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PH12020551156A1 - Two-component curable solventless adhesive and laminate film - Google Patents

Two-component curable solventless adhesive and laminate film

Info

Publication number
PH12020551156A1
PH12020551156A1 PH12020551156A PH12020551156A PH12020551156A1 PH 12020551156 A1 PH12020551156 A1 PH 12020551156A1 PH 12020551156 A PH12020551156 A PH 12020551156A PH 12020551156 A PH12020551156 A PH 12020551156A PH 12020551156 A1 PH12020551156 A1 PH 12020551156A1
Authority
PH
Philippines
Prior art keywords
mass
component
component curable
parts
free adhesive
Prior art date
Application number
PH12020551156A
Other versions
PH12020551156B1 (en
Inventor
Takashi Uemura
Tatsuya Jyounouchi
Taichi Uemura
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of PH12020551156A1 publication Critical patent/PH12020551156A1/en
Publication of PH12020551156B1 publication Critical patent/PH12020551156B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
    • C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/06—Polyurethanes from polyesters

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Laminated Bodies (AREA)

Abstract

A two-component curable solvent-free adhesive including a polyisocyanate component and a polyol component, wherein the polyisocyanate component contains an isocyanate-terminated prepolymer which is a reaction product of diphenylmethane diisocyanate and a polyol, and unreacted diphenylmethane diisocyanate, the polyol component contains a polyester polyol having a number-average molecular weight of 1000 or less, the content of unreacted diphenylmethane diisocyanate with respect to 100 parts by mass of the two-component curable solvent-free adhesive is 20 parts by mass to 30 parts by mass, and the two-component curable solvent-free adhesive contains 0.003 part by mass to 0.030 part by mass of phosphoric acid with respect to a total amount of 100 parts by mass of the two-component curable solvent-free adhesive.
PH1/2020/551156A 2018-01-29 2019-01-25 Two-component curable solventless adhesive and laminate film PH12020551156B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018012638 2018-01-29
PCT/JP2019/002464 WO2019146756A1 (en) 2018-01-29 2019-01-25 Two-component curable solvent-free adhesive and laminate film

Publications (2)

Publication Number Publication Date
PH12020551156A1 true PH12020551156A1 (en) 2021-05-31
PH12020551156B1 PH12020551156B1 (en) 2024-05-17

Family

ID=67395025

Family Applications (1)

Application Number Title Priority Date Filing Date
PH1/2020/551156A PH12020551156B1 (en) 2018-01-29 2019-01-25 Two-component curable solventless adhesive and laminate film

Country Status (4)

Country Link
JP (1) JP7030139B2 (en)
MY (1) MY202386A (en)
PH (1) PH12020551156B1 (en)
WO (1) WO2019146756A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020129668A1 (en) * 2018-12-20 2020-06-25 Dic株式会社 Two-part type adhesive, polyisocyanate composition for two-part type adhesive, layered product, and packaging material
CN113372871A (en) * 2021-07-05 2021-09-10 英克化工科技（太仓）有限公司 Single-component solvent-free adhesive and preparation method thereof
CN117769586A (en) * 2021-07-30 2024-03-26 陶氏环球技术有限责任公司 Solvent-free adhesive compositions and laminates prepared therefrom
JP2023042982A (en) * 2021-09-15 2023-03-28 東洋インキＳｃホールディングス株式会社 Two-liquid curable adhesive, laminate and package
US20240417607A1 (en) * 2021-11-26 2024-12-19 Dow Global Technologies Llc A moisture resistant two-component adhesive composition
WO2024138548A1 (en) * 2022-12-29 2024-07-04 Dic Corporation Adhesive, laminate, and packaging material
WO2025084144A1 (en) * 2023-10-19 2025-04-24 Dic株式会社 Two-component curable adhesive, laminated body, and packing material
CN118977479B (en) * 2024-08-08 2025-10-10 福建中裕水性超纤科技有限公司 Lightweight, high-density leather for labor protection shoes, preparation method and application thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122977A (en) * 1982-01-18 1983-07-21 Takeda Chem Ind Ltd Composition for polyurethane adhesive
JP4192544B2 (en) * 2002-09-27 2008-12-10 東洋インキ製造株式会社 Solventless adhesive composition and use thereof
CN101370890B (en) * 2006-02-17 2012-05-23 三井化学株式会社 Laminating adhesive
JP4948507B2 (en) * 2007-12-19 2012-06-06 ローム アンド ハース カンパニー Laminate adhesive
JP5634944B2 (en) * 2011-06-02 2014-12-03 三井化学株式会社 Polyurethane adhesive and laminate film
JP6210306B2 (en) * 2013-12-19 2017-10-11 Dic株式会社 Solvent-free two-component curable laminate adhesive composition
JP6980754B2 (en) * 2016-07-11 2021-12-15 ダウ グローバル テクノロジーズ エルエルシー High solid content solvent type adhesive composition and its manufacturing method
JP6823600B2 (en) * 2016-07-13 2021-02-03 イーグル工業株式会社 mechanical seal

Also Published As

Publication number Publication date
MY202386A (en) 2024-04-25
WO2019146756A1 (en) 2019-08-01
JP7030139B2 (en) 2022-03-04
PH12020551156B1 (en) 2024-05-17
JPWO2019146756A1 (en) 2021-01-28

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