KR20190113031A - Treatment chamber and handler comprising same - Google Patents

Abstract

The present invention relates to a processing chamber and a handler comprising the same. Specifically, according to an embodiment of the present invention, a processing chamber having an internal space through which gas can flow, comprising: a flow device for discharging gas from the internal space of the processing chamber and supplying gas to the internal space; A passage portion including a passage body, an outlet formed in the passage body for discharging gas from the inner space, and an inlet formed in the passage body for supplying gas to the inner space; And a flow regulating unit for controlling a gas flow path within the passage portion, wherein the flow regulating unit opens a first flow path between the inlet and the outlet, and forms an outer space and the inner space of the processing chamber. A first mode of operation intercepting a second flow path therebetween; And a second operating mode for opening the second flow path, wherein the flow regulating unit is selectively driven in any one of the first operating mode and the second operating mode. have.

Description

Processing Chambers and Handlers Containing the Same {TREATMENT CHAMBER AND HANDLER COMPRISING SAME}

The present invention relates to a process chamber and a handler comprising the same.

The handler supports a semiconductor device manufactured through a predetermined manufacturing process to be tested by a tester, and classifies the semiconductor device according to a test result and loads the semiconductor device into a customer tray.

These handlers are equipped with several test trays that circulate along the feed path. The transfer path of the test tray may be via a loading device, a soak chamber, a test chamber, a desoak chamber, and an unloading device. Before the test, the soak chamber sets the semiconductor device to a temperature according to the test conditions, and the desock chamber restores the semiconductor device to a predetermined temperature before the unloading after the test is performed. These soak chambers and desock chambers can increase the operating capacity of the TESTER and the unloading device, ultimately improving the throughput of the equipment. In addition, in the handler, a plurality of test trays may be translated in a state where the test trays are housed together in the soak chamber or the desock chamber, and the semiconductor elements loaded in the test trays during the translational time stay in the soak chamber and the desock chamber to adjust the temperature. This can be done.

However, in recent years, the number of electronic components to be processed per unit time continues to increase, and accordingly, the test time in the test chamber is also gradually decreasing. Accordingly, as the test time decreases, the speed and efficiency of the process of cooling, heating, or recovering the temperature to room temperature of electronic components in a processing chamber such as a desock chamber are also very important.

In addition, in recent years, electronic components are tested under various test conditions, and it is required to perform tests in accordance with rapidly changed test conditions whenever the temperature conditions change.

Embodiments of the present invention have been invented in view of the prior art as described above, and it is intended to provide a processing chamber that can more effectively and quickly adjust the temperature of an object to be subjected to temperature control.

It is also an object of the present invention to provide a processing chamber that can change the internal temperature environment and air flow path without changing the equipment or configuration of the processing chamber even if the temperature conditions of the test change.

According to an aspect of the present invention, there is provided a processing chamber having an internal space through which gas can flow, comprising: a flow device for discharging gas from the internal space of the processing chamber and supplying gas to the internal space; A passage portion including a passage body, an outlet formed in the passage body for discharging gas from the inner space, and an inlet formed in the passage body for supplying gas to the inner space; And a flow regulating unit for controlling a gas flow path within the passage portion, wherein the flow regulating unit opens a first flow path between the inlet and the outlet, and forms an outer space and the inner space of the processing chamber. A first mode of operation intercepting a second flow path therebetween; And a second operating mode for opening the second flow path, wherein the flow regulating unit is selectively driven in any one of the first operating mode and the second operating mode. have.

The flow apparatus may further include a gas supply unit provided at the inlet side and supplying gas to the internal space, wherein the gas supply unit comprises: a first main supply fan disposed at the passage body toward the internal space; And a first auxiliary supply fan spaced apart from the first main supply fan in the passage body and opposite to the inner space, and facing the first main supply fan, wherein the flow control unit is configured to perform the first operation. To prevent gas from the first auxiliary supply fan from entering the first main supply fan side in a mode and to direct gas from the first auxiliary supply fan to the first main supply fan side in the second operating mode A processing chamber may be provided that includes an adjusting member.

Further, the passage body and the regulating member provide a flow space extending from the outlet side to the inlet side so that gas can flow, and the regulating member moves to the outlet side when in the first operating mode. Provides a processing chamber for guiding the gas supplied from the air to move to the inlet side through the flow space, and to move the gas supplied from the outlet to the inlet side by moving to the inlet side when in the second mode of operation. Can be.

