KR20240143604A - Method of transferring micro semiconductor chip and deivce for transferring micro semiconductor chip - Google Patents

Abstract

A micro semiconductor chip transfer method according to one embodiment may include a step of preparing a transfer substrate including a plurality of grooves on an upper portion, a step of supplying a suspension including a plurality of micro semiconductor chips and a liquid onto an upper portion of the transfer substrate, and a step of sweeping an upper surface of the transfer substrate including the suspension using an align bar including a hydrophobic wiper to align the micro semiconductor chips within the grooves.

Description

{Method of transferring micro semiconductor chip and device for transferring micro semiconductor chip}

The present disclosure relates to a micro semiconductor chip transfer method and a micro semiconductor chip transfer device.

Light emitting diodes (LEDs) are seeing increasing industrial demand due to their low power consumption and environmental friendliness, and are being used not only for lighting devices and LCD backlights, but also for display devices. In manufacturing display devices using micro-unit LED chips, the pick and place method is used as a method for transferring micro LEDs. However, as the size of micro LEDs decreases and the size of displays increases, the productivity of this method decreases.

According to the present disclosure, a method for wet transferring a micro semiconductor chip and a micro semiconductor chip transfer device are provided.

According to one embodiment, a micro semiconductor chip transfer method may include a step of preparing a transfer substrate including a plurality of grooves on an upper portion, a step of supplying a suspension including a plurality of micro semiconductor chips and a liquid to the transfer substrate, and a step of sweeping an upper surface of the transfer substrate including the suspension using an align bar including a hydrophobic wiper to align the micro semiconductor chips within the grooves.

The above hydrophobic wiper may include a material that is insoluble in a polar solvent.

The above hydrophobic wiper may include Teflon or nylon.

The form of the above hydrophobic wiper may be a membrane filter, a general filter, a mesh, a sheet, or a thin film.

The mesh size of the above hydrophobic wiper may be 100㎛ or less.

The liquid may comprise one or a combination of a plurality of selected from the group consisting of water, ethanol, alcohol, polyol, ketone, halocarbon, acetone, flux, and organic solvent.

The above suspension may further contain a surfactant.

The step of supplying the suspension may include a spraying method, a dispensing method, an inkjet dot method, or a method of flowing the suspension onto the transfer substrate.

The step of sweeping the upper surface of the transfer substrate using the alignment bar including the hydrophobic wiper may include reciprocating motion, translational motion, rotational motion, rolling motion, rubbing, or spinning of the hydrophobic wiper.

The step of sweeping the upper surface of the transfer substrate using the alignment bar including the hydrophobic wiper may include reciprocating motion, rotational motion, translational motion, rolling motion, rubbing or spinning of the transfer substrate to move the transfer head on which the transfer substrate is mounted.

By using an alignment bar including the hydrophobic wiper to sweep the upper surface of the transfer substrate, the plurality of micro semiconductor chips can be aligned in the same direction within the groove.

The plurality of micro semiconductor chips each include a first surface including an electrode and a second surface without an electrode, and the plurality of micro semiconductor chips aligned in the groove can be aligned such that the second surface faces the bottom of the groove.

The above micro semiconductor chip transfer method may further include a step of cleaning unaligned micro semiconductor chips and remaining liquid within the groove by sweeping the transfer substrate with an absorbent of a hydrophilic material.

The step of cleaning the transfer substrate with the absorbent material may include reciprocating motion, translational motion, rotational motion, rolling motion, rubbing, or spinning of the absorbent material.

According to one embodiment, the device may include a transfer head on which a transfer substrate having a plurality of micro semiconductor chip transfer grooves formed on an upper portion thereof is mounted, a suspension supply module for supplying a suspension including a micro semiconductor chip and a liquid onto an upper portion of the transfer substrate on the transfer head, and an align bar including a hydrophobic wiper for sweeping the transfer substrate.

The above hydrophobic wiper may include a material that is insoluble in a polar solvent.

The above hydrophobic wiper may include Teflon or nylon.

The form of the above hydrophobic wiper may be a membrane filter, a general filter, a mesh, a sheet, or a thin film.

The above suspension may further contain a surfactant.

The above micro semiconductor chip transfer device may further include a cleaning module including an absorbent material of a hydrophilic material for cleaning liquid and micro semiconductor chips that are not aligned inside the groove.

According to the disclosed embodiment, a method for transferring a micro semiconductor chip and a micro semiconductor chip transfer device use a hydrophobic wiper for transfer, thereby separating a micro semiconductor chip transfer process and a micro semiconductor chip cleaning process.

According to the disclosed embodiment, a method for transferring a micro semiconductor chip and a micro semiconductor chip transfer device use a hydrophobic wiper for transfer, thereby reducing friction between the micro semiconductor chip and the hydrophobic wiper and increasing the transfer yield.

FIG. 1 is a flow chart illustrating a method for transferring a micro semiconductor chip according to one embodiment.
FIGS. 2A to 2C are drawings showing a transfer substrate used in a transfer method of a micro semiconductor chip according to one embodiment.
FIG. 3 is a drawing showing a suspension used in a method for transferring a micro semiconductor chip according to one embodiment.
FIGS. 4A to 4C are drawings showing a method for transferring a micro semiconductor chip according to one embodiment.
FIGS. 5A and 5B are drawings schematically illustrating the structure of a micro semiconductor chip according to one embodiment.
FIG. 6 is a drawing showing a micro semiconductor chip transfer device according to one embodiment.
Figure 7 illustrates an example of a state in which micro semiconductor chips are aligned on a transfer substrate.
FIGS. 8A to 8C are drawings showing a method of transferring a micro semiconductor chip according to another embodiment.
FIG. 9 illustrates a block diagram of an electronic device including a display transfer structure according to one embodiment.
FIG. 10 illustrates an example of an electronic device applied to a mobile device according to one embodiment.
FIG. 11 illustrates an example in which a display device according to one embodiment is applied to a car.
FIG. 12 illustrates an example in which a display device according to one embodiment is applied to augmented reality glasses or virtual reality glasses.
FIG. 13 illustrates an example in which a display device according to one embodiment is applied to a large signage.
FIG. 14 illustrates an example in which a display device according to one embodiment is applied to a wearable display.

