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LU90376B1 - Method for manufacturing a multilayer printed circuit board and composite foil for use therein - Google Patents

Method for manufacturing a multilayer printed circuit board and composite foil for use therein

Info

Publication number
LU90376B1
LU90376B1 LU90376A LU90376A LU90376B1 LU 90376 B1 LU90376 B1 LU 90376B1 LU 90376 A LU90376 A LU 90376A LU 90376 A LU90376 A LU 90376A LU 90376 B1 LU90376 B1 LU 90376B1
Authority
LU
Luxembourg
Prior art keywords
manufacturing
circuit board
printed circuit
multilayer printed
composite foil
Prior art date
Application number
LU90376A
Inventor
Raymond Gales
Damien Michel
Original Assignee
Circuit Foil Luxembourg Trading Sarl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to LU90376A priority Critical patent/LU90376B1/en
Application filed by Circuit Foil Luxembourg Trading Sarl filed Critical Circuit Foil Luxembourg Trading Sarl
Priority to IL14515300A priority patent/IL145153A/en
Priority to AU41083/00A priority patent/AU4108300A/en
Priority to KR1020017012161A priority patent/KR100760432B1/en
Priority to JP2000607449A priority patent/JP2002540609A/en
Priority to PL00350939A priority patent/PL350939A1/en
Priority to DE60000315T priority patent/DE60000315T3/en
Priority to PCT/EP2000/002560 priority patent/WO2000057680A1/en
Priority to US09/937,085 priority patent/US6779262B1/en
Priority to MXPA01009619A priority patent/MXPA01009619A/en
Priority to CNB008051844A priority patent/CN1193652C/en
Priority to EP00920545A priority patent/EP1172025B2/en
Priority to AT00920545T priority patent/ATE222046T1/en
Priority to CZ20013257A priority patent/CZ300550B6/en
Priority to ES00920545T priority patent/ES2181653T5/en
Priority to CA002364918A priority patent/CA2364918C/en
Priority to SK1347-2001A priority patent/SK13472001A3/en
Priority to HK02105066.6A priority patent/HK1043470B/en
Priority to HU0200426A priority patent/HUP0200426A2/en
Priority to EA200100928A priority patent/EA003263B1/en
Application granted granted Critical
Publication of LU90376B1 publication Critical patent/LU90376B1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
LU90376A 1999-03-23 1999-03-23 Method for manufacturing a multilayer printed circuit board and composite foil for use therein LU90376B1 (en)

Priority Applications (20)

Application Number Priority Date Filing Date Title
LU90376A LU90376B1 (en) 1999-03-23 1999-03-23 Method for manufacturing a multilayer printed circuit board and composite foil for use therein
AT00920545T ATE222046T1 (en) 1999-03-23 2000-03-23 METHOD FOR PRODUCING A MULTI-LAYER PRINTED CIRCUIT BOARD AND COMPOSITE FILM FOR USE THEREIN
KR1020017012161A KR100760432B1 (en) 1999-03-23 2000-03-23 Manufacturing method of multilayer printed circuit board and composite foil used therein
JP2000607449A JP2002540609A (en) 1999-03-23 2000-03-23 Method for manufacturing multilayer printed circuit board and composite foil used therefor
PL00350939A PL350939A1 (en) 1999-03-23 2000-03-23 Method for manufacturing a multilayer printed circuit board and composite foil for use therein
DE60000315T DE60000315T3 (en) 1999-03-23 2000-03-23 METHOD FOR PRODUCING A MULTILAYER PRINTED PCB AND COMPOSITE FILM FOR USE THEREIN
PCT/EP2000/002560 WO2000057680A1 (en) 1999-03-23 2000-03-23 Method for manufacturing a multilayer printed circuit board and composite foil for use therein
US09/937,085 US6779262B1 (en) 1999-03-23 2000-03-23 Method for manufacturing a multilayer printed circuit board
IL14515300A IL145153A (en) 1999-03-23 2000-03-23 Method for manufacturing a multilayer printed circuit board and composite foil for use therein
CNB008051844A CN1193652C (en) 1999-03-23 2000-03-23 Method for manufacturing multilayer printed circuit board and composite sheet used therein
EP00920545A EP1172025B2 (en) 1999-03-23 2000-03-23 Method for manufacturing a multilayer printed circuit board and composite foil for use therein
AU41083/00A AU4108300A (en) 1999-03-23 2000-03-23 Method for manufacturing a multilayer printed circuit board and composite foil for use therein
CZ20013257A CZ300550B6 (en) 1999-03-23 2000-03-23 Process for producing multilayer printer circuit board and composite film used in this production process
ES00920545T ES2181653T5 (en) 1999-03-23 2000-03-23 PROCEDURE FOR THE MANUFACTURE OF A MULTI-PAPER PRINTED CIRCUIT CARD AND COMPOSITE SHEET FOR USE THEREOF.
CA002364918A CA2364918C (en) 1999-03-23 2000-03-23 Method for manufacturing a multilayer printed circuit board and composite foil for use therein
SK1347-2001A SK13472001A3 (en) 1999-03-23 2000-03-23 Method for manufacturing a multilayer printed circuit board and composite foil for use therein
HK02105066.6A HK1043470B (en) 1999-03-23 2000-03-23 Method for manufacturing a multilayer printed circuit board and composite foil for use therein
HU0200426A HUP0200426A2 (en) 1999-03-23 2000-03-23 Method for manufacturing a multilayer printed circuit board and composite foil for use therein
EA200100928A EA003263B1 (en) 1999-03-23 2000-03-23 Method for manufacturing a multilayer printed circuit board and composite foil for use therein
MXPA01009619A MXPA01009619A (en) 1999-03-23 2000-03-23 Method for manufacturing a multilayer printed circuit board and composite foil for use therein.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
LU90376A LU90376B1 (en) 1999-03-23 1999-03-23 Method for manufacturing a multilayer printed circuit board and composite foil for use therein