The gas supply unit may further include a second main supply fan disposed from the passage body and spaced apart from the first main supply fan by a predetermined distance; And a second auxiliary supply fan disposed opposite the inner space in the passage body, wherein the flow control unit further includes a gate member having a gate passage formed therein, wherein the gate member includes: Prevents gas from the first auxiliary supply fan from flowing into the first main supply fan side and gas from the second auxiliary supply fan from flowing into the second main supply fan side, and in the second operation mode, The gate passage moves to face at least one of the first auxiliary supply fan and the second auxiliary supply fan such that gas from the first auxiliary supply fan and the second auxiliary supply fan is moved to the first main supply fan and the second auxiliary supply fan. A processing chamber may be provided that is configured to allow flow to the second main supply fan.

The flow regulating unit may further include a cover member having a cover through hole formed therein, and the gate member blocks the cover through hole in the first operation mode, and the cover through hole and the cover operation hole in the second operation mode. A processing chamber may be provided that is driven to communicate the gate passages with each other.

In addition, a loading device for loading an electronic component; A process chamber for preheating or precooling the loaded electronic component to a test set temperature; A test chamber for testing the preheated or precooled electronic component; The processing chamber for restoring a temperature of the electronic component in which the test is completed to a predetermined level; And an unloading device for unloading the electronic component recovered to the predetermined level of temperature.

According to embodiments of the present invention, the processing chamber can more effectively and quickly adjust the temperature of an object that is the object of desired temperature control.

In addition, the processing chamber has the effect of being able to respond quickly to changed test temperature conditions by changing the air flow path without changing its equipment or configuration.

1 is a conceptual diagram illustrating a handler according to an embodiment of the present invention.
2 is a conceptual diagram of a processing chamber included in the handler of FIG. 1.
3 is a perspective view of a flower provided in the processing chamber of FIG. 2.
4 is a rear perspective view of the flower of FIG. 3.
5 is an exploded perspective view of the flower of FIG. 3.
6 is an exploded perspective view of the gas exhaust unit of FIG. 5.
7 is an exploded perspective view of the gas supply unit of FIG. 5.
8 is an exploded perspective view of the flower of the processing chamber when the flow control unit is in the first mode of operation.
9 is an exploded perspective view of the flower of the processing chamber when the flow control unit is in the second mode of operation.

Hereinafter, specific embodiments for implementing the spirit of the present invention will be described in detail with reference to the accompanying drawings.

In addition, in describing the present invention, when it is determined that the detailed description of the related well-known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.

In addition, it is to be understood that when a component is referred to as being 'connected' or 'supplied' to another component, the component may be directly connected and supplied to the other component, but other components may be present in the middle.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. A singular expression includes a plural expression unless the context clearly indicates otherwise.

In addition, the expressions of the upper side, the lower side, etc. in the present specification are described with reference to the drawings in the drawings, and it will be apparent that they may be expressed differently when the direction of the corresponding object is changed.

Hereinafter, a detailed configuration of a handler 1 according to an embodiment of the present invention will be described with reference to FIG. 1.

Referring to FIG. 1, an unloading position and a loading position are sequentially performed through a process chamber 20, a test chamber 30, and a processing chamber 40 while being loaded on the electronic component test tray T of the handler 1. And may be circulated along the transfer path C leading back to the process chamber 20. This transport path (C) may be composed of a closed loop.

The handler 1 may include a loading device 10, a process chamber 20, a test chamber 30, a processing chamber 40, and an unloading device 50. The process chamber 20 may serve as one of a soak chamber and a desoak chamber in an electronic component test process, and the process chamber 40 may be a soak chamber and a desoak. It may serve as another one of the desoak chambers.

The loading device 10 loads an untested electronic component loaded in a customer tray (not shown) into a test tray T in a loading position.

The process chamber 20 may have a space in which the test tray T may be accommodated, and may serve as a soak chamber or a desoak chamber. For example, when the process chamber 20 is a soak chamber, the process chamber 20 preheats the electronic components to the test set temperature before testing the electronic components loaded on the transferred test tray T. ) Or precooled.

The test chamber 30 receives an electronic component loaded on the test tray T in a preheated or precooled state in the process chamber 20. In the test chamber 30, the test of the electronic component is performed, and the tested electronic component is transferred to the processing chamber 40.