Hereinafter, with reference to the attached drawings, a micro semiconductor chip transfer method and a micro semiconductor chip transfer device according to various embodiments will be described in detail. In the drawings below, the same reference numerals refer to the same components, and the size of each component in the drawings may be exaggerated for clarity and convenience of explanation. In addition, the embodiments described below are merely exemplary, and various modifications are possible from these embodiments.

Hereinafter, the expression "upper" or "upper" may include not only what is directly above in contact, but also what is above in a non-contact manner. The singular expression includes the plural expression unless the context clearly indicates otherwise. Also, when a part is said to "include" a certain component, this does not mean that it excludes other components, but rather that it may include other components, unless otherwise specifically stated.

The use of the term "above" and similar referential terms may refer to both the singular and the plural. Unless the steps of a method are explicitly stated to be in a particular order or to the contrary, these steps may be performed in any suitable order, and are not necessarily limited to the order stated.

The connections or lack of connections between the lines depicted in the drawings are merely illustrative of functional connections and/or physical or circuit connections, and may be represented in an actual device as alternative or additional various functional connections, physical connections, or circuit connections.

Additionally, terms such as “part”, “module”, etc. described in the specification mean a unit that processes a function or operation, which may be implemented by hardware or software, or by a combination of hardware and software.

The steps of a method may be performed in any suitable order unless there is an explicit statement that they must be performed in the order described.

Any use of examples or exemplary terms is intended merely to elaborate technical ideas and is not intended to limit the scope of the invention unless otherwise defined by the claims.

FIG. 1 is a flow chart illustrating a method for transferring a micro semiconductor chip according to one embodiment.

A method for transferring a micro semiconductor chip may include a step (S101) of preparing a transfer substrate including a plurality of grooves on an upper portion, a step (S102) of supplying a suspension including a plurality of micro semiconductor chips and a liquid onto an upper portion of the transfer substrate, and a step (S103) of sweeping an upper surface of the transfer substrate including the suspension using an align bar including a hydrophobic wiper to align the micro semiconductor chips into the grooves. The method for transferring a micro semiconductor chip may further include a step (S104) of sweeping the transfer substrate with an absorbent of a hydrophilic material to clean micro semiconductor chips that are not aligned inside the grooves and remaining liquid.

A transfer substrate including a plurality of grooves on the upper portion is prepared (S101). The transfer substrate may be provided as a single layer or may include a plurality of layers.

A suspension containing a plurality of micro semiconductor chips is supplied to the upper portion of the transfer substrate (S102). The suspension may contain micro semiconductor chips and a liquid.

The upper surface of the transfer substrate including the suspension is swept using an alignment bar including a hydrophobic wiper to align the micro semiconductor chip into the groove (S103). The micro semiconductor chip can be moved into a plurality of grooves of the transfer substrate using the alignment bar including a hydrophobic wiper.

The transfer substrate is swept with an absorbent material of a hydrophilic material to clean the micro semiconductor chips and remaining liquid that are not aligned within the groove (S104). The absorbent material can remove the micro semiconductor chips and liquid on the transfer substrate.

FIGS. 2A to 2C are drawings showing a transfer substrate used in a transfer method of a micro semiconductor chip according to one embodiment.

Referring to FIG. 2A, a transfer substrate (120) including a plurality of grooves (110) on an upper portion may be prepared. The grooves (110) may be provided to place a micro semiconductor chip (131). The micro semiconductor chip (131) may include various types of semiconductor chips having a micro size, and the micro size may be 100 μm or less. The grooves (110) may have a cross-sectional area larger than the area of the micro semiconductor chip (131) so as to accommodate the micro semiconductor chip (131).

The micro semiconductor chip (131) may include, for example, an LED (light emitting diode), a FET (field effect transistor), a CMOS (complementary metal-oxide semiconductor), a CIS (CMOS image sensor), a VCSEL (vertical-cavity surface-emitting laser), a PD (photo diode), a memory device, a 2D material device, etc. The 2D material may be graphene or a CNT (carbon nano tube), etc.

Referring to FIG. 2b, the spacing between the plurality of grooves (110) may correspond to the spacing between the micro semiconductor chips (131) inserted into the grooves (110). For example, when the micro semiconductor chips (131) are light-emitting elements, the spacing between the plurality of grooves (110) may correspond to the pixel spacing of the display device used in the final product. However, the spacing between the plurality of grooves (110) is not limited thereto and may be variously modified as needed.

The transfer substrate (120) may include a plurality of layers. For example, the transfer substrate (120) may include a base substrate (121) and a guide mold (122). The materials of the base substrate (121) and the guide mold (122) may be different, but may also be the same. The transfer substrate (120) may also be composed of a single layer. In addition, the plane shape of the transfer substrate (120) may be a square, but is not limited thereto, and may have, for example, a circular plane shape.

