[go: up one dir, main page]

PL3063798T3 - Termoelektryczna pompa ciepła ze strukturą otoczenia i przekładki (SAS) - Google Patents

Termoelektryczna pompa ciepła ze strukturą otoczenia i przekładki (SAS)

Info

Publication number
PL3063798T3
PL3063798T3 PL14799602T PL14799602T PL3063798T3 PL 3063798 T3 PL3063798 T3 PL 3063798T3 PL 14799602 T PL14799602 T PL 14799602T PL 14799602 T PL14799602 T PL 14799602T PL 3063798 T3 PL3063798 T3 PL 3063798T3
Authority
PL
Poland
Prior art keywords
sas
spacer
surround
heat pump
thermoelectric heat
Prior art date
Application number
PL14799602T
Other languages
English (en)
Inventor
Mattias K-O Olsson
Abhishek Yadav
Devon Newman
Original Assignee
Phononic Devices, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phononic Devices, Inc. filed Critical Phononic Devices, Inc.
Publication of PL3063798T3 publication Critical patent/PL3063798T3/pl

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/023—Mounting details thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Electromechanical Clocks (AREA)
PL14799602T 2013-10-28 2014-10-28 Termoelektryczna pompa ciepła ze strukturą otoczenia i przekładki (SAS) PL3063798T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361896287P 2013-10-28 2013-10-28
EP14799602.9A EP3063798B1 (en) 2013-10-28 2014-10-28 A thermoelectric heat pump with a surround and spacer (sas) structure

Publications (1)

Publication Number Publication Date
PL3063798T3 true PL3063798T3 (pl) 2017-11-30

Family

ID=51904250

Family Applications (1)

Application Number Title Priority Date Filing Date
PL14799602T PL3063798T3 (pl) 2013-10-28 2014-10-28 Termoelektryczna pompa ciepła ze strukturą otoczenia i przekładki (SAS)

Country Status (17)