The processing chamber 40 may have a space in which the test tray T may be accommodated, and may serve as a soak chamber or a desock chamber. For example, when the processing chamber 40 is a desock chamber, the processing chamber 40 cools the electronic component in a test completed state loaded on the test tray T transferred from the test chamber 30, and the electronic component. The temperature may be such that there is no problem during room temperature to unloading. Alternatively, the processing chamber 40 may heat the electronic component in a tested state so that the electronic component has a temperature at which room temperature or condensation does not occur.

The unloading device 50 may classify the electronic components into grades according to test results from the test tray T in the unloading position and unload them into the empty customer tray.

Hereinafter, the configuration of the processing chamber 40 described with reference to FIG. 2 will be described.

Referring to FIG. 2, the processing chamber 40 may include a chamber body 41 having a space (inner space S1) therein for accommodating electronic components therein, and a body capable of transferring gas in the inner space S1. It may include a synchronous 42 and a heater 43 capable of heating the gas. The gas in the internal space S1 may flow by the flower 42 to restore the temperature of the heated or cooled electronic component to room temperature or to a predetermined level. On the other hand, the gas inside the processing chamber 40 may be air.

The flower 42 of the processing chamber 40 may be composed of one module. In addition, the flower 42 may be configured as a door connected to the chamber body 41 to open and close the internal space S1. This fluid 42 may operate in a first mode of operation and a second mode of operation to cool or heat the electronic component to restore the temperature of the electronic component to room temperature. For example, the flower 42 may restore the temperature of the electronic component to room temperature by heating the electronic component in the first operating mode and cooling the electronic component in the second operating mode. The flower 42 can also communicate air between the interior and exterior of the processing chamber 40 when in the second mode of operation. On the other hand, the "room temperature" in this specification is not defined as a single temperature value of 20 ℃, it includes a temperature range higher or lower than 20 ℃ (for example 20 ± 5 ℃). Hereinafter, the configuration of the fluidizer 42 described above with reference to FIGS. 3 to 9 will be described.

With further reference to FIGS. 3-9, such a flower 42 may include a passage portion 100, a flow apparatus 200, a flow regulation unit 300 that may be placed in a first or second operating mode, and It may include a controller (not shown).

The passage part 100 provides a passage through which gas in the internal space S1 of the processing chamber 40 may be discharged to the outside or gas outside the processing chamber 40 may enter the internal space S1. The passage part 100 may be disposed outside the processing chamber 40 to serve as a housing.

The passage part 100 includes a passage body 101 provided with a flow path through which gas can flow, an outlet 111 formed in the passage body 101 to discharge gas from the internal space S1, and the passage body 101. Outflow auxiliary hole 115 for discharging the gas inside the outside of the processing chamber 40, the inlet 121 formed in the passage body 101 for introducing the gas into the internal space (S1), and the processing chamber It may include an outlet auxiliary hole 125 for introducing a gas outside the 40 into the passage body 101.

The passage body 101 may include an inner passage wall 102 disposed on the inner space S1 side and an outer passage wall 103 disposed on the outer side of the processing chamber 40. The inner passage wall 102 may be provided with a mounting portion 102a having a main shape supply fan 222 which will be described later and having a plate shape drawn into the inner space S1 (FIGS. 3 and 5). Installation portion 102a may be formed with the installation inlet 121 and the installation portion through-hole 117 for the inflow of gas [Fig. 3, 5]. Meanwhile, the inner passage wall 102 and the outer passage wall 103 may be disposed to face each other, and may have a plate shape. A flow space S2 may be provided between the inner passage wall 102 and the outer passage wall 103.

On the other hand, the gas in the interior space (S1) may be discharged to the outside of the interior space (S1) through the first flow path (P1) or the second flow path (P2), the gas outside of the interior space (S1) It may be introduced into the interior space (S1) through the first flow path (P1) or the second flow path (P2). The first flow path P1 is defined as a path from the outlet 111 through the flow space S2 to the inlet 121, and the second flow path P2 is the inlet 121 and the inlet from the outlet 111. A path leading to the outlet auxiliary hole 115 without passing through the auxiliary hole 125 and a path leading from the inlet auxiliary hole 125 to the inlet 121 without passing through the outlet 111 and the outlet auxiliary hole 115. Can be defined. The second flow path P2 may optionally include a path from the outlet auxiliary hole 115 to the inlet auxiliary hole 125 via the outside of the processing chamber 40.