The groove (110) and the upper surface of the transfer substrate (120) may have different adhesion or surface energy densities. The upper surface of the transfer substrate (120) may have a rough surface or a rough pattern that weakens the adhesion with the micro semiconductor chip (131), so that the micro semiconductor chip (131) may have difficulty in sticking. On the other hand, the lower surface of the groove (110), i.e., the base substrate (121), may be surface-treated with a material that strengthens the adhesion with the micro semiconductor chip (131). For example, the groove (110) may be surface-treated with a hydrophilic material, and the upper surface of the transfer substrate (120) may be surface-treated with a hydrophobic material. Alternatively, the upper surface of the transfer substrate (120) may be physically patterned to have different adhesion or surface energy densities.

Referring to FIG. 2c, the transfer substrate (120a) may include a body (123) having a plurality of grooves (110) and a surface energy reduction pattern (SP) formed of a plurality of convex patterns (124) formed in an area between the plurality of grooves (110) on the upper surface of the body (123).

The surface energy reduction pattern (SP) including a plurality of convex patterns (124) formed on the transfer substrate (120a) can lower the surface energy of the upper surface of the body (123) connected to the groove (110), thereby preventing the micro semiconductor chip (131) from being fixed to the upper surface of the body (123). In other words, the sliding of the micro semiconductor chip (131) on the upper surface of the body (123) is improved by the surface energy reduction pattern (SP), so that the micro semiconductor chip (131) can move well into the groove (110) without being pressed at a position other than the standard position. In general, the surface energy between the interface where two surfaces come into contact is proportional to the contact area. When the convex patterns (124) are provided, the surface energy of the interface between the bottom surface of the micro semiconductor chip (131) and the transfer substrate (120a) can be lowered, thereby allowing the micro semiconductor chip (131) to move well into the groove (110). In addition, since the adhesive force or surface energy density between the convex pattern (124) and the micro semiconductor chip (131) is low, when a magnetic field is applied, the micro semiconductor chip (131) can be easily separated from the convex pattern (124).

The width of the convex pattern (124) and the spacing between the convex patterns (124) can be set so that the micro semiconductor chip (131) is not fixed on the convex pattern (124) and also, the path of movement toward the groove (110) by being caught by the convex pattern (124) is not obstructed. The cross-sectional shape of the convex pattern (124) is shown as circular, but this is exemplary. It can be changed to various polygonal shapes, annular shapes, oval shapes, or other shapes.

The width of the convex pattern (124) may be smaller than the width of the micro semiconductor chip (131). In order to lower the surface energy at the interface between the convex pattern (124) and the micro semiconductor chip (131), for example, the width of the convex pattern (124) may be set to 50% or less, or 30% or less, or 10% or less of the width of the micro semiconductor chip (131).

FIG. 3 is a drawing showing a suspension used in a method for transferring a micro semiconductor chip according to one embodiment.

Referring to FIG. 3, the suspension (130) may include a micro semiconductor chip (131) and a liquid (132). Any type of liquid may be used as the liquid (132) as long as it does not corrode or damage the micro semiconductor chip (131). The liquid may include one or a combination of a plurality of the group including, for example, water, ethanol, alcohol, polyol, ketone, halocarbon, acetone, flux, and organic solvent. The organic solvent may include, for example, isopropyl alcohol (IPA). The usable liquid is not limited thereto and various changes are possible.

The step of supplying the suspension (130) can be variously used, such as a spray method, a dispensing method of dropping the liquid drop by drop, an inkjet dot method of ejecting the liquid like a printing method, or a method of flowing the suspension (130) onto the transfer substrate (120).

The step of supplying a suspension (130) containing a plurality of micro semiconductor chips (131) to the transfer substrate (120) may also be performed in two steps: a step of supplying a liquid (132) to the groove (110) of the transfer substrate (120) and a step of supplying the micro semiconductor chips (131) to the transfer substrate (120). Various methods of supplying the liquid (132) to the groove (110) may be used, for example, a spraying method, a dispensing method, an inkjet dot method, a method of flowing the liquid (132) to the transfer substrate (120). Meanwhile, the supply amount of the liquid (132) may be variously adjusted to fit the groove (110) or to overflow from the groove (110).

The suspension (130) containing a plurality of micro semiconductor chips (131) and a liquid (132) may further contain a surfactant. When the surfactant is supplied together with the suspension (130), the transfer yield of the micro semiconductor chip may be improved compared to when the surfactant is not supplied.

FIGS. 4A to 4C are drawings showing a method for transferring a micro semiconductor chip according to one embodiment.

Referring to FIG. 4A, a transfer substrate (110) including a plurality of grooves (120) can be prepared on a transfer head (180). The depth (d1) of the groove (110) can be about 20% smaller than the height of the micro semiconductor chip (131). The width (d2) of the groove (110) can be about 25% larger than the width of the micro semiconductor chip (131). Thereafter, a suspension (130) including a plurality of micro semiconductor chips (131) and a liquid (132) can be supplied to the transfer substrate (120).

Referring to FIG. 4b, an alignment bar (140) including a hydrophobic wiper (141) can be used to sweep an upper surface of a transfer substrate (120). By sweeping the upper surface of the transfer substrate (120) using the alignment bar (140) including the hydrophobic wiper (141), a plurality of micro semiconductor chips (131) can be aligned in the same direction within the groove (110). For example, the plurality of micro semiconductor chips (131) include a first surface including electrodes and a second surface without electrodes, and by sweeping the upper surface of the transfer substrate (120) using the alignment bar (140) including the hydrophobic wiper (141), the micro semiconductor chips (131) to be aligned within the groove (110) can be aligned such that the second surface without electrodes faces the bottom of the groove (110).

The hydrophobic wiper (141) may be made of a material that does not dissolve in a polar solvent. The hydrophobic wiper (141) may contain fluorine. The hydrophobic wiper (141) may contain a fluoropolymer series material. The hydrophobic wiper (141) may contain Teflon (PTFE). The hydrophobic wiper (141) may contain a polyamide series material. The hydrophobic wiper (141) may contain nylon.

