RU2336595C2 - Method of spatial mini module manufacturing for radio electronic devices - Google Patents

Abstract

FIELD: physics, radio.

SUBSTANCE: invention concerns designing of radio electric devices (RED), particularly methods of spatial mini module manufacturing for REDs. Objective of the invention is achieved by adjustments to a method of spatial mini module manufacturing for RED. The method involves assembly and tuning of mini module board fragments in the form of small printed circuit boards with radio electronic components installed on them, combining of mini boards into a single construction, compound casting, establishing links between mini boards, and functionality test of obtained mini module. Adjustments include butted positioning of mini boards in a closed spatial parallelepiped pattern, further electric and mechanical interlinkage of mini boards by putting bridges between adjoining boards, functionality test of obtained mini module, compound casting to form external shell of the mini module, and second functionality check. One layer of multilayer small printed circuit boards is a screen, and screening layers of all mini boards with the same power conductor of the spatial mini module are connected electrically, while all radio electronic components sensitive to jamming are positioned on printed circuit boards in the closed space inside parallelepiped.

EFFECT: jam resistance, high packing density and mechanical durability of radio electronic components at low production labour costs, increased manufacturability and maintainability of assembled mini modules.

2 cl, 2 dwg

Description

The invention relates to the field of designing electronic equipment (REA), in particular to methods for creating volumetric mini-modules for REA.

A known method of manufacturing miniature modules for CEA microassemblies (1), based on the use of thin-film or thick-film integrated hybrid technology, in which the assembly of the mini-module consists in the installation of housing and (or) packageless electronic components (microcircuits, transistors, resistors, capacitors and etc.) on a miniature printed circuit board on which all the necessary connections between the components (in two or more conductive layers) are made. The disadvantage of this method is the relatively low efficiency of using the available volume both in the microassembly itself and in the REA compiled using microassemblies, since the arrangement of the electronic components in the microassembly and their interconnection are performed in only one plane.

In addition, microassemblies (thin-film and thick-film) have low reliability (mechanical strength, moisture resistance, durability) and additional restrictions imposed by the manufacturing technology on the operating temperature range of microassemblies.

The closest analogue (prototype) of the proposed method for manufacturing volumetric mini-modules is a method for assembling electronic components in three dimensions and a device for its implementation (2), in which the assembly and configuration of individual fragments of mini-modules-mini-boards, which are miniature printed circuit boards with electronic components installed on them, they are carried out using special equipment in a single (storey) structure, in which mini-boards are parallel to each other, after which their room They are called compounds, and the establishment of connections between mini-cards is carried out by milling channels with the application of conductive and insulating layers in the necessary places of the mini-module. The disadvantages of this technical solution include the need to use complex technological equipment (one-time use), the use of high-precision and expensive mechanical equipment, the ability to check the operability of all mini-cards of the mini-module as a functionally complete device only after filling with the compound (when repair is no longer possible) , which affects the percentage of yield.

The objective of the present invention is to provide a high packing density of electronic components, their mechanical strength at low labor costs in their manufacture, increase noise immunity, simplify the process, and ensure maintainability of already assembled mini-modules.

The problem is solved by the method of manufacturing volumetric mini-modules for electronic equipment, which consists in assembling and setting up fragments of mini-modules-mini-boards, which are multilayer or double-sided miniature printed circuit boards with electronic components installed on them, in which the mini-boards are end-to-end in the form of a closed volumetric figure - a rectangular parallelepiped, then electrically and mechanically connect the mini-cards with each other by installing jumpers between adjacent mini-cards E, checking operability resulting mini-module, then poured compound forming the outer shell after solidification mini-module, and re-check its performance.

In this case, one of the layers of multilayer miniature printed circuit boards is shielded and electrically connect the shielding layers of all the mini-boards to a common power conductor of the surround mini-module, and all electronic components sensitive to interference are placed on the printed circuit boards in an enclosed space inside the parallelepiped.

