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PH12014000344B1 - Surface - treated copper foil, laminate, printed wiring board, electronic device, copper foil provided with carrier and method for fabricating printing wiring board - Google Patents

Surface - treated copper foil, laminate, printed wiring board, electronic device, copper foil provided with carrier and method for fabricating printing wiring board

Info

Publication number
PH12014000344B1
PH12014000344B1 PH12014000344A PH12014000344A PH12014000344B1 PH 12014000344 B1 PH12014000344 B1 PH 12014000344B1 PH 12014000344 A PH12014000344 A PH 12014000344A PH 12014000344 A PH12014000344 A PH 12014000344A PH 12014000344 B1 PH12014000344 B1 PH 12014000344B1
Authority
PH
Philippines
Prior art keywords
copper foil
wiring board
treated
laminate
carrier
Prior art date
Application number
PH12014000344A
Other versions
PH12014000344A1 (en
Inventor
Terusama Moriyama
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of PH12014000344A1 publication Critical patent/PH12014000344A1/en
Publication of PH12014000344B1 publication Critical patent/PH12014000344B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)

Abstract

Provided is a surface-treated copper foil that allows transmission loss to be suppressed better even if used for a high-frequency circuit substrate. A surface-treated copper foil with a surface-treated layer formed on at least one surface thereof, wherein a total amount of Co, Ni, and Fe deposited in the surface-treated layer is 1,000 ug/dm2 or less, the surface-treated layer has a Zn metal layer or an alloy treatment layer containing Zn, a ratio of three-dimensional surface area to a two-dimensional surface area on a surface of the surface-treated layer, measured with a laser microscope, is 1.0 to 1.9, and a surface roughness Rz JIS of at least one surface is 2.2 um or less.
PH12014000344A 2013-11-29 2014-11-28 Surface - treated copper foil, laminate, printed wiring board, electronic device, copper foil provided with carrier and method for fabricating printing wiring board PH12014000344B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013248691A JP5710737B1 (en) 2013-11-29 2013-11-29 Surface-treated copper foil, laminated board, printed wiring board, printed circuit board, and electronic equipment

Publications (2)

Publication Number Publication Date
PH12014000344A1 PH12014000344A1 (en) 2016-06-06
PH12014000344B1 true PH12014000344B1 (en) 2016-06-06

Family

ID=53277197

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12014000344A PH12014000344B1 (en) 2013-11-29 2014-11-28 Surface - treated copper foil, laminate, printed wiring board, electronic device, copper foil provided with carrier and method for fabricating printing wiring board

Country Status (5)

Country Link
JP (1) JP5710737B1 (en)
KR (2) KR20150062988A (en)
CN (1) CN104717831B (en)
PH (1) PH12014000344B1 (en)
TW (1) TWI619409B (en)

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JP6023367B1 (en) * 2015-06-17 2016-11-09 Ｊｘ金属株式会社 Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method
JP6204430B2 (en) * 2015-09-24 2017-09-27 Ｊｘ金属株式会社 Metal foil, metal foil with release layer, laminate, printed wiring board, semiconductor package, electronic device and method for manufacturing printed wiring board
KR20170037750A (en) * 2015-09-25 2017-04-05 일진머티리얼즈 주식회사 Surface-treated Copper Foil and Method of manufacturing of the same
JP6294862B2 (en) * 2015-12-09 2018-03-14 古河電気工業株式会社 Surface-treated copper foil for printed wiring board, copper-clad laminate for printed wiring board, and printed wiring board
PH12017000015A1 (en) 2016-01-15 2018-08-06 Jx Nippon Mining & Metals Corp Copper foil, copper-clad laminate board, method for producing printed wiring board, method for poducing electronic apparatus, method for producing transmission channel, and method for producing antenna
KR20180047897A (en) * 2016-11-01 2018-05-10 케이씨에프테크놀로지스 주식회사 Electrodeposited copper foil with its surfaceprepared, process for producing the same and usethereof
KR102268478B1 (en) * 2016-12-14 2021-06-22 후루카와 덴키 고교 가부시키가이샤 Surface-treated copper foil and copper clad laminate
JP7002200B2 (en) * 2017-02-07 2022-01-20 Ｊｘ金属株式会社 Manufacturing method of surface-treated copper foil, copper foil with carrier, laminate, printed wiring board and manufacturing method of electronic equipment
JP7033905B2 (en) 2017-02-07 2022-03-11 Ｊｘ金属株式会社 Manufacturing method of surface-treated copper foil, copper foil with carrier, laminate, printed wiring board and manufacturing method of electronic equipment
JP6543001B2 (en) * 2017-03-30 2019-07-10 古河電気工業株式会社 Surface-treated copper foil, and copper-clad laminate and printed wiring board using the same
KR102353878B1 (en) * 2017-03-30 2022-01-19 후루카와 덴키 고교 가부시키가이샤 Surface-treated copper foil and copper clad laminate using the same
JP7055049B2 (en) * 2017-03-31 2022-04-15 Ｊｘ金属株式会社 Surface-treated copper foil and laminated boards using it, copper foil with carriers, printed wiring boards, electronic devices, and methods for manufacturing printed wiring boards.
KR102340473B1 (en) * 2017-04-25 2021-12-16 후루카와 덴키 고교 가부시키가이샤 surface treatment copper foil
KR102180926B1 (en) 2017-06-28 2020-11-19 에스케이넥실리스 주식회사 Copper foil having improved workability and charge discharge characteristics, electrode comprisng the same, secondary battery comprising the same and method for manufacturing the same
WO2019198610A1 (en) * 2018-04-10 2019-10-17 Dic株式会社 Composite structure and manufacturing method therefor
EP3786316A4 (en) 2018-04-27 2022-04-27 JX Nippon Mining & Metals Corporation SURFACE TREATED COPPER FOIL, COPPER COATED LAMINATE AND CIRCUIT BOARD
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
CN111867239B (en) * 2019-04-24 2021-08-27 广东生益科技股份有限公司 Copper-clad laminate and printed circuit board
WO2022209990A1 (en) * 2021-03-29 2022-10-06 三井金属鉱業株式会社 Roughened copper foil, copper-clad laminate and printed wiring board
CN117044412A (en) 2021-03-29 2023-11-10 三井金属矿业株式会社 Roughening of copper foil, copper-clad laminates and printed circuit boards
CN113811093A (en) * 2021-08-09 2021-12-17 广州方邦电子股份有限公司 Metal foil, copper-clad laminated board, circuit board and preparation method of circuit board
WO2024219163A1 (en) * 2023-04-18 2024-10-24 ナミックス株式会社 Metal member

