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KR900700292A - 적층 중합체 시트 - Google Patents

적층 중합체 시트

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Publication number
KR900700292A
KR900700292A KR1019890701829A KR890701829A KR900700292A KR 900700292 A KR900700292 A KR 900700292A KR 1019890701829 A KR1019890701829 A KR 1019890701829A KR 890701829 A KR890701829 A KR 890701829A KR 900700292 A KR900700292 A KR 900700292A
Authority
KR
South Korea
Prior art keywords
sheet
polyimide
layer
electrically conductive
polyamide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019890701829A
Other languages
English (en)
Inventor
파트릭 제임스 호너
마이클 죠셉 루덴
피터 니홀름
니콜라스 제이. 지 스미스
리챠드 존 페넥크
Original Assignee
원본미기재
레이켐 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB888802566A external-priority patent/GB8802566D0/en
Priority claimed from GB888828245A external-priority patent/GB8828245D0/en
Application filed by 원본미기재, 레이켐 리미티드 filed Critical 원본미기재
Publication of KR900700292A publication Critical patent/KR900700292A/ko
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0333—Organic insulating material consisting of one material containing S
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
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    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
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    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
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    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

내용 없음

Description

적층 중합체 시트
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (24)

  1. 무정형 폴리아미드 재료층과 직접 접촉되어 적층화된 폴리이미드 재료층을 함유함을 특징으로 하는 적층시트.
  2. 제1항에 있어서, 폴리아미드 재료가 무정형 방향족 폴리아미드 재료를 함유한 시트.
  3. 제1또는 2항에 있어서, 폴리이미드 재료층의 두개의 주표면 각각이 폴리아미드 재료층과 직접 접촉되어 적층화된 시트.
  4. 제 1,2또는 3항 중 어느 한항에 있어서, 폴리이미드층이 폴리아미드층과 실질적으로 공-팽창되는 시트.
  5. 제1 내지 4항중 어느 한항에 있어서, UV광선에 노출됨으로써 가교결합된 시트.
  6. 제5항에 있어서, 선택적으로 가교 결합되어 저항패턴을 형성하는 시트.
  7. 제1 내지 6항중 어느 한항에 있어서, 관통-공이 U.V.레이져 광선에 시트의 선택된 부분이 노출됨으로써 제조되는 시트.
  8. 제1 내지 7항중 어느 한 항에 있어서, 전기 전도성 재료를 함유하는 관통-공이 시트의 주표면사이에 전기 전도성 경로를 제공하는 시트.
  9. 제8항에 있어서, 각각의 전도성 경로를 제공하는 전기 전도성 재료가 관통-공의 내표면상에 도금된 금속을 함하는 시트.
  10. 제8 또는 9항에 있어서, 각각의 전도성 경로가 실질적으로 다른 모든 경로로 부터 전기적으로 분리되는 시트.
  11. 제8,9 또는 10항에 따른 시트이 폴리이미드층의 표면으로 부터 폴리아미드층의 저거도 일부를 제거하여 생성된 시트의 주표면상에 사출된 관통-공에 전기전도성 재료를 남겨둠으로써 제조된 시트.
  12. 제11항에 있어서, 폴리아미드총이 실직적으로 완전히 제거된 시트.
  13. 제1 내지 5항중 어느 한 항에 있어서, 전기 와이의 전기 절연 커버링 형태의 시트.
  14. 제1 내지 13항중 어느 한 항에 있어서, 폴리아미드가 (A)테레프 탈산과 트리메틸헥사메틸렌 디아민의 이성질체(바람직하게는 2,2,4- 및 2,4,4-트리메틸헥사메틸렌 디아민 이성질체 함유)1종 이상의 축합, 또는 (B)1종이상의 비스아미노메틸노르보르난 이성질체와 1종 이상의 지방족, 지환족 또는 방향족 디카르복실산 및 임의적으로는 1종 이상의 아미노산 또는 에프실론-카르로락탐 공단량체와 같은 락탐의 축합, 또는 (C) 라우린락탐, 이소프탈산 및 비스-(4-아미노-3-메틸시클로헥실)메탄, (D)2,2-비스-(P-아미노시클로헥실)프로판과 이디프산 및 아젤라산의 축합, 또는 트란스 시클로헥산-1,4-디카르복실산과(A)에서 언급된 트리메틸헥사메틸렌디아민 이성질체의 축합, 또는 (E)m-크실릴렌 다이민 및 아디프산으로 부터 유도된 유니트를 기분으로 하는 폴리아미드로 부터 유도되는 시트.
