and the bulk conductive material at the terminal end.

Embodiment 72 is a system according to any one of Embodiments 49-71, in which each interconnect strip comprises a first end and a termination end, in which the conductive layer of each interconnect strip is connected to a power management system at the first end, and in which at least one of the connecting strips contains a circuit element connected between the conductive layer and the bulk conductive material at the terminal end, and the circuit element contains at least one of a capacitor, inductor or resistor.

Embodiment 73 is a system according to any one of Embodiments 49-72, in which each interconnect strip comprises a first end and a termination end, in which the conductive layer of each interconnect strip is connected to a power management system at the first end, in which the first interconnect strip in each the adjacent pair of connecting strips in turn contains an open circuit between the conductive layer and the bulk conductive material at the terminal end, and in which the second connecting strip in each adjacent pair of connecting strips in turn contains an electrically conductive path connected between the conductive layer and the bulk conductive material at the terminal end.

Embodiment 74 is a system according to Embodiment 73, wherein the power management system is configured to alternately switch between energizing a first bond strip in each adjacent pair of bond strips and energizing a second bond strip in each adjacent pair of bond strips.

Embodiment 75 is a system according to any one of Embodiments 49-74, in which each interconnect strip comprises a first end and a termination end, in which the conductive layer of each interconnect strip is connected to a power management system at the first end, in which the first interconnect strip in each the adjacent pair of connecting strips in turn contains a capacitor connected between the conductive layer and the bulk conductive material at the terminal end, and in which the second connecting strip in each adjacent pair of connecting strips in turn contains an inductor connected between the conductive layer and the bulk conductive material at the terminal end.

Embodiment 76 is the system of Embodiment 75 wherein the power management system is operable to alternately switch between energizing the first bond strip in each adjacent pair of bond strips and energizing the second bond strip in each adjacent pair of bond strips.

Embodiment 77 is a system according to any one of Embodiments 49-76, in which each interconnect strip comprises a first end and a termination end, in which the conductive layer of each interconnect strip is connected to a power management system at the first end, and in which at least one of the connecting strips contains an electrically conductive path to electrical ground at the terminal end.

Embodiment 78 is the system of Embodiment 77 in which the electrical ground comprises a conductive bulk material.

Embodiment 79 is a system according to Embodiment 77, in which the electrical ground comprises a conductive shield layer of at least one connecting strip.

Embodiment 80 is a system according to any one of Embodiments 49-79, in which each interconnect strip comprises a first end and a termination end, in which the conductive layer of each interconnect strip is connected to a power management system at the first end, and in which at least one of the connecting strips contains an open circuit between the conductive layer and electrical ground at the terminal end.

Embodiment 81 is the system of Embodiment 80 in which the electrical ground comprises a conductive bulk material.

Embodiment 82 is a system according to embodiment 80 in which the electrical ground comprises a conductive shield layer of at least one bond strip.

Embodiment 83 is a system according to any one of Embodiments 49-82, in which each interconnect strip comprises a first end and a termination end, in which the conductive layer of each interconnect strip is connected to a power management system at the first end, and in which at least one of the connecting strips contains a circuit element connected between the conductive layer and electrical ground at the terminal end, and the circuit element contains at least one of a capacitor, inductor or resistor.

Embodiment 84 is the system of Embodiment 71 in which the electrical ground comprises a conductive bulk material.

Embodiment 85 is the system of Embodiment 71 in which the electrical ground comprises a conductive shield layer of at least one bond strip.

Embodiment 86 is a system according to any one of Embodiments 49-85, in which each interconnect strip comprises a first end and a termination end, in which the conductive layer of each interconnect strip is connected to a power management system at the first end, in which the first interconnect strip in each adjacent pair of connecting strips in turn contains an open circuit between the conductive layer and electrical ground at the terminal end, and in which the second connecting strip in each adjacent pair of connecting strips in turn contains an electrically conductive path connected between the conductive layer and electrical ground at the terminal end.

Embodiment 87 is a system according to Embodiment 87, wherein the power management system is configured to alternately switch between supplying electric current to a first connecting strip in each adjacent pair of connecting strips and supplying electric current to a second connecting strip in each adjacent pair of connecting strips.

Embodiment 88 is a system according to any one of Embodiments 49-87, in which each interconnect strip comprises a first end and a termination end, in which the conductive layer of each interconnect strip is connected to a power management system at the first end, in which the first interconnect strip in each the adjacent pair of connecting strips in turn contains a capacitor connected between the conductive layer and electrical ground at the terminal end, and in which the second connecting strip in each adjacent pair of connecting strips in turn contains an inductor connected between the conductive layer and electrical ground at the terminal end.

Embodiment 89 is the system of Embodiment 88 in which the electrical ground comprises a conductive bulk material.

