KR20240016896A - Heat sink structure - Google Patents

Abstract

According to the present invention, a heat sink structure comprises: a cover plate on which a printed circuit board having a heating element is mounted on one surface to receive heat of the heating element; and a heat sink main body unit in which an inner space is divided by the cover plate into an accommodation space in which the printed circuit board is accommodated and a refrigerant chamber filled with a refrigerant. A plurality of refrigerant condensation grooves in which a vapor refrigerant heat-exchanged with the cover plate is condensed while flowing are formed on at least one surface of the refrigerant chamber, so that the vapor refrigerant heat-exchanged with heat generated from the heating element is quickly condensed to quickly radiate heat generated from the heating element.

Description

Heat sink structure {HEAT SINK STRUCTURE}

The present invention relates to a heat sink structure, and more specifically, to a heat sink structure for dissipating heat generated from a heat source such as an antenna element mounted on a printed circuit board.

Wireless communication technology, for example, MIMO (Multiple Input Multiple Output) technology, is a technology that dramatically increases data transmission capacity by using multiple antennas. The transmitter transmits different data through each transmit antenna, and the receiver transmits different data through each transmit antenna. is a spatial multiplexing technique that separates transmitted data through appropriate signal processing.

Therefore, as the number of transmitting and receiving antennas increases simultaneously, channel capacity increases, allowing more data to be transmitted. For example, if the number of antennas is increased to 10, about 10 times the channel capacity will be secured using the same frequency band compared to the current single antenna system.

In 4G LTE-advanced, up to 8 antennas are used, and in the 5G stage, base station equipment with 64 or 128 or more antennas is used, which is called Massive MIMO technology. While the current cell operation is 2-Dimension, Massive MIMO technology enables 3D-Beamforming, so it is also called FD-MIMO (Full Dimension).

In Massive MIMO technology, as the number of ANTs (antennas) increases, the number of transmitters and filters also increases. Nevertheless, due to lease costs and space constraints at the installation location, the reality is that RF components (Antenna/Filter/Power Amplifier/Transceiver etc.) are made small, light, and cheap, and Massive MIMO requires high output to expand coverage. Power consumption and heat generation due to such high output are acting as negative factors in reducing weight and size.

In particular, when installing a MIMO antenna in a limited space in which modules containing RF elements and digital elements are combined in a stacked structure, compactization and The need for miniaturized design is emerging, and in this case, the design of a new heat dissipation structure for heat generated from communication components mounted on multiple layers is required.

In Republic of Korea Patent Publication No. 10-2019-0118979 (published on October 21, 2019) (hereinafter referred to as 'prior art'), a heat dissipation structure is applied for compact and miniaturization design of multiple layers constituting a MIMO antenna. A 'multiple input/output antenna device' is disclosed.

The prior art includes a heat dissipation body in which heat dissipation fins are provided to protrude, and a plurality of unit heat dissipation bodies installed in the heat dissipation body. One end of the plurality of unit heat radiators is provided so as to be in contact with a heating element of the antenna board, and a plurality of sub heat radiating fins are provided at the other end to dissipate heat conducted from the heat generating element to the outside.

However, in the prior art, since the structure for dissipating the heat of the heating element is only a mechanical structure that is an air-cooled heat dissipation structure through heat exchange with external air, not only is it difficult to dissipate heat quickly, but it also requires more energy to dissipate heat quickly. There was a problem in that the size increased because a mechanical heat dissipation structure was required.

Republic of Korea Patent Publication No. 10-2019-0118979 (2019.10.21. Publication date)

The problem to be solved by the present invention is to provide a heat sink structure that can quickly dissipate the heat generated by the heating element by quickly condensing the heat generated from the heating element and the gaseous refrigerant that has been heat exchanged, and has improved heat dissipation performance while minimizing the size. is to provide.

The object of the present invention is not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

In order to achieve the above object, the heat sink structure according to the present invention includes a cover plate and a heat sink main body. A printed circuit board with a heating element is mounted on one side of the cover plate. The cover plate receives heat from the heating element. The internal space of the heat sink main body is divided into a receiving space and a refrigerant chamber by the cover plate. The printed circuit board is accommodated in the accommodation space. The refrigerant chamber is filled with refrigerant. A plurality of refrigerant condensation grooves are formed on at least one surface of the refrigerant chamber. In the plurality of refrigerant condensation grooves, the gaseous refrigerant that has exchanged heat with the cover plate flows and is condensed.

The plurality of refrigerant condensation grooves may be formed on a side of the refrigerant chamber that faces the other side of the cover plate.