The hydrophobic wiper (141) may have the form of a membrane filter, a general filter, a mesh, a sheet, or a thin film. When the hydrophobic wiper (141) has a mesh shape, the hydrophobic wiper (141) has a plurality of openings, and the size of the openings may be smaller than or equal to the size of the micro semiconductor chip (131) to prevent the micro semiconductor chip (131) from being stuck or jammed. The size of the openings of the hydrophobic wiper (141) may be, for example, 100 μm or smaller. The hydrophobic wiper (141) may be used alone without any other auxiliary device, but is not limited thereto, and may be combined with a first support member (142) to conveniently transfer the micro semiconductor chip (131). The hydrophobic wiper (141) may be provided on the surface of the first support member (142) to transfer the micro semiconductor chip (131). The first support member (142) may have various shapes and structures suitable for transferring the micro semiconductor chip (131). The first support (142) may have a shape such as a rod, a blade, a plate, or a wiper, for example. The hydrophobic wiper (141) may be provided on one side of the first support (142) or may wrap around the perimeter of the first support (142).

The step of sweeping the upper surface of the transfer substrate (120) using the alignment bar (140) including the hydrophobic wiper (141) may include various methods such as a reciprocating motion of the hydrophobic wiper (141), a translating motion, a rotating motion, a sliding motion, a rolling motion, a rubbing motion, and/or a spinning motion, and may include both a regular method and an irregular method. The transfer of the micro semiconductor chip (131) may also be performed by moving the transfer substrate (120) instead of moving the hydrophobic wiper (141), and for this purpose, the transfer head (180) may be used. The movement of the transfer substrate (120) to move the transfer head (180) on which the transfer substrate (120) is mounted may also be performed by a sliding, rotating, translating, reciprocating, rolling, spinning, and/or rubbing method. Of course, it is also possible for the transfer of the micro semiconductor chip (131) to be performed by cooperation between the hydrophobic wiper (141) and the transfer head (180).

When a hydrophobic wiper (141) is used, unlike when a hydrophilic wiper is used, the micro semiconductor chip (131) transfer process and the micro semiconductor chip (131) cleaning process can be separated, and the transfer yield can be improved compared to when a hydrophilic wiper is used. In addition, when a hydrophobic wiper (141) is used during the micro semiconductor chip (131) transfer process, the hydrophobic wiper (141) does not absorb the liquid (132) and the micro semiconductor chip (131), and the liquid (132) does not dry, so there is no need to supply additional liquid (132) during the transfer. The hydrophobic wiper (141) is made of a soft material and can reduce friction between the micro semiconductor chip (131) and the hydrophobic wiper (141). Through this, damage to the micro semiconductor chip (131) can be prevented.

Referring to FIG. 4c, the transfer substrate (120) can be swept with an absorbent (160) of a hydrophilic material to clean the micro semiconductor chips (131) that are not aligned inside the groove (110) and the remaining liquid (132). The absorbent (160) may be any material that can absorb the liquid (132), and its shape or structure is not limited. The absorbent (160) may include, for example, fabric, tissue, polyester fiber, paper, or a wiper. The absorbent (160) may be used alone without any other auxiliary device, but is not limited thereto, and may be combined with a second support (170) to facilitate cleaning the transfer substrate (120). The second support (170) may have various shapes and structures suitable for cleaning the transfer substrate (120). The second support (170) may have a shape such as a rod, a blade, a plate, or a wiper, for example. The absorbent material (160) may be provided on one side of the second support (170) or may wrap around the perimeter of the second support (170).

The absorbent (160) can be cleaned while pressurizing the transfer substrate (120) with an appropriate pressure. The cleaning can include a step in which the absorbent (160) contacts the transfer substrate (120) and absorbs liquid (132) while passing through a plurality of grooves (110).

After the absorbent (160) sweeps the transfer substrate (120), the micro semiconductor chips and the remaining liquid that are not aligned within the groove (110) and remain on the transfer substrate (120) are removed. The step of cleaning the transfer substrate (120) with the absorbent (160) can be performed in various ways, for example, a sliding manner, a reciprocating motion manner, a translating motion manner, a rotating manner, a rolling manner, a rubbing manner, and/or a spinning manner of the absorbent (160), and can include both a regular manner and an irregular manner. Instead of moving the absorbent (160), the cleaning can be performed by moving the transfer substrate (120), and the cleaning can also be performed by cooperation between the absorbent (160) and the transfer substrate (120).

FIGS. 5A and 5B are drawings schematically illustrating the structure of a micro semiconductor chip according to one embodiment.

Referring to FIG. 5a, the micro semiconductor chip (131) may include a first electrode (131b) and a second electrode (131c). The micro semiconductor chip (131) may be circular when viewed from above. However, the shape is not limited thereto, and the micro semiconductor chip (131) may have various shapes, such as a square shape.

Referring to FIG. 5b, the micro semiconductor chip (131) may include a chip body (131a), a first electrode (131b), and a second electrode (131c). A passivation film may be formed on the upper portion of the chip body (131a). The micro semiconductor chip (131) may be configured to be easily aligned in one direction using a fluidic self assembly method. When a plurality of micro semiconductor chips (131) are aligned on an external object such as a substrate using a fluidic self assembly method, most or all of the plurality of micro semiconductor chips (131) may be aligned in the same direction. For example, the plurality of micro semiconductor chips (131) may be aligned such that the first surface (S1), which is a lower surface of the micro semiconductor chip (131), comes into contact with the external object, and the second surface (S2), which is an upper surface of the micro semiconductor chip (131), does not come into contact with the external object.