Embodiment 90 is the system of Embodiment 88 in which the electrical ground comprises a corresponding conductive shield layer of the first and second bond strips.

Embodiment 91 is the system of Embodiment 88 in which the power management system is configured to alternately switch between supplying electrical current to a first bond strip in each adjacent pair of interconnect strips and supplying electrical current to a second interconnect strip in each adjacent pair of interconnect strips.

Embodiment 92 is a system according to any one of Embodiments 51-53, in which each interconnect strip comprises a first end and a termination end, in which the conductive layer of each interconnect strip is connected to a power management system at the first end, and in which each interconnect strip contains a switch connected at the terminal end between the conductive layer and the bulk conductive material and/or the conductive shield layer, wherein, when in the first state, the switch forms an open circuit between the conductive layer and the bulk conductive material or conductive shield layer, and when in the second state, the switch forms a closed circuit between the conductive layer and electrical ground.

Embodiment 93 is the system of Embodiment 92 in which the electrical ground comprises a conductive bulk material.

Embodiment 94 is the system of Embodiment 92 in which the electrical ground comprises a corresponding conductive shield layer of the first and second bond strips.

Embodiment 95 is a system according to any of embodiments 49-94 in which two or more connecting strips are electrically connected to each other in parallel.

Embodiment 96 is a system according to any of embodiments 49-95 in which two or more connecting strips are electrically connected to each other in a serial manner.

Embodiment 97 is a system according to any one of embodiments 49-96, wherein the structure includes an aircraft skin, a wind turbine blade, a building roof, or railroad tracks.

Embodiment 98 is a method for installing a bulk medium heating system, including the steps of: obtaining bonding strips, each bonding strip comprising a multilayer structure comprising: a first dielectric layer, a conductive layer overlaying a first dielectric layer, a conductive shielding layer overlaying a conductive layer, and a second dielectric layer between the conductive layer and the conductive shielding layer; attaching each of the connecting strips to the surface of the bulk medium at a distance from each other, while the first dielectric layer of each connecting strip is located between the bulk medium and the conductive layer; and connecting the conductive layer of each of the connecting strips to a power management system configured to supply electric current to the connecting strips.

Embodiment 99 is a method according to Embodiment 98, wherein the first dielectric layer comprises a double-sided adhesive, and wherein attaching each of the bonding strips to the surface of the bulk medium includes, for each bonding strip: removing the protective layer from the double-sided adhesive to expose its adhesive surface and attach the adhesive surface to the surface of the bulk medium.

Embodiment 100 is a method according to any one of Embodiments 98 or 99, wherein attaching each of the bond strips to the surface of the bulk medium includes applying an adhesive top layer over the bond strip for each bond strip, the top layer extending across the width of the bond strip. strips so that the lateral edges of the upper layer are in contact with areas of the bulk medium on both sides of the connecting strip and adhere to them.

Embodiment 101 is a method according to any of Embodiments 98-100, wherein attaching each of the bonding strips to the surface of the bulk medium includes, for each bonding strip: applying an adhesive material to the surface of the bulk medium, and attaching the first dielectric layer of the bonding strip to the adhesive material.

Embodiment 102 is a method according to any one of embodiments 98-101, wherein the volumetric medium comprises the skin of an aircraft, a wind turbine blade, a building roof, or railroad tracks.

Embodiment 103 is a bulk medium heating system comprising: two or more electrodes spaced apart and connected to the bulk medium; and a power management system connected to the electrodes, wherein the power management system is configured to heat the bulk medium by generating a current density along the current path between the electrodes, which results in the creation of an effective resistance along the current path in the bulk medium, which is greater than the resistance of the bulk medium to constant current, in which the power management system generates the current density in the depth of the bulk medium by adjusting the depth of the current skin layer, and in which the power management system generates the current density in the direction across the current path by adjusting the current proximity effect.

Embodiment 104 is a system according to embodiment 103, in which the bulk medium is a portion of an aircraft.

Embodiment 105 is a system according to any one of embodiments 103 or 104, wherein the volumetric medium is one or more of an aircraft wing section, an aircraft tail section, or an aircraft fuselage section.

Embodiment 106 is a system according to any one of embodiments 103-105, wherein the two or more electrodes are a first set of two or more electrodes, and wherein the system further comprises a second set of two or more electrodes connected to a different portion of the volume an environment in which the power management system is connected to the second set of two or more electrodes and configured to alternately supply power to the first set of two or more electrodes and the second set of two or more electrodes.

Embodiment 107 is a system according to any one of embodiments 103-106, wherein the bulk medium contains aluminum or carbon fiber, and wherein two or more electrodes contain aluminum, silver, or copper.

Embodiment 108 is a system according to any one of embodiments 103-107 in which two or more electrodes are connected to the bulk medium so as to reduce contact resistance between the electrodes and the bulk medium.

