RU2482547C2 - Display device, particularly transparent multimedia facade - Google Patents

Abstract

FIELD: physics.

SUBSTANCE: media facade, having a plurality of transparent modular elements, the transparent elements having at least one transparent substrate and one or more light-emitting means mounted on the transparent substrate, the modular elements forming a media facade display field larger than 50 m², particularly larger than 100 m², particularly larger than 1000 m², particularly larger than 3000 m², particularly larger than 5000 m²; separate modules are connected to each other by T-junctions, and the intermediate space formed between separate modules is filled by a T-junction which goes in between modules and is adjacent to cover plates of the modules.

EFFECT: design of a media facade having a plurality of transparent modular elements.

24 cl, 20 dwg

Description

The invention relates to a display device, in particular to a display device with a large display field, in particular to a transparent media facade.

The prior art indicator devices with a large display field, for example, in the form of video displays with a large display field for sports programs in the open air or in the form of media facades consisting of plates. Individual plates are equipped with light emitting means, for example LEDs. The plates are mounted in lattices or nets. Network structures are very catchy due to the thickness of individual plates up to 20 mm or more. Network structures i.e. plates can also be mounted in front of the building facades. Light emitting means, preferably LEDs, are integrated into the plates. With the help of media facades, for example, multi-color illumination of a large area of facades is possible. So, for example, on indicator devices with a large display field, i.e. on media facades, events or live graphics can be played back in color. Using indicator devices on facades, video images, for example, mobile television images, can also be made to move close-ups. The disadvantage of indicator devices, in particular media facades, according to the prior art, was that they were barely transparent or had an expensive structure, and that in front of the building facades a large number of plates had to be mounted openly. Then, individual LEDs were mounted on the plates. The plates themselves were very afraid of the weather, in particular extreme weather events, such as wind, and their installation was not cheap.

Thus, the objective of the invention is to create an indicator with a large display field, in particular a media facade, devoid of the disadvantages of the prior art, in particular its costly design.

This task according to the invention is solved in that the indicator device with a large display field, in particular the media facade, contains an element containing at least partially transparent and / or quasi-transparent element, and the transparent and / or quasi-transparent element contains at least one transparent and / or a quasi-transparent substrate, and light emitting means are mounted on a part of the transparent and / or quasi-transparent substrate.

The installation of light-emitting means on a transparent substrate is carried out, for example, as described in EP-A-1450416. A transparent and / or quasi-transparent substrate in the visible range of light is transparent and / or quasi-transparent and, in particular, is arbitrarily structured. The light emitting means according to the invention is applied directly to the surface of the transparent substrate.

Transparent substrates are understood, in particular, as substrates, such as, for example, glass with a transmission of ≥80, particularly preferably ≥90% in the visible wavelength range with perpendicular incidence of light. The visible wavelength range is 380-780, preferably 420-780 nm.

By quasi-transparent, we mean substrates with transmission in the range of 40-80% of the visible wavelength range with perpendicular light incidence.

As materials for a transparent and / or quasi-transparent substrate, all inorganic glasses, in particular silicate glasses, preferably soda-lime glasses, as well as borosilicate glasses, in particular also refractory glasses, are used. Other materials for transparent and / or quasi-transparent substrates can also be plastics, transparent and / or quasi-transparent in the visible wavelength range, in particular as transparent as glass, i.e. transparent, plastics, such as polymethyl methacrylates, acrylic glass or polycarbonates.

Due to the design of the indicator device with a large display field according to the invention, containing at least partially transparent and / or quasi-transparent optical element with at least one transparent and / or quasi-transparent substrate, it is possible to create, for example, a transparent and / or quasi-transparent media facade, which still allows An overview of the building or from the building in front of which the media facade is located, but at the same time dispenses with an expensive plate structure.

The media facade can be designed so that it itself becomes part of a transparent and / or quasi-transparent facade element and / or, in particular, is mounted, for example, suspended, as a transparent and / or quasi-transparent media facade in front of existing facades. Light emitting means preferably consist of organic or inorganic LEDs. If you want to use the media facade, for example, for receiving television images, then in the first embodiment of the invention, as a lighting tool, it is preferable to use a device with inorganic LEDs that reproduce all three primary colors of a video element (red, green, blue) in one single case. These LEDs are called RGB LEDs. Transparent display devices with a large display field, in particular media facades with the so-called RGB LEDs, are ideally suited for the appropriate control of individual LEDs for media projection, such as television images. In the so-called RGB LEDs, in one single LED chip, all the basic colors of the television image (red, green, blue) are realized.

An alternative embodiment of the invention is in close proximity to each other of three LEDs. One of the LEDs emits red, the other green, and the third blue. The distances between the three LEDs are in the range of 5 mm. An observer located at a distance of more than 1 m from the indicator device perceives this as a mixed luminous point.

It is particularly preferred that the light emitting means, i.e. individual LEDs, for an observer who is far away at a great distance from the indicator device, were supplied with current and controlled discreetly, in particular, imperceptibly. Suitable for this are, for example, transparent conductive paths, known for example from EP-A 1450416, as well as from WO 2006/018066.

The contents of both publications WO 2006/018066 and EP-A 1450416 are fully included in this application. The conductive paths serve both for power supply and for controlling individual RGB LEDs. With such a device, the control bus and the conductor for at least one pole are one and the same. In this case, the other pole of the LED is connected to the busbar.

It is particularly preferred that the transparent conductive paths consist of a transparent conductive layer for transmitting energy. Due to this, more currents can be transmitted along these conductive paths, so that even several light-emitting means can be fed along one conductive path. However, it is preferable that the installation with conductive tracks be arranged so that each individual LED can be individually controlled to obtain the corresponding images.

Along with transparent conductive tracks with a transmission of ≥40, in particular ≥60%, in the visible wavelength range, conductive tracks with low transparency can also be used, i.e. with a transmission of less than 40%, in particular ≥60%, if the conductive paths are made, respectively, narrow, i.e. small width. Such conductive paths are, for example, conductive paths based on silver conductive paste.

The transparent and / or quasi-transparent element contains, in particular, at least one transparent and / or quasi-transparent substrate with light emitting means mounted on it, and the transparent and / or quasi-transparent substrate is made in the form of a plate. The transparent and / or quasi-transparent substrate, as mentioned above, may consist of plastic or glass, or crystalline, or partially crystalline, or ceramic, or partially ceramic material, in particular, glass ceramics. For example, it would be possible, as a plastic substrate, acrylic glass or soda-lime glass, or gray glass, or iron-depleted glass with an iron content of preferably less than 0.05 weight%, preferably less than 0.03 weight% as glass substrate.

The transparent and / or quasi-transparent element, preferably, may contain a cover plate, and in this case it is made, in particular, in the form of a composite element. In the general case, a cover plate is mounted above a transparent and / or quasi-transparent substrate with light emitting means.

The transparent and / or quasi-transparent element may contain a layer of injection resin, which allows you to either fix the transparent and / or quasi-transparent substrate with light-emitting means on the facade directly, or connect it to the cover plate, forming a laminated glass plate. An alternative to bonding with an injection resin may also be bonding with an adhesive film. For this, films of PVB (polyvinyl butyral), TPU (thermoplastic polyurethane), PET (polyethylene terephthalate), EVA (ethylene vinyl acetate) are preferably used. A film laminated to a laminated glass plate between a transparent and / or translucent substrate with light emitting means and a cover plate may be a special film, for example, a liquid crystal coated film. Such a film with a liquid crystal coating by applying voltage makes it possible to switch the film from an opaque or low transparent state to a transparent state. In this case, a phase transition of liquid crystals from an initially completely disordered structure, which causes the film to become cloudy upon light transmission, into an ordered phase that transmits visible radiation. In this case, the film appears transparent and ceases to be milky. Switchable film can cover the entire surface of the element or only part of it.