The outlet 111 may communicate the internal space S1 and the flow space S2 of the passage body 101. Therefore, the gas in the internal space S1 may flow out to the flow space S2 through the outlet 111. The outlet 111 may be formed in the inner passage wall 102 and may have a circular shape. In addition, the outlet 111 may be disposed above the processing chamber 40 and may be provided in plurality.

The outlet auxiliary hole 115 may communicate with the flow space S2 and the outside of the processing chamber 40. Therefore, the gas in the flow space S2 may flow out of the processing chamber 40 through the outflow auxiliary hole 115. The outflow auxiliary hole 115 may be formed in the outer passage wall 103 and may have a slit shape. In addition, the outlet auxiliary hole 115 may be disposed above the processing chamber 40. In addition, the outlet auxiliary hole 115 may be provided at a position corresponding to the outlet 111. In addition, the outflow assistance hole 115 may be a slit extending in the transverse direction, and the transverse slit may be provided with a guide 116 curved outwardly upward (FIG. 4). As the guide 116 extends outwardly, the gas discharged through the flower 42 may be discharged upwards so as not to be directly applied to the operator.

The inlet 121 may communicate the internal space S1 and the flow space S2 of the passage body 101. The gas in the flow space S2 may be introduced into the internal space S1 through the inlet 121. The inlet 121 may be formed in the outer passage wall 103 and may have a circular shape. In addition, the inlet 121 may be disposed below the processing chamber 40 and may be provided in plurality.

The inlet 121 may include a first inlet 121-1 and a second inlet 121-2. The first inlet 121-1 may be disposed at a position farther from the outlet 111 than the second inlet 121-2. For example, the first inlet 121-1 may be disposed above the second inlet 121-2.

The inflow auxiliary hole 125 may be formed in the outer passage wall 103 and may communicate with the flow space S2 and the outside of the processing chamber 40. Therefore, the gas outside the processing chamber 40 may flow out into the flow space S2 through the inlet auxiliary hole 125. The inlet auxiliary hole 125 may be formed in plural in the outer passage wall 103 and may have a slit shape extending in the vertical direction. In addition, the inflow auxiliary hole 125 may be formed in an area of the outer passage wall 103 corresponding to the installation portion 102a of the inner passage wall 102.

The flow apparatus 200 may discharge and supply gas from the internal space S1 of the processing chamber 40. This flow device 200 may include a gas discharge unit 210 and a gas supply unit 220.

The gas discharge unit 210 discharges gas in the internal space S1. The gas discharge unit 210 may be disposed on the inner space S1 side of the outlet 111, and may be disposed to face the outlet 111. Thus, the gas passes through the gas discharge unit 210 before exiting to the outlet 111. Hereinafter, the configuration of the gas discharge unit 210 will be described further with reference to FIG. 6.

Referring to FIG. 6, the gas discharge unit 210 may include a discharge fan 211 and a spacer 212. The discharge fan 211 supports the discharge rotating shaft 211a, the discharge blade 211b rotatably supported by the discharge rotating shaft 211a, and the discharge rotating shaft 211a, and discharges surrounding the side of the discharge blade 211b. It may include a housing 211c. The discharge housing 211c may have a pipe shape, and the cross section of the pipe shape may be circular. In addition, the discharge housing 211c may cover the discharge blade 211b so that gas does not flow in the lateral direction of the discharge blade 211b. Therefore, the gas around the discharge fan 211 does not flow in the direction orthogonal to the axial direction A, but flows along the axial direction A or in a direction substantially parallel to the axial direction A.

The discharge fan 211 may include an inner discharge fan 211-1 and an outer discharge fan 211-2. The inner discharge fan 211-1 and the outer discharge fan 211-2 may operate to be driven or stopped together regardless of the operation mode of the flow control unit 300. In addition, the inner discharge fan 211-1 and the outer discharge fan 211-2 may be disposed in series to face each other. As the plurality of discharge fans 211 are provided in series, the discharge fan 211 can be efficiently installed even in a narrow space, and the gas can be discharged more effectively from the internal space S1. The spacer 212 may be disposed between the inner discharge fan 211-1 and the outer discharge fan 211-2 so that the fan 211-1 and the outer discharge fan 211-2 are spaced apart from each other by a predetermined interval. . The outer discharge fan 211-2 may be disposed farther from the outlet 111 than the inner discharge fan 211-1. For example, the inner discharge fan 211-1 may be disposed at the inner space S1 side of the outlet 111, and the outer discharge fan 211-2 may be disposed at the opposite side of the outlet 111. 211-1). Therefore, the gas transferred by the inner discharge fan 211-1 flows into the inner space S1 through the outer discharge fan 211-2.

