PL3159435T3 - Additive for silver palladium alloy electrolytes - Google Patents
Additive for silver palladium alloy electrolytesInfo
- Publication number
- PL3159435T3 PL3159435T3 PL15190885T PL15190885T PL3159435T3 PL 3159435 T3 PL3159435 T3 PL 3159435T3 PL 15190885 T PL15190885 T PL 15190885T PL 15190885 T PL15190885 T PL 15190885T PL 3159435 T3 PL3159435 T3 PL 3159435T3
- Authority
- PL
- Poland
- Prior art keywords
- additive
- palladium alloy
- silver palladium
- alloy electrolytes
- electrolytes
- Prior art date
Links
- 229910001252 Pd alloy Inorganic materials 0.000 title 1
- 239000000654 additive Substances 0.000 title 1
- 230000000996 additive effect Effects 0.000 title 1
- 239000003792 electrolyte Substances 0.000 title 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/023—Composite material having a noble metal as the basic material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Composite Materials (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP15190885.2A EP3159435B1 (en) | 2015-10-21 | 2015-10-21 | Additive for silver palladium alloy electrolytes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3159435T3 true PL3159435T3 (en) | 2018-10-31 |
Family
ID=54360003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL15190885T PL3159435T3 (en) | 2015-10-21 | 2015-10-21 | Additive for silver palladium alloy electrolytes |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20190071789A1 (en) |
| EP (2) | EP3159435B1 (en) |
| JP (1) | JP2018535318A (en) |
| KR (1) | KR20180072774A (en) |
| CN (1) | CN108350592A (en) |
| PL (1) | PL3159435T3 (en) |
| TW (1) | TW201728787A (en) |
| WO (1) | WO2017067985A1 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3159435B1 (en) * | 2015-10-21 | 2018-05-23 | Umicore Galvanotechnik GmbH | Additive for silver palladium alloy electrolytes |
| ES2773771T3 (en) * | 2017-05-23 | 2020-07-14 | Saxonia Edelmetalle Gmbh | Preparation of noble metal salt, a method for the preparation thereof, and use for electroplating |
| DE102019106004B4 (en) * | 2019-03-08 | 2023-11-30 | Umicore Galvanotechnik Gmbh | Additive for the cyanide-free deposition of silver |
| CN112469847A (en) * | 2018-08-21 | 2021-03-09 | 优美科电镀技术有限公司 | Electrolyte for cyanide-free deposition of silver |
| DE102018126174B3 (en) * | 2018-10-22 | 2019-08-29 | Umicore Galvanotechnik Gmbh | Thermally stable silver alloy layers, methods of deposition and use |
| US11242609B2 (en) | 2019-10-15 | 2022-02-08 | Rohm and Hass Electronic Materials LLC | Acidic aqueous silver-nickel alloy electroplating compositions and methods |
| DE102020109818A1 (en) * | 2020-04-08 | 2021-04-22 | Doduco Solutions Gmbh | Electrical connector for connecting an electric vehicle to a charging station |
| CN111455360A (en) * | 2020-05-06 | 2020-07-28 | 广东工业大学 | Chemical palladium plating reducing agent and chemical palladium plating solution |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3915718A (en) * | 1972-10-04 | 1975-10-28 | Schering Ag | Chemical silver bath |
| DE2445538C2 (en) | 1974-09-20 | 1984-05-30 | Schering AG, 1000 Berlin und 4709 Bergkamen | Cyanide-free bath and process for the electrodeposition of precious metal alloys |
| US4126524A (en) * | 1975-03-12 | 1978-11-21 | Technic, Inc. | Silver complex, method of making said complex and method and electrolyte containing said complex for electroplating silver and silver alloys |
| DE3118908C2 (en) | 1981-05-13 | 1986-07-10 | Degussa Ag, 6000 Frankfurt | Galvanic palladium bath |
| US4465563A (en) * | 1982-12-22 | 1984-08-14 | Learonal, Inc. | Electrodeposition of palladium-silver alloys |
| US4478692A (en) * | 1982-12-22 | 1984-10-23 | Learonal, Inc. | Electrodeposition of palladium-silver alloys |
| PL157733B1 (en) * | 1988-05-10 | 1992-06-30 | Lubelska Polt | Palladium and silver alloys obtaining method |