As an alternative or addition to a film containing liquid crystals, a film containing scattering centers can also be used as a film. A film containing scattering centers has become known, for example, from DE-U-2000 09099 or DE-U-2000 12471. Films containing scattering centers, for example, a scattering layer, are suitable for visualizing projected light images in a portion of a scattering film.

To enhance the contrast between the scattering film and one of the two laminated glass plates, a gray film can be inserted as a means of enhancing the contrast.

If the scattering film, as described above, is made in the form of a liquid crystal film, then the projection plane is formed due to the scattering milky-hazy state of the switched liquid crystal film. Then such a projection plane, if the projection is no longer reproduced, could again switch to a transparent state.

The projection plane, along with a large display field using light emitting means in the form of LEDs, allows the projection of images and, in particular, logos on reflection and light.

If the transparent and / or quasi-transparent element as an element of laminated glass is made of at least two plates, then the light-emitting means can be laminated into a transparent film, for example, a film of PVB, TPU or PET, which does not perform any optical function. There is a reference to WO 2004/106056 in this regard. The contents of this publication are included in full.

A transparent film equipped with light emitting means, for example LEDs, which is transparent and conductive, is distributed, for example, by SUN-TEC Swiss United Technologies GmbH & Co. Rebenweg 20, 6331 Hünenberg, Schweiz. Such films equipped with LEDs are transparent and conductive. Films equipped with LEDs can be poured into a laminated glass element by injection molding. It is also possible to laminate with an adhesive film, for example PVB, TPU or EVA film.

The cover plate may be inorganic glass, in particular silicate glass, preferably soda-lime glass, and also borosilicate glass, in particular also refractory glass. Other glasses are also possible as cover plates.

In a particular embodiment, amorphous silicon, for example, in the form of strips, could be deposited on a transparent substrate along with LEDs. Then, together with the cover plate, a photovoltaic module is formed using thin-film technology, which is transparent from the outside. Thin-film photovoltaic modules are, for example, glass ASI modules from SCHOTT Solar GmbH, Carl-Zeiss-Straße 4, 63755 Alzenau. The energy of the sun absorbed by such a module can be stored and consumed to power the LEDs at a later point in time. For thin-film technology in solar energy applications, in particular with respect to photovoltaic modules, reference is made to EP 0500451. According to EP 0500451, the light-permeable thin-film photovoltaic element has a transparent substrate on which a sequence of thin layers is deposited, containing a transparent metal layer, a photoelectric semiconductor conversion layer and an additional layer of metal to obtain a photocurrent.

Alternatively, the cover plate may be connected to a transparent and / or quasi-transparent substrate such that an intermediate space is formed between the cover plate and the transparent or quasi-transparent substrate, used for example for an insulating glass composite. In the case of a composite of insulating glass, it would be possible, in particular, to provide heat-insulating and sun-protection layers. For an indicator device, in particular a media facade, a particular advantage is that the conductive paths for powering the light emitting means are divided into several electrical circuits, namely, in such a way that the individual light emitting means are individually controlled. Thus, on an indicator device with a large display field, in particular on a media facade, video images can be reproduced. In this application, it is particularly preferred that the individual RGB LEDs are mounted on a transparent substrate in the form of a matrix.

If the transparent substrate is separated from the cover plate by an intermediate space, the intermediate space can also be filled with a medium, for example a cooling medium.

If an insulating glass composite is formed, then a translucent thin-film solar module can be used instead of a cover plate. For solar modules, reference is made to EP 0500451 A.

To prevent the emission of LEDs in the direction of the building’s interior, in front of which the media facade is installed, they can be shielded from the interior. In particular, in this way, backward radiation of light-emitting means, i.e. LEDs towards the building. An alternative to shielding an LED emitting in all directions is the use of single-sided emitting diodes.

Shielding would be possible due to the very close placement of the pads on a transparent substrate, receiving LEDs. Alternatively, the transparent substrate could be sandblasted or have a mirror effect in the area where the LEDs are installed. In addition, radiation into the interior can be prevented by using mirror elements opposite the LEDs.

In the manufacture of conductive paths, in particular also transparent conductive paths, metal oxides such as ITO (InO _x : Sn), FTO (SnO _x : F) or ATO (SnO _x : Sb) are used in a preferred embodiment. However, ZnO _x : Ga, ZnO _x : F, ZnO _x : B, ZnO _x : Al or Ag / TiO _{x are} also possible. FTO (SnO _x : F), in particular (SnO ₂ : F), is particularly preferred since this material can be used as a heat-insulating layer in an insulating glass composite. The use of (SnO ₂ : F) as a thermal insulation layer is described in the publication “Dünnfilmtechnologie auf Flachglas” (Thin-film technology on sheet glass) von Hans Joachim Glasses, S. 155-S. 199, Verlag Karl Hofmann, 1999, the contents of which are fully incorporated in the application.

The application of the conductive layer on a transparent substrate is preferably carried out by chemical vapor deposition of the films (CVD) or physical vapor deposition of the films (PVD), by dipping, spraying, chemical or electrochemical coating, by coating with a sol gel.

Spray pyrolysis, ion sputtering, and also a sol-gel coating method can be mentioned as an example only. Coating by spray pyrolysis is particularly economical, with SnO ₂ : F or SnO _x : F, or ZnO _x : F being preferably used as the coating material. If you want to achieve particularly good optical properties, the preferred deposition method is ion sputtering.

As an alternative to this, it is also possible that the conductive layer consisted of a metal deposited by evaporation or ion sputtering, such as Al, Ag, Au, Ni or Cr, which, as a rule, are quasi-transparent. Metal coatings are preferably used at high ambient temperatures.

Conductive tracks can also be applied by screen printing of elements of reduced size, for example, by applying silver to a transparent and / or quasi-transparent substrate.

By transparent conductive layers in the present invention is meant layers with a transmission of ≥40, preferably ≥60, in particular> 70, particularly preferably 80%, in the visible wavelength range.

To obtain systems with low reflection in one of the improved variants of the invention, it is provided that a special reflective layer, for example, of TiO ₂ , SiO ₂ , or a mixed layer of Ti _x Si _1-x O _{2, is} applied to the conductive layer.

The transparent element to provide unobstructed visibility through the transparent element, preferably, may contain an enlightened layer. Such a coating for highly enlightened glass is, for example, AMIRAN ^R glass manufactured by Schott AG, Mainz. AMIRAN ^R , highly coated, for example, is glass, interference-optically coated on both sides by immersion, with a residual reflection of only 1 percent. With the glass, highly enlightened, the reflection can be reduced to about 1/8, and thus the exceptional transparency of the element can be achieved.

With the help of such glasses, unwanted mirror effects can be almost completely eliminated.

The conductive layer of metal oxide or metal may have either a matrix shape or any structure. This ensures that complex structures are applied to the transparent substrate. This, in turn, allows the application of a fully electronic circuit to a transparent substrate. Structuring of the conductive layer after its application can be carried out by deliberate interruption of the layer, for example, using a laser that performs local heating of the coating and its evaporation. When using a laser to form structures in a conductive layer deposited on the entire surface, it is preferable that the layer in the wavelength range of the laser used has a particularly high absorption, and the substrate transmits a wave of this length. In such a system, almost all the energy enters the conductive layer, and the glass surface detects only minor damage. In particular, in such a system, cracking in the glass surface can be avoided.

As an alternative to this, it is possible to structure a layer deposited on the entire surface using lithography and subsequent etching processes.

