PL1945401T3 - Urządzenie i sposób do rozdzielania materiału przy użyciu impulsów laserowych, z energią impulsu laserowego mniejszą niż energia impulsu laserowego do uzyskania rozdzielenia materiału - Google Patents
Urządzenie i sposób do rozdzielania materiału przy użyciu impulsów laserowych, z energią impulsu laserowego mniejszą niż energia impulsu laserowego do uzyskania rozdzielenia materiałuInfo
- Publication number
- PL1945401T3 PL1945401T3 PL06777003T PL06777003T PL1945401T3 PL 1945401 T3 PL1945401 T3 PL 1945401T3 PL 06777003 T PL06777003 T PL 06777003T PL 06777003 T PL06777003 T PL 06777003T PL 1945401 T3 PL1945401 T3 PL 1945401T3
- Authority
- PL
- Poland
- Prior art keywords
- laser
- energy
- laser pulses
- sequence
- laser pulse
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 4
- 238000000926 separation method Methods 0.000 title 1
- 230000006735 deficit Effects 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Lasers (AREA)
- Laser Surgery Devices (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102005039833A DE102005039833A1 (de) | 2005-08-22 | 2005-08-22 | Vorrichtung und Verfahren zur Materialtrennung mit Laserpulsen |
| PCT/EP2006/008225 WO2007022948A2 (de) | 2005-08-22 | 2006-08-21 | Vorrichtung und verfahren zur materialtrennung mit laserpulsen, mit energie eines laserpuls kleiner als die energie eines laserpuls zum erzeugung einer materialtrennung |
| EP06777003.2A EP1945401B2 (de) | 2005-08-22 | 2006-08-21 | Vorrichtung und verfahren zur materialtrennung mit laserpulsen, mit energie eines laserpuls kleiner als die energie eines laserpuls zum erzeugen einer materialtrennung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL1945401T3 true PL1945401T3 (pl) | 2013-01-31 |
Family
ID=37198698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL06777003T PL1945401T3 (pl) | 2005-08-22 | 2006-08-21 | Urządzenie i sposób do rozdzielania materiału przy użyciu impulsów laserowych, z energią impulsu laserowego mniejszą niż energia impulsu laserowego do uzyskania rozdzielenia materiału |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US9162319B2 (pl) |
| EP (1) | EP1945401B2 (pl) |
| JP (1) | JP2009504415A (pl) |
| CN (1) | CN101257993A (pl) |
| AT (1) | ATE552065T1 (pl) |
| CA (1) | CA2619857C (pl) |
| DE (1) | DE102005039833A1 (pl) |
| PL (1) | PL1945401T3 (pl) |
| WO (1) | WO2007022948A2 (pl) |
Families Citing this family (83)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8221400B2 (en) | 2005-08-22 | 2012-07-17 | Sie Surgical Instruments Engineering Ag | Apparatus for and method of refractive surgery with laser pulses |
| US20080065052A1 (en) * | 2005-10-14 | 2008-03-13 | Carl Zeiss Meditec Ag | Device and method for material processing by means of laser radiation |
| DE102005049281A1 (de) * | 2005-10-14 | 2007-04-19 | Carl Zeiss Meditec Ag | Vorrichtung und Verfahren zur Materialbearbeitung mittels Laserstrahlung |
| DE102007012815B4 (de) | 2007-03-16 | 2024-06-06 | Dmg Mori Ultrasonic Lasertec Gmbh | Verfahren und Vorrichtung zur Bildung eines Gesenks |
| DE102007017119A1 (de) | 2007-04-11 | 2008-10-16 | Carl Zeiss Meditec Ag | Vorrichtung und Verfahren zur Materialbearbeitung mittels Laserstrahlung |
| WO2009003107A1 (en) * | 2007-06-26 | 2008-12-31 | Bausch & Lomb Incorporated | Method for modifying the refractive index of ocular tissues |