Country Link
US (1) US9144180B2 (pl)
EP (1) EP3063798B1 (pl)
JP (1) JP6494645B2 (pl)
KR (1) KR102292432B1 (pl)
CN (1) CN105874623B (pl)
CY (1) CY1119278T1 (pl)
DK (1) DK3063798T3 (pl)
ES (1) ES2637481T3 (pl)
HR (1) HRP20171205T1 (pl)
HU (1) HUE035836T2 (pl)
LT (1) LT3063798T (pl)
PL (1) PL3063798T3 (pl)
PT (1) PT3063798T (pl)
RS (1) RS56195B1 (pl)
SI (1) SI3063798T1 (pl)
SM (1) SMT201700410T1 (pl)
WO (1) WO2015066049A1 (pl)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11950726B2 (en) 2010-11-02 2024-04-09 Ember Technologies, Inc. Drinkware container with active temperature control
US9814331B2 (en) 2010-11-02 2017-11-14 Ember Technologies, Inc. Heated or cooled dishware and drinkware
US10010213B2 (en) 2010-11-02 2018-07-03 Ember Technologies, Inc. Heated or cooled dishware and drinkware and food containers
US20130291555A1 (en) * 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
DE112015000816T5 (de) 2014-02-14 2016-11-03 Gentherm Incorporated Leitfähiger, konvektiver klimatisierter Sitz
US10458683B2 (en) 2014-07-21 2019-10-29 Phononic, Inc. Systems and methods for mitigating heat rejection limitations of a thermoelectric module
US11639816B2 (en) 2014-11-14 2023-05-02 Gentherm Incorporated Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system
US11857004B2 (en) 2014-11-14 2024-01-02 Gentherm Incorporated Heating and cooling technologies
USD816198S1 (en) 2015-01-28 2018-04-24 Phononic, Inc. Thermoelectric heat pump
JP6546414B2 (ja) * 2015-03-06 2019-07-17 株式会社Kelk 熱電発電ユニット
JP2018522408A (ja) * 2015-06-10 2018-08-09 ジェンサーム インコーポレイテッドＧｅｎｔｈｅｒｍ Ｉｎｃｏｒｐｏｒａｔｅｄ 車両バッテリのための仮圧縮性圧縮リミッタを備える熱電モジュール
JP6527250B2 (ja) * 2015-06-10 2019-06-05 ジェンサーム インコーポレイテッドＧｅｎｔｈｅｒｍ Ｉｎｃｏｒｐｏｒａｔｅｄ 低温プレートアセンブリ一体化車両バッテリ熱電素子と熱電素子の組立方法
WO2016200899A2 (en) * 2015-06-10 2016-12-15 Gentherm Inc. Thermoelectric module with thermal isolation features for vehicle battery
CN107735638A (zh) * 2015-06-10 2018-02-23 金瑟姆股份有限公司 具有改进的传热和隔热特征的运载工具电池热电模块
ES2948113T3 (es) * 2016-06-20 2023-08-31 Phononic Inc Un sistema de control de microclima
US11249522B2 (en) 2016-06-30 2022-02-15 Intel Corporation Heat transfer apparatus for a computer environment
CA3039382C (en) * 2016-10-07 2023-10-03 Marlow Industries, Inc. Variable band for thermoelectric modules
DE102016014686B4 (de) * 2016-12-12 2018-08-02 Gentherm Gmbh Thermoelektrische Einrichtung, Verfahren zu seiner Herstellung, Getränkehalter für ein Fahrzeug sowie Temperier-Vorrichtung für Sitze
USD833588S1 (en) 2017-10-11 2018-11-13 Phononic, Inc. Thermoelectric heat pump
CN118935853A (zh) 2018-04-19 2024-11-12 恩伯技术公司 具有主动温度控制的便携式冷却器
US11075331B2 (en) 2018-07-30 2021-07-27 Gentherm Incorporated Thermoelectric device having circuitry with structural rigidity
CN113167510B (zh) 2018-11-30 2025-10-03 金瑟姆股份公司 热电调节系统和方法
JP7430728B2 (ja) 2019-01-11 2024-02-13 エンバー テクノロジーズ， インコーポレイテッド 能動的温度制御を備える可搬式冷却器
US11152557B2 (en) * 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board
US11670813B2 (en) 2019-04-01 2023-06-06 Applied Thermoelectric Solutions, LLC Electrically insulative and thermally conductive parallel battery cooling and temperature control system
KR20220027144A (ko) 2019-06-25 2022-03-07 엠버 테크놀로지스 인코포레이티드 휴대용 쿨러
US11668508B2 (en) 2019-06-25 2023-06-06 Ember Technologies, Inc. Portable cooler
US11162716B2 (en) 2019-06-25 2021-11-02 Ember Technologies, Inc. Portable cooler
WO2021134068A1 (en) 2019-12-26 2021-07-01 Phononic, Inc. Thermoelectric refrigerated/frozen product storage and transportation cooler
EP4100683A1 (en) 2020-02-04 2022-12-14 Phononic, Inc. Systems and methods for fluid-dynamic isolation of actively conditioned and return air flow in unconstrained environments
WO2021202147A1 (en) 2020-04-03 2021-10-07 Ember Technologies, Inc. Portable cooler with active temperature control
KR102808773B1 (ko) * 2020-06-12 2025-05-16 엘지이노텍 주식회사 발전장치
JP7672435B2 (ja) * 2020-06-15 2025-05-07 エルジー イノテック カンパニー リミテッド 熱電モジュール及びこれを含む発電装置
WO2021256852A1 (ko) * 2020-06-18 2021-12-23 엘지이노텍 주식회사 열전모듈 및 이를 포함하는 발전장치
JP7588507B2 (ja) 2020-12-23 2024-11-22 株式会社Kelk 熱電発電装置
EP4367463A1 (en) 2021-07-09 2024-05-15 Phononic, Inc. High reliability, microchannel heat pipe array for improved efficiency, simplified charging/discharging and low-cost manufacture
CN117769633A (zh) 2021-07-09 2024-03-26 弗诺尼克公司 针对饮料质量和快速降温时间优化的饮料冷却器控制方案
US20230085105A1 (en) 2021-09-15 2023-03-16 Phononic, Inc. Intelligent actively cooled tote
US20230194141A1 (en) 2021-12-17 2023-06-22 Phononic, Inc. Countertop freezer