However, structuring is also possible if, even when applying the coating, for example during thermal vacuum spraying using the masking method, conductive paths are applied with a given structure.

Structures of conductive paths of layers of silver, for example of silver conductive paste, are also possible. The conductive tracks of silver conductive varnish do not have to be transparent themselves, but they are designed in such a way that they do not catch the eye of an observer at a distance. This effect can be achieved if separate conductive paths are performed, respectively, narrow with a small width.

Particularly preferably, if the conductive paths consist, in particular, of conductive layers that can be structured by using a laser, of so-called highly conductive layers, in particular of metal oxide, in particular of SnO _x : F, preferably SnO ₂ : F. High conductivity layers, in particular those containing SnO _x : F, have a layer resistance (surface resistance), preferably ≤15 Ω / square, in particular ≤10 Ω / square, particularly preferably ≤8 Ω / square, in particular, preferably 7 7 Ω / square, in particular, preferably 5 5 Ω / square (Ω / □), with a layer thickness of about 500 nm.

Common for transparent substrates coated with SnO _x : F, preferably SnO ₂ : F, with a thickness of the order of 500 nm, layer resistances of more than 15 Ohm / square (Ω / □) were used.

The thicknesses of these highly conductive layers are preferably more than 150 nm, preferably more than 180 nm, in particular, preferably more than 280 nm, in particular, preferably more than 420 nm, in particular, preferably more than 500 nm, in particular preferably greater than 550 nm. Transparency, i.e. the transmission of such layers at a wavelength of 550 nm is more than 82%, in particular more than 87%, in particular more than 89%.

To connect LEDs or other electrical components on load-bearing substrates, pads can be applied to a conductive layer or to a conductive path of a highly conductive material in a preferred embodiment of the invention. These pads contain a conductive paste or varnish, for example, silver varnish or silver conductive paste. The application of individual contact pads can be carried out using screen printing and subsequent firing, and this method in the case of using glasses as transparent substrates can simultaneously be used for prestressing the glasses. An advantage of the elements made in this way is that particularly hard glasses can be obtained without the subsequent additional processing step. Another advantage is that by applying the pads on a transparent substrate, soldering is possible for the first time. Alternatively, bonding can also be carried out by brazing. However, unlike adhesive joints, soldered joints are stronger, longer-lasting and insensitive to external influences, such as air humidity, heat, chemicals, etc.

According to a preferred embodiment of the invention, the installation of light-emitting means, in particular LEDs, is carried out on a transparent or quasi-transparent substrate not directly, for example by gluing, but indirectly. In the indirect installation of light emitting means, first, as described above, the joint is applied, i.e. contact pad. Then a light emitting agent is soldered to it, i.e. Light-emitting diode.

If all almost invisible conductive paths are made, for example, not of a transparent material with high conductivity, but of a thin layer of silver conductive varnish, then silver conductive varnish, as connecting contact pads, can be applied by screen printing or by dosing. In the dosing method, silver conductive paste is applied using a dispenser. Silver conductive tracks can also be applied to a transparent substrate by an inkjet method, for example, using inkjet printing.

Another possibility would be to apply thin wires, preferably metal wires.

To connect components or light-emitting means, respectively, LEDs to the conductive layer of the carrier substrate through the contact pads, the carrier can be equipped with LEDs using standard methods known in the electronics industry, for example, by screen printing on separate contact pads or on connecting contact pads solder paste is applied. Following this, LEDs are installed on the circuit board. For this, a mounting installation for chips can be used, fixing individual light-emitting means on a substrate before the soldering process. After fixing the individual light emitting means, the carrier substrate is sent to the fusion furnace. As an alternative to this, the LEDs installed with the mounting unit for the chips are passed through a soldering wave bath. The soldering process and indirect application have the advantage of simple organization of the process, in particular, the supporting substrate after application of the LEDs can be washed.

However, using screen or template printing, a conductive adhesive can be applied to the carrier substrate so that light emitting means and electrical components, respectively, can be directly mounted on the carrier substrate. Can be used both isotropically and anisotropically conductive adhesive. With a very small distance between the conductive paths, anisotropic adhesive is preferred. The disadvantage of direct application with an adhesive is the time-consuming treatment, which, as a rule, involves cleanliness of the room.

A particular advantage of the present invention is free structurability. It contributes to the fact that not only light-emitting means, for example LEDs, as in the prior art, but also other electrical or electronic components can be applied to the carrier substrate. This refers to all known electrical and electronic components, such as sensors, discrete semiconductors, passive and active components, resistances, capacitors, coils, speakers, interactive components, such as keyboards, etc. Interactive components provide, for example, an indication and recall of customer information, as well as reproduction of acoustic information by speakers in addition to reproducing video information. In addition, it is possible that in the subregions the liquid crystal film was controlled using a conductive layer. If not the entire area with a conductive coating is equipped with LEDs, then with the LEDs all the control electronics or part of the control electronics can be applied to the substrate. This is an advantage if indicator devices are used as video devices with a large display field. Video display devices with a large display field, which can be created according to the invention, contain more than 1000, in particular more than 5000, preferably more than 10000 individual light emitting means, particularly preferably more than 100,000 light emitting means, in particular, preferably more than 250,000 light emitting means, particularly preferably, more than a million individual light emitting agents.

Indicator devices with a large display field, in particular transparent media facades with the number of LEDs indicated above, are preferably distributed in such a way that, for example, more than 80, in particular more than 100, preferably more than 200, preferably more than 500, particularly preferably , more than 750, particularly preferably, more than 1000 or more individual LEDs relate to control electronics, the control electronics being preferably mounted on a transparent substrate. This, in particular, is possible in the case when not the entire substrate is equipped with light-emitting means. For example, a substrate at the edge of an optical element cannot be used. In this case, control electronics can be installed on the edge of the optical element.

In this case, individual current leads of the LEDs can be transferred from the optical element to the edge. Then the current leads of individual LEDs at the edge can be connected to a busbar running along the edge and supplying current to individual LEDs. Then from the edge from the transparent substrate will be displayed only a few cables.

The display fields of the large screens according to the invention comprise more than 10 m ² , in particular more than 50 m ² , particularly preferably more than 100 m ² , in particular preferably more than 1000 m ² , particularly preferably more than 3000 m ² , in particular, preferably , more than 5000 m ² . By media facades area of 4000 m ² distributed about 400,000 LEDs. Since transparent substrates of this size are not produced, media facades of such a large format are formed from separate transparent modular elements assembled together containing the corresponding transparent substrate according to the invention. The modular device of transparent elements makes it possible to create an indication field of any size.

The advantage of electronics, i.e. control buses mounted on a transparent substrate, in particular when using chips of RGB LEDs to reproduce the image, is the simplicity of the wiring diagram compared to the current level of technology. Individual LEDs are preferably mounted on a substrate not directly, for example by gluing, but indirectly. For this, the substrate is provided with so-called connecting contact pads containing a conductive paste or varnish, for example a silver conductive varnish or silver paste. In this case, separate or several light-emitting means, for example, LEDs, are installed on the connecting pads by soldering.

In a particularly preferred embodiment, not only separate electrical or electronic components, such as coils or capacitors, are installed on the carrier substrate, but additional printed circuit boards or hybrid circuits with independent integrated circuits, which may include, for example, a current source or current control. In addition, active mounting elements, such as speakers, for example, can also be mounted on a carrier substrate.

This, in particular, is significant if RGB LEDs are used.

When arranging a transparent element for a media facade, in a preferred embodiment, it is provided that the light emitting means are protected by a second transparent substrate. In this case, the LEDs are located between the transparent carrier substrate and another transparent substrate. Thus, light sources can be further protected from external influences such as humidity and mechanical shear.