| DE3935664C1 (en) * | 1989-10-26 | 1991-03-28 | W.C. Heraeus Gmbh, 6450 Hanau, De | Palladium-silver alloys for electrical contacts - deposited from ammoniacal bath contg. palladium tetramine complex, silver di:amine complex and organic sulphur cpd. |
| EP0693579B1 (en) * | 1994-07-21 | 1997-08-27 | W.C. Heraeus GmbH | Palladium-silver alloys electroplating bath |
| US6251249B1 (en) | 1996-09-20 | 2001-06-26 | Atofina Chemicals, Inc. | Precious metal deposition composition and process |
| JP2001335986A (en) * | 2000-05-30 | 2001-12-07 | Matsuda Sangyo Co Ltd | Palladium plating solution |
| FR2825721B1 (en) * | 2001-06-12 | 2003-10-03 | Engelhard Clal Sas | MIXTURE FOR USE AS A BRILLIANT IN A BATH OF ELECTROLYTIC DEPOSIT OF SILVER, GOLD OR ONE OF THEIR ALLOYS |
| US6773573B2 (en) * | 2001-10-02 | 2004-08-10 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| DE102011105207B4 (en) * | 2011-06-17 | 2015-09-10 | Umicore Galvanotechnik Gmbh | Electrolyte and its use for the deposition of black ruthenium coatings and coatings and articles obtained therefrom |
| US9512529B2 (en) * | 2013-06-04 | 2016-12-06 | Rohm And Haas Electronic Materials Llc | Electroplating baths of silver and tin alloys |
| DE102013215476B3 (en) * | 2013-08-06 | 2015-01-08 | Umicore Galvanotechnik Gmbh | Electrolyte for the electrodeposition of silver-palladium alloys and process for their deposition |
| EP3159435B1 (en) * | 2015-10-21 | 2018-05-23 | Umicore Galvanotechnik GmbH | Additive for silver palladium alloy electrolytes |
-
2015
- 2015-10-21 EP EP15190885.2A patent/EP3159435B1/en not_active Not-in-force
- 2015-10-21 PL PL15190885T patent/PL3159435T3/en unknown
-
2016
- 2016-10-06 TW TW105132420A patent/TW201728787A/en unknown
- 2016-10-19 WO PCT/EP2016/075096 patent/WO2017067985A1/en not_active Ceased
- 2016-10-19 JP JP2018520151A patent/JP2018535318A/en active Pending
- 2016-10-19 US US15/767,234 patent/US20190071789A1/en not_active Abandoned
- 2016-10-19 EP EP16784879.5A patent/EP3365478A1/en not_active Withdrawn
- 2016-10-19 CN CN201680061439.2A patent/CN108350592A/en active Pending
- 2016-10-19 KR KR1020187014301A patent/KR20180072774A/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| US20190071789A1 (en) | 2019-03-07 |
| EP3159435B1 (en) | 2018-05-23 |
| TW201728787A (en) | 2017-08-16 |
| WO2017067985A1 (en) | 2017-04-27 |
| KR20180072774A (en) | 2018-06-29 |
| JP2018535318A (en) | 2018-11-29 |
| EP3365478A1 (en) | 2018-08-29 |
| EP3159435A1 (en) | 2017-04-26 |
| CN108350592A (en) | 2018-07-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SG11201608933SA (en) | Lead-free solder alloy | |
| SG11201603421PA (en) | Lead-free, silver-free solder alloys | |
| SG11201605991UA (en) | Interface for mounting interchangable components | |
| EP3056578A4 (en) | Copper alloy | |
| ZA201502055B (en) | Methods for processing alloys | |
| AP2016009302A0 (en) | Copper processing method | |
| PL3159435T3 (en) | Additive for silver palladium alloy electrolytes | |
| PL2945772T3 (en) | Solder alloys | |
| SG11201508575XA (en) | Lead-free solder alloy | |
| EP3042984A4 (en) | Zinc alloy plating method | |
| PT3333856T (en) | Conductive composition | |
| PL3031566T3 (en) | Lead-free solder alloy | |
| SG11201505623XA (en) | Pb-FREE SOLDER ALLOY | |
| PT3006582T (en) | Copper alloy wire | |
| PT3320122T (en) | Brass alloy | |
| SI3253906T1 (en) | Electrolyte for electroplating | |
| SG10201504959UA (en) | Plating method | |
| GB201421949D0 (en) | Alloy | |
| GB201312000D0 (en) | Alloy | |
| SG11201600900SA (en) | Lead-free solder alloy | |
| EP3363928A4 (en) | Electroless platinum plating solution | |
| SG10201508104TA (en) | Alloyed silver wire | |
| GB201401906D0 (en) | Alloy | |
| SG11201800843PA (en) | An electrolytic device | |
| EP3394319A4 (en) | Gold plating solution |