RU2013120817A - Устройство и способы для реакторов осаждения - Google Patents
Устройство и способы для реакторов осаждения Download PDFInfo
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- 230000008021 deposition Effects 0.000 title claims abstract 3
- 238000007789 sealing Methods 0.000 claims abstract 8
- 239000011810 insulating material Substances 0.000 claims abstract 4
- 239000002245 particle Substances 0.000 claims abstract 3
- 239000011248 coating agent Substances 0.000 claims abstract 2
- 238000000576 coating method Methods 0.000 claims abstract 2
- 239000000463 material Substances 0.000 claims abstract 2
- 238000004140 cleaning Methods 0.000 claims 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4485—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation without using carrier gas in contact with the source material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45553—Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45561—Gas plumbing upstream of the reaction chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/6416—With heating or cooling of the system
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Formation Of Insulating Films (AREA)
- Recrystallisation Techniques (AREA)
- General Engineering & Computer Science (AREA)
Abstract
1. Источник исходного продукта, содержащий:присоединяемый картридж исходного продукта, выполненный с возможностью отсоединения;первую соединительную часть, выполненную с возможностью присоединения картриджа исходного продукта к источнику исходного продукта и отсоединения от него; ивторую соединительную часть для присоединения источника исходного продукта к устройству реактора осаждения и отсоединения от него.2. Источник по п.1, содержащий фильтр частиц, соединенный с первой соединительной частью.3. Источник по п.1, содержащий уплотнительную часть или клапан, выполненный с возможностью герметичного закрытия картриджа исходного продукта с обеспечением предотвращения потока материала исходного продукта из картриджа исходного продукта к первой соединительной части.4. Источник по п.3, содержащий третью соединительную часть на первой стороне уплотнительной части или клапана и четвертую соединительную часть на другой стороне уплотнительной части или клапана, при этом указанные третья и четвертая части выполнены с возможностью открытия для отсоединения указанной уплотнительной части или клапана и для того, чтобы очистить картридж.5. Источник по п.1, содержащий теплопроводящий корпус источника, и в нем картридж нагревателя.6. Источник по п.5, содержащий слой теплоизолирующего материала вокруг корпуса источника, и покрытие вокруг слоя теплоизолирующего материала.7. Источник по п.1, содержащий теплопроводящий выступ, расположенный около нижней части картриджа исходного продукта и имеющий выточенный канал для вмещения термопары.8. Источник по п.1, в котором картридж исходного продукта содержит ручной клапан кар
Claims (16)
1. Источник исходного продукта, содержащий:
присоединяемый картридж исходного продукта, выполненный с возможностью отсоединения;
первую соединительную часть, выполненную с возможностью присоединения картриджа исходного продукта к источнику исходного продукта и отсоединения от него; и
вторую соединительную часть для присоединения источника исходного продукта к устройству реактора осаждения и отсоединения от него.
2. Источник по п.1, содержащий фильтр частиц, соединенный с первой соединительной частью.
3. Источник по п.1, содержащий уплотнительную часть или клапан, выполненный с возможностью герметичного закрытия картриджа исходного продукта с обеспечением предотвращения потока материала исходного продукта из картриджа исходного продукта к первой соединительной части.
4. Источник по п.3, содержащий третью соединительную часть на первой стороне уплотнительной части или клапана и четвертую соединительную часть на другой стороне уплотнительной части или клапана, при этом указанные третья и четвертая части выполнены с возможностью открытия для отсоединения указанной уплотнительной части или клапана и для того, чтобы очистить картридж.
5. Источник по п.1, содержащий теплопроводящий корпус источника, и в нем картридж нагревателя.
6. Источник по п.5, содержащий слой теплоизолирующего материала вокруг корпуса источника, и покрытие вокруг слоя теплоизолирующего материала.
7. Источник по п.1, содержащий теплопроводящий выступ, расположенный около нижней части картриджа исходного продукта и имеющий выточенный канал для вмещения термопары.
8. Источник по п.1, в котором картридж исходного продукта содержит ручной клапан картриджа, выполненный с возможностью герметичного закрытия картриджа исходного продукта.
9. Картридж исходного продукта, присоединяемый с возможностью отсоединения для использования в источнике исходного продукта, выполненном по п.1.
10. Картридж по п.9, содержащий камеру исходного продукта с расположенным в ней резервуаром исходного продукта для вмещения исходного продукта.
11. Картридж по п.10, в котором камера исходного продукта содержит соединительную часть с горловиной для разборки контейнера исходного продукта для очистки.
12. Картридж по п.9, в котором стенка резервуара исходного продукта герметично закрыта уплотнением от стенки камеры исходного продукта.
13. Картридж по п.9, содержащий соединительную часть для загрузки и разгрузки резервуара исходного продукта из нижней части картриджа.
14. Картридж по п.13, содержащий выступающую вниз ручку для вытаскивания резервуара из камеры исходного продукта после открытия соединительной части.
15. Картридж по п.10, содержащий клапан для изоляции газового пространства камеры исходного продукта от выходного трубопровода источника.
