[go: up one dir, main page]

PH12020552144A1 - Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components - Google Patents

Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components

Info

Publication number
PH12020552144A1
PH12020552144A1 PH12020552144A PH12020552144A PH12020552144A1 PH 12020552144 A1 PH12020552144 A1 PH 12020552144A1 PH 12020552144 A PH12020552144 A PH 12020552144A PH 12020552144 A PH12020552144 A PH 12020552144A PH 12020552144 A1 PH12020552144 A1 PH 12020552144A1
Authority
PH
Philippines
Prior art keywords
mould
electronic components
insert
encapsulating electronic
producing
Prior art date
Application number
PH12020552144A
Inventor
Sebastianus Hubertus Maria Kersjes
Original Assignee
Besi Netherlands Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Netherlands Bv filed Critical Besi Netherlands Bv
Publication of PH12020552144A1 publication Critical patent/PH12020552144A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The invention relates to a mould for encapsulating electronic components mounted on a carrier, comprising at least two mould parts which are displaceable relative to each other, at least one of the mould parts with a mould cavity recessed in a contact side, which mould parts are configured to engage with the mould cavity round the electronic components to be encapsulate, wherein at least a part of the mould cavity is formed by an insert having a flexible three-dimensional moulding surface facing the electronic components. The invention further relates to an insert for use in said mould and a method for encapsulating electronic components mounted on a carrier using said mould.
PH12020552144A 2018-06-18 2020-12-10 Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components PH12020552144A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2021145A NL2021145B1 (en) 2018-06-18 2018-06-18 Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components
PCT/NL2019/050374 WO2019245364A1 (en) 2018-06-18 2019-06-18 Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components

Publications (1)

Publication Number Publication Date
PH12020552144A1 true PH12020552144A1 (en) 2021-06-21

Family

ID=63145170

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12020552144A PH12020552144A1 (en) 2018-06-18 2020-12-10 Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components

Country Status (8)

Country Link
JP (1) JP7391051B2 (en)
KR (1) KR102784021B1 (en)
CN (1) CN112262461B (en)
NL (1) NL2021145B1 (en)
PH (1) PH12020552144A1 (en)
SG (1) SG11202011472VA (en)
TW (1) TWI834678B (en)
WO (1) WO2019245364A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT202100022775A1 (en) * 2021-09-02 2023-03-02 Luxottica Srl EYEWEAR FRAMES COMPRISING AT LEAST A PORTION OF AN ELECTRONIC DEVICE ENCAPSULATED WITHIN AT LEAST ONE ELEMENT THEREOF AND METHOD FOR ENCAPSULATING SAYING AT LEAST A PORTION OF AN ELECTRONIC DEVICE WITHIN SUCH AT LEAST ONE ELEMENT OF A EYEWEAR FRAME.
CN114679840B (en) * 2022-03-28 2024-05-24 杭州电子科技大学 Flexible device packaging structure and packaging method
CN115302695A (en) * 2022-07-20 2022-11-08 临海伟星新型建材有限公司 Porous ceramic composite pipe and manufacturing method thereof