To this end, the micro semiconductor chip (131) may be configured such that the van der Waals force between the first surface (S1) of the micro semiconductor chip (131) and the external contact surface is greater than the van der Waals force between the second surface (S2) of the micro semiconductor chip (131) and the external contact surface. In this case, when the first surface (S1) of the micro semiconductor chip (131) comes into contact with the external contact surface, it is relatively difficult to fall off, whereas when the second surface (S2) of the micro semiconductor chip (131) comes into contact with the external contact surface, it can be relatively easily fallen off. Therefore, when aligning the micro semiconductor chip (131), the probability that the micro semiconductor chip (131) is arranged such that the first surface (S1) of the micro semiconductor chip (131) comes into contact with the external contact surface may increase.

The van der Waals force can become larger as two objects in contact with each other come into closer contact with each other or as the contact area between the two objects in contact with each other becomes larger. Therefore, according to an embodiment, the surface roughness of the first surface (S1) of the micro semiconductor chip (131) can be smaller than the surface roughness of the second surface (S2) of the micro semiconductor chip (131). As a result, a relatively very smooth surface can be formed on the first surface (S1) which is the lower portion of the micro semiconductor chip (131), and a relatively rough surface can be formed on the second surface (S2) which is the upper portion of the micro semiconductor chip (131).

In addition, the area of the first surface (S1) of the micro semiconductor chip (131) may be larger than the area of the second surface (S2) of the micro semiconductor chip (131). To this end, the width (W1) of the first surface (S1) of the micro semiconductor chip (131) may be larger than the width (W2) of the second surface (S2) of the micro semiconductor chip (131). For example, the width (W2) of the second surface (S2) may be 0.7 to 1 times, or 0.8 to 0.95 times, the width (W1) of the first surface (S1). Accordingly, the side surface of the micro semiconductor chip (131) may have an inclined shape.

FIG. 6 is a drawing showing a micro semiconductor chip transfer device according to one embodiment.

A micro semiconductor chip transfer device (200) may include a transfer head (180) on which a transfer substrate (120) having a plurality of grooves (110) formed on the upper portion is mounted, a suspension supply module (220) for supplying a suspension (130) containing a micro semiconductor chip (131) and a liquid (132) to the upper portion of the transfer substrate (120) on the transfer head (180), and an alignment bar (140) including a hydrophobic wiper (141) for sweeping the transfer substrate (120).

A micro semiconductor chip transfer device (200) may include a transfer substrate supply module (210), a suspension supply module (220), and a chip alignment module (230). The transfer substrate supply module (210) may supply a transfer substrate (120) for transferring a micro semiconductor chip (131) and a transfer head (180) on which the transfer substrate (120) is mounted.

The suspension supply module (220) includes a suspension (130) containing a micro semiconductor chip (131) and a liquid (132), and can supply the suspension (130) to the transfer substrate (120). The suspension (130) can further include a surfactant. Alternatively, a liquid supply module for supplying the liquid (132) onto the transfer substrate (120) and a chip supply module for supplying a plurality of micro semiconductor chips (131) may be separately provided. In this case, the liquid supply module may include a liquid sprayer, a liquid spreader, a liquid dispenser, an inkjet dot machine, or a liquid diffuser, and the chip supply module may supply the micro semiconductor chips on the transfer substrate (120) in various ways, such as by spraying or dispersing them.

The chip alignment module (230) can sweep the transfer substrate (120) using an alignment bar (140) including a hydrophobic wiper (141). The hydrophobic wiper (141) is as described with reference to Fig. 4b. The overlapping content with Fig. 4b is omitted.

The micro semiconductor chip transfer device (200) may further include a cleaning module (240), an inspection module (250), and a control unit (270).

The cleaning module (240) may be configured to clean the micro semiconductor chips (131) and the liquid (132) that are not aligned inside the grooves (110) and remain on the surface of the transfer substrate (120) after the plurality of micro semiconductor chips (131) are aligned inside the grooves (110) by the chip alignment module (230). The cleaning module (240) may remove the dummy micro semiconductor chips by various methods. The cleaning module (240) may include an absorbent (160) of a hydrophilic material for cleaning the micro semiconductor chips (131) and the liquid (132) that are not aligned inside the grooves (110). Cleaning using the absorbent (160) is as described with reference to FIG. 4c.

The inspection module (250) can inspect the state of the transfer substrate (120). The inspection module (250) can be a camera capable of high-resolution image analysis. The inspection module (250) can inspect the state of the transfer substrate (120) through image analysis.

For example, the inspection module (250) can inspect the alignment status of the micro semiconductor chip (131) on the transfer substrate (120). Based on the inspection result by the inspection module (250), the control unit (260) can control at least one of the suspension supply module (220) and the chip alignment module (230) to operate. Through this, the alignment accuracy of a plurality of micro semiconductor chips (131) can be improved.

For example, as a result of the inspection by the inspection module (250), the location of a groove (110) in which a micro semiconductor chip (131) is missing among the grooves (110) of the transfer substrate (120) can be confirmed. In this case, based on the result of the inspection by the inspection module (250), the control unit (260) can control at least one of the suspension supply module (220) and the chip alignment module (230) to operate centered on the location of the groove (110) in which the micro semiconductor chip (131) is missing.

For example, the inspection module (250) can inspect the supply status of the micro semiconductor chip (131) and the liquid (132) on the transfer substrate (120). For example, the inspection module (250) can inspect whether the liquid (132) exists on the transfer substrate (120) and whether the liquid (132) is sufficient even if it exists. For example, the inspection module (250) can inspect whether the micro semiconductor chip (131) exists on the transfer substrate (120) and whether the micro semiconductor chip (131) is sufficient even if it exists. Based on the inspection result by the inspection module (250), the control unit (260) can control the suspension supply module (220) to operate.