| US8231612B2 (en) * | 2007-11-19 | 2012-07-31 | Amo Development Llc. | Method of making sub-surface photoalterations in a material |
| US9108270B2 (en) | 2008-01-02 | 2015-08-18 | Amo Development, Llc | System and method for scanning a pulsed laser beam |
| US9101446B2 (en) | 2008-01-02 | 2015-08-11 | Intralase Corp. | System and method for scanning a pulsed laser beam |
| JP2009291865A (ja) * | 2008-06-04 | 2009-12-17 | Rezakku:Kk | 抜き型の製造方法および抜き型 |
| DE102009012873B4 (de) | 2009-03-12 | 2021-08-19 | Carl Zeiss Meditec Ag | Ophthalmologisches Lasersystem und Steuereinheit |
| WO2010139841A1 (en) * | 2009-06-04 | 2010-12-09 | Corelase Oy | Method and apparatus for processing substrates |
| DE102009038590B4 (de) * | 2009-08-26 | 2017-02-16 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Bearbeitung von Werkstücken mit Laserstrahlung |
| EP2332688A1 (de) * | 2009-12-08 | 2011-06-15 | LCD Laser Cut AG | Verfahren zum Herstellen eines magnetisierbaren Körpers |
| JP5397768B2 (ja) * | 2009-12-10 | 2014-01-22 | 三菱マテリアル株式会社 | レーザ加工装置およびレーザ加工方法 |
| DE102010022634A1 (de) | 2010-06-03 | 2011-12-08 | Carl Zeiss Meditec Ag | Vorrichtung und Verfahren zur Steuerung eines Lasersystems |
| DE102010023568A1 (de) * | 2010-06-08 | 2011-12-08 | Forschungsverbund Berlin E.V. | Verfahren und Vorrichtung zum Herstellen nanostrukturierter Oberflächen |
| JP5634765B2 (ja) * | 2010-06-24 | 2014-12-03 | 東芝機械株式会社 | パルスレーザ加工方法およびパルスレーザ加工用データ作成方法 |
| KR102088722B1 (ko) * | 2010-07-12 | 2020-03-17 | 로핀-시나르 테크놀로지스 엘엘씨 | 레이저 필라멘테이션에 의한 재료 가공 방법 |
| DE102011078825B4 (de) | 2011-07-07 | 2018-07-19 | Sauer Gmbh Lasertec | Verfahren und Laserbearbeitungsmaschine zur Bearbeitung eines Werkstücks |
| DE102012205702B3 (de) * | 2012-04-05 | 2013-05-23 | Schaeffler Technologies AG & Co. KG | Verfahren zum Markieren von Bauteilen |
| DE102012019438B4 (de) | 2012-10-04 | 2015-05-21 | Medite Gmbh | Verfahren und Vorrichtung zur Bearbeitung histologischer Gewebeproben |
| WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
| EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
| DE102013212577A1 (de) * | 2013-06-28 | 2014-12-31 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren zum Abtragschneiden eines Werkstücks mittels eines gepulsten Laserstrahls |
| US9102007B2 (en) | 2013-08-02 | 2015-08-11 | Rofin-Sinar Technologies Inc. | Method and apparatus for performing laser filamentation within transparent materials |
| US9102011B2 (en) | 2013-08-02 | 2015-08-11 | Rofin-Sinar Technologies Inc. | Method and apparatus for non-ablative, photoacoustic compression machining in transparent materials using filamentation by burst ultrafast laser pulses |
| US10017410B2 (en) | 2013-10-25 | 2018-07-10 | Rofin-Sinar Technologies Llc | Method of fabricating a glass magnetic hard drive disk platter using filamentation by burst ultrafast laser pulses |
| US10252507B2 (en) | 2013-11-19 | 2019-04-09 | Rofin-Sinar Technologies Llc | Method and apparatus for forward deposition of material onto a substrate using burst ultrafast laser pulse energy |
| US10005152B2 (en) | 2013-11-19 | 2018-06-26 | Rofin-Sinar Technologies Llc | Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses |
| US11053156B2 (en) | 2013-11-19 | 2021-07-06 | Rofin-Sinar Technologies Llc | Method of closed form release for brittle materials using burst ultrafast laser pulses |
| US9517929B2 (en) | 2013-11-19 | 2016-12-13 | Rofin-Sinar Technologies Inc. | Method of fabricating electromechanical microchips with a burst ultrafast laser pulses |