The cover plate may be composed of a first cover part and a second cover part. The first cover part may correspond to the heating element. The second cover part may extend from one side of the first cover part. The plurality of refrigerant condensation grooves may be formed in a portion corresponding to the second cover portion.

A plurality of heat exchange grooves for heat exchange with the refrigerant may be formed in the first cover part on a surface opposite to the refrigerant chamber.

The width of the refrigerant chamber may be smaller than the width of the accommodation space. The cover plate may cover an open surface of the refrigerant chamber that communicates with the receiving space.

The surface of the refrigerant chamber that faces the other surface of the cover plate may be composed of a first opposing surface and a second opposing surface. The first opposing surface may face the first cover part. The second opposing surface may face the second cover part. The plurality of refrigerant condensation grooves may be formed on the second opposing surface. The side of the plurality of refrigerant condensation grooves facing the first opposing surface may be formed as an inclined portion.

The inclined portion may be formed of a plurality of first step portions.

A second step may be formed on the edge of the refrigerant chamber. The edge of the cover plate may be seated on the second step. The other side of the cover plate may be spaced apart from a side of the refrigerant chamber that faces the other side of the cover plate.

A third step may be formed on the edge of the cover plate. The third step portion may be seated on the second step portion.

A plurality of support protrusions may be formed on the other surface of the cover plate. The plurality of support protrusions may support the other surface of the cover plate at a distance from a surface of the refrigerant chamber that faces the other surface of the cover plate.

A plurality of support grooves may be formed on a side of the refrigerant chamber that faces the other side of the cover plate. The plurality of support protrusions may be respectively inserted into the plurality of support grooves.

A plurality of mounting grooves may be formed on one surface of the cover plate. The printed circuit board may be mounted in the plurality of mounting grooves. The plurality of mounting grooves may each extend inside the plurality of support protrusions.

A plurality of welding grooves may be formed on the outer surface of the heat sink main body in portions corresponding to the plurality of support protrusions. The plurality of welding grooves may be used to laser weld each of the plurality of support protrusions to the heat sink main body.

A plurality of welding point protrusions may be further formed on the outer surface of the heat sink main body. The plurality of welding grooves may be formed on each of the plurality of welding point protrusions.

A plurality of welded joints may be protruding from the outer surface of the heat sink main body. The ends of the plurality of heat dissipation fins may be respectively joined to the plurality of welded joints by laser welding. The plurality of welded joints may be formed to be long in the width direction of the refrigerant chamber. The plurality of welding point protrusions may extend from one side of the plurality of weld joints.

Specific details of other embodiments are included in the detailed description and drawings.

In the heat sink structure according to the present invention, a plurality of refrigerant condensation grooves are formed on at least one surface of the refrigerant chamber through which gaseous refrigerant heat-exchanged with the cover plate is condensed as it passes, so that the gaseous refrigerant is quickly condensed and generated in the heating element. It can quickly dissipate heat, and has the effect of improving heat dissipation performance while minimizing size.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

1 is a perspective view showing a heat sink structure according to an embodiment of the present invention;
Figure 2 is an exploded perspective view of Figure 1;
Figure 3 is a bottom perspective view and partially enlarged view showing the cover plate shown in Figure 2;
Figure 4 is a cut-away perspective view and partially enlarged view showing the cover plate shown in Figure 2;
Figure 5 is a cut-away perspective view and partially enlarged view showing the heat sink main body shown in Figure 2;
Figure 6 is a bottom perspective view and partially enlarged view showing the heat sink main body shown in Figure 2;
Figure 7 is a side cross-sectional view of the heat sink structure in an assembled state according to an embodiment of the present invention.

Hereinafter, a heat sink structure according to an embodiment of the present invention will be described with reference to the drawings.

Figure 1 is a perspective view showing a heat sink structure according to an embodiment of the present invention, and Figure 2 is an exploded perspective view of Figure 1.

In the following description, one side may be the upper side in the drawings shown in FIGS. 1 and 2, and the other side may be the lower side in the drawings shown in FIGS. 1 and 2.

Referring to Figures 1 and 2, the heat sink structure according to an embodiment of the present invention may include a cover plate 100 and a heat sink main body 200.

A printed circuit board (not shown) equipped with a heating element may be mounted on one side of the cover plate 100.

The heating element may be an element that is mounted on the printed circuit board and generates heat. The heating element may include an electronic component that generates a certain amount of heat while operating when power is supplied. For example, the heating element may be an Rx element and a Tx element that are responsible for outputting and transmitting signals in the antenna device.

Since the printed circuit board is mounted on one side of the cover plate 100, heat generated from the heating element can be transferred to the cover plate 100, and the cover plate 100 transfers the heat of the heating element. You can receive it.