In this way, the control unit (260) can improve the alignment accuracy of a plurality of micro semiconductor chips (131) by controlling the suspension supply module (220) to operate based on the inspection results of the inspection module (250).

Figure 7 illustrates an example of a state in which micro semiconductor chips are aligned on a transfer substrate.

According to the transfer method of the micro semiconductor chip described above, the transferred micro semiconductor chip (331) can be arranged irregularly and randomly in the groove (310) of the transfer substrate (320). While the micro semiconductor chip aligned according to the conventional stamping method is arranged in the groove of the transfer substrate at a regular position, the micro semiconductor chip (331) aligned according to the embodiments of the present specification can be arranged in the groove (310) of the transfer substrate at an irregular position. Meanwhile, after the transfer of the micro semiconductor chip (331) is completed and the dummy micro semiconductor chip that is not arranged in the groove (310) is removed, the irregularity of the irregularly arranged micro semiconductor chip can be reduced by sweeping the transfer substrate at least once with a clean absorbent.

FIGS. 8A to 8C are drawings showing a method of transferring a micro semiconductor chip according to another embodiment.

Referring to FIG. 8a, a transfer substrate (120) including a plurality of grooves (110) can be prepared on a transfer head (180). The upper surface of the transfer substrate (120) can include a surface energy reduction pattern composed of a plurality of convex patterns (124) formed in an area between the plurality of grooves (110). The convex patterns (124) can be the same as the convex patterns (124) of FIG. 2c.

Referring to FIG. 8b, the upper surface of the transfer substrate (120) can be swept using an alignment bar (140) including a hydrophobic wiper (141).

Referring to FIG. 8c, by sweeping the transfer substrate (120) with an absorbent material (160) of a hydrophilic material, the micro semiconductor chips (131) that are not aligned inside the groove (110) and the remaining liquid (132) can be cleaned.

The transfer method of the micro semiconductor chip according to the embodiment of FIGS. 8a to 8c may be the same as the transfer method of the micro semiconductor chip described with reference to FIGS. 4a to 4c, except that the transfer substrate (120) includes a convex pattern (124).

FIG. 9 illustrates a block diagram of an electronic device including a display transfer structure according to one embodiment.

Referring to FIG. 9, an electronic device (8201) may be provided in a network environment (8200). In the network environment (8200), the electronic device (8201) may communicate with another electronic device (8202) via a first network (8298) (such as a short-range wireless communication network), or may communicate with another electronic device (8204) and/or a server (8208) via a second network (8299) (such as a long-range wireless communication network). The electronic device (8201) may communicate with the electronic device (8204) via the server (8208). The electronic device (8201) may include a processor (8220), a memory (8230), an input device (8250), an audio output device (8255), a display device (8260), an audio module (8270), a sensor module (8276), an interface (8277), a haptic module (8279), a camera module (8280), a power management module (8288), a battery (8289), a communication module (8290), a subscriber identification module (8296), and/or an antenna module (8297). Some of these components may be omitted or other components may be added to the electronic device (8201). Some of these components may be implemented as a single integrated circuit. For example, the sensor module (8276) (such as a fingerprint sensor, an iris sensor, or an ambient light sensor) may be implemented embedded in the display device (8260) (such as a display).

The processor (8220) may execute software (e.g., a program (8240)) to control one or more other components (e.g., hardware, software components) of the electronic devices (8201) connected to the processor (8220) and perform various data processing or calculations. As part of the data processing or calculations, the processor (8220) may load commands and/or data received from other components (e.g., a sensor module (8276), a communication module (8290)) into a volatile memory (8232), process the commands and/or data stored in the volatile memory (8232), and store result data in a non-volatile memory (8234). The processor (8220) may include a main processor (8221) (a central processing unit, an application processor, etc.) and a secondary processor (8223) (a graphics processing unit, an image signal processor, a sensor hub processor, a communication processor, etc.) that may operate independently or together therewith. The auxiliary processor (8223) uses less power than the main processor (8221) and can perform specialized functions.

The auxiliary processor (8223) may control functions and/or states related to some of the components of the electronic device (8201) (such as the display device (8260), the sensor module (8276), and the communication module (8290)) on behalf of the main processor (8221) while the main processor (8221) is in an inactive state (sleep state) or together with the main processor (8221) while the main processor (8221) is in an active state (application execution state). The auxiliary processor (8223) (such as the image signal processor, the communication processor) may also be implemented as a part of other functionally related components (such as the camera module (8280), the communication module (8290)).

The memory (2230) can store various data required by components of the electronic device (8201) (processor (8220), sensor module (8276), etc.). The data can include, for example, input data and/or output data for software (program (8240), etc.) and commands related thereto. The memory (8230) can include volatile memory (8232) and/or nonvolatile memory (8234).

The program (8240) may be stored as software in memory (8230) and may include an operating system (8242), middleware (8244), and/or applications (8246).

The input device (8250) can receive commands and/or data to be used in components of the electronic device (8201, such as the processor (8220)) from an external source (such as a user) of the electronic device (8201). The input device (8250) can include a remote controller, a microphone, a mouse, a keyboard, and/or a digital pen (such as a stylus pen).

The audio output device (8255) can output an audio signal to the outside of the electronic device (8201). The audio output device (8255) can include a speaker and/or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive an incoming call. The receiver can be combined as a part of the speaker or implemented as an independent, separate device.