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2497150A (en) 1946-08-23 1950-02-14 Standard Oil Dev Co Process for the control of foaming
FR1310228A (pl) 1961-01-06 1963-03-06
US3196620A (en) 1964-02-10 1965-07-27 Thore M Elfving Thermoelectric cooling system
JP3533826B2 (ja) * 1996-05-29 2004-05-31 アイシン精機株式会社 熱変換装置
JPH10125962A (ja) * 1996-10-22 1998-05-15 Nanba Kikujiro 熱電変換装置
US6314741B1 (en) 1997-08-25 2001-11-13 Citizen Watch Co., Ltd. Thermoelectric device
ES2159218B1 (es) 1998-05-14 2002-04-01 Consejo Superior Investigacion Refrigerador domestico con efecto peltier, acumuladores termicos y termosifones evaporativos.
JP2000124510A (ja) * 1998-10-19 2000-04-28 Nissan Motor Co Ltd 電子冷却モジュール
US20040068991A1 (en) * 1999-10-07 2004-04-15 Ben Banney Heat exchanger for an electronic heat pump
CA2305647C (en) 2000-04-20 2006-07-11 Jacques Laliberte Modular thermoelectric unit and cooling system using same
US6345507B1 (en) * 2000-09-29 2002-02-12 Electrografics International Corporation Compact thermoelectric cooling system
US6712258B2 (en) 2001-12-13 2004-03-30 International Business Machines Corporation Integrated quantum cold point coolers
WO2004054007A2 (en) 2002-12-09 2004-06-24 M.T.R.E Advanced Technologies Ltd. Thermoelectric heat pumps
US6804965B2 (en) 2003-02-12 2004-10-19 Applied Integrated Systems, Inc. Heat exchanger for high purity and corrosive fluids
US6880345B1 (en) 2003-11-04 2005-04-19 Intel Corporation Cooling system for an electronic component
US7032389B2 (en) 2003-12-12 2006-04-25 Thermoelectric Design, Llc Thermoelectric heat pump with direct cold sink support
US7051536B1 (en) * 2004-11-12 2006-05-30 Bio-Rad Laboratories, Inc. Thermal cycler with protection from atmospheric moisture
US7703291B2 (en) * 2005-04-15 2010-04-27 March Networks Corporation Contained environmental control system for mobile event data recorder
US7861538B2 (en) 2006-07-26 2011-01-04 The Aerospace Corporation Thermoelectric-based refrigerator apparatuses
US20080098750A1 (en) 2006-10-27 2008-05-01 Busier Mark J Thermoelectric cooling/heating device
US8209989B2 (en) 2007-03-30 2012-07-03 Intel Corporation Microarchitecture control for thermoelectric cooling
WO2008148042A2 (en) 2007-05-25 2008-12-04 Bsst Llc System and method for distributed thermoelectric heating and colling
KR20130028035A (ko) 2009-10-05 2013-03-18 더 보드 오브 리젠츠 오브 더 유니버시티 오브 오클라호마 박막 열전 모듈 제조를 위한 방법
WO2011127416A2 (en) * 2010-04-09 2011-10-13 Arnold Anthony P Improved mechanical support for a thin-film thermoelectric cooling device
JP2012156227A (ja) * 2011-01-25 2012-08-16 National Institute Of Advanced Industrial & Technology 熱電発電モジュールのケーシング及びその製造方法
US8649179B2 (en) 2011-02-05 2014-02-11 Laird Technologies, Inc. Circuit assemblies including thermoelectric modules
JP5488510B2 (ja) 2011-03-25 2014-05-14 株式会社豊田自動織機 熱電変換ユニット
DE102011075661A1 (de) 2011-03-29 2012-10-04 Micropelt Gmbh Thermoelektrische Anordnung und Verfahren zum Herstelleneiner thermoelektrischen Anordnung
JP2013077810A (ja) * 2011-09-12 2013-04-25 Yamaha Corp 熱電装置
US8997502B2 (en) * 2012-03-01 2015-04-07 Marlow Industries, Inc. Thermoelectric assembly for improved airflow
EP2848101B1 (en) * 2012-05-07 2019-04-10 Phononic Devices, Inc. Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance
US20130291555A1 (en) 2012-05-07 2013-11-07 Phononic Devices, Inc. Thermoelectric refrigeration system control scheme for high efficiency performance
US9437518B2 (en) * 2012-10-29 2016-09-06 Samsung Electronics Co., Ltd. Semiconductor module