The cover plate 100 may be made of aluminum or aluminum alloy, and may also be made of various known metal materials with excellent heat dissipation performance.

The heat sink main body 200 may have an internal space. The heat sink main body 200 may be a part of a housing having a sealed internal space. The internal space of the heat sink main body 200 may be open on one side. The heat sink main body 200 is formed in a substantially hexahedral shape, but one side may be open, and the internal space of the heat sink main body 200 may also be formed in a hexahedral shape, but one side may be open.

The internal space of the heat sink main body 200 may be divided into a receiving space 210 and a refrigerant chamber 220 by the cover plate 100. That is, the cover plate 100 can be disposed inside the heat sink main body 200 to divide the internal space of the heat sink main body 200 into the receiving space 210 and the refrigerant chamber 220. Here, the accommodation space 210 may be a space in which the printed circuit board is accommodated, and the refrigerant chamber 220 may be a space filled with refrigerant.

When the cover plate 100 divides the internal space of the heat sink main body 200 into the receiving space 210 and the refrigerant chamber 220, the receiving space 210 is located on one side of the cover plate 100. It may be a space where the refrigerant chamber 220 is located, and the refrigerant chamber 220 may be a space located on the other side of the cover plate 100.

The refrigerant chamber 220 may be formed on the bottom of the receiving space 210. However, the refrigerant chamber 220 does not necessarily have to be formed on the bottom of the accommodation space 210, and may be formed on the bottom of the accommodation space 210 and at least one of the four sides. The refrigerant chambers 220 may be formed in plural, in which case the cover plate 100 is provided with a plurality of cover plates 100, and the plurality of cover plates 100 each accommodate a plurality of refrigerant chambers 220. It can be divided into space 210.

The width of the refrigerant chamber 220 may be smaller than the width of the accommodation space 210. The cover plate 100 may cover one open surface of the refrigerant chamber 220 that communicates with the receiving space 210. The cover plate 100 can cover one open surface of the refrigerant chamber 220 and divide the internal space of the heat sink main body 200 into the receiving space 210 and the refrigerant chamber 220.

However, the width of the refrigerant chamber 220 does not necessarily have to be smaller than the width of the accommodation space 210, and may be formed equal to or larger than the width of the accommodation space 210. In this case, the cover plate 100 The internal space of the heat sink main body 200 may be divided into a receiving space 210 and a refrigerant chamber 220.

The cover plate 100 may include a first cover part 110 and a second cover part 120.

The width of the first cover part 110 may be formed to be narrower than the width of the second cover part 120, and the width of the second cover part 120 may be formed to be wider than the width of the first cover part 110. there is. The length of the first cover part 110 may be formed to be the same as the length of the second cover part 120.

The first cover part 110 may be a part corresponding to the heating element. That is, a portion of the printed circuit board on which a heating element is mounted is mounted on one surface of the first cover part 110, so that the first cover part 110 can receive heat from the heating element. The printed circuit board may be formed to have the same size as one side of the cover plate 100 or may be formed to a size larger than one side of the cover plate 100 and may be mounted on the entire one side of the cover plate 100. In this case, the heating element may be mounted on a portion of the printed circuit board that is mounted on the first cover portion 110, and may not be mounted on a portion of the printed circuit board that is mounted on the second cover portion 120. Alternatively, the printed circuit board may be formed in a smaller size than one side of the cover plate 100 and may be mounted on one side of the first cover portion 110, but may not be mounted on one side of the second cover portion 120. there is.

The second cover part 120 may extend from one side of the first cover part 110. The first cover part 110 may be formed in a plate shape that forms one side of the cover plate 100, and the second cover part 120 may be formed in a plate shape that forms the other side of the cover plate 100. You can.

The heat sink main body 200 may be made of aluminum or aluminum alloy, and may also be made of various known metal materials with excellent heat dissipation performance.

The bottom surface of the refrigerant chamber 220 may include a first opposing surface 221 and a second opposing surface 222. The bottom surface of the refrigerant chamber 220 may be the surface opposite to the other surface of the cover plate 100. Here, the first opposing surface 221 may face the first cover part 110 of the cover plate 100, and the second opposing surface 222 may face the second cover part 120 of the cover plate 100. You can face it.

The width of the first opposing surface 221 may be narrower than the width of the second opposing surface 222, and the width of the second opposing surface 222 may be formed wider than the width of the first opposing surface 221. there is. The length of the first opposing surface 221 may be the same as the length of the second opposing surface 222.

The width of the first opposing surface 221 may be formed to be the same as the width of the first cover part 110, and the length of the first opposing surface 221 may be formed to be the same as the length of the first cover part 110. It can be. The width of the second opposing surface 222 may be formed to be the same as the width of the second cover part 120, and the length of the second opposing surface 222 may be formed to be the same as the length of the second cover part 120. It can be.