Embodiment 109 is a system according to embodiment 108 in which a conductive material is located between at least one of two or more electrodes and a bulk medium.

Embodiment 110 is a system according to any one of embodiments 103-109 wherein the power management system is configured to adjust the current skin depth by generating current in a bulk medium at an AC frequency above 1 kHz.

Embodiment 111 is a system according to embodiment 110 in which the AC frequency is between 100 kHz and 450 MHz.

Embodiment 112 is a system according to any of embodiments 103-111 in which the proximity effect of the current is controlled by placing a second current path near the surface of the bulk medium and along a section of the current path.

Embodiment 113 is a system according to embodiment 112 in which at least a portion of the second current path is located within 10 cm of the surface of the bulk medium.

Embodiment 114 is a system according to embodiment 112 in which the second current path is a cable that completes a closed circuit including two or more electrodes and a power management system.

Embodiment 115 is a system according to any one of embodiments 103-114, wherein the power management system includes an impedance control circuit configured to adjust the output impedance of the power management system.

Embodiment 116 is a system according to embodiment 115 in which the impedance adjustment circuit is configured to adjust the output impedance of the power management system in accordance with the impedance of the bulk medium.

Embodiment 117 is a system according to any one of embodiments 103-116, wherein the power management system includes a signal conditioning circuit configured to convert power from a power source to AC of a suitable frequency and voltage for use by the power management system.

Embodiment 118 is a system according to any one of embodiments 103-117, wherein the power management system comprises a controller configured to control the operation of the power management system.

Embodiment 119 is a system according to any one of embodiments 103-118 in which the power management system generates a current path between electrodes using the current proximity effect to increase the overall length of the current path between the electrodes.

Embodiment 120 is a system according to any one of embodiments 103-119, wherein the power management system generates a current path between electrodes by placing a second current path near the surface of the bulk medium, and in which the second current path is located in accordance with the required current path. between electrodes.

Implementation variant 121 is a system containing: two or more electrodes located at a distance from each other and connected to a bulk medium; a power management system connected to the electrodes and configured to generate an AC signal along the current path through the bulk medium between the electrodes at a frequency above 1 kHz and below 300 GHz; and a second current path located near the surface of the bulk medium and along the current path through the bulk medium.

Embodiment 122 is an aircraft de-icing and anti-icing system comprising: two or more electrodes spaced apart and connected to a portion of the aircraft; a power management system connected to the electrodes and configured to heat the area of the aircraft by generating a current density along the current path through the area of the aircraft between the electrodes by: generating an AC signal along the current path through the area of the aircraft between the electrodes with a frequency of 1 MHz to 50 MHz, wherein the frequency causes current density to form in the first direction by adjusting the current skin depth along the current path; and providing a second current path located along at least a section of the current path through the aircraft section and within 10 cm from the surface of the aircraft section, wherein the proximity of the second current path to the surface of the aircraft section causes the current density to be generated in a second different direction by adjusting the effect the proximity of the current along the section of the current path.

Claims (63)