In a particularly preferred embodiment, it is provided that the other transparent substrate is also provided with a conductive transparent layer.

The transparent substrate can be either glass or plastic. It is particularly preferred that the glass substrate be tempered and prestressed. Especially preferred glasses are soda-lime glass.

In a particularly preferred embodiment, it is provided that several carrier substrates with light-emitting means, for example with LEDs, are connected and in contact with each other.

It is particularly preferred that the transparent element for media facades according to the invention is used in a glass composite, for example in an insulating composite of glass. Insulating glass composite is also called double glazing unit (DGB). By a double glazing unit or an insulating element of glass is meant a glass element, especially a glass element for use in the field of architecture, consisting of two glass elements spaced apart from each other. At least one of these glass elements contains a transparent element having one or more light emitting means. The intermediate space between at least two spaced apart glass elements forming a double glazing unit (DGB) may be filled with medium. The medium may be filled with gaseous or liquid and serve, for example, for cooling purposes.

One element that contains a transparent element with one or more light emitting means may be either glass from a single wafer, safety glass from a single wafer, or partially prestressed glass from a single wafer. In addition, it is possible for the transparent element, as described above, to be part of laminated glass, for example safety laminated glass, which may contain both safety glass from a single wafer and partially prestressed glass. In the case of laminated glass, it is possible that the LEDs are mounted on a conductive coating applied, for example to one glass of laminated glass, either directly or in a film located between both glasses. In addition, the first element may be a special glass, such as glass with a high degree of enlightenment, heat-insulating, sun-protection or fire-resistant glass. In addition, the first element may be transparent concrete or glass ceramics.

The second element of the insulating composite glass, installed at a distance relative to the first element, in turn, can be either glass from one wafer, safety glass from one wafer, partially prestressed glass from one wafer, laminated safety glass, laminated safety glass containing safety glass from a single plate, and laminated safety glass containing partially prestressed glass, or special glass, such as glass with a high degree of clearance laziness, decorative glass, colored glass, glass with a color effect with an interference-optical coating, heat-insulating or sun-protection glass. In addition, the second insulating glass composite element may be refractory glass or even transparent concrete.

The gap between the two elements, in particular in the glass insulating element, is provided by a spacer element, for example a metal spacer, as well as by sealing between both elements forming an insulating composite of glass. The gap A between the two opposite surfaces of the insulating glass composite is 5-50 mm, preferably 10-30 mm. In addition to the spacer, its sealants relative to the plate elements are provided with sealants, preferably made of butyl rubber.

Under plate in this application refers to both flat and bent plate elements. In the plate element according to the invention, the length of the surface formed by the plate is 10 times the thickness of the plate.

As described above, the second element, not containing LEDs, can take many forms. For example, in the first embodiment of the second element, glass with a high degree of transparency could be used, for example, AMIRAN ^R glass manufactured by Schott AG, with a high degree of transparency, which reduces reflection compared to unlighted glasses to one-eighth. Glasses with a color effect could be used in the same way, for example, NARIMA ^R glass manufactured by Schott AG with a coating and with a color effect based on the interference-optical effect. In addition, the second optical element could contain colored flat glasses, for example, IMERA ^R glass manufactured by Schott AG with a structureless surface or colored flat glass with a one-sided structured surface, such as ARTISTA ^R glass manufactured by Schott AG. It goes without saying that in an insulating composite of glass, glass that is transparent in the visible range but has a structured surface, such as a print treated surface or a sandblasted surface, could also be used as a second optical element. It goes without saying that the opposite glass should not be structured, brightened or made like glass with a color effect or decorative glass over the entire area of the transparent optical element with light-emitting means, on the contrary, in this way only separate sections of the glass opposite the element with LEDs can be made.

Below the invention is explained in more detail on the basis of the drawings, not limited to this.

FIG. 1 shows a fragment of a transparent substrate for a transparent element of a media facade with light emitting means mounted on a transparent substrate;

FIG. 2a-2d illustrate a typical process for manufacturing a transparent substrate with laser-patterned light emitting means;

FIG. 3 is a fragment of a transparent substrate for a transparent facade element;

FIG. 4a is a first embodiment of a transparent facade element with several transparent substrates with LEDs installed in series;

FIG. 4b is a second embodiment of a transparent facade element with several transparent substrates with LEDs installed in series;

FIG. 4c is a third embodiment with several sequentially mounted transparent substrates with LEDs;

FIG. 5a-5f are various glass blocks, in particular insulating glass blocks with at least one transparent element and / or a quasi-transparent element receiving light-emitting means, and with an additional optical element;

FIG. 6 - multimedia facade;

FIG. 7a-7b are a cross-section and a top view of a first embodiment of two facade elements connected to each other;

FIG. 7c is a section and a plan view of a second embodiment of two facade elements connected to each other;

FIG. 8 is an example of fixing a transparent element to a facade.

In FIG. 1 shows a transparent or quasi-transparent substrate that acts as a carrier substrate for the LEDs of a transparent element, for example, a media facade, with a conductive layer deposited, which, in turn, is structured so that conductive tracks 3 are applied to the transparent carrier substrate 1. On the conductive path 3, separate pads 9 are installed, one of which is shown here. The pads 9 are used for conductive connection of individual light emitting means, for example LEDs, in particular RGB LEDs (not shown), with a conductive track 3 to provide power for them. An ITO or FTO conductive path (SnO _x : F) has a width b of the order of several mm. As a carrier substrate, preferably, soda-lime glass is provided.

In FIG. 2a-2d show, according to the invention, a process for manufacturing a transparent substrate for installing light-emitting means for a transparent element of a multimedia facade. First, for example, the sol-gel method covers the entire surface of the carrier substrate 1 by a method of conducting layer.

Then according to FIG. 2b, for example, by means of a laser locally heating and evaporating the coating, it is structured. In this way, both large conductive sections and individual conductive paths can be obtained. The carrier substrates that are structured by means of a laser preferably comprise a conductive layer which has a large absorption in the wavelength range of the laser used, and a substrate which is transmissive at this wavelength. With such a system, the glass layer has only minor damage. In particular, cracking in such systems can be broadly prevented. Particularly preferably, in the case of the conductive layer, it is a metal oxide layer with a high conductivity, as described above. The materials for this highly conductive layer can be one or more of the following metal oxides:

- InO _x : Sn

- SnO _x : F

- SnO _x : Sb

- ZnO _x : Ga

- ZnO _x : B

- ZnO _x : F

- ZnO _x : Al

- Ag / NiO _x

A coating with high conductivity with a layer thickness of about 500 nm preferably has a layer resistance of R _□ ≤15 Ω / square, in particular ≤10 Ω / square, in particular ≤9 Ω / square, in particular ≤7 Ω / square in particular, ≤5 ohm / square (Ω / □).

The thicknesses of the highly conductive layers are preferably more than 150 nm, preferably more than 180 nm, in particular preferably more than 280 nm, particularly preferably more than 420 nm, in particular preferably more than 500 nm, particularly preferably more than 550 nm . The transparency of such layers at a wavelength of 550 nm is more than 82%, in particular more than 87%, particularly preferably more than 89%. The preferred way the layers with high conductivity are layers of SnO _x : F, SnO _x : Sb, ZnO _x : F. The advantage of SnO _x : F, in particular of the SnO ₂ layer, is that it acts not only as a conductive, but also as a heat-insulating layer.