A plurality of refrigerant condensation grooves 250 may be formed on the second opposing surface 222 of the refrigerant chamber 220. However, the plurality of refrigerant condensation grooves 250 do not necessarily have to be formed on the second opposing surface 222 of the refrigerant chamber 220, but may be formed on the bottom surface and at least one of the four sides of the refrigerant chamber 220. You can. That is, a plurality of refrigerant condensation grooves 250 may be formed on at least one surface of the refrigerant chamber 220.

A plurality of refrigerant condensation grooves 250 may be formed on a side of the refrigerant chamber 220 that faces the other side of the cover plate 100.

A plurality of refrigerant condensation grooves 250 may be formed in a portion of the cover plate 100 corresponding to the second cover portion 120.

In the plurality of refrigerant condensation grooves 250, the gaseous refrigerant that has exchanged heat with the cover plate 100 may flow and be condensed. However, in this embodiment, since a plurality of refrigerant condensation grooves 250 are formed on the second opposing surface 222, the plurality of refrigerant condensation grooves 250 are formed on the first opposing surface 221 by forming the first cover portion 110. ) The gaseous refrigerant that flows to the second opposing surface 222 after heat exchange may flow and condense.

A plurality of refrigerant condensation grooves 250 may be formed long in the width direction of the cover plate 100. The plurality of refrigerant condensation grooves 250 may be formed long in the direction in which the first cover part 110 and the second cover part 120 are disposed. A plurality of refrigerant condensation grooves 250 may be formed long in the width direction of the refrigerant chamber 220. The plurality of refrigerant condensation grooves 250 may be formed long in the direction in which the first opposing surface 221 and the second opposing surface 222 are disposed.

FIG. 3 is a bottom perspective view and partially enlarged view showing the cover plate shown in FIG. 2, FIG. 4 is a cutaway perspective view and partially enlarged view showing the cover plate shown in FIG. 2, and FIG. 5 is a heat sink main body shown in FIG. 2. Figure 6 is a cut-away perspective view and partially enlarged view, Figure 6 is a bottom perspective view and partially enlarged view showing the heat sink main body shown in Figure 2, and Figure 7 is a side cross-sectional view of the heat sink structure in an assembled state according to an embodiment of the present invention.

Referring to FIGS. 2 to 7 , a plurality of heat exchange grooves 150 that exchange heat with the refrigerant may be formed on the other surface of the first cover part 110. Here, the other surface of the first cover part 110 may be the surface facing the refrigerant chamber 220. That is, a plurality of heat exchange grooves 150 that exchange heat with the refrigerant may be formed in the first cover part 110 on the surface opposite to the refrigerant chamber 220.

The plurality of heat exchange grooves 150 may be formed in a circular shape. However, the plurality of heat exchange grooves 150 may be formed in a polygonal shape such as a triangle or square.

Since the cover plate 100 must change the shape of the part where the component is mounted on the cover plate 100 depending on the shape of the component mounted on the printed circuit board, the cover plate 100 has no choice but to be thick. . In this way, when the cover plate 100 is formed to be thick, due to the thick cover plate 100, the heat of the heating element mounted on the printed circuit board is transmitted through the cover plate 100 to the refrigerant chamber ( 220) may not be delivered quickly. Even if the cover plate 100 is formed to be thick, the first cover part 110 has a plurality of heat exchange grooves 150, so the contact area with the refrigerant disposed on the first opposing surface 221 is increased. It can be done widely. Accordingly, the heat of the heating element mounted on the printed circuit board can be quickly transferred to the refrigerant in the refrigerant chamber 220 through the first cover part 110 and exchange heat with the refrigerant.

The plurality of refrigerant condensation grooves 250 may be formed with an inclined portion 255 on the side facing the first opposing surface 221 . The refrigerant heat-exchanged with the heat of the heating element through the first cover part 110 on the first opposing surface 221 is formed in a plurality of refrigerant condensation grooves 250 through inclined portions 255 respectively formed in the plurality of refrigerant condensation grooves 250. It can be easily moved to (250).

The inclined portion 255 may be formed of a plurality of first step portions 255A. The plurality of first step portions 255A can widen the contact area with the refrigerant disposed in the plurality of refrigerant condensation grooves 250, allowing the refrigerant to condense quickly.

