PL2735025T3 - Moduł optoelektroniczny z układem soczewek - Google Patents
Moduł optoelektroniczny z układem soczewekInfo
- Publication number
- PL2735025T3 PL2735025T3 PL12737715T PL12737715T PL2735025T3 PL 2735025 T3 PL2735025 T3 PL 2735025T3 PL 12737715 T PL12737715 T PL 12737715T PL 12737715 T PL12737715 T PL 12737715T PL 2735025 T3 PL2735025 T3 PL 2735025T3
- Authority
- PL
- Poland
- Prior art keywords
- lens system
- optoelectronic module
- optoelectronic
- module
- lens
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00278—Lenticular sheets
- B29D11/00298—Producing lens arrays
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0009—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
- G02B19/0014—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only at least one surface having optical power
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
- G02B19/0066—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED in the form of an LED array
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Ophthalmology & Optometry (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102011107895.2A DE102011107895B4 (de) | 2011-07-18 | 2011-07-18 | Optoelektronisches Modul mit Linsensystem |
| PCT/EP2012/002838 WO2013010636A1 (de) | 2011-07-18 | 2012-07-06 | Optoelektronisches modul mit linsensystem |
| EP12737715.8A EP2735025B1 (de) | 2011-07-18 | 2012-07-06 | Optoelektronisches modul mit linsensystem |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL2735025T3 true PL2735025T3 (pl) | 2019-10-31 |
Family
ID=46548382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL12737715T PL2735025T3 (pl) | 2011-07-18 | 2012-07-06 | Moduł optoelektroniczny z układem soczewek |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US9640579B2 (pl) |
| EP (1) | EP2735025B1 (pl) |
| JP (1) | JP5963858B2 (pl) |
| KR (2) | KR20140057554A (pl) |
| CN (1) | CN103918077A (pl) |
| CA (1) | CA2842117C (pl) |
| DE (1) | DE102011107895B4 (pl) |
| ES (1) | ES2736259T3 (pl) |
| PL (1) | PL2735025T3 (pl) |
| WO (1) | WO2013010636A1 (pl) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013203912A1 (de) | 2013-03-07 | 2014-09-11 | Zumtobel Lighting Gmbh | LED-Leuchtmodul und Leuchte mit wenigstens einem LED-Leuchtmodul |
| CN105980769B (zh) * | 2014-02-10 | 2019-03-01 | 飞利浦灯具控股公司 | 舒适的分布式led照明 |
| ES2659784T3 (es) | 2015-03-13 | 2018-03-19 | Lunux Gmbh | Módulo de iluminación |
| DE202015104292U1 (de) * | 2015-08-14 | 2016-11-15 | Zumtobel Lighting Gmbh | LED-Anordnung mit Pitch-Kompensation |
| JP6294898B2 (ja) * | 2016-01-15 | 2018-03-14 | Hoya Candeo Optronics株式会社 | 光照射装置 |
| DE102016107495B4 (de) * | 2016-04-22 | 2022-04-14 | Tdk Electronics Ag | Vielschicht-Trägersystem, Verfahren zur Herstellung eines Vielschicht-Trägersystems und Verwendung eines Vielschicht-Trägersystems |
| DE102016107493B4 (de) * | 2016-04-22 | 2021-10-14 | Tdk Electronics Ag | Trägersystem, Verfahren zu seiner Herstellung und Verwendung desselben |
| DE102017011881A1 (de) * | 2017-12-21 | 2019-06-27 | Gunther Ackermann | Vorrichtung zur Bestrahlung eines Gegenstandes |