Dividing lines between individual portions of the substrate in FIG. 2b are indicated by 11.1-11.3. Then to the structuring according to FIG. 2b, in sections 13.1-13.4, separate contact pads are applied, the so-called connecting contact pads 9. The connecting contact pads 9 contain a conductive paste or varnish, for example a conductive silver varnish or silver paste, which are printed on a conductive substrate by screen printing and then fired. During firing, prestressing of the transparent substrate, in particular the transparent glass substrate, can be carried out simultaneously. Thus, in one technological operation, high mechanical strength is achieved. Alternatively, screen or template printing, the solder may be dosed.

After the contacts are applied to the various sections 13.1-13.4, they, as shown in FIG. 2d, are completed in a standard way, for which solder paste is applied to the connecting contact pads 9, for example, using template screen printing. Then the LEDs (LEDs) are mounted on the circuit board, and a mounting installation for Chip-Bonder chips can be used, fixing the LEDs 4 before the soldering process. After fixing individual LEDs (LEDs), the carrier substrate 1 with the LEDs mounted on it is passed through a melting furnace or through a soldering wave bath.

In an embodiment of the invention, the glass substrate — typically of soda-lime glass — is coated with a layer of tin oxide (SnO _x : F) doped with fluorine. The coating is as follows.

Soda-lime glass as a transparent glass is heated to 500 ° C. Then the glass is sprayed with monobutyltin chloride and hydrofluoric acid in ethanol, and the sprayed solution has the following composition:

- monobutyltin chloride 70%;

- ethanol <30%;

- hydrofluoric acid 0.4%.

After spraying, the soda-lime glass contains a transparent layer of tin oxide doped with fluorine.

The coating is divided by laser into separate sections or conductive paths. Using a squeegee, a silver conductive paste is applied by screen printing, for example Cerdec SP 1248. Cerdec SP 1248 paste is dried in a conveyor oven at 140 ° C for 2 minutes, and then, using a pre-tensioner at approximately 700 ° C, it is calcined sodium glass and is subjected to prestressing. After that, using standard printing, a standard solder paste is applied and a complete set of LEDs is carried out. During the subsequent reflow soldering, the completed substrate is preheated for 2 minutes to 120 ° C, and then heated for 5 seconds to 235 ° C. Following this, gradual cooling is carried out.

Preferably, RGB LEDs are used as LEDs. In the case of RGB LEDs, we are talking about LEDs that reproduce all three primary colors of a video element, namely red, green and blue, in one single housing. Using such LEDs, it is very easy to reproduce moving images, such as television images on a multimedia facade. For this, individual RGB LEDs for computer reproduction, such as moving television images in a media facade, are preferably individually controlled.

The configuration with RGB LEDs on a transparent element mounted as a carrier substrate is preferably the correct configuration of the raster elements.

The media façade, of course, can also be equipped with simple LEDs, which in this case can reproduce, for example, moving or changing images for reproducing light configurations.

In FIG. 3 shows an embodiment of the invention in which a transparent element comprising a carrier substrate 1 is structured into three different regions 13.1, 13.2, 13.3, 13.4. In this case, the sections can be considered as conductive paths, and LEDs 4 are installed on or adjacent to the conductive paths using the method described with reference to FIG. 2a-2d. Along with the LEDs 4, made preferably in the form of an RGB LED chip, the carrier substrate also contains other electronic components, for example, computer chips 23, providing individual control of the RGB LED chips 4.

As an alternative to connecting the individual light-emitting means with the conductive tracks of a conductive transparent substrate made on a holohedral surface by structuring using alternative technology, for example, screen printing or inkjet, it would be possible to apply separate conductive tracks as finely as possible. The conductive paths applied by screen printing or inkjet method could, for example, be thin silver conductive paths made so thin that they would not catch the eye of an observer at a distance. In the same way, individual LEDs or LED chips could be connected using thin wires.

In FIG. 4a shows an alternative embodiment of the invention. In this embodiment, instead of LEDs mounted on a single supporting substrate element and made as so-called RGB LEDs, several transparent substrates are mounted in series, forming a transparent element for the media facade, and different substrates are equipped with LEDs emitting different light. In the embodiment of FIG. 4a, a transparent element 200, which can be used as a facade element, contains a total of four substrates, here there are four transparent plates 202.1, 202.2, 202.3 and 202.4 installed in series. In the case of transparent substrates 202.1, 202.2, 202.3, we are talking about substrates provided with a conductive coating 204.1, 204.2, 204.3. In a conductive coating, for example, using laser patterning, for the corresponding light emitting means, here the LEDs 208.1, 208.2, 208.3, 208.4, 208.5, 208.6, conductive tracks are made. The transparent plate 202.4 is the cover plate of the element 200. The element 200 is fastened, for example, using brackets 206.1, 206.2. It would even be possible to join the individual plates together in the form of a laminated glass plate, for example, using injection resin or adhesive tape. The LEDs 208.1, 208.2, 208.3, 208.4, 208.5, 208.6 are mounted on different transparent substrates 202.1, 202.2, 202.3, 202.4 with an offset relative to each other, but all with the radiating side in the same direction, so that in the 210 direction the radiation is greater than in the 212 direction Direction 210 is the preferred radiation direction. If a laminated glass plate is made with a film, then the LEDs can be not only mounted on the substrate, but also mounted in the film.

LEDs of different substrates can emit light with different wavelengths, so that color images are possible, as, for example, in the case of chips with RGB LEDs. The LEDs 208.1 may be red light emitting diodes, the LEDs 208.2 may be green light emitting diodes, and the LEDs 208.3 may be blue light emitting diodes. The LEDs can also be individually controlled if, for example, the conductive paths are connected from the element 200 to the individual LEDs separately. Thus, moving or changing images for a media facade can, as shown in FIG. 4a, play even with one device.

In FIG. 4b shows an alternative embodiment of an element in which several transparent substrates with LEDs are mounted in series.

In the embodiment of FIG. 4b, a transparent element 300 used as a facade element has a total of two substrates, transparent plates 302.1, 302.2, mounted in series.

As in FIG. 4a, both plates 302.1, 302.2 are connected to each other, for example, by means of brackets and, as is customary for laminated glass plates, with sealing elements. In contrast to the embodiment of FIG. 4a in the embodiment of FIG. 4b, it is provided that on both plates 302.1, 302.2 on their inner side, i.e. from the side opposite the intermediate space formed by the spaced plates, conductive coatings 304.1, 304.2 are located. It is particularly preferred that the LEDs 308.1, 308.2, 308.3 mounted on the conductive coating 304.1, 304.2 are offset to one another and are located opposite to each other.

If a facade element constructed as shown in FIG. 4b is used in such a way that the side designated as internal is facing the building, and the side designated as external to the external side, then the light emitting means 308.1, 308.2 preferably radiate unilaterally in the direction of the external side, and the radiating means, t. e. LED 308.2, radiates in the opposite direction through the transparent plate 302.2 also in the direction of the outside (AUßEN).

In order to prevent light from entering the building, it can be provided that the back side of the plate 302.1 is provided with absorbent or reflective material, so that light emitted in the direction of the building is also reflected in the direction of the outside.

In the element shown in FIG. 4b, in order to cool, inert glass can be inserted in the intermediate space between the plates 302.1 and 302.2, as in an insulating glass element or with a filler, for example, a filling medium.