The display device (8260) can visually provide information to the outside of the electronic device (8201). The display device (8260) can include a display, a holographic device, or a projector and a control circuit for controlling the device. The display device (8260) can be manufactured by the manufacturing method described with reference to FIGS. 1 to 4C and FIGS. 8A to 8C. The display device (8260) can include a touch circuitry configured to detect a touch, and/or a sensor circuitry (such as a pressure sensor) configured to measure the intensity of a force generated by a touch.

The audio module (8270) can convert sound into an electrical signal, or vice versa. The audio module (8270) can acquire sound through an input device (8250), or output sound through speakers and/or headphones of an audio output device (8255), and/or another electronic device (such as an electronic device (8102)) directly or wirelessly connected to the electronic device (8201).

The sensor module (8276) can detect the operating status (power, temperature, etc.) of the electronic device (8201) or the external environmental status (user status, etc.) and generate an electric signal and/or data value corresponding to the detected status. The sensor module (8276) can include a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (Infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and/or an illuminance sensor.

The interface (8277) may support one or more designated protocols that may be used to allow the electronic device (8201) to connect directly or wirelessly with another electronic device (such as the electronic device (8102)). The interface (8277) may include a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, and/or an audio interface.

The connection terminal (8278) may include a connector that allows the electronic device (8201) to be physically connected to another electronic device (such as the electronic device (8102)). The connection terminal (8278) may include an HDMI connector, a USB connector, an SD card connector, and/or an audio connector (such as a headphone connector).

The haptic module (8279) can convert electrical signals into mechanical stimuli (vibration, movement, etc.) or electrical stimuli that a user can perceive through tactile or kinesthetic senses. The haptic module (8279) can include a motor, a piezoelectric element, and/or an electrical stimulation device.

The camera module (8280) can capture still images and moving images. The camera module (8280) can include a lens assembly including one or more lenses, image sensors, image signal processors, and/or flashes. The lens assembly included in the camera module (8280) can collect light emitted from a subject that is a target of image capture.

The power management module (8288) can manage power supplied to the electronic device (8201). The power management module (8388) can be implemented as a part of a PMIC (Power Management Integrated Circuit).

A battery (8289) may power components of the electronic device (8201). The battery (8289) may include a non-rechargeable primary battery, a rechargeable secondary battery, and/or a fuel cell.

The communication module (8290) can support establishment of a direct (wired) communication channel and/or a wireless communication channel between the electronic device (8201) and other electronic devices (such as the electronic device (8102), the electronic device (8104), the server (8108), etc.), and performance of communication through the established communication channel. The communication module (8290) can operate independently from the processor (8220) (such as an application processor) and can include one or more communication processors that support direct communication and/or wireless communication. The communication module (8290) can include a wireless communication module (8292) (such as a cellular communication module, a short-range wireless communication module, a GNSS (Global Navigation Satellite System), etc.) communication module) and/or a wired communication module (8294) (such as a LAN (Local Area Network) communication module, a power line communication module, etc.). Any of these communication modules may communicate with other electronic devices via a first network (8298) (a short-range communication network such as Bluetooth, WiFi Direct, or Infrared Data Association (IrDA)) or a second network (8299) (a long-range communication network such as a cellular network, the Internet, or a computer network (LAN, WAN, etc.)). These various types of communication modules may be integrated into a single component (such as a single chip) or implemented as multiple separate components (multiple chips). The wireless communication module (8292) may use subscriber information (such as an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (8296) to identify and authenticate the electronic device (8201) within a communication network such as the first network (8298) and/or the second network (8299).

The antenna module (8297) can transmit signals and/or power to or receive signals from the outside (such as other electronic devices). The antenna can include a radiator formed of a conductive pattern formed on a substrate (such as a PCB). The antenna module (8297) can include one or more antennas. When multiple antennas are included, an antenna suitable for a communication method used in a communication network, such as the first network (8298) and/or the second network (8299), can be selected from among the multiple antennas by the communication module (8290). Signals and/or power can be transmitted or received between the communication module (8290) and the other electronic device through the selected antenna. In addition to the antenna, other components (such as an RFIC) can be included as part of the antenna module (8297).

Some of the components can be connected to each other and exchange signals (commands, data, etc.) through communication methods between peripheral devices (bus, GPIO (General Purpose Input and Output), SPI (Serial Peripheral Interface), MIPI (Mobile Industry Processor Interface), etc.).

Commands or data may be transmitted or received between the electronic device (8201) and an external electronic device (8204) via a server (8108) connected to a second network (8299). The other electronic devices (8202, 8204) may be the same or different types of devices as the electronic device (8201). All or part of the operations executed in the electronic device (8201) may be executed in one or more of the other electronic devices (8202, 8204, 8208). For example, when the electronic device (8201) needs to perform a certain function or service, instead of executing the function or service itself, it may request one or more other electronic devices to perform the function or part or all of the service. One or more other electronic devices that receive the request may execute additional functions or services related to the request and transmit the results of the execution to the electronic device (8201). To this end, cloud computing, distributed computing, and/or client-server computing technologies may be used.

FIG. 10 illustrates an example of an electronic device according to one embodiment being applied to a mobile device. The mobile device (9100) may include a display device (9110), and the display device (9110) may include a display transfer structure. The display device (9110) may have a foldable structure, for example, a multi-foldable structure.

Fig. 11 illustrates an example of a display device according to one embodiment being applied to a vehicle. The display device may be a head-up display device (9200) for a vehicle, and may include a display (9210) provided in one area of the vehicle, and an optical path changing member (9220) that changes an optical path so that the driver can view an image generated by the display (9210).

FIG. 12 illustrates an example of a display device according to one embodiment being applied to augmented reality glasses or virtual reality glasses. The augmented reality glasses (9300) may include a projection system (9310) that forms an image, and an element (9320) that guides the image from the projection system (9310) to enter the user's eyes. The projection system (9310) may include a display transfer structure.