A second step 226 may be formed on the edge of the refrigerant chamber 220. The edge of the cover plate 100 is seated on the second step portion 226, so that the other surface of the cover plate 100 can be spaced apart from the surface of the refrigerant chamber 220 that faces the other surface of the cover plate 100. . That is, the surface of the cover plate 100 facing the bottom of the refrigerant chamber 220 may be spaced apart from the bottom of the refrigerant chamber 220. The second step portion 226 can widen the contact area with the edge of the cover plate 100 so that as much heat from the heating element can be transferred to the second step portion 226 through the edge of the cover plate 100 as possible. there is.

A third step 106 may be formed on the edge of the cover plate 100 to be seated on the second step 226 of the refrigerant chamber 220. The third step 106 widens the contact area with the second step 226 so that the heat of the heating element flows to the second step 226 through the third step 106 of the cover plate 100. We can deliver as much as possible.

A plurality of support protrusions 131 and 132 may be formed on the other surface of the cover plate 100. The plurality of support protrusions 131 and 132 may support the other surface of the cover plate 100 by keeping it spaced apart from the surface of the refrigerant chamber 220 that faces the other surface of the cover plate 100. A plurality of support protrusions 131 and 132 are formed on the surface of the cover plate 100 facing the bottom of the refrigerant chamber 220, and the surface of the cover plate 100 facing the bottom of the refrigerant chamber 220 is used to store the refrigerant. It can be supported by being spaced apart from the bottom of the chamber 220.

The plurality of support protrusions 131 and 132 include a plurality of first support protrusions 131 formed on the other surface of the first cover part 110 and a plurality of second support protrusions formed on the other surface of the second cover part 120. It may include (132).

A plurality of first support protrusions 131 may be formed on the surface of the first cover part 110 facing the first opposing surface 221, and a plurality of second support protrusions 132 may be formed on the second cover part 120. ) may be formed on the surface facing the second opposing surface 222.

The plurality of first support protrusions 131 may be arranged in two rows in the width direction of the first cover part 110, and the plurality of second support protrusions 132 may be arranged in three rows in the width direction of the second cover part 120. Can be arranged in columns.

The plurality of first support protrusions 131 and the plurality of second support protrusions 132 may be formed in the same shape. However, the plurality of first support protrusions 131 and the plurality of second support protrusions 132 may be formed in different shapes. In this embodiment, the plurality of first support protrusions 131 and the plurality of second support protrusions 132 are formed in the same circular shape, but may also be formed in polygonal shapes such as triangles and squares.

In addition, a plurality of support grooves 231 and 232 into which a plurality of support protrusions 131 and 132 are respectively inserted may be formed on the surface of the refrigerant chamber 220 that faces the other surface of the cover plate 100. A plurality of support grooves 231 and 232 are formed on the bottom surface of the refrigerant chamber 220, into which ends of the plurality of support protrusions 131 and 132 can be inserted, respectively.

The plurality of support grooves 231 and 232 includes a plurality of first support grooves 231 formed on the first opposing surface 221 and a plurality of second supporting grooves 232 formed on the second opposing surface 222. It can be included.

The ends of the plurality of first support protrusions 131 may be respectively inserted into the plurality of first support grooves 231, and the ends of the plurality of second support protrusions 132 may be inserted into the plurality of second support grooves 232. Each can be inserted.

A plurality of first support grooves 231 may be formed on the surface of the refrigerant chamber 220 facing the other side of the first cover portion 110, and a plurality of second support grooves 232 may be formed on the surface of the refrigerant chamber 220. It may be formed on the side facing the other side of the second cover portion 120.

The plurality of first support grooves 231 may be formed at positions corresponding to the plurality of first support protrusions 131, and the plurality of second support grooves 232 may be formed at positions corresponding to the plurality of first support protrusions 131. Each may be formed at a corresponding location. That is, the plurality of first support grooves 231 may be arranged in two rows in the width direction of the first opposing surface 221, and the plurality of second support grooves 232 may be arranged in the width direction of the second opposing surface 222. It can be arranged in three rows.

The plurality of first support grooves 231 and the plurality of second support grooves 232 may be formed in different shapes. However, the plurality of first support grooves 231 and the plurality of second support grooves 232 may be formed in the same shape. In this embodiment, the plurality of first support grooves 231 and the plurality of second support grooves 232 are formed in different shapes, so that the plurality of first support grooves 231 are formed in a circular shape, and the plurality of second support grooves 232 are formed in a circular shape. The support groove 232 is formed in a square shape. However, the plurality of first support grooves 231 and the plurality of second support grooves 232 may be formed in various polygonal shapes such as circles, triangles, or squares.

The plurality of second support grooves 232 may communicate portions of the plurality of refrigerant condensation grooves 250 with each other. The depth of the plurality of second support grooves 232 may be the same as the maximum depth of the plurality of refrigerant condensation grooves 250.