Also Published As

Publication number Publication date
EP3063798A1 (en) 2016-09-07
CY1119278T1 (el) 2018-02-14
WO2015066049A1 (en) 2015-05-07
SMT201700410T1 (it) 2017-09-07
LT3063798T (lt) 2017-08-25
JP6494645B2 (ja) 2019-04-03
US20150116943A1 (en) 2015-04-30
EP3063798B1 (en) 2017-07-05
US9144180B2 (en) 2015-09-22
ES2637481T3 (es) 2017-10-13
CN105874623A (zh) 2016-08-17
PT3063798T (pt) 2017-08-01
HUE035836T2 (en) 2018-05-28
JP2017502527A (ja) 2017-01-19
RS56195B1 (sr) 2017-11-30
DK3063798T3 (en) 2017-08-28
KR102292432B1 (ko) 2021-08-20
SI3063798T1 (sl) 2017-10-30
HRP20171205T1 (hr) 2017-10-06
KR20160077078A (ko) 2016-07-01
CN105874623B (zh) 2019-01-29

Similar Documents

Publication Publication Date Title
SMT201700410T1 (it) Pompa di calore termoelettrica con una struttura di contorno e spaziamento (sas)
BR302013002320S1 (pt) Configuração aplicada em computador tipo tablet
BR302014001231S1 (pt) Configuração aplicada em torradeira.
PL2956422T3 (pl) Oszklenie przeciwsłoneczne
EP3029395A4 (en) Heat pump device
BR302013005760S1 (pt) Configuração aplicada em computador tablet
GB201317148D0 (en) Computer game with physics element
PL2827185T3 (pl) Urządzenie wyświetlacza z czujnikami fotoelektrycznymi podczerwieni
BR302013005762S1 (pt) Configuração aplicada em computador tablet
EP3006848A4 (en) Heat pump device
GB2516006B (en) Wine thermometer
PL3011187T3 (pl) Pompa z urządzeniem grzewczym
EP3009767A4 (en) Heat pump device
PT3301238T (pt) Elemento de perfil com lábio e linguetas e espaçador associado
PL2816302T3 (pl) Urządzenie chłodnicze ze wspornikiem dystansowym
PL2823732T3 (pl) System meblowy z elementem meblowym
GB201312188D0 (en) Heat Pump
DE112014002244A5 (de) Infusionslösung
TWM476314U (en) Touch-control structure and its manufacturing device
DK3012542T3 (da) Varmepumpeindretning
GB201511443D0 (en) Rugged Scintillation crystal assembly
GB2518518B (en) Spacer
TWM475464U (en) Sputtering structure with external heater
TWM476969U (en) Password input structure
TWI560424B (en) Heat-dissipating assembly structure