In FIG. 4c shows an alternative embodiment of several transparent substrates equipped with LEDs mounted in series. In contrast to FIG. 4a and 4b, in the embodiment of FIG. 4c, the elements are mounted relative to each other without a gap, and sequentially installed plates are connected to each other, for example, by means of injection resin, in the form of a composite element. Element 400 comprises two plates 402.1 and 402.2. Plates 402.1 and 402.2 are designed as transparent plates, i.e. like transparent substrates, however, they can also be quasi-transparent plates. Both plates 402.1 and 402.2 are connected to each other, for example, by injection resin 403, poured between the plates 402.1 and 402.2. Instead of resin 403, films, for example, PVB or EVA films or other adhesive films, can also be introduced between the plates 402.1 and 402.2. In the same way, functional films, such as, for example, liquid crystal or scattering films, can be introduced between both elements. LEDs 408.1, 408.2, 408.3, 408.4 are installed on each of both transparent or quasi-transparent substrates 402.1, 402.2. Preferably, they are reinstalled offset from each other. If the element is used on the facade, on which the side designated as the inner side is facing the structure, and the side designated as the outer side is facing the outside, then the LEDs 408.1, 408.2 preferably emit in the direction of the outer side, the diodes 408.3, 408.4, preferably through transparent substrates 402.1, 402.2 also in the direction of the outside. LEDs, preferably, can be made in the form of LEDs with single-sided radiation. Two-way LEDs are also possible. If in the case of LEDs we are talking about such LEDs that emit in both directions, then with the help of appropriate reflectors the light emitted in the direction of the facade, i.e. inward, may be reflected towards the outside.

Light-emitting means, in particular LEDs, can be installed on a conductive coating deposited on a laminated glass plate, or in a film inserted between both plates.

The second element of the insulating glass composite, spaced relative to the first element, in turn, may be glass from one wafer, safety glass from one wafer, partially prestressed glass from one wafer, laminated safety glass, laminated safety glass containing safety glass from one plates, and laminated safety glass containing partially prestressed glass.

The gap between the two elements in the glass insulating element is provided by means of a spacer element, for example a metal spacer, as well as a seal between the two elements forming the insulating glass composite. The gap A between the two opposite surfaces of the insulating glass composite is 5-50 mm, preferably 10-30 mm. In addition to the spacer, sealants, preferably butyl rubber, are provided for sealing the spacer relative to the plate elements.

The second element, which does not contain LEDs, can now take many forms. For example, in the first embodiment of the second element, glass with a high degree of enlightenment could be used, for example, AMIRAN glass manufactured by Schott AG with a high degree of enlightenment, which, as compared to unlighted glasses, reduces reflection to one eighth. Glasses with a color effect could be applied in the same way, such as, for example, a glass with a color effect NARIMA ^R , manufactured by Schott AG based on a interference-optical effect with a coating. In addition, the second optical element could contain colored flat glasses, for example IMERA ^R glass manufactured by Schott AG with a structureless surface or colored flat glass with a one-sided structured surface, such as ARTISTA glass manufactured by Schott AG. It goes without saying that in a glass insulating composite, glass that is transparent in the visible range but has a structured surface, such as a printed surface or a sandblasted surface, could also be used as a second optical element. It goes without saying that the opposite glass should not be structured, brightened or made like glass with a color effect or decorative glass over the entire area of the transparent optical element with light-emitting means, on the contrary, in this way only separate sections of glass opposite the element with LEDs can be made. A transparent element with light emitting means, for example a transparent substrate with light emitting means, can also be used in laminated glasses, in particular in composites of insulating glass. In glass insulating composites, at least one other element is located at a distance from the transparent element with light-emitting means, for example, connected to it through a spacer. Between the additional element and the transparent element with light emitting means there is a vacuum or a filler gas, in particular an inert filler gas, such as argon.

In FIG. 5a-5f show elements consisting of at least one transparent and / or quasi-transparent substrate and one more element. An additional element may also be considered as a cover plate. The elements shown in FIG. 5a-5f are preferably glass insulating elements with an intermediate space.

The glass insulating element according to the first embodiment shown in FIG. 5a, consists of a laminated glass element 500, as well as a single plate 510. The laminated glass element 500 consists of a transparent substrate 520 and a conductive coating 530 deposited thereon. Light emitting means 540 are mounted on the conductive coating 530, for example, by using solder contact sites. On the side opposite the substrate, a second plate 560 is provided covering the transparent substrate. Casting resin 570 is poured into the intermediate space between the transparent element with the conductive layer and the second second plate opposite to it, so that the element is made of laminated glass. However, the laminated glass element may also be one in which a film that can carry, for example, light-emitting means, is located between the plates, i.e. a transparent substrate and the opposite second plate. A film with light emitting means, together with other films, is laminated between both plates. Other films may also be films with special functions, for example, a liquid crystal film switched between two states. One could also provide one part instead of one film containing liquid crystals with a film containing scatterers, for example, to obtain a projection plane for projection onto reflection and light. The gap A between the inner surfaces 580, 590 of both elements 500, 510, i.e. here, the laminated glass plates 500, as well as the single-plate element 510 constituting the insulating glass element 600, are 5-55 mm, preferably 10-30 mm, in particular about 16 mm. The gap between the laminated glass element and the single plate is maintained using a metal spacer, preferably aluminum. The spacer element 610 is sealed relative to the plate elements, namely with a sealant 620, preferably consisting of butyl rubber. Complete sealing of the intermediate space between the first and second plate elements is achieved by using butyl rubber 630, applied under the spacer element 610. Between the first 500 and the second plate element 510, there is preferably a gaseous medium. With increased requirements for thermal insulation, in particular, an inert gas medium is used. The inert gas medium may contain, for example, elements of argon or xenon, or krypton. In addition, in FIG. 5a, surfaces typical of an insulating element of glass, as well as sides facing outward, i.e. from the atmospheric side of the facade, and also facing the inside, i.e. towards the building. The laminated glass element facing the outside contains surfaces F1 and F2, and a single plate facing the building contains surfaces F3 and F4.

In order to obtain a particularly transparent element, it can be envisaged that the surface F4 is provided with an enlightened layer, for example, as in the case of flat glass AMIRAN ^R. Thermal insulation layers can be applied to surfaces F2 and F3, for example, a soft coating based on silver layers or a hard coating based on SnO _x : F, or sun protection layers. In order to achieve a color effect, it can be envisaged that the composite plate or single plate is made of colored glass. Decorative glasses are also possible here.

While the intermediate space in insulating glass composites is filled with an inert gas, a medium, such as a cooling medium, can also be located between the two plates.

In FIG. 5b shows a device similar to that of FIG. 5a, but in the laminated glass element 700, light-emitting means 740 are embedded in a film 702 laminated between both plates 720, 760 of the laminated glass element together with other films, for example, adhesive films (not shown), as described above. The rest is about the same device as in FIG. 5a, and for the same components, the same positions are used, increased by 200.

In FIG. 5c shows a device of an insulating element made of glass with two plates 800, 900 of laminated glass. In such a device, for example in a laminated glass element 800 located externally, light emitting means 840 can be installed. Light emitting means, as already shown in FIG. 5b may be installed in the film. A film with light-emitting means, in turn, is installed between the plates 820 and 860 using adhesive films (not shown). Instead of a single plate for the plate facing the inside, in turn, a laminated glass element 900 with two plates 904, 906, which, of course, may contain more than two plates, for example three plates. The film 908 laminated to this laminated glass member can, for example, be a liquid crystal film 908 for switching between two states, namely between a scattering or cloudy state and a transmission state, or at least in the range of a film provided with diffusers and allowing projection on reflection and on clearance. Otherwise, in FIG. 5c, identical components are again denoted by the same reference numbers. The gap between the two laminated glass elements forming the glass insulating element is maintained due to a metal spacer, preferably aluminum.

In FIG. 5d shows a particularly simple embodiment of an insulating glass element 950 comprising a transparent substrate 952 on which light-emitting means 954.1, 954.2, 954.3, and a cover plate 960 are mounted. Both the cover plate 960 and the transparent substrate 952 are single-glass panes, for example, soda-lime glass. A conductive coating 958 is again applied to the transparent substrate 952 to form conductive paths for individual light emitting means 954.1, 954.2, 954.3. A transparent or quasi-transparent substrate 952 and a cover plate 960 form an insulating glass composite 950. To this end, a spacer 962 is installed and sealed between the two plate elements 960 and 952 with respect to the plate elements, namely with a sealant consisting preferably of butyl rubber. In this case, an intermediate space is formed between the two plates 960 and 952, preferably , an inert gas or a medium, such as a cooling medium.