| US10144088B2 (en) | 2013-12-03 | 2018-12-04 | Rofin-Sinar Technologies Llc | Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses |
| US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
| US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
| US9517963B2 (en) | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
| US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
| US9815730B2 (en) * | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
| US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| US20150187558A1 (en) * | 2013-12-27 | 2015-07-02 | Imra America, Inc. | Pulse-burst assisted electrospray ionization mass spectrometer |
| US9938187B2 (en) | 2014-02-28 | 2018-04-10 | Rofin-Sinar Technologies Llc | Method and apparatus for material processing using multiple filamentation of burst ultrafast laser pulses |
| KR102445217B1 (ko) | 2014-07-08 | 2022-09-20 | 코닝 인코포레이티드 | 재료를 레이저 가공하는 방법 및 장치 |
| US10611667B2 (en) | 2014-07-14 | 2020-04-07 | Corning Incorporated | Method and system for forming perforations |
| WO2016010991A1 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
| TWI659793B (zh) * | 2014-07-14 | 2019-05-21 | 美商康寧公司 | 用於使用可調整雷射束焦線來處理透明材料的系統及方法 |
| WO2016010943A2 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Method and system for arresting crack propagation |
| US9757815B2 (en) | 2014-07-21 | 2017-09-12 | Rofin-Sinar Technologies Inc. | Method and apparatus for performing laser curved filamentation within transparent materials |
| US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
| EP3245166B1 (en) | 2015-01-12 | 2020-05-27 | Corning Incorporated | Laser cutting of thermally tempered substrates using the multi photon absorption method |
| KR101972466B1 (ko) | 2015-01-13 | 2019-04-25 | 로핀-시나르 테크놀로지스 엘엘씨 | 취성 재료를 묘각하고 화학 식각하는 방법 및 시스템 |
| EP3848334A1 (en) | 2015-03-24 | 2021-07-14 | Corning Incorporated | Alkaline earth boro-aluminosilicate glass article with laser cut edge |
| WO2016160391A1 (en) | 2015-03-27 | 2016-10-06 | Corning Incorporated | Gas permeable window and method of fabricating the same |
| US11186060B2 (en) | 2015-07-10 | 2021-11-30 | Corning Incorporated | Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same |
| MY194570A (en) | 2016-05-06 | 2022-12-02 | Corning Inc | Laser cutting and removal of contoured shapes from transparent substrates |
| US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
| US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
| CN109803934A (zh) | 2016-07-29 | 2019-05-24 | 康宁股份有限公司 | 用于激光处理的装置和方法 |
| WO2018044843A1 (en) | 2016-08-30 | 2018-03-08 | Corning Incorporated | Laser processing of transparent materials |
| CN109803786B (zh) | 2016-09-30 | 2021-05-07 | 康宁股份有限公司 | 使用非轴对称束斑对透明工件进行激光加工的设备和方法 |
| JP7066701B2 (ja) | 2016-10-24 | 2022-05-13 | コーニング インコーポレイテッド | シート状ガラス基体のレーザに基づく加工のための基体処理ステーション |
| US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
| US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
| US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
| US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
| CN107520545B (zh) * | 2017-09-01 | 2019-06-21 | 大族激光科技产业集团股份有限公司 | 激光钻孔方法 |
| DE102018216507A1 (de) | 2017-09-29 | 2019-04-04 | Carl Zeiss Meditec Ag | Vorrichtung und Verfahren zur Materialbearbeitung mittels Laserstrahlung |