The gas supply unit 220 supplies gas to the internal space S1. The gas supply unit 220 supplies the gas flowing through the first flow path P1 in the first operating mode, and the gas supply unit 220 supplies the second flow path P2 in the second operating mode. It is possible to supply the gas flowing through. The gas supply unit 220 may be disposed at the inlet 121 and the inlet auxiliary hole 125. Hereinafter, the configuration of the gas discharge unit 210 will be described further with reference to FIG. 7.

Referring further to FIG. 7, the gas supply unit 220 may include a supply fan 221. The supply fan 221 supports a supply rotation shaft 221a, a supply blade 221b rotatably supported by the supply rotation shaft 221a, and a supply that supports the supply rotation shaft 221a and surrounds the side of the supply blade 221b. It may include a housing 221c. Supply housing 221c may have a pipe shape, the cross section of the pipe shape may be circular. In addition, the supply housing 221c may cover the supply blade 221b so that gas does not flow in the lateral direction of the supply blade 221b. Therefore, the gas around the supply fan 221 does not flow in the direction orthogonal to the axial direction A, but flows along the axial direction A or in a direction substantially parallel to the axial direction A. On the other hand, since the supply fan 221 is not necessarily the same as the discharge fan 211 described above, it may have a different size, shape than the discharge fan 211.

The supply fan 221 may include a main supply fan 222 and an auxiliary supply fan 223.

The main supply fan 222 may supply gas to the internal space S1 regardless of the operation mode of the flow control unit 300. The main supply fan 222 may be provided adjacent to the inlet 121. For example, the main supply fan 222 may be provided at the inner space S1 side of the inlet 121. In other words, the main supply fan 222 may be connected to the inner passage wall 102 in which the inlet 121 is formed.

The main supply fan 222 may be provided in plurality, and may include a first main supply fan 222-1 and a second main supply fan 222-2. The first main supply fan 222-1 may be disposed adjacent to the first inlet 121-1, and the second main supply fan 222-2 may be disposed adjacent to the second inlet 121-2. have. In addition, the first main supply fan 222-1 and the second main supply fan 222-2 may be arranged in parallel. As such, since the plurality of main supply fans 222 are provided in parallel, gas may be more effectively supplied to the internal space S1. The first main supply fan 222-1 may be spaced apart from the second main supply fan 222-2, and may be located closer to the outlet 111 than the second main supply fan 222-2. The distance between the first main supply fan 222-1 and the second main supply fan 222-2 is greater than the size (diameter) of the inlet 121 and the first main supply fan 222-1 and the outlet 111. May be smaller than the distance between

The auxiliary supply fan 223 may supply gas to the internal space S1 when the flow regulating unit 300 is in the first operating mode, and may be controlled to be driven only when the first operating mode is in the first supply mode. The auxiliary supply fan 223 may be provided adjacent to the inlet auxiliary hole 125. For example, the main supply fan 222 may be provided at the flow space S2 side of the inlet auxiliary hole 125. In other words, the auxiliary supply fan 223 may be provided between the inner passage wall 102 and the outer passage wall 103, and may be connected to the outer passage wall 103 having the inflow auxiliary hole 125 formed therein.

The auxiliary supply fan 223 may be provided in plural and may include a first auxiliary supply fan 223-1 and a second auxiliary supply fan 223-2. The first auxiliary supply fan 223-1 and the second auxiliary supply fan 223-2 may be disposed to face the first main supply fan 222-1 and the second main supply fan 222-2, respectively. have. In addition, the first auxiliary supply fan 223-1 and the second auxiliary supply fan 223-2 may be disposed in parallel. The first auxiliary supply fan 223-1 may be spaced apart from the second auxiliary supply fan 223-2, and may be located closer to the outlet auxiliary hole 115 than the second auxiliary supply fan 223-2. have.

Flow control unit 300 is provided to control the gas flow path within passageway 100. To this end, the flow control unit 300 can be placed in a first mode of operation that allows gas to flow in the first flow path and a second mode of operation that allows gas to flow in the second flow path. The flow control unit 300 may include an adjustment member 320, a gate member 340, and a cover member 330.