In FIG. 5e shows a particular embodiment of a glass insulating element 980 containing a transparent substrate 982, which is part of a composite element 956, in which light-emitting means 954.1, 954.2, 954.3 are installed between the transparent substrate 982 and the plate 983 connected to the transparent substrate 982. The laminated glass element, in turn, is connected by a spacer 992 to the solar module. The solar module is translucent and is indicated by 988. In turn, the inside of the insulating glass composite is designated as the inside and the outside as the outside.

Sunlight falling from the outside directly hits the solar module, while due to the light transmission of the solar module, the LEDs emitting from the rear can emit light through the solar module, which is also perceived from the outside.

In the same way, a reverse installation is possible, as shown in FIG. 5f.

During reverse installation, the solar module is installed on the inside, and the laminated glass element with light-emitting means on the outside. Otherwise, the installation is identical to the installation in FIG. 5f. Due to the transparency of the multilayer wafer with light emitting means mounted on the wafer, enough sunlight is incident on the solar module mounted on the inside.

It goes without saying that it would be possible to provide for a facade in which part of the facade elements consists of facade elements according to the invention, and part of the facade elements is made of solar modules. In this case, solar modules are installed along with transparent elements in a modular fashion.

Facades with solar modules, as described above, have the advantage that they absorb solar energy and convert it into electrical energy. In the presence of accumulating installations, the current can later be supplied again, for example, for the operation of light-emitting means.

A transparent element according to the invention with a transparent substrate can be used as an element, preferably, as a mounting element of the facade structure of a multimedia facade or display with a large display field of 10, 20, 50, 100, 1000, 3000 square meters or more. Individual transparent elements have a size of the order, for example, 2 × 2, 2 × 5, 2 × 10 m.

In FIG. 6 shows a media facade according to the invention. The media facade is indicated by the reference numeral 1000. The media facade contains at least one, but there are several, but four preferred transparent elements 1002.1, 1002.2, 1002.3, 1002.4 according to the invention with LEDs mounted, for example, on a particular facade building 1010, for example, on the building with the internal premises, with the help of fasteners adopted by specialists. Elements according to the invention can be constructed as in FIG. 3, 4a-c or 5a-f. It is important that the transparent elements contain light-emitting means that can be installed on transparent substrates. The transparent elements are preferably standard elements of a size of, for example, 2 × 2, preferably 2 × 4 or 2 × 10 m. In this case, four transparent elements, if each individual transparent element occupies an area of 2 × 10 m, have, for example, display area of the order of 80 square meters.

All individual elements of the facade 1002.1, 1002.2, 1002.3, 1002.4 contain many LEDs, preferably RGB-LED chips, preferably installed in the structure of the image elements and which, when individually controlled, reproduce moving images 1050, such as television images along the front of a transparent media facade.

In FIG. 7a-b show the first possibility of improving individual transparent modules connected to each other in a media facade.

Moreover, in FIG. 7a is a sectional view of two interconnected modules, and FIG. 7b is a top view of such two modules. The first module is indicated by 2000.1, the second module by 2000.2. Each of the modules 2000.1, 2000.2 contains a transparent substrate 2004.1 for the module 2000.1 and 2004.2 for the module 2000.2, on which light-emitting means 2008.1.1, 2008.1.2, 2008.2.1, 2008.2.2 are installed. The light emitting means, in turn, are preferably soldered to the so-called contact pads connected to individual conductive paths isolated from the conductive transparent layer on the transparent substrates 2004.1, 2004.2. In addition, the transparent element 2000.1 contains a cover plate or an additional second plate 2006.1, 2006.2. The second plate, which is also transparent or quasi-transparent, is connected in one element with the first plate, for example, using injection resin 2007.1, 2007.2 or adhesive films, such as PVB films placed in the intermediate space between both plates 2006.1, 2006.2.

As can be seen from the section in FIG. 7a, the carrier substrate 2004.1, 2004.2 for light-emitting means is always wider than the cover plate 2006.1, 2006.2. As a result, an edge region 2010.1.1, 2010.1.2, 2010.2.1, 2010.2.2 is created on each side of the substrate 2004.1. The current leads for individual light emitting means may go into the edge region, as shown in FIG. 7b. In this case, busbars 2012.1.1, 2012.1.2, 2012.2.1, 2012.2.2 pass in the edge region of the carrier substrate, supplying current to the corresponding LEDs of the substrate.

If the two modules are connected, as shown in FIG. 7a, they are connected using a T-branch 2030 adjacent to both cover plates and extending between both modules 2000.1, 2000.2. In this case, the intermediate spaces 2050.1, 2050.2 are in the corresponding boundary region of the optical elements 2004.1, 2004.2. After that, control electronics or busbars can be installed in the edge area. The control electronics, or busbars, in this case can be connected to external devices, such as a power source. In addition, in the intermediate space it is possible to place control electronics for the entire transparent component and only conduct current paths for control through the intermediate spaces.

In FIG. 7b shows a top view of part of a transparent optical element 2004.1, 2004.2. This essentially involves the image of a transparent substrate in the edge region. As can be clearly seen in FIG. 7b, individual light-emitting means, in particular LEDs 2009.1, 2009.2, 2009.3, 2009.4, on a transparent substrate are supplied with current via parallel wires 2200.1, 2200.2, 2200.3, 2200.4, which all lead to the edge region 2010.1.2, and from there to the control unit and / or to a common power source. In turn, the intermediate space formed between the individual modules is filled with a T-branch, as shown in FIG. 7a. In this case, one single cable 2013 is outputted from the control unit 2011.

In FIG. 7c shows an alternative embodiment of connecting two modules.

The first module is indicated by 3000.1, the second module by 3000.2. Each module 3000.1, 3000.2 contains a transparent substrate - 3004.1 for module 3000.1 and 3004.2 for module 3000.2, on which light-emitting means 3008.1.1, 3008.1.2, 3008.2.1, 3008.2.2 are installed. The light emitting means, in turn, are preferably soldered to the so-called contact pads connected to individual conductive paths isolated from the conductive transparent layer 3004.1, 3004.2. In addition, the transparent element 3000.1.1 contains a cover plate or an additional second plate 3006.1, 3006.2. The second plate, which is also transparent or quasi-transparent, is connected in one element to the first plate, for example, using injection resin or adhesive films, such as PVB films placed in the intermediate space between both plates 3006.1, 3006.2. As can be seen from the section in FIG. 7c, the carrier substrate 3004.1, 3004.2 for light emitting means from one edge is wider than the cover plate 3006.1, 3006.2. As a result, an edge region 3010.1 is created on one side of the substrate 3004.1. On the opposite side, the carrier substrate 3004.1 is made shorter than the cover plate 3006.1. Here, the cover plate 3006.1 protrudes above the carrier substrate 3004.1 in the edge region 3010.2. Preferably, the protruding parts of both the substrate 3004.1 in the edge region 3010.1 and the cover plate 30006.1 in the edge region 3010.2 are selected so that they are the same length. This, as shown in FIG. 7c, provides the module 3000.1 in places where the carrier substrate protrudes, the possibility of overlapping on the side of the cover plate of the adjacent module 3002. Thus, it is possible to obtain a system in which one module is connected to another seamlessly. T-shaped profile, as in the case of the embodiment of FIG. 7a and 7b, not needed.