| CN109273469A (zh) * | 2018-09-17 | 2019-01-25 | 德淮半导体有限公司 | 图像传感器及其形成方法 |
| JP6900603B2 (ja) * | 2018-10-12 | 2021-07-07 | 株式会社Uskテクノロジー | 光源装置 |
| DE112019005473T5 (de) * | 2018-11-02 | 2021-08-12 | Ams Sensors Singapore Pte. Ltd. | Herstellung optischer Elementmodule |
| EP3908099A4 (en) * | 2019-01-10 | 2022-11-30 | Verdant Lighting Technology, Inc. | OPTICAL SYSTEM FOR PLANT GROWTH WITH NON-UNIFORM LIGHT DENSITY DISTRIBUTION |
| CN109780476B (zh) * | 2019-03-08 | 2024-07-02 | 欧普照明股份有限公司 | 发光单元排布结构、光源模组以及投光灯 |
| US10761243B1 (en) * | 2019-08-26 | 2020-09-01 | Jute Industrial Co., Ltd. | Optical device |
| CN110861398B (zh) * | 2019-12-17 | 2024-09-24 | 陈诗剑 | 一种uv-led光源系统 |
| CN210860730U (zh) * | 2019-12-27 | 2020-06-26 | 苏州欧普照明有限公司 | 光源模组以及灯具 |
| US20220034497A1 (en) * | 2020-02-18 | 2022-02-03 | Exposure Illumination Architects, Inc. | Light emitting heat dissipating structure |
| US12025294B2 (en) | 2020-04-09 | 2024-07-02 | Usk Technology Co., Ltd. | Light source device |
| JP2023099236A (ja) * | 2020-05-22 | 2023-07-12 | ソニーセミコンダクタソリューションズ株式会社 | 発光装置および測距装置 |
| CN111486352A (zh) * | 2020-05-29 | 2020-08-04 | 欧普照明电器(中山)有限公司 | 配光元件及灯具 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0294673A (ja) | 1988-09-30 | 1990-04-05 | Toshiba Lighting & Technol Corp | 発光ダイオードアレイ |
| JP2566087B2 (ja) * | 1992-01-27 | 1996-12-25 | 株式会社東芝 | 有色マイクロレンズアレイ及びその製造方法 |
| JPH07211943A (ja) * | 1994-01-25 | 1995-08-11 | Nikon Corp | 光源装置 |
| SE503306C2 (sv) * | 1994-03-16 | 1996-05-13 | Itab Ind Ab | Belysningsanordning |
| JP2001196637A (ja) * | 2000-01-11 | 2001-07-19 | Toyoda Gosei Co Ltd | 発光装置 |
| US6556349B2 (en) | 2000-12-27 | 2003-04-29 | Honeywell International Inc. | Variable focal length micro lens array field curvature corrector |
| US6773139B2 (en) * | 2001-09-17 | 2004-08-10 | Gelcore Llp | Variable optics spot module |
| JP2005114924A (ja) * | 2003-10-06 | 2005-04-28 | Pentax Corp | 撮影用照明装置 |
| WO2005041632A2 (en) | 2003-10-31 | 2005-05-12 | Phoseon Technology, Inc. | Collection optics for led array with offset hemispherical or faceted surfaces |
| DE102004036157B4 (de) * | 2004-07-26 | 2023-03-16 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Leuchtmodul |
| US7068432B2 (en) * | 2004-07-27 | 2006-06-27 | Micron Technology, Inc. | Controlling lens shape in a microlens array |
| TWI261654B (en) * | 2004-12-29 | 2006-09-11 | Ind Tech Res Inst | Lens and LED with uniform light emitted applying the lens |
| JP4905630B2 (ja) * | 2005-07-14 | 2012-03-28 | 東芝ライテック株式会社 | 照明装置 |
| US7284871B2 (en) * | 2005-08-08 | 2007-10-23 | Avago Technologies Ecb4 Ip (Singapore) Pte Ltd | Light-emitting diode module for flash and auto-focus application |
| US7847302B2 (en) | 2005-08-26 | 2010-12-07 | Koninklijke Philips Electronics, N.V. | Blue LED with phosphor layer for producing white light and different phosphor in outer lens for reducing color temperature |
| JP2007080526A (ja) * | 2005-09-09 | 2007-03-29 | Matsushita Electric Works Ltd | 発光装置 |
| JP4843324B2 (ja) * | 2006-01-31 | 2011-12-21 | 京セラ株式会社 | 発光素子アレイおよび光プリントヘッドならびに画像形成装置 |
