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PL1891847T3 - Urządzenie elektroniczne wyposażone w zespół chłodzący do chłodzenia modułu wprowadzanego przez użytkownika i zespół chłodzący do chłodzenia takiego modułu - Google Patents

Urządzenie elektroniczne wyposażone w zespół chłodzący do chłodzenia modułu wprowadzanego przez użytkownika i zespół chłodzący do chłodzenia takiego modułu

Info

Publication number
PL1891847T3
PL1891847T3 PL06745052T PL06745052T PL1891847T3 PL 1891847 T3 PL1891847 T3 PL 1891847T3 PL 06745052 T PL06745052 T PL 06745052T PL 06745052 T PL06745052 T PL 06745052T PL 1891847 T3 PL1891847 T3 PL 1891847T3
Authority
PL
Poland
Prior art keywords
cooling
module
assembly
sliding means
cooling assembly
Prior art date
Application number
PL06745052T
Other languages
English (en)
Inventor
Dirck Seynaeve
Gratien A M Banckaert
Danny A J Delacroix
Original Assignee
Koninl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninl Philips Electronics Nv filed Critical Koninl Philips Electronics Nv
Publication of PL1891847T3 publication Critical patent/PL1891847T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
    • H05K5/026—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms having standardized interfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239—Electronic boxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0256—Details of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
    • H05K5/0286—Receptacles therefor, e.g. card slots, module sockets, card groundings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
PL06745052T 2005-06-02 2006-05-31 Urządzenie elektroniczne wyposażone w zespół chłodzący do chłodzenia modułu wprowadzanego przez użytkownika i zespół chłodzący do chłodzenia takiego modułu PL1891847T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP05104804 2005-06-02
EP06745052A EP1891847B1 (en) 2005-06-02 2006-05-31 Electronic appliance provided with a cooling assembly for cooling a consumer insertable module, and cooling assembly for cooling such module
PCT/IB2006/051734 WO2006129281A2 (en) 2005-06-02 2006-05-31 Electronic appliance provided with a cooling assembly for cooling a consumer insertable module, and cooling assembly for cooling such module

Publications (1)

Publication Number Publication Date
PL1891847T3 true PL1891847T3 (pl) 2012-05-31

Family

ID=37401201

Family Applications (1)

Application Number Title Priority Date Filing Date
PL06745052T PL1891847T3 (pl) 2005-06-02 2006-05-31 Urządzenie elektroniczne wyposażone w zespół chłodzący do chłodzenia modułu wprowadzanego przez użytkownika i zespół chłodzący do chłodzenia takiego modułu

Country Status (5)

Country Link
US (1) US7800910B2 (pl)
EP (1) EP1891847B1 (pl)
AT (1) ATE538632T1 (pl)
PL (1) PL1891847T3 (pl)
WO (1) WO2006129281A2 (pl)

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JP2013004783A (ja) * 2011-06-17 2013-01-07 Sony Corp 放熱構造および表示装置
USD676029S1 (en) * 2012-06-15 2013-02-12 Peerless Industries, Inc. System for mounting audio/visual devices or the like from an overhead structure
US9693479B2 (en) * 2013-03-14 2017-06-27 Hewlett Packard Enterprise Development Lp Support member
TWM519879U (zh) * 2015-08-03 2016-04-01 道登電子材料股份有限公司 電子裝置之改良散熱結構
US9910231B2 (en) * 2016-01-04 2018-03-06 Infinera Corporation Stacked cage optical module heat relay system
US10945357B2 (en) * 2019-02-21 2021-03-09 Cisco Technology, Inc. Optical module cage with configurable heatsink
WO2021010874A1 (en) * 2019-07-16 2021-01-21 Telefonaktiebolaget Lm Ericsson (Publ) A cooling device, a receptacle assembly, a system and a printed board assembly
US11917797B2 (en) * 2019-12-03 2024-02-27 The Florida State University Research Foundation, Inc. Integrated thermal-electrical component for power electronics converters
US12050352B2 (en) * 2020-09-17 2024-07-30 Te Connectivity Solutions Gmbh Heat exchange assembly for a pluggable module
DE102021205301A1 (de) * 2021-05-25 2022-12-01 Robert Bosch Gesellschaft mit beschränkter Haftung Einschubmodul und Modulanordnung
US11864353B2 (en) * 2021-09-15 2024-01-02 Te Connectivity Solutions Gmbh Heat exchange assembly
DE102022200002A1 (de) 2022-01-03 2023-07-06 Continental Automotive Technologies GmbH Wärmeableitvorrichtung, elektronische Vorrichtung und Kraftfahrzeug
US20230239993A1 (en) * 2022-01-26 2023-07-27 Microsoft Technology Licensing, Llc Cooling systems for a circuit board

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SG64996A1 (en) * 1997-07-08 1999-05-25 Dso National Laborataries A heat sink
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US6882533B2 (en) * 2001-02-22 2005-04-19 Hewlett-Packard Development Company, L.P. Thermal connector for cooling electronics
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Also Published As

Publication number Publication date
US20090279261A1 (en) 2009-11-12
WO2006129281A2 (en) 2006-12-07
EP1891847A2 (en) 2008-02-27
US7800910B2 (en) 2010-09-21
ATE538632T1 (de) 2012-01-15
EP1891847B1 (en) 2011-12-21
WO2006129281A3 (en) 2007-08-02

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