RU2278011C1 - Nickel base solder - Google Patents

Abstract

FIELD: manufacture of soldered parts of radiators, heat exchangers, honeycomb boards and other structures including thin-wall members of stainless steels.

SUBSTANCE: solder contains next relation of ingredients, mass %: chrome, 3.0 - 17.9; iron, 0.1 - 10.0; molybdenum, 0.5 - 6.0; silicon, 3.0 -6.5; cobalt, 0.1 - 10.0; niobium, 0.1 - 2.9; titanium, 0.1 - 2.9; boron, 1.2 - 1.6; manganese, 0.1 - 2.0; nickel, the balance. Solder in the form of amorphous metallic strip features improved technological plasticity, low erosion activity in relation to basic material, soldering temperature lower than 1100°C.

EFFECT: possibility for lowering mass of soldered structure, for improving technological effectiveness of soldering process due to high accuracy of solder dozing.

2 tbl, 1 ex

Description

The invention relates to mechanical engineering, namely to nickel-based solders, mainly to amorphous solders, and can find application in the manufacture of soldered parts of radiator units, heat exchangers, honeycomb panels, etc., in the design of which thin-walled elements made of stainless steel are used.

Known solder based on Nickel, having the following chemical composition, wt.%:

Chromium 5.05-15.4 Iron 0-11.0 Boron 3.4-3.8 Molybdenum 3.7-9.46 Cobalt 11.5-34.9 Nickel rest

(US Patent No. 4801072).

The disadvantages of the known solder are large values of erosion when brazing stainless steels, a low level of strength of the joints.

Also known solder based on Nickel of the following chemical composition, in wt.%:

Chromium 6.1-8.2 Iron 2.6-3.5 Boron 2.0-6.4 Silicon 1.7-8.5 Nickel rest

(U.S. Patent No. 5,158,229).

The disadvantage of this solder is its high erosion activity when brazing stainless steels.

The closest analogue, taken as a prototype, is the solder of the following chemical composition, wt.%:

Chromium 19,2-40,0 Iron 8.0-28.0 Molybdenum 1.0-7.9 Silicon 3.0-7.5 Cobalt 0.5-6.0 Niobium 0.5-7.5 Titanium 0.5-7.4 Aluminum 1.1-5.0 Nickel rest

(RF patent №2115528)

The disadvantages of the prototype solder are the inability to obtain it in the form of an amorphous metal strip, the high erosion activity of the solder to stainless steels, and the high temperature of soldering.

An object of the invention is the development of solder in the form of amorphous metal strips having high technological ductility, low erosion activity in relation to the base material, the soldering temperature below 1100 ° C.

The stated technical problem is achieved by the fact that the proposed Nickel-based solder containing chromium, iron, molybdenum, silicon, cobalt, niobium, titanium, which additionally contains boron and manganese, in the following ratio of components, wt.%:

Chromium 3.0-17.9 Iron 0.1-10.0 Molybdenum 0.5-6.0 Silicon 3.0-6.5 Cobalt 0.1-10.0 Niobium 0.1-2.9 Titanium 0.1-2.9 Boron 1.2-1.6 Manganese 0.1-2.0 Nickel rest

The introduction of additional boron and manganese into the solder based on nickel with the declared content and ratio of other components provides solder in the form of amorphous metal strips with high technological ductility, low erosion activity with respect to the base material, and the soldering temperature below 1100 ° C.

An example implementation.

The proposed solder was smelted in a vacuum induction furnace with a crucible for 4-4.5 kg of alloy. Table 1 presents the compositions of the proposed solders (examples 1-3) and the solder prototype.

The solder in the form of amorphous metal strips was prepared by melt casting onto the surface of a rapidly rotating cooler disk.

Technological ductility was evaluated by repeated bending of the solder sample in the form of an amorphous metal tape on a cylindrical mandrel with a diameter of 5 mm clamped in a vice.

The erosion activity of solder (dissolution by solder of the main material) was evaluated based on the results of the interaction of solders with stainless steel grade 12X18H10T according to GOST 21549-76 "Soldering. Method for determination of erosion of soldered material".

The soldering temperature of stainless steel samples was determined by the method of stepwise control of the degree of wetting of the stainless steel material according to GOST 23904-79 "Soldering. Method for determining the wetting of materials with solders" according to differential thermal analysis on a DTA-7 installation.

The properties of the proposed solder and solder joints in comparison with the properties of the prototype solder are presented in Table 2.

Table 1 The compositions of the proposed solder and solder prototype No. p / p Cr Fe Mo Si With Nb Ti AT Mn Al Ni one 10 5.5 3,5 3.0 4,5 1,5 1,6 1,6 1,0 - the basis 2 17.9 10.0 6.0 6.5 0.1 0.1 2.9 1,2 2.0 - - "- 3 3 0.1 0.5 4,5 10.0 2.9 0.1 1.4 0.1 - - "- 4 prototype 29.5 10.0 4,5 5.2 4.0 4.0 4.0 - - 2,8 - "- table 2 No. p / p Soldering temperature, ° С Erosion activity,% Technological plasticity, number of bends Filler Thickness, mm one 1040-1050 5 more than 100 cycles 0.08 2 1080-1090 eleven 60 cycles 0.1 3 1060-1070 9 70 cycles 0.08 Prototype 1200-1220 over 28 fragile fragments (the tape does not form) 0.15 and more

From Table 2 it follows that the proposed solder in comparison with the prototype solder can be obtained in the form of amorphous metal strips, has technological plasticity (60-100 cycles or more), is characterized by a 3-6 times reduced erosion activity with respect to the base material in compared with the prototype solder and has a soldering temperature below 1100 ° C.

Using the proposed solder can reduce the weight of the soldered structure due to the use of a thinner filler foil, significantly reduce the complexity and increase the manufacturability of the soldering process, due to the dosage accuracy due to the high degree of equal thickness of the semi-finished solder, and increase the environmental friendliness of the process of manufacturing soldered parts.

Claims (1)

Nickel-based solder containing chromium, iron, molybdenum, silicon, cobalt, niobium, titanium, characterized in that it additionally contains boron and manganese in the following ratio, wt.%: Chromium 3.0-17.9 Iron 0.1-10.0 Molybdenum 0.5-6.0 Silicon 3.0-6.5 Cobalt 0.1-10.0 Niobium 0.1-2.9 Titanium 0.1-2.9 Boron 1.2-1.6 Manganese 0.1-2.0 Nickel Rest