When the refrigerant in the refrigerant chamber 220 is evaporated by heat exchange with the first cover part 110, the pressure in the refrigerant chamber 220 increases, and the plurality of support protrusions 131 and 132 have a plurality of support grooves 231, Since it is inserted into 232), the cover plate 100 can be prevented from expanding laterally due to the increased pressure in the refrigerant chamber 220.

A plurality of mounting grooves 141 and 142 may be formed on one surface of the cover plate 100. That is, the cover plate 100 may have a plurality of mounting grooves 141 and 142 formed on the surface on which the printed circuit board is mounted. The printed circuit board may be mounted in the plurality of mounting grooves 141 and 142. That is, the printed circuit board can be mounted on one surface of the cover plate 100 through a fastening member such as a screw fastened to the plurality of mounting grooves 141 and 142.

The plurality of mounting grooves 141 and 142 may extend inside the plurality of support protrusions 131 and 132, respectively. Accordingly, since the depth of the plurality of mounting grooves 141 and 142 can be formed, the printed circuit board can be firmly mounted on the cover plate 100.

The plurality of mounting grooves 141 and 142 include a plurality of first mounting grooves 141 formed on one surface of the first cover part 110 and a plurality of second mounting grooves formed on one surface of the second cover part 120. It may include (142).

The plurality of first mounting grooves 141 may each extend into the inside of the plurality of first support protrusions 131, and the plurality of second mounting grooves 142 may extend into the inside of the plurality of second support protrusions 132. Each can be extended.

The plurality of first mounting grooves 141 may be formed at positions corresponding to the plurality of first support protrusions 131, and the plurality of second mounting grooves 142 may correspond to the plurality of second support protrusions 132. It can be formed in a location where That is, the plurality of first mounting grooves 141 may be arranged in two rows in the width direction of the first cover part 110, and the plurality of second mounting grooves 142 may be arranged in the width direction of the second cover part 120. It can be arranged in three rows.

The plurality of first mounting grooves 141 and the plurality of second mounting grooves 142 may be formed in the same shape. However, the plurality of first mounting grooves 141 and the plurality of second mounting grooves 142 may be formed in different shapes. In this embodiment, the plurality of first mounting grooves 141 and the plurality of second mounting grooves 142 are formed in the same circular shape, but may also be formed in a polygonal shape such as a triangle or a square.

On the other surface of the heat sink main body 200, a plurality of welding grooves 281 and 282 may be formed in portions corresponding to the plurality of support protrusions 131 and 132. That is, a plurality of welding grooves 281 and 282 may be formed on the outer surface of the heat sink main body 200 in portions corresponding to the plurality of support protrusions 131 and 132.

The plurality of welding grooves 281 and 282 may be used to laser weld each of the plurality of support protrusions 131 and 132 to the heat sink main body 200. That is, after the ends of the plurality of support protrusions 131 and 132 are brought into contact with the bottom surface of the refrigerant chamber 220, the laser is irradiated into the plurality of welding grooves 281 and 282, respectively, to form the plurality of support protrusions 131 and 132. The end of 132) can be laser welded to the bottom surface of the refrigerant chamber 220.

When a plurality of support grooves (231, 232) are formed on the surface of the refrigerant chamber (220) opposite to the other surface of the cover plate (100), the plurality of welding grooves (281, 282) are connected to the plurality of support grooves (231, 232). ) can be formed in the corresponding part.

The plurality of welding grooves 281 and 282 includes a plurality of first welding grooves 281 formed on a portion of the outer surface of the heat sink main body 200 corresponding to the plurality of first support protrusions 131, and heat It may include a plurality of second welding grooves 282 formed in a portion of the outer surface of the sink main body 200 corresponding to the plurality of second support protrusions 132.

When a plurality of support grooves 231 and 232 are formed on the surface of the refrigerant chamber 220 opposite to the other surface of the cover plate 100, the plurality of first weld grooves 281 are formed on the heat sink main body portion 200. It may be formed in a portion of the outer surface corresponding to the plurality of first support grooves 231, and the plurality of second welding grooves 282 may be formed in a plurality of second support grooves on the outer surface of the heat sink main body 200 ( 232) and can be formed in the corresponding part.

The plurality of first welding grooves 281 may be for laser welding the plurality of first support protrusions 131 to the heat sink main body 200, and the plurality of second welding grooves 282 may be for laser welding the plurality of first support protrusions 131 to the heat sink main body 200. The support protrusion 132 may be laser welded to the heat sink main body 200.