| US12180108B2 (en) | 2017-12-19 | 2024-12-31 | Corning Incorporated | Methods for etching vias in glass-based articles employing positive charge organic molecules |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| DE102018205270A1 (de) * | 2018-04-09 | 2019-10-10 | Scanlab Gmbh | Laserstrahlpositioniersystem, Laserbearbeitungsvorrichtung und Steuerungsverfahren |
| WO2019246569A1 (en) * | 2018-06-21 | 2019-12-26 | Genomic Health, Inc. | Automated sample preparation system and applications thereof |
| CN109471119A (zh) * | 2018-09-30 | 2019-03-15 | 维沃移动通信有限公司 | 一种控制功耗的方法及终端设备 |
| US10615044B1 (en) * | 2018-10-18 | 2020-04-07 | Asm Technology Singapore Pte Ltd | Material cutting using laser pulses |
| DE102019219121A1 (de) * | 2018-12-10 | 2020-06-10 | Trumpf Laser Gmbh | Verfahren zum Abtragen von Material von einer Oberfläche |
| CN111037115A (zh) * | 2019-12-30 | 2020-04-21 | 英诺激光科技股份有限公司 | 一种雾面玻璃的激光切割方法及装置 |
| EP4103939B1 (en) * | 2020-02-13 | 2024-12-11 | Hach Company | Ph electrode with boron doped diamond region |
| DE102020122598A1 (de) * | 2020-08-28 | 2022-03-03 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren zum Bearbeiten eines Materials |
| CN112646703B (zh) * | 2020-12-29 | 2023-01-24 | 中国科学院长春光学精密机械与物理研究所 | 一种单分子荧光基因测序光学系统 |
| JP7768757B2 (ja) * | 2021-12-24 | 2025-11-12 | 株式会社ディスコ | 面処理装置 |
| TWI880732B (zh) * | 2023-04-25 | 2025-04-11 | 聚嶸科技股份有限公司 | 用於切割複合材料的GHz脈衝串雷射光源系統與方法 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3527198A (en) * | 1966-03-26 | 1970-09-08 | Tokyo Shibaura Electric Co | Method and apparatus for working diamonds by means of laser light beam |
| GB2218660B (en) * | 1988-05-16 | 1991-09-25 | Lumonics Ltd | Method of material processing using a laser beam |
| US5312396A (en) * | 1990-09-06 | 1994-05-17 | Massachusetts Institute Of Technology | Pulsed laser system for the surgical removal of tissue |
| DE4232915A1 (de) * | 1992-10-01 | 1994-04-07 | Hohla Kristian | Vorrichtung zur Formung der Cornea durch Abtragen von Gewebe |
| US5656186A (en) * | 1994-04-08 | 1997-08-12 | The Regents Of The University Of Michigan | Method for controlling configuration of laser induced breakdown and ablation |
| US5786560A (en) * | 1995-03-31 | 1998-07-28 | Panasonic Technologies, Inc. | 3-dimensional micromachining with femtosecond laser pulses |
| DE19636429C1 (de) * | 1996-09-07 | 1997-11-20 | Jenoptik Jena Gmbh | Verfahren zur Herstellung einer Schwächelinie mittels Laser |
| US5931834A (en) * | 1996-10-15 | 1999-08-03 | Eclipse Surgical Technologies, Inc. | Method for non-synchronous laser-assisted myocardial revascularization |
| DE19730028C2 (de) * | 1997-07-14 | 2002-12-12 | Deutsche Telekom Ag | Verfahren zum Trennen und Bearbeiten von auf einem Halbleitersubstrat im Verband hergestellten Halbleiterchips aus A III - B V- Verbindungshalbleitern unter Verwendung eines Excimer-Lasers |
| DE19745294A1 (de) * | 1997-10-14 | 1999-04-15 | Biotronik Mess & Therapieg | Verfahren zur Herstellung feinstrukturierter medizintechnischer Implantate |
| US5928221A (en) * | 1997-11-17 | 1999-07-27 | Coherent, Inc. | Fluence monitoring method for laser treatment of biological tissue |
| EP1210011B1 (en) * | 1999-07-28 | 2008-03-12 | Visx, Incorporated | Hydration and topography tissue measurements for laser sculpting |
| US6552301B2 (en) * | 2000-01-25 | 2003-04-22 | Peter R. Herman | Burst-ultrafast laser machining method |
