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PH12016502286A1 - Composite sheet for forming protective film - Google Patents

Composite sheet for forming protective film

Info

Publication number
PH12016502286A1
PH12016502286A1 PH12016502286A PH12016502286A PH12016502286A1 PH 12016502286 A1 PH12016502286 A1 PH 12016502286A1 PH 12016502286 A PH12016502286 A PH 12016502286A PH 12016502286 A PH12016502286 A PH 12016502286A PH 12016502286 A1 PH12016502286 A1 PH 12016502286A1
Authority
PH
Philippines
Prior art keywords
protective film
composite sheet
forming protective
supporting sheet
forming
Prior art date
Application number
PH12016502286A
Inventor
Naoya Saiki
Daisuke Yamamoto
Hiroyuki Yoneyama
Youichi Inao
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of PH12016502286A1 publication Critical patent/PH12016502286A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laser Beam Processing (AREA)
  • Laminated Bodies (AREA)

Abstract

This composite sheet (3) for forming a protective film is provided with: a supporting sheet (4); and a protective film forming film (1) that is laminated on a first surface of the supporting sheet (4). A second surface of the supporting sheet (4) has an arithmetic mean roughness (Ra1) of 0.2 mm or more, and the second surface of the supporting sheet (4) has an arithmetic mean roughness (Ra2) of 0.25 mm or less after being heated at 130oC for 2 hours.
PH12016502286A 2014-05-23 2016-11-16 Composite sheet for forming protective film PH12016502286A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014106757 2014-05-23
PCT/JP2015/064202 WO2015178346A1 (en) 2014-05-23 2015-05-18 Composite sheet for forming protective film

Publications (1)

Publication Number Publication Date
PH12016502286A1 true PH12016502286A1 (en) 2017-02-13

Family

ID=54554016

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12016502286A PH12016502286A1 (en) 2014-05-23 2016-11-16 Composite sheet for forming protective film

Country Status (7)

Country Link
JP (1) JP6319433B2 (en)
KR (1) KR102378063B1 (en)
CN (1) CN106463373B (en)
PH (1) PH12016502286A1 (en)
SG (1) SG11201609543VA (en)
TW (2) TWI675900B (en)
WO (1) WO2015178346A1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102378063B1 (en) * 2014-05-23 2022-03-23 린텍 가부시키가이샤 Composite sheet for forming protective film
SG11201806881WA (en) * 2016-02-22 2018-09-27 Lintec Corp Protective film formation sheet, manufacturing method for protective film formation sheet, and manufacturing method for semiconductor device
WO2017150330A1 (en) * 2016-03-02 2017-09-08 古河電気工業株式会社 Wafer processing tape
CN108243616B (en) * 2016-03-04 2022-10-28 琳得科株式会社 Semiconductor processing sheet
JP6893500B2 (en) * 2016-03-24 2021-06-23 リンテック株式会社 Composite sheet for forming a protective film
TWI722170B (en) * 2016-04-28 2021-03-21 日商琳得科股份有限公司 Film for forming protective film and composite sheet for forming protective film
TWI721158B (en) * 2016-04-28 2021-03-11 日商琳得科股份有限公司 Protective film forming film and composite sheet for forming protective film
TWI778960B (en) * 2016-04-28 2022-10-01 日商琳得科股份有限公司 Film for forming protective film, composite sheet for forming protective film, and method of manufacturing semiconductor chip having protective film
US10825694B2 (en) * 2017-02-02 2020-11-03 Hitachi Chemical Company, Ltd. Method for manufacturing electronic component, resin composition for temporary protection, and resin film for temporary protection
CN109789666B (en) * 2017-03-30 2024-06-04 琳得科株式会社 Composite sheet for forming protective film
JP6298226B1 (en) * 2017-03-30 2018-03-20 リンテック株式会社 Composite sheet for protective film formation
JP2019079961A (en) * 2017-10-25 2019-05-23 リンテック株式会社 Semiconductor processing sheet
KR102797032B1 (en) * 2018-04-18 2025-04-18 린텍 가부시키가이샤 Sheet for work processing
JP7435624B2 (en) * 2019-12-23 2024-02-21 株式会社レゾナック Dicing/die bonding integrated film, its quality control method, and semiconductor device manufacturing method
JP7457513B2 (en) * 2020-02-03 2024-03-28 リンテック株式会社 PRODUCTION METHOD OF PROTECTIVE FILM-FORMING FILM, COMPOSITE SHEET FOR PROTECTIVE FILM-FORMING, AND APPARATUS
JP7724069B2 (en) * 2021-03-17 2025-08-15 リンテック株式会社 Support sheet, composite sheet for forming protective film, and method for manufacturing the device
JP7591453B2 (en) 2021-03-31 2024-11-28 リンテック株式会社 Support sheet, composite sheet for forming resin film, kit, and method for producing chip with resin film
JP2023144842A (en) 2022-03-28 2023-10-11 リンテック株式会社 Composite sheet for forming resin film, kit, and method for manufacturing workpiece with resin film
JP2024142714A (en) 2023-03-30 2024-10-11 リンテック株式会社 Composite sheet for forming resin film, kit, and method for manufacturing workpiece with resin film