That is, after bringing the ends of the plurality of first support protrusions 131 into contact with the first opposing surface 221 of the refrigerant chamber 220, the laser is irradiated to the plurality of first welding grooves 281, respectively, The end of the first support protrusion 131 can be laser welded to the first opposing surface 221. Then, the ends of the plurality of second support protrusions 132 are brought into contact with the second opposing surface 222 of the refrigerant chamber 220, and then the laser is irradiated to the plurality of second welding grooves 282, respectively. The end of the second support protrusion 132 may be laser welded to the second opposing surface 222 of the refrigerant chamber 220.

In addition, when a plurality of support grooves 231 and 232 are formed on the surface of the refrigerant chamber 220 opposite to the other surface of the cover plate 100, the ends of the plurality of first support protrusions 131 are connected to the plurality of first support protrusions 131. After contacting each of the support grooves 231, a laser is irradiated to each of the plurality of first welding grooves 281, so that the ends of the plurality of first support protrusions 131 are respectively connected to the plurality of first support grooves 231. Laser welding is possible. Then, the ends of the plurality of second support protrusions 132 are each brought into contact with the plurality of second support grooves 232, and then the laser is irradiated to the plurality of second welding grooves 282, respectively, to form the plurality of second support grooves 282. The ends of the protrusions 132 can be laser welded to each of the plurality of second support grooves 232.

The plurality of first welding grooves 281 and the plurality of second welding grooves 282 may be formed in the same shape. However, the plurality of first welding grooves 281 and the plurality of second welding grooves 282 may be formed in different shapes. In this embodiment, the plurality of first welding grooves 281 and the plurality of second welding grooves 282 are formed in the same circular shape, but may also be formed in a polygonal shape such as a triangle or square.

A plurality of welding point protrusions 271 and 272 may be further formed on the other surface of the heat sink main body 200. That is, a plurality of welding point protrusions 271 and 272 may be further formed on the outer surface of the heat sink main body 200. A plurality of welding grooves 281 and 282 may be formed on each of the plurality of welding point protrusions 271.

The plurality of welding point protrusions (271, 272) can enable the operator to easily recognize the laser welding position, and reinforce the thickness of the heat sink main body 200 to prevent the heat sink main body (200) from being damaged by the heat generated during laser welding. 200) can be prevented from being deformed.

The plurality of welding point projections 271 and 272 includes a plurality of first welding point projections 271 in which a plurality of first welding grooves 281 are formed, and a plurality of second welding grooves 282 in each. It may include a plurality of second welding point protrusions 272.

The plurality of first welding point protrusions 271 and the plurality of second welding point protrusions 272 may be formed in the same shape. However, the plurality of first welding point protrusions 271 and the plurality of second welding point protrusions 272 may be formed in different shapes.

On the other side of the heat sink main body 200, a plurality of welded joints 260 in which a plurality of heat dissipation fins (not shown) are each joined by laser welding may be formed to protrude. That is, a plurality of welded joints 260 in which the plurality of heat dissipation fins are respectively joined by laser welding may be formed to protrude on the outer surface of the heat sink main body 200. Here, the heat dissipation fin may be formed in a thin plate shape to secure a contact area with external air, and may be used to easily dissipate heat from the heat generating element.

The plurality of welded joints 260 may be formed long in the width direction of the refrigerant chamber 220. The ends of the plurality of heat dissipating fins may be respectively joined to the plurality of welded joints 260 by laser welding. The plurality of welding point protrusions 271 and 272 may extend from one side of the plurality of welded joints 260.

Specifically, each of the plurality of welded joints 260 may include a first heat dissipation fin support portion 261 and a second heat dissipation fin support portion 262. The first heat dissipation fin support portion 261 and the second heat dissipation fin support portion 262 may be formed to be long in the width direction of the refrigerant chamber 220. The first heat dissipation fin support portion 261 and the second heat dissipation fin support portion 262 may be spaced apart from each other in the longitudinal direction of the refrigerant chamber 220. The second heat radiation fin support portion 262 may be spaced apart from the first heat radiation fin support portion 261 in the longitudinal direction of the refrigerant chamber 220 and may be disposed to face the first heat radiation fin support portion 261. The ends of the plurality of heat dissipation fins are respectively inserted between the first heat dissipation fin support portion 261 and the second heat dissipation fin support portion 262 and then attached to at least one of the first heat dissipation fin support portion 261 and the second heat dissipation fin support portion 262. Can be laser welded.

A plurality of welding point protrusions 271 and 272 may extend from one side of the first heat dissipation fin support portion 261. However, the plurality of welding point protrusions 271 and 272 may extend from one side of either the first heat dissipation fin support portion 261 or the second heat dissipation fin support portion 262.