| US6509547B1 (en) * | 2000-04-07 | 2003-01-21 | Resonetics, Inc. | Method for laser stripping of optical fiber and flat cable |
| DE10018251C2 (de) * | 2000-04-13 | 2003-08-14 | Leica Microsystems | Laserschneid-Vorrichtung mit Mikroskop |
| DE10020559A1 (de) * | 2000-04-27 | 2001-10-31 | Hannover Laser Zentrum | Laser-Bearbeitung von Materialien |
| US20010035447A1 (en) * | 2000-05-05 | 2001-11-01 | Andreas Gartner | Methods for laser cut initiation |
| JP4659300B2 (ja) * | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
| US6676878B2 (en) † | 2001-01-31 | 2004-01-13 | Electro Scientific Industries, Inc. | Laser segmented cutting |
| DE60124938T2 (de) * | 2000-10-26 | 2007-09-20 | Xsil Technology Ltd. | Steueurung von laserbearbeitung |
| US7247240B2 (en) * | 2002-03-11 | 2007-07-24 | Nippon Shokubai Co., Ltd. | Method for treating waste water |
| US6580054B1 (en) * | 2002-06-10 | 2003-06-17 | New Wave Research | Scribing sapphire substrates with a solid state UV laser |
| DE10250015B3 (de) * | 2002-10-25 | 2004-09-16 | Universität Kassel | Adaptive, rückkopplungsgesteuerte Materialbearbeitung mit ultrakurzen Laserpulsen |
| DE10300091A1 (de) * | 2003-01-04 | 2004-07-29 | Lubatschowski, Holger, Dr. | Mikrotom |
| US7351241B2 (en) * | 2003-06-02 | 2008-04-01 | Carl Zeiss Meditec Ag | Method and apparatus for precision working of material |
| JP2005118821A (ja) | 2003-10-16 | 2005-05-12 | Olympus Corp | 超短パルスレーザ加工方法 |
| DE10358927B4 (de) * | 2003-12-16 | 2021-09-09 | Carl Zeiss Meditec Ag | Laservorrichtung und Verfahren zur Materialbearbeitung mittels Laserstrahlung |
| JP4348199B2 (ja) * | 2004-01-16 | 2009-10-21 | 日立ビアメカニクス株式会社 | レーザ加工方法およびレーザ加工装置 |
| US20060100610A1 (en) * | 2004-03-05 | 2006-05-11 | Wallace Daniel T | Methods using a robotic catheter system |
| US7486705B2 (en) * | 2004-03-31 | 2009-02-03 | Imra America, Inc. | Femtosecond laser processing system with process parameters, controls and feedback |
| DE102004039023A1 (de) * | 2004-08-11 | 2006-02-23 | Siemens Ag | Verfahren zur Bearbeitung eines Werkstücks mittels Laserstrahlung, Laserbearbeitungssystem |
| US7169687B2 (en) * | 2004-11-03 | 2007-01-30 | Intel Corporation | Laser micromachining method |
-
2005
- 2005-08-22 DE DE102005039833A patent/DE102005039833A1/de not_active Withdrawn
-
2006
- 2006-08-21 JP JP2008527380A patent/JP2009504415A/ja active Pending
- 2006-08-21 CN CNA2006800307348A patent/CN101257993A/zh active Pending
- 2006-08-21 CA CA2619857A patent/CA2619857C/en active Active
- 2006-08-21 AT AT06777003T patent/ATE552065T1/de active
- 2006-08-21 EP EP06777003.2A patent/EP1945401B2/de not_active Not-in-force
- 2006-08-21 US US11/990,888 patent/US9162319B2/en active Active
- 2006-08-21 WO PCT/EP2006/008225 patent/WO2007022948A2/de not_active Ceased
- 2006-08-21 PL PL06777003T patent/PL1945401T3/pl unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007022948A2 (de) | 2007-03-01 |
| DE102005039833A1 (de) | 2007-03-01 |
| US9162319B2 (en) | 2015-10-20 |
| JP2009504415A (ja) | 2009-02-05 |
| WO2007022948A3 (de) | 2007-05-10 |
| EP1945401B1 (de) | 2012-04-04 |
| CN101257993A (zh) | 2008-09-03 |
| CA2619857C (en) | 2014-12-09 |
| EP1945401A2 (de) | 2008-07-23 |
| US20090294422A1 (en) | 2009-12-03 |
| ATE552065T1 (de) | 2012-04-15 |
| CA2619857A1 (en) | 2007-03-01 |
| EP1945401B2 (de) | 2016-12-28 |
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