| DE102007001706A1 (de) * | 2007-01-11 | 2008-07-17 | Osram Opto Semiconductors Gmbh | Gehäuse für optoelektronisches Bauelement und Anordnung eines optoelektronischen Bauelementes in einem Gehäuse |
| JP2008207450A (ja) | 2007-02-27 | 2008-09-11 | Towa Corp | 発光素子の圧縮成形方法 |
| JP2010192347A (ja) * | 2009-02-20 | 2010-09-02 | Hitachi Ltd | 光源モジュール、並びにこれを用いた照明装置,液晶表示装置、及び映像表示装置 |
| JP5327042B2 (ja) * | 2009-03-26 | 2013-10-30 | 豊田合成株式会社 | Ledランプの製造方法 |
| DE102009015313B4 (de) * | 2009-03-27 | 2022-02-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Anzeigeeinrichtung |
| US20100321640A1 (en) * | 2009-06-22 | 2010-12-23 | Industrial Technology Research Institute | Projection display chip |
| EP2453163A4 (en) * | 2009-07-06 | 2013-08-14 | Sharp Kk | LIGHTING DEVICE, DISPLAY DEVICE AND TELEVISION RECEIVER |
| CN101949494A (zh) * | 2009-07-10 | 2011-01-19 | 富准精密工业(深圳)有限公司 | 发光组件 |
| DE102009039982A1 (de) * | 2009-09-03 | 2011-03-10 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zum Herstellen eines optoelektronischen Halbleiterbauelements |
| CN102135239B (zh) * | 2010-01-21 | 2013-01-23 | 财团法人工业技术研究院 | 照明装置及其光学元件模块 |
| DE102010013286B4 (de) | 2010-03-29 | 2012-03-22 | Heraeus Noblelight Gmbh | LED-Lampe zur homogenen Ausleuchtung von Hohlkörpern |
| DE102010044471A1 (de) | 2010-09-06 | 2012-03-08 | Heraeus Noblelight Gmbh | Beschichtungsverfahren für ein optoelektronisches Chip-On-Board-Modul |
| DE102010044470B4 (de) | 2010-09-06 | 2018-06-28 | Heraeus Noblelight Gmbh | Verfahren zur Beschichtung eines optoelektronischen Chip-On-Board-Moduls, optoelektronisches Chip-On-Board-Modul und System damit |
-
2011
- 2011-07-18 DE DE102011107895.2A patent/DE102011107895B4/de not_active Expired - Fee Related
-
2012
- 2012-07-06 ES ES12737715T patent/ES2736259T3/es active Active
- 2012-07-06 CA CA2842117A patent/CA2842117C/en not_active Expired - Fee Related
- 2012-07-06 US US14/232,298 patent/US9640579B2/en not_active Expired - Fee Related
- 2012-07-06 KR KR1020147003970A patent/KR20140057554A/ko not_active Ceased
- 2012-07-06 CN CN201280035543.6A patent/CN103918077A/zh active Pending
- 2012-07-06 KR KR1020167004528A patent/KR20160027240A/ko not_active Ceased
- 2012-07-06 PL PL12737715T patent/PL2735025T3/pl unknown
- 2012-07-06 EP EP12737715.8A patent/EP2735025B1/de not_active Not-in-force
- 2012-07-06 JP JP2014520557A patent/JP5963858B2/ja not_active Expired - Fee Related
- 2012-07-06 WO PCT/EP2012/002838 patent/WO2013010636A1/de not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| US20140339440A1 (en) | 2014-11-20 |
| JP5963858B2 (ja) | 2016-08-03 |
| CA2842117C (en) | 2020-08-18 |
| US9640579B2 (en) | 2017-05-02 |
| CA2842117A1 (en) | 2013-01-24 |
| DE102011107895A1 (de) | 2013-01-24 |
| DE102011107895B4 (de) | 2020-11-05 |
| EP2735025B1 (de) | 2019-04-24 |
| KR20140057554A (ko) | 2014-05-13 |
| KR20160027240A (ko) | 2016-03-09 |
| ES2736259T3 (es) | 2019-12-27 |
| JP2014523650A (ja) | 2014-09-11 |
| WO2013010636A1 (de) | 2013-01-24 |
| CN103918077A (zh) | 2014-07-09 |
| EP2735025A1 (de) | 2014-05-28 |
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