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4658353B2 (en) * 2001-03-01 2011-03-23 ルネサスエレクトロニクス株式会社 Resin mold and resin mold package manufacturing method
NL1019042C2 (en) * 2001-09-26 2003-03-27 Europ Semiconductor Assembly E Method for encapsulating a chip and / or other object.
JP4102634B2 (en) * 2002-09-27 2008-06-18 Ｔｏｗａ株式会社 Resin injection device for electronic parts
JP2004128303A (en) * 2002-10-04 2004-04-22 Towa Corp Underfill resin mold substrate and individual piece, and underfill resin molding method and die
JP2004363406A (en) * 2003-06-06 2004-12-24 Honda Motor Co Ltd Resin-sealed electronic component unit and method of manufacturing the same
JP4443334B2 (en) * 2004-07-16 2010-03-31 Ｔｏｗａ株式会社 Resin sealing molding method of semiconductor element
US8008757B2 (en) * 2006-02-03 2011-08-30 Mitsui Chemicals, Inc. Resinous hollow package and producing method thereof
JP2007288081A (en) * 2006-04-20 2007-11-01 Towa Corp Resin seal molding device of electronic component
CN104051280B (en) * 2013-03-11 2018-06-08 恩智浦美国有限公司 Die sleeve
EP2192825A1 (en) * 2008-11-26 2010-06-02 Osram Gesellschaft mit Beschränkter Haftung An injection tool for encapsulating electronic circuits with light sources, and related encapsulation process
JP5725016B2 (en) * 2010-03-25 2015-05-27 住友ベークライト株式会社 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
JP5630652B2 (en) * 2011-01-06 2014-11-26 日立化成株式会社 Epoxy resin molding material for sealing and electronic component device
KR102335853B1 (en) * 2014-01-14 2021-12-07 아피쿠 야마다 가부시키가이샤 Resin mold tooling and resin-molding method
DE102014109779A1 (en) * 2014-06-13 2015-12-17 Osram Opto Semiconductors Gmbh Method for producing an assembly with a component
JP2016025198A (en) * 2014-07-18 2016-02-08 マイクロン テクノロジー， インク． Method of manufacturing semiconductor device
DE102016224949B4 (en) * 2016-12-14 2023-08-10 Vitesco Technologies Germany Gmbh Process for the production of mechatronic assemblies

Also Published As

Publication number Publication date
CN112262461B (en) 2025-07-08
JP2021531643A (en) 2021-11-18
WO2019245364A1 (en) 2019-12-26
KR102784021B1 (en) 2025-03-21
JP7391051B2 (en) 2023-12-04
TW202000416A (en) 2020-01-01
TWI834678B (en) 2024-03-11
KR20210022002A (en) 2021-03-02
NL2021145B1 (en) 2020-01-06
CN112262461A (en) 2021-01-22
SG11202011472VA (en) 2020-12-30

Similar Documents

Publication Publication Date Title
PH12020552144A1 (en) Mould for encapsulating electronic components, insert for such a mould, method for producing an insert and method for encapsulating electronic components
GB201120331D0 (en) Contact lens manufacturing method
MX378475B (en) Plastic moulded part and method for the production thereof
MX2018014051A (en) Method for providing an aerosol-generating device, aerosol-generating device and flat aerosol-generating article for use in such a device.
MY176541A (en) Mold release film and process for producing semiconductor package
WO2013106391A3 (en) Systems and methods for manufacturing foam parts
RU2014110016A (en) FASTENING AND ENAPSULATION IN OPHTHALMIC DEVICES WITH POWER SUPPLIES WITH RING INSERTS
MY173073A (en) Mold release film and process for producing semiconductor package
MX2018009684A (en) Production method for composite member, and composite member.
PH12014500139A1 (en) Injection moulding plastic components with a slit
MX2015006012A (en) Method for manuf acturing polarizing plastic lens.
MX2015005001A (en) Bumper component with embedded sensor.
BR112015002192A2 (en) injection molding apparatus and method comprising a mold cavity surface comprising a thermally controllable die
MY187162A (en) Mould, moulding apparatus and method for controlled overmoulding of a carrier with electronic components and moulded product
WO2018226780A8 (en) Elastomer articles having embedded electronics and method of manufacturing the same
SG10201806043PA (en) Resin molding apparatus and method for manufacturing resin molded product
PT3928945T (en) Forming mold, forming mold manufacturing method, injection molding device and molded article manufacturing method
MY156283A (en) Process for producing in-mold decorated molded article
MX387043B (en) METHOD, MOULD INSERT AND INJECTION MOULD FOR PRODUCING A PLASTIC MOULDED PRODUCT.
MX2014001775A (en) Semi permanent tool coating enhancement for extended number of releases.
MY189914A (en) Reusable lens molds and methods of use thereof
MX2019006927A (en) Method for manufacturing three-dimensional items with flexible walls.
MX364972B (en) Improvements in or relating to moulding machines.
MX2019005338A (en) Process for manufacturing, by injection, a plastic part comprising a technical face and incorporating a reinforcing element.
MX2014014157A (en) Method for operating a high productivity injection molding machine.