The adjusting member 320 may provide a flow space extending from the outlet 111 side to the inlet 121 side to allow gas to flow therein, and may serve as an auxiliary duct. In addition, the adjustment member 320 may change the path of the gas introduced into the flow space (S2) from the outlet 111 by moving in the vertical direction. The adjusting member 320 may include an inner adjusting part 321 and an outer adjusting part 322. When in the second mode of operation the adjustment member 320 is moved downward than in the first mode of operation.

The inner adjusting part 321 is open toward the inner passage wall 102 through one side of the first opening 321-1, and the other side of the inner adjusting part 321 through the second opening 321-2. Can be configured to open toward the side [FIG. 5]. For example, the inner adjustment part 321 has an opening that is open toward the inner space S1 at an upper portion thereof, and has a bent portion that is inclined outward from an upper side of the upper opening to an outer side of the inner space S1, and has a lower end portion. It may be composed of an open formed duct. In more detail, the bent portion of the inner adjuster 321 extends from the upper end to the lower side when viewed from the side, and the inner space becomes wider, and the inner space becomes narrower again. It may be formed in a portion corresponding to the first opening (321-1). In the first operating mode, the inner adjusting part 321 of the adjusting member 320 guides the gas introduced into the flow space S2 from the outlet 111 to flow through the flow space S2 toward the inlet 121. At the same time, it is possible to block the gas introduced into the outlet auxiliary hole 115. On the other hand, the term "blocking" in the present specification is defined to include not only to completely seal the gas flow, but also to block or cover the flow of the gas to hinder the flow of the gas.

The outer adjuster 322 may cover the upper side of the inner adjuster 321. The outer adjuster 322 may be connected to the inner adjuster 321 and move together. The outer adjuster 322 may be configured to extend from the lower end of the outlet 111 to the lower end of the outlet auxiliary hole 115 when placed in the second mode of operation. In addition, the outer adjuster 322 guides the gas introduced into the flow space S2 from the outlet 111 to the outside through the outlet auxiliary hole 115 when the second operation mode is in the inlet. It can block the flow to 121.

The cover member 330 may cover the circumference of the auxiliary supply fan 223. In addition, the cover member 330 may be configured to cover a portion other than a point extending substantially parallel to the inner passage wall 102 or the outer passage wall 103 and facing the auxiliary supply fan 223. The cover member 330 may be provided at a position adjacent to the auxiliary supply fan 223 between the inner passage wall 102 and the outer passage wall 103.

In addition, the cover member 330 may include a cover through hole 331 formed at a point facing the auxiliary supply fan 223. The cover through hole 331 may have a size substantially the same as that of the supply blade 222b of the main supply fan 222. In addition, the cover through hole 331 may be provided in a number corresponding to the number of the main supply fan 222. The cover member 330 may be fixed to the outer passage wall 103 and does not move even if the operation mode of the flow control unit 300 is changed.

In addition, the cover through hole 331 may include a first cover through hole 331-1 and a second cover through hole 331-2. The first cover through hole 331-1 is formed at a position corresponding to the position where the first inlet 121-1 is formed, and is formed in the second cover through hole 331-2 and the second inlet 121-2. It may be formed at a corresponding position.

In addition, the cover member 330 may have a size corresponding to the inner passage wall 102 or the outer passage wall 103. When the cover member 330 is configured as described above, the gas introduced into the outlet 111 in the first operation mode flows into the space between the inner passage wall 102 and the cover member 330 to the inlet 121. You can get out. Therefore, in this case, the gas introduced into the outlet 111 in the first operating mode may be blocked by the cover member 330 so as not to flow into the space between the outer passage wall 103 and the cover member 330.

The gate member 340 may be placed in a position to block the second flow path P2 in the first operation mode and in a position to open the second flow path P2 in the second operation mode, and both positions It is configured to be movable between. The gate member 340 may be disposed adjacent to the cover member 330 at a position between the main supply fan 222 and the auxiliary supply fan 223. The gate member 340 may be a plate disposed side by side with the inner passage wall 102 or the outer passage wall 103. In addition, the gate member 340 may be configured to be slidably movable in a direction parallel to a direction in which the inner passage wall 102 or the outer passage wall 103 extends.

