RU2507287C1 - Copper-based alloy - Google Patents
Copper-based alloy Download PDFInfo
- Publication number
- RU2507287C1 RU2507287C1 RU2013117837/02A RU2013117837A RU2507287C1 RU 2507287 C1 RU2507287 C1 RU 2507287C1 RU 2013117837/02 A RU2013117837/02 A RU 2013117837/02A RU 2013117837 A RU2013117837 A RU 2013117837A RU 2507287 C1 RU2507287 C1 RU 2507287C1
- Authority
- RU
- Russia
- Prior art keywords
- copper
- based alloy
- indium
- silver
- gallium
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 16
- 239000010949 copper Substances 0.000 title claims abstract description 16
- 239000000956 alloy Substances 0.000 title claims abstract description 13
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 13
- 229910052738 indium Inorganic materials 0.000 claims abstract description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 8
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052709 silver Inorganic materials 0.000 claims abstract description 8
- 239000004332 silver Substances 0.000 claims abstract description 8
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims abstract description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 7
- 238000005272 metallurgy Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 description 4
- 238000003723 Smelting Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
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- Adornments (AREA)
Abstract
Description
Изобретение относится к области металлургии, а именно к составам сплавов на основе меди, которые могут быть использованы для изготовления монет, бижутерии.The invention relates to the field of metallurgy, and in particular to compositions of copper-based alloys that can be used to make coins, jewelry.
Известен сплав на основе меди, содержащий, мас.%: медь 50,0-85,0; серебро 0,5-15,0; индий 1,0-14,0 [1].Known alloy based on copper, containing, wt.%: Copper 50,0-85,0; silver 0.5-15.0; indium 1.0-14.0 [1].
Задачей изобретения является расширение ассортимента сплавов на основе меди.The objective of the invention is to expand the range of alloys based on copper.
Технический результат достигается тем, что сплав на основе меди, содержащий серебро, индий, дополнительно содержит галлий и олово, причем компоненты находятся при следующем соотношении, мас.%. медь 68,2-70,2; серебро 20,0-25,0; индий 0,3-0,5; галлий 6,0-9,0; олово 0,3-0,5.The technical result is achieved in that the copper-based alloy containing silver, indium, additionally contains gallium and tin, and the components are in the following ratio, wt.%. copper 68.2-70.2; silver 20.0-25.0; indium 0.3-0.5; gallium 6.0-9.0; tin 0.3-0.5.
В таблице приведены составы сплава на основе меди.The table shows the composition of the alloy based on copper.
В составе сплава компоненты проявляют себя следующим образом. Серебро в указанном количестве в сочетании с медью и оловом обеспечивает прочность и пластичность сплава. Индий, галлий препятствуют окислению сплава на воздухе.In the composition of the alloy components manifest themselves as follows. Silver in the specified amount in combination with copper and tin provides strength and ductility of the alloy. Indium and gallium prevent the oxidation of the alloy in air.
Выплавка сплава на основе меди может быть проведена в электропечах.Copper-based alloy smelting can be carried out in electric furnaces.
Источник информацииThe source of information
1. US 3977869 A, 1976.1. US 3977869 A, 1976.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| RU2013117837/02A RU2507287C1 (en) | 2013-04-17 | 2013-04-17 | Copper-based alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| RU2013117837/02A RU2507287C1 (en) | 2013-04-17 | 2013-04-17 | Copper-based alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| RU2507287C1 true RU2507287C1 (en) | 2014-02-20 |
Family
ID=50113292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2013117837/02A RU2507287C1 (en) | 2013-04-17 | 2013-04-17 | Copper-based alloy |
Country Status (1)
| Country | Link |
|---|---|
| RU (1) | RU2507287C1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2587351C1 (en) * | 2015-03-13 | 2016-06-20 | Юлия Алексеевна Щепочкина | Copper-based sintered alloy |
| CN106222478A (en) * | 2016-08-23 | 2016-12-14 | 无锡日月合金材料有限公司 | A kind of ternary-alloy sealing material and preparation method thereof |
| CN106435325A (en) * | 2016-10-10 | 2017-02-22 | 无锡日月合金材料有限公司 | Multielement alloy sealing material and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3977869A (en) * | 1975-08-14 | 1976-08-31 | Eutectic Corporation | Indium-containing, low silver copper-base filler metal |
| JPH0920968A (en) * | 1995-06-30 | 1997-01-21 | Res Inst Electric Magnetic Alloys | Cu-based non-magnetic metallic glass alloy, method for producing the same, and elastic actuator |
| WO2006025347A1 (en) * | 2004-08-31 | 2006-03-09 | National University Corporation Tohoku University | Copper alloy and liquid-crystal display |
| US20070062619A1 (en) * | 2004-03-12 | 2007-03-22 | Yasuhiro Maehara | Copper alloy and process for producing the same |
| RU2446220C1 (en) * | 2011-04-29 | 2012-03-27 | Юлия Алексеевна Щепочкина | Copper-based alloy |
-
2013
- 2013-04-17 RU RU2013117837/02A patent/RU2507287C1/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3977869A (en) * | 1975-08-14 | 1976-08-31 | Eutectic Corporation | Indium-containing, low silver copper-base filler metal |
| JPH0920968A (en) * | 1995-06-30 | 1997-01-21 | Res Inst Electric Magnetic Alloys | Cu-based non-magnetic metallic glass alloy, method for producing the same, and elastic actuator |
| US20070062619A1 (en) * | 2004-03-12 | 2007-03-22 | Yasuhiro Maehara | Copper alloy and process for producing the same |
| WO2006025347A1 (en) * | 2004-08-31 | 2006-03-09 | National University Corporation Tohoku University | Copper alloy and liquid-crystal display |
| RU2446220C1 (en) * | 2011-04-29 | 2012-03-27 | Юлия Алексеевна Щепочкина | Copper-based alloy |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2587351C1 (en) * | 2015-03-13 | 2016-06-20 | Юлия Алексеевна Щепочкина | Copper-based sintered alloy |
| CN106222478A (en) * | 2016-08-23 | 2016-12-14 | 无锡日月合金材料有限公司 | A kind of ternary-alloy sealing material and preparation method thereof |
| CN106222478B (en) * | 2016-08-23 | 2018-02-13 | 无锡日月合金材料有限公司 | A kind of ternary-alloy sealing material and preparation method thereof |
| CN106435325A (en) * | 2016-10-10 | 2017-02-22 | 无锡日月合金材料有限公司 | Multielement alloy sealing material and preparation method thereof |
| CN106435325B (en) * | 2016-10-10 | 2018-06-08 | 无锡日月合金材料有限公司 | A kind of multicomponent alloy seal, sealing materials and preparation method thereof |
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