16. Картридж по п.10, в котором резервуар исходного продукта содержит фильтр частиц, расположенный сверху резервуара исходного продукта.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/148,885 US8741062B2 (en) | 2008-04-22 | 2008-04-22 | Apparatus and methods for deposition reactors |
| US12/148,885 | 2008-04-22 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2010146303/02A Division RU2503744C2 (ru) | 2008-04-22 | 2009-04-15 | Устройство и способ для реакторов осаждения (варианты) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| RU2013120817A true RU2013120817A (ru) | 2014-11-10 |
| RU2630727C2 RU2630727C2 (ru) | 2017-09-12 |
Family
ID=41201340
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2013116787A RU2630731C2 (ru) | 2008-04-22 | 2009-04-15 | Устройство и способ для реакторов осаждения |
| RU2010146303/02A RU2503744C2 (ru) | 2008-04-22 | 2009-04-15 | Устройство и способ для реакторов осаждения (варианты) |
| RU2013120817A RU2630727C2 (ru) | 2008-04-22 | 2009-04-15 | Устройство и способы для реакторов осаждения |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2013116787A RU2630731C2 (ru) | 2008-04-22 | 2009-04-15 | Устройство и способ для реакторов осаждения |
| RU2010146303/02A RU2503744C2 (ru) | 2008-04-22 | 2009-04-15 | Устройство и способ для реакторов осаждения (варианты) |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US8741062B2 (ru) |
| EP (4) | EP2628820B1 (ru) |
| JP (3) | JP5635974B2 (ru) |
| KR (4) | KR101876465B1 (ru) |
| CN (3) | CN103266309B (ru) |
| RU (3) | RU2630731C2 (ru) |
| WO (1) | WO2009130375A1 (ru) |
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| US8211235B2 (en) * | 2005-03-04 | 2012-07-03 | Picosun Oy | Apparatuses and methods for deposition of material on surfaces |
| US20070080613A1 (en) * | 2006-09-20 | 2007-04-12 | Sterlite Optical Technologies Ltd | Storage and transportation device for storing and transporting optical fiber preform and precursors thereof |
| US9394608B2 (en) | 2009-04-06 | 2016-07-19 | Asm America, Inc. | Semiconductor processing reactor and components thereof |
| WO2010128968A1 (en) * | 2009-05-08 | 2010-11-11 | Mt Coatings, Llc | Apparatus and methods for forming modified metal coatings |
| JP5307072B2 (ja) * | 2009-06-17 | 2013-10-02 | 東京エレクトロン株式会社 | 金属酸化物膜の形成方法及び成膜装置 |
| US8802201B2 (en) | 2009-08-14 | 2014-08-12 | Asm America, Inc. | Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species |
| US8887720B2 (en) | 2010-04-26 | 2014-11-18 | Geno Llc | Delivery of ultra pure nitric oxide (NO) |
| WO2011151041A1 (en) * | 2010-06-04 | 2011-12-08 | Oc Oerlikon Balzers Ag | Vacuum processing device |
| US20110311726A1 (en) * | 2010-06-18 | 2011-12-22 | Cambridge Nanotech Inc. | Method and apparatus for precursor delivery |
| US8372687B2 (en) * | 2011-02-16 | 2013-02-12 | Ahbee1, Lp | System, method and apparatus for forming multiple layers in a single process chamber |
| RU2571547C2 (ru) * | 2011-04-07 | 2015-12-20 | Пикосан Ой | Реактор для осаждения с плазменным источником |
| RU2584841C2 (ru) * | 2011-04-07 | 2016-05-20 | Пикосан Ой | Атомно-слоевое осаждение с плазменным источником |
| US9312155B2 (en) | 2011-06-06 | 2016-04-12 | Asm Japan K.K. | High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules |
| US10854498B2 (en) | 2011-07-15 | 2020-12-01 | Asm Ip Holding B.V. | Wafer-supporting device and method for producing same |
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| DE102011113406A1 (de) | 2011-09-16 | 2013-03-21 | Amf Gmbh | Dampfquelle zur Abscheidung dünner Schichten |
| CN103031544A (zh) * | 2011-09-29 | 2013-04-10 | 中国科学院微电子研究所 | 一种可快速处理数据的原子层沉积设备 |
| CN103031546B (zh) * | 2011-09-29 | 2016-01-20 | 中国科学院微电子研究所 | 一种原子层沉积设备及其使用方法 |
| US9017481B1 (en) | 2011-10-28 | 2015-04-28 | Asm America, Inc. | Process feed management for semiconductor substrate processing |
| RU2600042C2 (ru) * | 2012-05-14 | 2016-10-20 | Пикосан Ой | Нанесение покрытия на мелкие частицы с использованием модуля для атомного осаждения |
| US20130312663A1 (en) * | 2012-05-22 | 2013-11-28 | Applied Microstructures, Inc. | Vapor Delivery Apparatus |
| JP2015525298A (ja) * | 2012-06-15 | 2015-09-03 | ピコサン オーワイPicosun Oy | 原子層堆積法による基板ウェブのコーティング |
| DE102012215708A1 (de) * | 2012-09-05 | 2014-03-06 | Osram Opto Semiconductors Gmbh | Vorratsbehälter für eine beschichtungsanlage und beschichtungsanlage |
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- 2009-04-15 KR KR1020137011028A patent/KR20130055703A/ko not_active Ceased
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- 2009-04-15 CN CN2009801140463A patent/CN102016118B/zh active Active
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