RU2393654C1 - Heat sink - Google Patents

Abstract

FIELD: physics. ^ SUBSTANCE: distribution of heat conducting coat is made directly on rib contact surface split-jointed, via flexible element, with the base. Surface of every rib furnished with ducts stays in contact with all irregularities of heat-loaded case of electronic component surface. Flexible element pressed against the heat-loaded electronic component case allows heat conducting coat flows to flow into rib ducts to facilitate uniform and optimum distribution of heat conducting coat which couples surfaces of heat loaded components, even those poorly connected. ^ EFFECT: improved heat withdrawal from radiolectronic components due uniform distribution of heat conducting coat in heat sink proper. ^ 5 dwg

Description

The invention relates to the field of electronics, namely to the removal of heat from heat-loaded elements of electronic components, for example, on-board equipment of aircraft.

A heat dissipation device is known (US patent No. 6663964, H05K 7/20, B32B 9/00, F16L 59/02, publ. December 16, 2003). Its distinctive feature is a heat-conducting coating, in which there is no fluidity at room temperature, when the heat-loaded elements do not work. During operation of the heat-loaded elements, due to the increase in temperature, the heat-conducting material softens, fluidity appears, as a result of which the heat-conducting material is distributed between the heat-loaded elements and the heat removal device.

The disadvantage of this device is the uneven distribution of the heat-conducting coating due to the uneven heat generation by various heat-loaded elements. In addition, the temperature of the heat-loaded element decreases with distance from its center to the periphery, which leads to an uneven distribution of the heat-removing coating. Those. the hot zone is in the center, and zones with a lower temperature are at the edges, which leads to the fact that fluidity appears only in the central part.

The closest technical solution (prototype) is a heat dissipation device according to the patent of the Russian Federation No. 2303862, H05K 7/20, H01L 23/36 G06F 1/20, publ. 07.27.2007, made of metal or a metal alloy, containing a cooling fin, which is connected to the metal housing of the operating tool. The cooling element is detachably connected to the housing by fixing means and is provided with a heat-conducting and electrically insulating coating.

The disadvantage of this device is the increase in thermal resistance at the junction of the cooling element and the heat-loaded element in the case of different shapes of the interface of the heat sink and the mounting surface of the body of the heat-loaded element (for example, one concave, the other flat). Then, under cyclic thermal loads, the distribution of the heat-conducting coating directly on the working surface of the heat-loaded element becomes uneven.

The technical result of the invention is to improve the heat removal from the heat-loaded elements of the electronic blocks due to a more uniform distribution of the heat-conducting coating in the heat removal device itself, the coating becoming thinner, as a result of which it more effectively removes heat from the heat-loaded elements.

The technical result is achieved in that in a heat removal device having a base provided with cooling fins and detachably connected to the body of the heat-loaded element through a heat-conducting coating, the ribs are connected to the base detachably through an elastic element, and the contact surface of each rib with the body of the heat-loaded element is made in the form of a rectangle, and the ribs are provided with channels.

The invention is illustrated by drawings.

Figure 1 - heat removal device at the initial moment of its operation;

figure 2 - device for heat removal at the final moment of its operation;

figure 3 - device heat dissipation in isometry;

4 is a device for heat removal in isometry with several heat-loaded elements;

5 is a device for heat dissipation in cross section with several heat-loaded elements,

Where:

1 - base;

2 - hole in the base for installing ribs;

3 - elastic element;

4 - cooling rib;

5 - step of the cooling fin;

6 - contact surface of the cooling fin with the body of the heat-loaded element;

7 - case of a heat-loaded element;

8 - printed circuit board;

9 - channels;

10 - heat conductive coating;

11 - hole base for mounting on the board;

12 - hole in the board for mounting the base;

13 - fastener;

14 - hole of the elastic element, coaxial to the hole of the base.

The heat removal device has a base 1 (FIGS. 1, 2) with holes 2 for detachable connection through an elastic element 3 with cooling ribs 4 having the shape of a truncated cone equipped with a step 5. The contact surface 6 of each rib 4 with the housing 7 of the heat-loaded element located on a printed circuit board 8, made in the form of a rectangle (for example, a square) with channels 9 (groove, hole, etc.) A heat-conducting coating is applied to this surface 10. Channels 9 (Fig. 3) are used for mass transfer of a heat-conducting coating 10 (for example , P asthma), which contributes to a more uniform and finer distribution of this coating over the entire contact surface 6.

For fastening the base 1 to the board 8, they have holes 11 and 12, respectively, for the fastening elements 13. The elastic element 3 is provided with holes 14 coaxially with the holes 11 of the base 1.

The surface of the heat-loaded element may have a deviation from flatness, in particular, it may be concave, i.e. look like a bowl. If necessary, to remove heat from several heat-loaded elements (Figs. 4, 5), cooling fins are installed in several holes made in accordance with the location of the heat-loaded elements.

The proposed design allows you to fill the surface irregularities of the heat-loaded element with many ribs with a minimum thickness of the heat-conducting layer, i.e. any irregularity is filled, which improves heat dissipation. The elastic element 3 creates a certain force, which under cyclic thermal loads helps to maintain thermal contact with the heat-loaded element.

When mounting the heat removal device to the printed circuit board 8 with heat-loaded elements under the influence of the elastic element 3 on the step 5 of the rib 4, the latter comes into contact with all the irregularities with the housing 1 of the heat-loaded element. After some time, even at room temperature, the paste flows 10, following the path of least resistance, appear in the channels 9 of the ribs 4, which reduces the thickness of the paste layer 10. When a heat-loaded element is connected, heat is released, which is removed through a thin layer of paste 10, whose thermal conductivity by definition, significantly higher than the thick layer to the ribs 4 of the heat removal device. Further, the ribs 4 dissipate heat into the environment.

The tests showed the efficiency of the claimed device. It has a novelty, inventive step, is industrially applicable and solves the technical problem posed: it increases heat transfer due to a more uniform and finer distribution of heat-conducting paste and effectively removes heat even from poorly coordinated surfaces of heat-loaded elements.

Claims (1)

A heat removal device having a base provided with cooling fins and detachably connected to the body of the heat-loaded element through a heat-conducting coating, characterized in that the fins are connected to the base detachably through an elastic element, and the contact surface of each rib equipped with channels with the body of the heat-loaded element is made in the form the rectangle.

Images