Fig. 13 illustrates an example in which a display device according to one embodiment is applied to a large signage. The signage (9400) can be used for outdoor advertising using a digital information display, and can control advertising content, etc. through a communication network. The signage (9400) can be implemented, for example, through an electronic device described with reference to Fig. 9.

FIG. 14 illustrates an example in which a display device according to one embodiment is applied to a wearable display. The wearable display (9500) may include a display transfer structure and may be implemented through an electronic device described with reference to FIG. 9.

The micro semiconductor chip transfer method and the micro semiconductor chip transfer device of the present disclosure can increase the transfer yield by aligning the micro semiconductor chip using a hydrophobic wiper. Although the micro semiconductor chip transfer method and the micro semiconductor chip transfer device have been described with reference to the embodiments illustrated in the drawings, these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the disclosed embodiments should be considered in an illustrative rather than a restrictive sense. The scope of the rights is set forth in the claims, not the foregoing description, and all differences within a scope equivalent thereto should be construed as being included in the scope of the rights.

110, 310, 1100.....Home
120, 120a, 320, 1200.....Transmission board
121.....base board
122.....Guide Mold
123.....body
124.....convex pattern
130.....suspension
131, 331, 1300.....micro semiconductor chips
132.....liquid
140.....sort bar
141.....Hydrophobic wiper
142.....1st support
160.....absorbent
170.....2nd support
180.....Warrior Head
200.....Micro semiconductor chip transfer device

Claims (20)

A step of preparing a transfer substrate including a plurality of grooves on the upper part;
A step of supplying a suspension containing a plurality of micro semiconductor chips and a liquid onto the upper portion of the transfer substrate; and
A micro semiconductor chip transfer method, comprising: a step of sweeping the upper surface of the transfer substrate including the suspension using an align bar including a hydrophobic wiper to align the micro semiconductor chip into the groove. In the first paragraph,
A micro semiconductor chip transfer method, wherein the hydrophobic wiper comprises a material that does not dissolve in a polar solvent. In the first paragraph,
A micro semiconductor chip transfer method, wherein the hydrophobic wiper comprises Teflon or nylon. In the first paragraph
A micro semiconductor chip transfer method, wherein the form of the hydrophobic wiper is a membrane filter, a general filter, a mesh, a sheet, or a thin film. In the fourth paragraph,
A micro semiconductor chip transfer method, wherein the mesh size of the hydrophobic wiper is 100㎛ or less. In the first paragraph,
A method for transferring a micro semiconductor chip, wherein the liquid comprises one or a combination of a plurality of liquids selected from the group consisting of water, ethanol, alcohol, polyol, ketone, halocarbon, acetone, flux, and organic solvent. In Article 6,
A micro semiconductor chip transfer method, wherein the suspension further contains a surfactant. In the first paragraph,
A micro semiconductor chip transfer method, wherein the step of supplying the suspension includes a spraying method, a dispensing method, an inkjet dot method, or a method of flowing the suspension onto the transfer substrate. In the first paragraph,
A method for transferring a micro semiconductor chip, wherein the step of sweeping the upper surface of the transfer substrate using an alignment bar including the hydrophobic wiper includes reciprocating motion, translational motion, rotational motion, rolling motion, rubbing, or spinning of the hydrophobic wiper. In the first paragraph,
A method for transferring a micro semiconductor chip, wherein the step of sweeping the upper surface of the transfer substrate using an alignment bar including the hydrophobic wiper includes reciprocating motion, rotational motion, translational motion, rolling motion, rubbing or spinning of the transfer substrate to move a transfer head on which the transfer substrate is mounted. In the first paragraph,
A micro semiconductor chip transfer method, wherein the plurality of micro semiconductor chips are aligned in the same direction within the groove through a step of sweeping the upper surface of the transfer substrate using an alignment bar including the hydrophobic wiper. In Article 11,
A microchip transfer method, wherein each of the plurality of micro semiconductor chips includes a first surface including an electrode and a second surface without an electrode, and the plurality of micro semiconductor chips aligned in the groove are aligned such that the second surface faces the bottom of the groove. In the first paragraph,
A micro semiconductor chip transfer method further comprising a step of cleaning unaligned micro semiconductor chips and remaining liquid within the groove by sweeping the transfer substrate with an absorbent of a hydrophilic material. In Article 13,
A method for transferring a micro semiconductor chip, wherein the step of cleaning the transfer substrate with the absorbent material includes reciprocating motion, translational motion, rotational motion, rolling motion, rubbing, or spinning of the absorbent material. A transfer head on which a transfer substrate having a plurality of grooves formed on the upper side is mounted;
A suspension supply module for supplying a suspension containing a micro semiconductor chip and a liquid to the upper portion of the transfer substrate on the transfer head; and
A micro semiconductor chip transfer device, comprising: an align bar including a hydrophobic wiper for sweeping the transfer substrate; In Article 15,
A micro semiconductor chip transfer device, wherein the hydrophobic wiper comprises a material that does not dissolve in a polar solvent. In Article 15,
The above hydrophobic wiper is a micro semiconductor chip transfer device comprising Teflon or nylon. In Article 15
A micro semiconductor chip transfer device in which the above hydrophobic wiper is in the form of a membrane filter, a general filter, a mesh, a sheet, or a thin film. In Article 15,
A micro semiconductor chip transfer device, wherein the suspension further contains a surfactant. In Article 15,
A micro semiconductor chip transfer device further comprising a cleaning module including an absorbent material of a hydrophilic material for cleaning liquid and micro semiconductor chips that are not aligned inside the home.

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