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JP3662404B2 (en) * 1997-11-19 2005-06-22 芝浦メカトロニクス株式会社 Wafer sheet stretching apparatus and pellet bonding apparatus using the same
TW499508B (en) * 1999-12-10 2002-08-21 Nippon Denkai Kk Roughening treated copper foil and producing method therefor
US7026059B2 (en) * 2000-09-22 2006-04-11 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultrafine printed wiring boad
JP3622680B2 (en) * 2001-02-22 2005-02-23 住友金属工業株式会社 Ferritic stainless steel continuously annealed steel for mask frame of cathode ray tube and manufacturing method thereof
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JP2002356789A (en) * 2001-05-30 2002-12-13 Nippon Mining & Metals Co Ltd Copper alloy foil for laminates
JP2003013156A (en) * 2001-07-04 2003-01-15 Nippon Mining & Metals Co Ltd Copper alloy foil for laminates
JP2004238647A (en) * 2003-02-04 2004-08-26 Furukawa Techno Research Kk Smoothed copper foil and method for producing the same
JP4172704B2 (en) * 2003-07-31 2008-10-29 日鉱金属株式会社 Surface-treated copper foil and substrate using the same
TW200535259A (en) * 2004-02-06 2005-11-01 Furukawa Circuit Foil Treated copper foil and circuit board
JP2006103189A (en) * 2004-10-06 2006-04-20 Furukawa Circuit Foil Kk Surface-treated copper foil and circuit board
JP5129642B2 (en) * 2007-04-19 2013-01-30 三井金属鉱業株式会社 Surface treated copper foil, copper clad laminate obtained using the surface treated copper foil, and printed wiring board obtained using the copper clad laminate
CN102203326A (en) * 2008-09-05 2011-09-28 古河电气工业株式会社 Ultrathin copper foil with carrier, and copper laminated board or printed wiring board
JP5242710B2 (en) * 2010-01-22 2013-07-24 古河電気工業株式会社 Roughening copper foil, copper clad laminate and printed wiring board
JP5794806B2 (en) * 2011-03-30 2015-10-14 古河電気工業株式会社 Surface-treated copper foil, copper-clad laminate using the surface-treated copper foil, and printed wiring board
JP5871426B2 (en) * 2012-01-31 2016-03-01 古河電気工業株式会社 Surface treated copper foil for high frequency transmission, laminated plate for high frequency transmission and printed wiring board for high frequency transmission
JP5475897B1 (en) * 2012-05-11 2014-04-16 Ｊｘ日鉱日石金属株式会社 Surface-treated copper foil and laminate using the same, copper foil, printed wiring board, electronic device, and method for manufacturing printed wiring board
JP5855244B2 (en) * 2012-05-21 2016-02-09 Jx日鉱日石金属株式会社 Surface-treated copper foil, laminate using the same, printed wiring board, electronic device, and method for producing printed wiring board

Also Published As

Publication number Publication date
KR20150062988A (en) 2015-06-08
PH12014000344A1 (en) 2016-06-06
CN104717831A (en) 2015-06-17
TWI619409B (en) 2018-03-21
TW201524280A (en) 2015-06-16
JP5710737B1 (en) 2015-04-30
JP2015105421A (en) 2015-06-08
KR20170046632A (en) 2017-05-02
CN104717831B (en) 2018-01-23

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