A gate passage 341 may be formed in the gate member 340. The gate passage 341 may be a through hole penetrating through the gate member 340, and may be provided in a number corresponding to the number of the inflow auxiliary holes 125. In addition, the gate passage 341 may be formed to be positioned at a position opposite to the inlet auxiliary hole 125 when in the second mode of operation. In addition, the gate passage 341 may be formed at a position opposite to the first inlet 121-1 and the second inlet 121-2. In addition, the gate passage 341 may have a size such that it is covered by the cover member 330 in the first operation mode. In other words, the gate passage 341 is disposed between the first cover through hole 331-1 and the second cover through hole 331-2 when the flow regulation unit 300 placed in the first operating mode is viewed from the side. Can be deployed. In other words, in the first operation mode, the first cover through hole 331-1 and the second cover through hole 331-2 may be closed by the gate member 340 without being exposed to the gate passage 341. have.

The actuator 350 may move the adjustment member 320 and the gate member 340. The actuator 350 moves the adjusting member 320 so that the inside of the adjusting member 320 communicates with the outlet 111 in the first operation mode, and the inlet 121 and the inlet auxiliary hole 125 do not communicate with each other. The gate member 340 may be moved so as not to. In addition, the actuator 350 prevents the interior of the adjustment member 320 from communicating with the outlet 111 when the second operation mode is in operation, and adjusts the member 320 so that the outlet 111 and the outlet auxiliary hole 115 communicate with each other. ), And the gate member 340 may be moved so that the inlet 121 and the inlet auxiliary hole 125 communicate with each other. The actuator 350 may include, for example, a first piston connected to the adjustment member 320 and a second piston connected to the gate member 340, but the spirit of the present invention is not necessarily limited thereto.

The controller may control the driving of the actuator 350. The control unit drives the actuator 350 to recover the temperature of the electronic component tested at a low temperature so that the flow control unit 300 is placed in the first operating mode, and the actuator (return the temperature of the electronic component tested at a high temperature) 350 may be driven to place the flow regulation unit 300 in a second mode of operation. Since the first mode of operation and the second mode of operation have different flow paths, the processing chamber 40 may be different from each other when restoring the temperature of the electronic component tested at low temperature and when restoring the temperature of the electronic component tested at high temperature. Other flow paths can be provided. Such a control unit may be implemented by a computing device including a microprocessor, and its implementation manner is obvious to those skilled in the art, and thus, further description thereof will be omitted.

Hereinafter, an operation method of the processing chamber 40 having the above configuration will be described with reference to FIGS. 8 and 9.

First, a description will be given when the processing chamber 40 is in the first mode of operation with reference to FIG. 8. The processing chamber 40 may recover the temperature of the cooled electronic component to room temperature by heating the electronic component (temperature control object) accommodated in the internal space S1. Gas can be flowed. When the flow regulating unit 300 is placed in the first operating mode, the adjusting member 320 moves upward to communicate with the outlet 111 so that the gas in the internal space S1 flows through the outlet 111 through the outlet 111. Inflow).

Meanwhile, the gate member 340 of the flow control unit 300 moves downward to block the cover through hole 331 so that gas in the flow space S2 may flow into the internal space S1 through the inlet 121. Can be. The controller may control the control member 320 through the actuator 350 so that the inside of the control member 320 communicates with the outlet 111 and blocks the gate passage 341 and the cover through hole 331 of the gate member 340. And movement of the gate member 340.

Next, a description will be given when the processing chamber 40 is in the second mode of operation with reference to FIG. 9. The processing chamber 40 may recover the temperature of the heated electronic component to room temperature by cooling the electronic component (temperature control object) accommodated in the internal space S1. Gas can be flowed. When the flow regulating unit 300 is placed in the second operation mode, the adjusting member 320 moves downward to communicate the outlet 111 to the outlet auxiliary hole 115 so that the gas in the internal space S1 passes through the passage body ( Discharges to the outside of the processing chamber 40 through 101 (second flow path P2 on the outlet 111 side).

Meanwhile, the gate member 340 of the flow control unit 300 moves upward to communicate the cover through hole 331 and the gate passage 341, and the gas outside the processing chamber 40 passes through the passage body 101. It may flow into the internal space S1 (second flow path P2 on the inlet 121 side). The controller may control the adjustment member 320 through the actuator 350 such that the inside of the adjustment member 320 does not communicate with the outlet 111, and the gate passage 341 and the cover through hole 331 of the gate member 340 communicate with each other. 320 and the movement of the gate member 340 is controlled.

