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PH12022550995A1 - Insulating resin composition, insulating resin cured body, layered body, and circuit base board - Google Patents

Insulating resin composition, insulating resin cured body, layered body, and circuit base board

Info

Publication number
PH12022550995A1
PH12022550995A1 PH1/2022/550995A PH12022550995A PH12022550995A1 PH 12022550995 A1 PH12022550995 A1 PH 12022550995A1 PH 12022550995 A PH12022550995 A PH 12022550995A PH 12022550995 A1 PH12022550995 A1 PH 12022550995A1
Authority
PH
Philippines
Prior art keywords
insulating resin
resin composition
base board
circuit base
layered body
Prior art date
Application number
PH1/2022/550995A
Inventor
Yuuki Kimoto
Ryota Kumagai
Katsunori Yashima
Original Assignee
Denka Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Company Ltd filed Critical Denka Company Ltd
Publication of PH12022550995A1 publication Critical patent/PH12022550995A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/24—Derivatives of hydrazine
    • C08K5/25—Carboxylic acid hydrazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)

Abstract

An insulating resin composition comprising an organic material and an inorganic filler, wherein the organic material contains an epoxy resin, a curing agent, a phosphate ester compound having one or more hydroxyl group per molecule, a heavy metal inactivator, and a hindered phenol-based antioxidant, and the contained amount of the inorganic filler is 50-95 mass%.
PH1/2022/550995A 2019-11-08 2020-10-07 Insulating resin composition, insulating resin cured body, layered body, and circuit base board PH12022550995A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019203454 2019-11-08
PCT/JP2020/038031 WO2021090630A1 (en) 2019-11-08 2020-10-07 Insulating resin composition, insulating resin cured body, layered body, and circuit base board

Publications (1)

Publication Number Publication Date
PH12022550995A1 true PH12022550995A1 (en) 2023-10-02

Family

ID=75849913

Family Applications (1)

Application Number Title Priority Date Filing Date
PH1/2022/550995A PH12022550995A1 (en) 2019-11-08 2020-10-07 Insulating resin composition, insulating resin cured body, layered body, and circuit base board

Country Status (5)

Country Link
JP (1) JP7625530B2 (en)
CN (1) CN114341263A (en)
PH (1) PH12022550995A1 (en)
TW (1) TWI849247B (en)
WO (1) WO2021090630A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023063761A (en) * 2021-10-25 2023-05-10 デンカ株式会社 Thick copper embedded circuit board structure
JP7773883B2 (en) * 2021-10-26 2025-11-20 デンカ株式会社 circuit board
JP2023133741A (en) * 2022-03-14 2023-09-27 住友ベークライト株式会社 Resin composition for semiconductor encapsulation, and semiconductor device
JP7706848B2 (en) * 2022-06-24 2025-07-14 信越化学工業株式会社 Epoxy resin composition
WO2025204277A1 (en) * 2024-03-27 2025-10-02 東洋紡エムシー株式会社 Adhesive composition, and adhesive sheet, laminate, and printed wiring board containing same

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3209132B2 (en) * 1997-02-27 2001-09-17 日立化成工業株式会社 Metal base substrate
JP2002012653A (en) * 2000-07-03 2002-01-15 Denki Kagaku Kogyo Kk Curable resin composition and metal-based circuit board using the same
JP2003026773A (en) 2001-07-17 2003-01-29 Nippon Kayaku Co Ltd Epoxy resin composition and flexible printed circuit board material using the same
JP3751271B2 (en) * 2002-08-15 2006-03-01 電気化学工業株式会社 Resin composition for circuit board and metal base circuit board using the same
JP2005035397A (en) 2003-07-15 2005-02-10 Kaoru Shimizu Vehicle and driving assist method
JP2005353974A (en) * 2004-06-14 2005-12-22 Hitachi Chem Co Ltd Metal base circuit board
JP5444737B2 (en) 2009-01-30 2014-03-19 株式会社オートネットワーク技術研究所 Flame retardant composition, insulated wire, and method for producing flame retardant composition
TW201307470A (en) * 2011-05-27 2013-02-16 Taiyo Ink Mfg Co Ltd Thermocuring resin composition, dry film and printed wiring board
WO2013147086A1 (en) * 2012-03-30 2013-10-03 株式会社トクヤマ Curable resin composition, method for producing same, highly thermally conductive resin composition, and highly thermally conductive multilayer substrate
MY189234A (en) 2013-10-17 2022-01-31 Sumitomo Bakelite Co Epoxy resin composition, resin layer-attached carrier material metal base circuit substrate, and electronic device
CN103641998B (en) * 2013-12-24 2016-05-04 江苏华海诚科新材料股份有限公司 The white epoxy resin composition that LED reflector is used
WO2018016524A1 (en) * 2016-07-20 2018-01-25 日立化成株式会社 Thermosetting resin composition, interlayer insulation resin film, composite film, printed wiring board, and production method thereof
JP6919335B2 (en) * 2017-05-29 2021-08-18 大日本印刷株式会社 Agricultural sheet
JP6284673B1 (en) * 2017-07-05 2018-02-28 古河電気工業株式会社 RESIN COMPOSITION, RESIN COATING MATERIAL, AUTOMATIC WIRE HARNESS, AND AUTOMATIC WIRE HARNESS MANUFACTURING METHOD
CN110071206B (en) * 2018-12-29 2021-09-17 博罗康佳精密科技有限公司 COB aluminum-based packaging plate and preparation process thereof
JP7304161B2 (en) * 2019-01-23 2023-07-06 デンカ株式会社 Insulating resin composition, insulating resin cured body, laminate and circuit board

Also Published As

Publication number Publication date
TWI849247B (en) 2024-07-21
WO2021090630A1 (en) 2021-05-14
JPWO2021090630A1 (en) 2021-05-14
JP7625530B2 (en) 2025-02-03
TW202132461A (en) 2021-09-01
CN114341263A (en) 2022-04-12

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