Figure 1 presents a diagram of the mutual arrangement of miniature printed circuit boards at the design stage and the installation of jumpers, and figure 2 is a General view of the electronic minimum module in the context, where

1 - electronic component;

2 - miniature printed circuit board;

3 - jumper;

4 - external output;

5 - compound shell;

6 - shielding conductor layer.

After assembling the mini-boards and checking their operability, they carry out the installation of on-board electrical connections. For these purposes, jumpers 3 are used, which can be made of insulated or uninsulated wire (depending on the density of installation), of a flat metal strip or created in the process of manufacturing miniature printed circuit boards. At the first stage of installation, all mini-cards are placed horizontally, so that the outer surface of each board is on top, and all jumpers are installed that are available for installation in this position of the mini-cards.

If necessary, you can optionally install jumpers on the reverse side to connect the mini-card 1 with the neighboring mini-cards 2, 3, 4 and 5. For this, the mini-cards are turned 180 ° (with the inner surfaces up). From the same position in the next step, the mini-boards 2, 3, 4 and 5 are sequentially rotated 90 ° and the jumpers between these boards are sealed. Lastly, also 90 °, turn the mini-board 6 and solder the remaining jumpers. As a result, the mini-boards form a cube. Since in this position all the necessary electrical connections are established between the mini-cards, then the operability of the volumetric minimodule (OMM) as a whole is easily checked.

In this case, interboard electrical connections are established by jumpers between adjacent mini-boards, and not by milling the side surfaces of the mini-module with subsequent application of insulating and conductive layers into the channels formed by milling, as in the prototype. Moreover, installation of jumpers implements not only all the necessary electrical connections inside the mini-module, but also provides a certain mechanical rigidity of the resulting design of the mini-module before it is filled with a compound.

After that, the entire OMM design is placed in a metal or plastic case and is filled with the compound through the holes specially left for this purpose in the printed circuit boards of the mini-modules. In the case when a frozen compound is used as the outer shell of the OMM, technological equipment is used instead of the body for pouring. After the compound hardens, the performance of the OMM is checked again.

The use of the invention allowed to increase the manufacturability of manufacturing mini-modules by replacing the complex process of establishing electrical connections between mini-boards with the standard process of establishing electrical connections using jumpers, similar to the process of soldering the contacts of electronic components during their installation on a printed circuit board; reduce the complexity and costs of manufacturing mini-modules by simplifying the process of establishing inter-circuit connections and eliminating the cost of operating expensive equipment (high-precision milling machine, spraying machine, etc.), eliminate the use of disposable equipment for attaching mini-cards, and improve the quality of mini-cards modules by increasing the completeness of control at the stage when the design of the mini-module is still repairable (before filling with a compound), and significantly increase the noise immunity Addressing modules.

References

1. Functional nodes of integrated hybrid VIP. Stepanov Yu.B., Lukin A.V., Opadchiy Yu.F. on Sat articles edited by Yu.I. Koneva "Electronic Engineering in Automation", M., "Soviet Radio", 1980, issue 11, s.16-24.

2. US Patent No. 2002211380, 2002

Claims (2)

1. A method of manufacturing volumetric mini-modules for electronic equipment (REA), which consists in assembling and configuring fragments of mini-modules-mini-boards, which are multi-layer or double-sided miniature printed circuit boards with electronic components installed on them, in which the mini-boards are end-to-end in the form of a closed volumetric figure - a parallelepiped, then electrically and mechanically connect the mini-cards to each other by installing jumpers between adjacent mini-cards, check the efficiency obtained th mini-module, then poured compound forming after curing the outer shell of the mini-module, and re-check its performance. 2. The method according to claim 1, characterized in that one of the layers of the multilayer miniature printed circuit boards is shielded and electrically connect the shielding layers of all the mini-boards with a common power conductor of the mini-module, and all electronic components that are sensitive to interference are placed on the printed circuit boards in a confined space inside the box.

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