1. A system for heating the exterior of an aircraft, comprising: - two or more connecting strips spaced apart and attached to the skin of the aircraft, each of the connecting strips comprising a sandwich structure extending along the surface of the skin of the aircraft, which in combination with the skin of the aircraft forms a power line, and the sandwich structure contains: the first dielectric layer over the skin of the aircraft, a conductive layer on top of the first dielectric layer, a second dielectric layer on top of the conductive layer, and a conductive shielding layer over the second dielectric layer; And - a power management system connected to the conductive layer of each of the connecting strips and to the aircraft skin, the power management system being configured to heat the surface of the aircraft skin by supplying electric current to the connecting strips and thereby generating electric currents in the bulk medium of the aircraft skin . 2. The system of claim. 1, in which the power management system is configured to supply electrical current to the connecting strips with an AC frequency from 1 kHz to 450 MHz. 3. The system of claim. 1, in which the conductive layer is located within 1 inch (2.54 cm) from the skin of the aircraft. 4. The system of claim. 1, in which the conductive layer of at least one of the connecting strips is arranged in a serpentine pattern, in which the segments of the conductive layer are located next to each other. 5. The system of claim 1, wherein the conductive layer is separated from the aircraft skin by a first distance, and the conductive shielding layer is separated from the conductive layer by a second distance, wherein the ratio between the first distance and the second distance is in the range of 5:1 to 1 :5. 6. The system according to claim 1, in which the conductive layer of at least one of the connecting strips has a width across the conductive layer, which varies along the length of the conductive layer, and the width across the conductive layer varies from a maximum width to a minimum width, while the maximum width from 1.5 to 100 times the minimum width. 7. The system of claim. 1, in which the conductive layer of at least one of the connecting strips contains a plurality of segments with one or more circuit elements connected between each pair of segments. 8. The system of claim. 1, in which the skin of the aircraft forms a second shielding layer for the power line formed in combination with each of the connecting strips. 9. The system of claim. 1, in which the first dielectric layer contains an adhesive material. 10. The system according to claim 1, in which the multilayer structure further comprises: a first adhesive layer between the conductive layer and the second dielectric layer and a second adhesive layer between the second dielectric layer and the conductive shielding layer. 11. The system according to claim. 1, in which each connecting strip contains a first end and a terminal end, wherein the conductive layer of each interconnect strip is connected to a power management system at the first end, and at least one of the connecting strips contains an electrically conductive path to electrical ground at the terminal end. 12. The system of claim. 11, in which the electrical ground contains the skin of the aircraft. 13. The system of claim. 11, in which the electrical ground contains a conductive shielding layer of at least one connecting strip. 14. The system according to claim. 1, in which each connecting strip contains a first end and a terminal end, wherein the conductive layer of each interconnect strip is connected to a power management system at the first end, and at least one of the connecting strips contains an open circuit between the conductive layer and electrical ground at the terminal end. 15. The system of claim. 14, in which the electrical ground contains the skin of the aircraft. 16. The system of claim. 14, in which the electrical ground contains a conductive shielding layer of at least one connecting strip. 17. The system according to claim. 1, in which each connecting strip contains a first end and a terminal end, wherein the conductive layer of each interconnect strip is connected to a power management system at the first end, and at least one of the connecting strips contains a circuit element connected between the conductive layer and electrical ground at the terminal end, while the circuit element contains at least one of a capacitor, inductor or resistor. 18. The system of claim. 1, in which each connecting strip contains a first end and a terminal end, and the conductive layer of each connecting strip is connected to a power management system at the first end, wherein the first connecting strip in each adjacent pair of connecting strips in turn contains an open circuit between the conductive layer and electrical ground at the terminal end, and the second connecting strip in each adjacent pair of connecting strips alternately contains an electrically conductive path to electrical ground at the terminal end. 19. The system of claim. 1, in which two or more connecting strips are electrically connected to each other in parallel. 20. The system of claim. 1, in which two or more connecting strips are electrically connected to each other in series. 21. System for heating the outer part of the aircraft, containing: - an aircraft skin made of non-conductive material and containing bulk conductive material embedded therein; two or more connecting strips spaced apart and attached to the skin of the aircraft, each of the connecting strips comprising a sandwich structure extending along the skin of the aircraft which, in combination with a bulk conductive material embedded in the skin of the aircraft, forms power line, and the multilayer structure contains: a conductive layer overlaying the bulk conductive material, and a first dielectric layer between the bulk conductive material and the first conductive layer; And - a power management system connected to the conductive layer of each of the connecting strips and to the skin of the aircraft, and the power management system is configured to heat the surface of the skin of the aircraft by applying electric current to the connecting strips. 22. The system according to claim 21, in which each connecting strip runs along the surface of the skin of the aircraft, wherein the multilayer structure further comprises: a conductive shield layer on top of the conductive layer, a second dielectric layer between the conductive layer and the conductive shield layer, and protective layer on top of the conductive shielding layer. 23. The system according to claim 21, in which the conductive layer is embedded in the skin of the aircraft, moreover, the first section of the skin of the aircraft forms the first dielectric layer, and the multilayer structure additionally contains: a conductive shielding layer embedded in the skin of an aircraft and overlaying the conductive layer, and a second dielectric layer formed by the second section of the skin of the aircraft and located between the conductive layer and the conductive shielding layer. 24. The system of claim 21, wherein the power management system is configured to supply electrical current to the connecting strips at an AC frequency of 1 kHz to 450 MHz. 25. A method for installing an aircraft skin heating system, comprising the steps of: connecting strips are obtained, with each connecting strip containing a multilayer structure containing: the first dielectric layer over the skin of the aircraft, a conductive layer on top of the first dielectric layer, a second dielectric layer on top of the conductive layer and a conductive shielding layer over the second dielectric layer; attaching each of the connecting strips to the aircraft skin surface at a distance from each other, wherein the first dielectric layer of each connecting strip is located between the aircraft skin and the conductive layer; And connecting the conductive layer of each of the connecting strips to a power management system configured to supply electric current to the connecting strips and thereby generate electric currents in the volumetric environment of the skin of the aircraft. 26. The method according to claim 25, in which the first dielectric layer contains a double-sided adhesive, moreover, the attachment of each of the connecting strips to the skin surface of the aircraft includes the steps in which, for each connecting strip: remove the protective layer from the double-sided adhesive to expose its adhesive surface and attaching the adhesive surface to the surface of the skin of the aircraft.