  15. 제1 내지 14항중 어느 한항에 있어서, 폴리이미드가·4,4′-비페닐디안히드라이드 및 (4,4′-디아미노비페닐, 또는 4,4′-디아민노비페닐에테르, 또는 페닐렌디아민)으로 부터 유도된 시트.
  16. 제1 내지 15항중에 어느 한 항에 있어서, 중합체 재료의 적어도 1개의 또 다른 층을 폴리아미드 재료의 적어도 1층에 오버레인한 시트.
  17. 제1 내지 16항중 어느 한 항에 있어서, 적어도 하나의 금속층을 폴리아미드 재료의 적어도 1층에 오버레이한 시트.
  18. 제17항에 있어서, 주표면의 한쪽 또는 양쪽에 폴리아미드 재료층을 가지며, 또 다른 층의 한쪽 또는 양쪽에 금속층을 갖는 폴리이미드 재료층을 포함하는 시트.
  19. 제1 내지 18항중 어느 한항에 있어서, 폴리이미드 재료가 ASTM D882에 따라성 100℃의 pH10 물 중에서 4일동안 침지시킨 후 본래 신장율의 50%이상, 바람직하게 75%이상, 좀더 바람직하게는 85%이상 보유가능한 시트.
  20. 제1 내지 19항 중 어느 한항에 있어서, 폴리이미드 재료가 4,4′-비페닐 디안히드라이드 및 p-페닐렌디아민 중합으로 부터 유도된 시트.
  21. 비등방성 전기 전도성 물품으로서, 적어도 선택된 부위가 그표면의 평방밀리미터당 적어도 25개의 실질적으로 비-상호 결합된 공극을 가지며, 공극의 적어도 특정 비율이 각각 시트재로의 주표면사이에서 전기전도성 경로를 제공하며 주표면중 적어도 한쪽에 사출되는 전기 전도성 재료를 함유하고, 상기 각각의 전도 경로가 실질적으로 다른 모든 전도 경로로 부터 전기 분리되며, 폴리이미드가 4,4-비페닐디안히드라이드 및(4,4′-디아미노비페닐 또는 4.4′-디아미노비페닐 에테르, 또는 페닐렌 디아민)으로 부터 유도되며/또는 ASTM D882에 따라서 100℃의 pH10물 중에서 4시산 동안 침지시킨 후 본래 신장율의 50%이상, 바람직하게 75%이상, 좀더 바람직하게는 85%이상 보유가능한 다공성 전기 절연 폴리이미드 시트재료를 함유함을 특징으로 하는 물품.
  22. 비등방성 전기 전도성 물품으로서, 적어도 선택된 부위가 그표면의 평방밀리미터 당 적어도 25개의 실질적으로 비-상호 결합된 공극을 가지며, 공극의 적어도 특정 비율이 전기 정도성 재료로 내부도금되고, 전기전도성 재료가 시트재료의 주표면 사이에 전기 전도성 경로를 제공하며 각각의 상기 경로의 실질적으로 다른 모든 경로와 전기분리되며, 폴리이미드가 4,4′-비페닐 디안히드라이드 및 (4,4′-디아미노비페닐 또는 4,4′-디아미노비페닐에테르 또는 페닐렌 디아민)의 중합으로 부터 유도 되며/또는 ASTM D 882에 따라서 100℃의 pH10물 중에서 4일 동안 침지시킨 후 본래 신장율의 50%이상, 바람직하게 75%이상, 좀더 바람직하게는 85%이상 보유가능한 다공성 전기 절열 폴리이미드시트 재료를 함유함을 특징으로 하는 물품.
  23. 비등방성 전기 전도성 물품으로서, 적어도 선택된 부위가 실질적으로 비-상호 결합된 공극 다수를 가지며, 공극의 적어도 특정비율이 전기 전도성재료의 관형 1차 부위를 함유하고, 관형 재료가 시트재료 주표면의 적어도 한쪽을 넘어서 사출되며, 폴리이미드가 4,4′-비페닐디안히드라이드 및 (4,4′-디아미노 비페닐 또는 4,4′-디아미노비페닐에테르, 또는 페닐렌디아민)의 중합으로 부터 유도되며/또는 ASTM D882에 따라서 100℃의 pH10물중에서 4일동안 침지시킨 후 본래 신장율의 50%이상, 바람직하게는 75%이상, 좀더 바람직하게는 85% 이상 보유가능한 다공성 전기 절연 폴리이미드 시트 재료를 함유함을 특징으로 하는 물품.
  24. 제1 내지 23항중 어느 한 항에 있어서, (관통-공축에 비해)10°미만, 바람직하게는 8°미만, 좀더 바람직하게는 6°미만의 공(hole)테이퍼와 함께 레이져-뀀뚫어진 관통-공을 갖는 시트.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890701829A 1988-02-05 1989-02-03 적층 중합체 시트 Withdrawn KR900700292A (ko)

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GB888802566A GB8802566D0 (en) 1988-02-05 1988-02-05 Laminar polymeric sheet
GB888828245A GB8828245D0 (en) 1988-12-02 1988-12-02 Anisotropically electrically conductive articles
GB8802566 1988-12-02
GB882845.4 1988-12-02
PCT/GB1989/000108 WO1989007336A1 (en) 1988-02-05 1989-02-03 Laminar polymeric sheet

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DE68918303D1 (de) 1994-10-27
US5194316A (en) 1993-03-16
JPH03502434A (ja) 1991-06-06
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ATE112099T1 (de) 1994-10-15
EP0328325A1 (en) 1989-08-16
JP2664091B2 (ja) 1997-10-15

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