As described above, the heat sink structure according to an embodiment of the present invention includes a refrigerant chamber 220 covered with a cover plate 100 on which the printed circuit board is mounted on the heat sink main body 200 and filled with a refrigerant. A plurality of refrigerant condensation grooves 250 are formed on the bottom surface 222 of the refrigerant chamber 220 through which gaseous refrigerant heat exchanged with heat generated from the heating element mounted on the printed circuit board passes through and condenses. Therefore, the heat generated from the heating element can be quickly condensed and the gaseous refrigerant that has exchanged heat with it can be quickly dissipated, and the heat dissipation performance can be improved while minimizing the size.

Those skilled in the art to which the present invention pertains will understand that the present invention can be implemented in other specific forms without changing its technical idea or essential features. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive. The scope of the present invention is indicated by the claims described below rather than the detailed description above, and all changes or modified forms derived from the meaning and scope of the claims and their equivalent concepts should be construed as being included in the scope of the present invention.

100: Cover plate 106: Third step portion
110: first cover part 120: cover part
131, 132: Support projection 141, 142: Mounting groove
150: heat exchange groove 200: heat sink main body
210: Accommodating space 220: Refrigerant chamber
221: first opposing surface 222: second opposing surface
226: second step portion 231, 232: support groove
250: refrigerant condensation groove 255: inclined portion
255A: first step portion 271, 272: welding point protrusion
281, 282: welding groove

Claims (15)

A cover plate on which a printed circuit board with a heating element is mounted on one side to receive heat from the heating element; and
A heat sink main body portion whose internal space is divided by the cover plate into a receiving space in which the printed circuit board is accommodated and a refrigerant chamber filled with refrigerant,
A heat sink structure in which a plurality of refrigerant condensation grooves are formed on at least one surface of the refrigerant chamber in which gaseous refrigerant heat-exchanged with the cover plate flows and condenses. In claim 1,
A heat sink structure wherein the plurality of refrigerant condensation grooves are formed on a side of the refrigerant chamber that faces the other side of the cover plate. In claim 2,
The cover plate is,
A first cover portion corresponding to the heating element,
A second cover part extending from one side of the first cover part,
A heat sink structure in which the plurality of refrigerant condensation grooves are formed in a portion corresponding to the second cover portion. In claim 3,
A heat sink structure in which a plurality of heat exchange grooves for heat exchange with the refrigerant are formed in the first cover portion on a surface opposite to the refrigerant chamber. In claim 1,
The width of the refrigerant chamber is smaller than the width of the accommodation space,
The cover plate is a heat sink structure that covers an open surface of the refrigerant chamber that communicates with the receiving space. In claim 3,
The side of the refrigerant chamber that faces the other side of the cover plate is,
a first opposing surface facing the first cover portion;
It faces the second cover part and includes a second opposing surface on which the plurality of refrigerant condensation grooves are formed,
A heat sink structure in which a side of the plurality of refrigerant condensation grooves facing the first opposing surface is formed as an inclined portion. In claim 6,
A heat sink structure wherein the inclined portion is formed of a plurality of first step portions. In claim 1,
A second step is formed on the edge of the refrigerant chamber,
A heat sink structure wherein an edge of the cover plate is seated on the second step, and the other surface of the cover plate is spaced apart from a surface of the refrigerant chamber that faces the other surface of the cover plate. In claim 8,
A heat sink structure in which a third step portion is formed on the edge of the cover plate and is seated on the second step portion. In claim 1,
A heat sink structure in which a plurality of support protrusions are formed on the other surface of the cover plate to support the other surface of the cover plate while being spaced apart from a surface of the refrigerant chamber opposite to the other surface of the cover plate. In claim 10,
A heat sink structure in which a plurality of support grooves into which the plurality of support protrusions are respectively inserted are formed on a surface of the refrigerant chamber opposite to the other surface of the cover plate. In claim 10,
A plurality of mounting grooves on which the printed circuit board is mounted are formed on one side of the cover plate,
A heat sink structure wherein the plurality of mounting grooves each extend inside the plurality of support protrusions. In claim 10,
A heat sink structure in which a plurality of welding grooves are formed on an outer surface of the heat sink main body in portions corresponding to the plurality of support protrusions for laser welding each of the plurality of support protrusions to the heat sink main body. In claim 13,
A plurality of welding point protrusions are further formed on the outer surface of the heat sink main body,
A heat sink structure wherein the plurality of welding grooves are formed on each of the plurality of welding point protrusions. In claim 14,
On the outer surface of the heat sink main body, a plurality of welded joints where the ends of the plurality of heat dissipation fins are respectively joined by laser welding are protrudingly formed,
The plurality of welded joints are formed long in the width direction of the refrigerant chamber,
A heat sink structure wherein the plurality of welding point protrusions extend from one side of the plurality of welded joints.

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