Publications (1)

Publication Number Publication Date
LU90376B1 true LU90376B1 (en) 2000-09-25

Family

ID=19731809

Family Applications (1)

Application Number Title Priority Date Filing Date
LU90376A LU90376B1 (en) 1999-03-23 1999-03-23 Method for manufacturing a multilayer printed circuit board and composite foil for use therein

Country Status (1)

Country Link
LU (1) LU90376B1 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3998601A (en) * 1973-12-03 1976-12-21 Yates Industries, Inc. Thin foil
DE3103986A1 (en) * 1981-02-05 1982-09-09 Reiner Dipl.-Phys. 8011 Vaterstetten Szepan Method for producing drilled holes for through-plated contact making in electronic printed-circuit boards
US4398993A (en) * 1982-06-28 1983-08-16 International Business Machines Corporation Neutralizing chloride ions in via holes in multilayer printed circuit boards
WO1997041713A1 (en) * 1996-05-01 1997-11-06 Alliedsignal Inc. New method of forming fine circuit lines
JPH1075069A (en) * 1996-06-27 1998-03-17 Samsung Electro Mech Co Ltd Manufacture of build-up multi-layer printed circuit board using yag laser
JPH10190236A (en) * 1996-12-26 1998-07-21 Nippon Carbide Ind Co Inc Method for manufacturing multilayer wiring board

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3998601A (en) * 1973-12-03 1976-12-21 Yates Industries, Inc. Thin foil
DE3103986A1 (en) * 1981-02-05 1982-09-09 Reiner Dipl.-Phys. 8011 Vaterstetten Szepan Method for producing drilled holes for through-plated contact making in electronic printed-circuit boards
US4398993A (en) * 1982-06-28 1983-08-16 International Business Machines Corporation Neutralizing chloride ions in via holes in multilayer printed circuit boards
WO1997041713A1 (en) * 1996-05-01 1997-11-06 Alliedsignal Inc. New method of forming fine circuit lines
JPH1075069A (en) * 1996-06-27 1998-03-17 Samsung Electro Mech Co Ltd Manufacture of build-up multi-layer printed circuit board using yag laser
JPH10190236A (en) * 1996-12-26 1998-07-21 Nippon Carbide Ind Co Inc Method for manufacturing multilayer wiring board

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
A. KESTENBAUM ET AL.: "Laser drilling of microvias in epoxy-glass printed circuit boards", IEEE TRANSACTIONS ON COMPONENTS,HYBRIDS,AND MANUFACTURING TECHNOLOGY., vol. 13, no. 4, December 1990 (1990-12-01), IEEE INC. NEW YORK., US, pages 1055 - 1062, XP000176849, ISSN: 0148-6411 *
A. N. PARGELLIS: "Formation of microvias in epoxy-glass composites by laser ablation", OPTICS AND LASER TECHNOLOGY, vol. 22, no. 3, June 1990 (1990-06-01), ELSEVIER SCIENCE PUBLISHERS BV., AMSTERDAM., NL, pages 205 - 207, XP000137239, ISSN: 0030-3992 *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 12 31 October 1998 (1998-10-31) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 8 30 June 1998 (1998-06-30) *

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