Next, in FIG. 8 shows the connection of a transparent optical element consisting of two plates, as shown in FIG. 7a and 7b, with a facade.

For this purpose, holes are preferably made in the transparent substrate, and even in the cover plate. These holes are provided at 5000. Fasteners, such as screws, may pass through holes at 5000. Then, with the help of screws, the facade elements are mounted on the building. Fasteners can be made in the form of hollow bodies, through which wires can be passed to the outside of the module.

It is particularly preferable that the facade element be made as a composite element, consisting, as shown, of a transparent substrate 5002 with light-emitting means 5004 mounted thereon, as well as a cover plate. In this case, the fixing is preferably carried out in such a way that the insert 5010, for example a threaded sleeve, is glued onto the transparent substrate 5002 using a curable adhesive for bonding metal to glass. Then, between the transparent substrate 5002 and the cover plate 5008, an intermediate layer 5006 is placed, for example, injection resin or adhesive tape. Then, using a casting resin or adhesive tape, the cover plate 5008 is fixed to the transparent substrate 5002, forming a composite element.

The insert 5010 is connected to a functional element, for example with a threaded bolt 5020, which serves for fixing. The insert 5010 is inserted before the transparent substrate 5002 together with the cover plate 5008 form a composite element. To do this, first, the metal insert 5010 with a curable adhesive for bonding metal with glass is glued to a transparent substrate, and after that, after the insert 5010 with a curable adhesive for gluing metal with glass is glued to a transparent substrate, an intermediate layer 5006 is applied. and using the intermediate layer 5006 and the cover plate 5008, a composite element is manufactured.

Thanks to the invention, it has become possible to provide transparent media facades, which, on the one hand, are transparent in and out of the building, and, on the other hand, have a very simple, almost maintenance-free design compared to existing media facades in accordance with the prior art.

In addition, losses can be minimized if conductive paths with high conductivity are used as a conductive path for supplying current to individual LEDs. Such conductive paths are, for example, part of the system:

transparent substrate / TiO ₂ / SnO ₂ : F.

The conductivity of such systems, or conductive paths, is 3-6 · 10 ^-4 Ohm · cm, in particular, 5-5.5 · 10 ^-4 Ohm · cm (Ω · cm). In a highly conductive layered system with the structure:

transparent substrate / TiO ₂ / SnO ₂ : F

the thickness of the TiO ₂ layer is 5-50 nm, preferably 10-30 nm, and the thickness of the SnO ₂ : F layer is 200-2000 nm, in particular 500-600 nm.

The conductive tracks, as described above, can find application in all the elements presented in this application, in particular in the indicator elements, and are not limited to the few applications mentioned in this application.

Compared to conductive paths, or layers with low conductivity, conductive paths have the advantage that they do not heat up, and thus staining or peeling from the transparent substrate can be prevented. In addition, glass with conductive paths or layers with high conductivity can be illuminated, for example, using an enlightened layer.

Claims (24)

1. A media facade (1000) containing a plurality of transparent elements of modular design (2000.1, 2000.2, 2000.3, 2000.4), and the transparent elements (2000.1, 2000.2) contain at least one transparent substrate (2004.1, 2004.2), as well as one or more light emitting means installed on a transparent substrate (2004.1, 2004.2), while the elements of a modular design form an indication field of the media facade of more than 50 m ² , in particular more than 100 m ² , in particular more than 1000 m ² , in particular more than 3000 m ² , in particular more 5000 m ^2, the individual modules are connected to one another via T-Obra GOVERNMENTAL branching (2030), and an intermediate space formed between the individual modules is filled with a T-shaped branching, the setting between the modules and the adjoining cover plates modules. 2. The media facade according to claim 1, in which the light emitting means are LEDs (2008.1, 2008.2, 2008.3, 2008.4) mounted on a transparent substrate (2004.1, 2004.2). 3. The media facade according to claim 1, characterized in that the power of the light-emitting means is carried out via conductive paths on a transparent substrate. 4. The media facade according to claim 3, characterized in that the conductive tracks consist of an electrically conductive layer (204.1, 204.2, 204.3, 204.4) for energy transfer. 5. The media facade according to claim 1, characterized in that the conductive tracks are made transparent. 6. The media facade according to claim 1, characterized in that the transparent substrate is lamellar, in particular flat or bent. 7. The media facade according to claim 1, characterized in that the transparent element contains a layer of injection resin or a film (570). 8. The media facade according to claim 7, characterized in that the film contains light-emitting means. 9. The media facade according to claim 7, characterized in that the film contains liquid crystals. 10. The media facade according to claim 7, characterized in that the film contains dispersion centers. 11. The media facade according to claim 1, characterized in that the transparent element (500, 700) contains at least one additional plate (510, 710), and the additional plate is selected from
enlightened single plate,
laminated glass plate,
decorative glass plate,
single glass plate with color effect,
heat insulating glass plate,
transparent or quasi-transparent glass ceramics,
sun glass plate,
single plate with structured glass surface. 12. The media facade according to claim 1, characterized in that the transparent element is part of an insulating composite of glass. 13. The media facade according to claim 3, characterized in that the conductive paths form several electrical circuits for power supply and / or control of the light emitting means so that the individual light emitting means are individually controlled. 14. The media facade according to claim 1, characterized in that the light-emitting means form a dot matrix on a transparent substrate. 15. The media facade according to claim 3, characterized in that the power source of the light emitting means is configured to be connected to a freely programmable computer that controls individual electrical circuits. 16. The media facade according to claim 3, characterized in that the transparent conductive tracks are conductive tracks with high conductivity with a resistance of R≤15 Ohm / square, in particular ≤10 Ohm / square, in particular ≤9 Ohm / square, in particular ≤7 Ohm / square, in particular ≤5 Ohm / square (Ω /). 17. The media facade according to claim 3, characterized in that the transparent layer, in particular, the conductive track has a thickness of ≥150 nm, preferably ≥180 nm, in particular preferably ≥280 nm, in particular preferably ≥500 nm, in particular preferably ≥550 nm 18. The media facade according to claim 4, characterized in that the transparent layer, in particular the transparent conductive layer of the conductive track, contains one or more of the following oxides:
InO _x : Sn
SnO _x : F
SnO _x : Sb
ZnO _x : Ga
ZnO _x : B
ZnO _x : F
ZnO _x : B
ZnO _x : Al
Ag / TiO _x 19. The media facade according to claim 3, characterized in that the conductive tracks on a transparent substrate are thin metal conductive tracks, preferably of silver. 20. The media facade according to claim 1, characterized in that it contains more than 1000, in particular more than 5000, preferably more than 10000, particularly preferably more than 100000, in particular more than 150,000, particularly preferably more than a million individual light-emitting agents. 21. The media facade according to claim 1, characterized in that it consists of at least two modules (2000.1, 2000.2), and the modules consist of at least one transparent substrate (2004.1, 2004.2) and one cover plate (2006.1, 2006.2) and the transparent substrates are at least one edge longer than the corresponding cover plate, so that an edge region (2010.1.1, 201.1.2, 2010.2.1, 2010.2.2) of the transparent substrate is created. 22. The media facade according to item 21, wherein the current leads of light-emitting means (2008.1, 2008.2, 2008.3, 2008.4) installed on a transparent substrate are connected to the edge region, and there to a common power source (2012.1.1, 2012.1.2, 2012.2.1, 2012.2.2). 23. The media facade according to claim 1, characterized in that the large transparent display field contains means (5010, 5020) for mounting transparent elements on the facade. 24. The media facade according to claim 24, wherein the fastening means (5010, 5020) are passed through the opening (5000) in the transparent substrate and / or the cover plate.

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