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PH12014500138A1 - Resin composition for cleaning die - Google Patents

Resin composition for cleaning die

Info

Publication number
PH12014500138A1
PH12014500138A1 PH1/2014/500138A PH12014500138A PH12014500138A1 PH 12014500138 A1 PH12014500138 A1 PH 12014500138A1 PH 12014500138 A PH12014500138 A PH 12014500138A PH 12014500138 A1 PH12014500138 A1 PH 12014500138A1
Authority
PH
Philippines
Prior art keywords
resin composition
particle diameter
cleaning die
less
standard deviation
Prior art date
Application number
PH1/2014/500138A
Inventor
Hiroaki Nomura
Taichi Sato
Katsunori Yoshimura
Original Assignee
Nippon Carbide Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Carbide Kogyo Kk filed Critical Nippon Carbide Kogyo Kk
Publication of PH12014500138A1 publication Critical patent/PH12014500138A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B29C33/722—Compositions for cleaning moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Detergent Compositions (AREA)

Abstract

A mold-cleaning resin composition which comprises, as the essential components, both a melamine resin and an inorganic filler that has a mean particle diameter of 4 to 12µm, a standard deviation of particle diameter of 10µm or less, an average aspect ratio of particle diameter of 1 to 1.3, and a standard deviation of aspect ratio of particle diameter of 0.5 or less.
PH1/2014/500138A 2011-07-15 2012-07-10 Resin composition for cleaning die PH12014500138A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011156953 2011-07-15
PCT/JP2012/067619 WO2013011876A1 (en) 2011-07-15 2012-07-10 Mold-cleaning resin composition

Publications (1)

Publication Number Publication Date
PH12014500138A1 true PH12014500138A1 (en) 2014-02-24

Family

ID=47558054

Family Applications (1)

Application Number Title Priority Date Filing Date
PH1/2014/500138A PH12014500138A1 (en) 2011-07-15 2012-07-10 Resin composition for cleaning die

Country Status (6)

Country Link
JP (1) JP5972266B2 (en)
KR (1) KR101934065B1 (en)
CN (1) CN103702813B (en)
PH (1) PH12014500138A1 (en)
TW (1) TWI580547B (en)
WO (1) WO2013011876A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013111709A1 (en) * 2012-01-23 2013-08-01 日本カーバイド工業株式会社 Resin composition for cleaning die
JP6715627B2 (en) * 2016-03-18 2020-07-01 日本カーバイド工業株式会社 Mold cleaning resin composition
KR102274604B1 (en) * 2019-11-27 2021-07-07 아쿠아켐(주) Melamine Resin Composition for Cleaning Semiconductor Mold
KR102325676B1 (en) 2019-12-18 2021-11-11 황진상 Resin composition for mold cleaning and manufacturing method thereof
KR102304403B1 (en) 2019-12-18 2021-09-17 황진상 Resin composition for mold cleaning and manufacturing method thereof
JP7265495B2 (en) * 2020-01-17 2023-04-26 日本カーバイド工業株式会社 Mold cleaning resin composition
JP2023124048A (en) * 2022-02-25 2023-09-06 富士紡ホールディングス株式会社 Polishing pad and manufacturing method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2978308B2 (en) * 1991-11-15 1999-11-15 松下電工株式会社 Mold cleaning resin composition
JP4262476B2 (en) * 2000-10-11 2009-05-13 日本カーバイド工業株式会社 Mold cleaning resin composition
JP4529280B2 (en) 2000-11-28 2010-08-25 住友ベークライト株式会社 Mold cleaning material for semiconductor encapsulation
JP3847259B2 (en) * 2001-04-25 2006-11-22 日本カーバイド工業株式会社 Mold cleaning resin composition
JP2006335913A (en) * 2005-06-03 2006-12-14 Daicel Polymer Ltd Cleaning resin composition
JP6116789B2 (en) 2009-07-17 2017-04-19 日立化成株式会社 Semiconductor device molding die cleaning sheet and semiconductor device molding die cleaning method using the same
KR101788859B1 (en) * 2009-07-17 2017-10-20 닛토덴코 가부시키가이샤 Mold cleaner composition and mold cleaning material, and method of cleaning using the same

Also Published As

Publication number Publication date
WO2013011876A1 (en) 2013-01-24
JP5972266B2 (en) 2016-08-17
KR101934065B1 (en) 2019-01-02
CN103702813B (en) 2016-03-30
TW201311423A (en) 2013-03-16
CN103702813A (en) 2014-04-02
TWI580547B (en) 2017-05-01
KR20140039047A (en) 2014-03-31
JPWO2013011876A1 (en) 2015-02-23

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