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PT2136958T - Processo e máquina para o processamento de peças de trabalho - Google Patents

Processo e máquina para o processamento de peças de trabalho

Info

Publication number
PT2136958T
PT2136958T PT87165759T PT08716575T PT2136958T PT 2136958 T PT2136958 T PT 2136958T PT 87165759 T PT87165759 T PT 87165759T PT 08716575 T PT08716575 T PT 08716575T PT 2136958 T PT2136958 T PT 2136958T
Authority
PT
Portugal
Prior art keywords
workpiece
machining
Prior art date
Application number
PT87165759T
Other languages
English (en)
Inventor
Hildebrand Peter
Kuhl Michael
Original Assignee
Sauer Gmbh Lasertec
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sauer Gmbh Lasertec filed Critical Sauer Gmbh Lasertec
Publication of PT2136958T publication Critical patent/PT2136958T/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
PT87165759T 2007-03-16 2008-03-17 Processo e máquina para o processamento de peças de trabalho PT2136958T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007012816A DE102007012816B4 (de) 2007-03-16 2007-03-16 Verfahren und Vorrichtung zur Werkstückbearbeitung

Publications (1)

Publication Number Publication Date
PT2136958T true PT2136958T (pt) 2016-10-12

Family

ID=39608225

Family Applications (1)

Application Number Title Priority Date Filing Date
PT87165759T PT2136958T (pt) 2007-03-16 2008-03-17 Processo e máquina para o processamento de peças de trabalho

Country Status (6)

Country Link
US (1) US8525076B2 (pt)
EP (1) EP2136958B1 (pt)
JP (1) JP5666141B2 (pt)
DE (1) DE102007012816B4 (pt)
PT (1) PT2136958T (pt)
WO (1) WO2008113535A1 (pt)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2011011369A (es) * 2009-04-27 2012-01-20 Echelon Laser Systems Lp Sistema grafico de linea grabada con laser escalonada, metodo y articulos de fabricacion.
DE102009044316B4 (de) * 2009-10-22 2015-04-30 Ewag Ag Verfahren zur Herstellung einer Fläche und/oder einer Kante an einem Rohling sowie Laserbearbeitungsvorrichtung zur Durchführung des Verfahrens
DE102010011508B4 (de) * 2010-03-15 2015-12-10 Ewag Ag Verfahren zur Herstellung zumindest einer Spannut und zumindest einer Schneidkante und Laserbearbeitungsvorrichtung
DE102011106097B4 (de) * 2011-06-09 2017-02-16 Cero Gmbh Verfahren und Vorrichtung zum Bearbeiten eines Werkstückes
DE102013217783A1 (de) * 2013-09-05 2015-03-05 Sauer Gmbh Lasertec Verfahren zur Bearbeitung eines Werkstücks mittels eines Laserstrahls, Laserwerkzeug, Lasermaschine, Maschinensteuerung
KR20190052516A (ko) * 2017-11-08 2019-05-16 삼성전자주식회사 표면 검사 장치
JP7435626B2 (ja) * 2019-12-26 2024-02-21 株式会社ニコン ビーム加工装置
DE102023109575B3 (de) 2023-04-17 2024-04-11 Jenoptik Automatisierungstechnik Gmbh Verfahren und Vorrichtung zum Erstellen einer aus Musterpunkten bestehenden Musterfigur in einem Werkstück, Bearbeitungsvorrichtung sowie Computerprogrammprodukt
WO2025002322A1 (zh) * 2023-06-28 2025-01-02 广州童心制物科技有限公司 加工元素的限位方法、装置、设备、程序介质和数控机器

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4749840A (en) * 1986-05-16 1988-06-07 Image Micro Systems, Inc. Intense laser irradiation using reflective optics
US4801352A (en) * 1986-12-30 1989-01-31 Image Micro Systems, Inc. Flowing gas seal enclosure for processing workpiece surface with controlled gas environment and intense laser irradiation
US4904340A (en) * 1988-10-31 1990-02-27 Microelectronics And Computer Technology Corporation Laser-assisted liquid-phase etching of copper conductors
DE3916264A1 (de) * 1989-05-18 1990-11-22 Diehl Gmbh & Co Einrichtung zur strahlfuehrung bei der laser-werkstueckbearbeitung
US5225650A (en) * 1989-07-14 1993-07-06 Maho Aktiengesellschaft Process and device for the manufacture of cavities in workpieces through laser beams
ES2054166T3 (es) * 1989-07-14 1994-08-01 Maho Ag Procedimiento y maquina herramienta para producir espacios huecos en piezas macizas por medio de rayo laser.
US5262613A (en) * 1991-09-24 1993-11-16 General Laser, Inc. Laser retrofit for mechanical engravers
US5368900A (en) * 1991-11-04 1994-11-29 Motorola, Inc. Multistep laser ablation method for making optical waveguide reflector
DE4209933C2 (de) 1992-03-27 1994-08-11 Foba Formenbau Gmbh Verfahren für den Formabtrag an einem Werkstück durch Laserstrahlverdampfung des Werkstoffes mit einem cw-Nd:YAG-Laser
US5546187A (en) * 1995-03-15 1996-08-13 Hughes Aircraft Company Self-referencing laser-based ultrasonic wave receiver
US6156220A (en) * 1997-03-10 2000-12-05 Ohlig; Albert H. System and method for optically aligning films and substrates used in printed circuit boards
US6670575B1 (en) * 1998-09-30 2003-12-30 Lasertec Gmbh Method and apparatus for removing substance from the surface of a workpiece
DE10032981A1 (de) * 2000-07-10 2002-01-24 Alltec Angewandte Laser Licht Verfahren zur Materialbearbeitung mittels Laser
DE10317822B4 (de) * 2003-04-16 2005-04-14 Concept Laser Gmbh Verfahren zum flächigen, schichtweisen Abtragen von Materialbereichen eines Werkstückes
JP4527003B2 (ja) 2005-05-24 2010-08-18 三菱電機株式会社 レーザ加工装置
JP4392388B2 (ja) 2005-06-20 2009-12-24 日立ビアメカニクス株式会社 穴明け方法及び穴明け装置
JP4711774B2 (ja) 2005-08-09 2011-06-29 日立ビアメカニクス株式会社 平板状ワークの加工方法

Also Published As

Publication number Publication date
JP5666141B2 (ja) 2015-02-12
DE102007012816B4 (de) 2009-12-03
US20100147815A1 (en) 2010-06-17
JP2010521314A (ja) 2010-06-24
EP2136958B1 (de) 2016-07-06
DE102007012816A1 (de) 2008-09-18
WO2008113535A1 (de) 2008-09-25
EP2136958A1 (de) 2009-12-30
US8525076B2 (en) 2013-09-03

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