Although the embodiments of the present invention have been described as specific embodiments, these are only examples, and the present invention is not limited thereto and should be construed as having the broadest scope in accordance with the basic idea disclosed herein. Those skilled in the art can combine / substitute the disclosed embodiments to implement a pattern of a timeless shape, but this also does not depart from the scope of the present invention. In addition, those skilled in the art can easily change or modify the disclosed embodiments based on the present specification, it is apparent that such changes or modifications belong to the scope of the present invention.

1: handler 10: loading device
20: process chamber 30: test chamber
40: process chamber 41: chamber body
42: fluidizer 50: unloading device
100: passage portion 101: passage body
102: inner passage wall 103: outer passage wall
111: outlet 115: outlet auxiliary hole
116: guide 117: mounting portion
121: inlet 125 inlet auxiliary hole
200: flow device 210: gas discharge unit
211: exhaust fan 211-1: inner exhaust fan
211-2: Outer exhaust fan 212: Spacer
220: gas supply unit 222: supply fan
222-1: first main supply fan 222-2: second main supply fan
223-1: first auxiliary supply fan 223-2: second auxiliary supply fan
300: flow control unit 320: adjustment member
321: Inner adjusting portion 321-1: First opening
321-2: second opening 322: outer adjustment portion
330: cover member 331: cover through hole
331-1: First cover through hole 331-2: Second cover through hole
340: gate member 341: gate passage
350: actuator

Claims (6)

A processing chamber in which an internal space in which gas can flow is formed,
A flow device for discharging gas from the internal space of the processing chamber and supplying gas to the internal space;
A passage portion including a passage body, an outlet formed in the passage body for discharging gas from the inner space, and an inlet formed in the passage body for supplying gas to the inner space; And
A flow control unit for controlling a gas flow path in the passage section,
The flow control unit,
A first mode of operation that opens a first flow path between the inlet and the outlet and blocks a second flow path between the outside of the processing chamber and the interior space; And
Has a second mode of operation for opening said second flow path,
The flow regulating unit is selectively driven in one of the first operating mode and the second operating mode,
Processing chamber. The method of claim 1,
The flow device,
A gas supply unit provided on the inlet side and supplying gas to the internal space,
The gas supply unit,
A first main supply fan disposed from the passage body toward the inner space; And a first auxiliary supply fan disposed on an opposite side of the inner space in the passage body and facing the first main supply fan.
The flow control unit,
Guide the gas supplied from the outlet in the first operating mode to flow into the first main supply fan side and prevent the gas supplied from the outlet in the second operating mode from entering the first main supply fan side. Including an adjustment member to make,
Processing chamber. The method of claim 2,
The passage body and the regulating member provide a flow space extending from the outlet side to the inlet side to allow gas to flow;
The adjustment member,
Gas supplied from the outlet by moving to the outlet side when in the first operating mode guides the movement of gas from the outlet to the inlet side through the flow space, and gas supplied from the outlet by moving to the inlet side when in the second operating mode To prevent movement to the inlet side,
Processing chamber. The method of claim 2,
The gas supply unit,
A second main supply fan disposed in the passage body and spaced apart from the first main supply fan by a predetermined distance; And
A second auxiliary supply fan disposed opposite the inner space in the passage body;
The flow control unit,
In the first operating mode, gas is prevented from flowing from the first auxiliary supply fan and the second auxiliary supply fan to the first main supply fan and the second main supply fan, and in the second operating mode, the gas And a gate member provided to allow flow from the first auxiliary supply fan and the second auxiliary supply fan to the first main supply fan and the second main supply fan,
Processing chamber. The method of claim 4, wherein
The flow control unit further includes a cover member formed with a cover through hole,
The gate member is formed with a gate passage disposed opposite to at least one of the first auxiliary supply fan and the second auxiliary supply fan in the second operating mode,
The gate member,
The cover through hole is blocked in the first operating mode, and the cover through hole and the gate passage are driven to communicate with each other in the second operating mode.
Processing chamber. A loading device for loading an electronic component;
A process chamber for preheating or precooling the loaded electronic component to a test set temperature;
A test chamber for testing the preheated or precooled electronic component;
The processing chamber according to any one of claims 1 to 5, which is provided to restore the temperature of the electronic component in which the test is completed to a predetermined temperature; And
And an unloading device for unloading the electronic component restored to the preset temperature by the processing chamber.

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