Family Cites Families (19)

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JPS58149048A (en) * 1982-03-02 1983-09-05 Sony Corp Cover film for use in color hard copy printing paper
CN101335235B (en) 2002-03-12 2010-10-13 浜松光子学株式会社 Method for dicing substrate
JP4128058B2 (en) * 2002-09-24 2008-07-30 三井化学株式会社 Adhesive film and method of using the same
JP5165829B2 (en) * 2004-02-26 2013-03-21 日東電工株式会社 Rolled wafer processing adhesive sheet
JP4642436B2 (en) * 2004-11-12 2011-03-02 リンテック株式会社 Marking method and protective film forming and dicing sheet
JP2007109808A (en) * 2005-10-12 2007-04-26 Furukawa Electric Co Ltd:The Semiconductor wafer dicing-adhesive tape for die bonding
JP4762671B2 (en) 2005-10-26 2011-08-31 古河電気工業株式会社 Dicing tape and semiconductor wafer dicing method
JP2011040449A (en) * 2009-08-07 2011-02-24 Du Pont Mitsui Polychem Co Ltd Substrate for dicing tape, the dicing tape, and method for manufacturing semiconductor device
JP5603757B2 (en) * 2009-12-04 2014-10-08 リンテック株式会社 Laser dicing adhesive sheet and method for manufacturing semiconductor device
JP2011151362A (en) 2009-12-24 2011-08-04 Nitto Denko Corp Dicing tape-integrated film for semiconductor back surface
WO2011096350A1 (en) * 2010-02-02 2011-08-11 三井化学東セロ株式会社 Surface protective film
EP2542635A1 (en) * 2010-03-01 2013-01-09 3M Innovative Properties Company Translucent film for protecting rough surfaces
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JP2012033637A (en) * 2010-07-29 2012-02-16 Nitto Denko Corp Dicing tape integrated semiconductor rear face film, and method of manufacturing semiconductor device
WO2012172959A1 (en) * 2011-06-14 2012-12-20 電気化学工業株式会社 Adhesive sheet, and method for manufacturing electronic component
WO2013047674A1 (en) * 2011-09-30 2013-04-04 リンテック株式会社 Dicing sheet with protective film forming layer and chip fabrication method
JP5583725B2 (en) * 2012-09-20 2014-09-03 リンテック株式会社 Laser dicing sheet-peeling sheet laminate, laser dicing sheet and chip body manufacturing method
KR102378063B1 (en) * 2014-05-23 2022-03-23 린텍 가부시키가이샤 Composite sheet for forming protective film

Also Published As

Publication number Publication date
CN106463373B (en) 2020-01-03
CN106463373A (en) 2017-02-22
KR20170008749A (en) 2017-01-24
TWI675900B (en) 2019-11-01
TWI741336B (en) 2021-10-01
JPWO2015178346A1 (en) 2017-04-20
KR102378063B1 (en) 2022-03-23
SG11201609543VA (en) 2016-12-29
WO2015178346A1 (en) 2015-11-26
JP6319433B2 (en) 2018-05-09
TW201602303A (en) 2016-01-16
TW201940624A (en) 2019-10-16

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