KR20190083607A - Antenna and method for making the antenna - Google Patents

Abstract

A method of manufacturing an antenna and an antenna is disclosed. The antenna includes an antenna structure and a high-permittivity meta-material including a metal pattern disposed at regular intervals therein.

Description

Technical Field [0001] The present invention relates to an antenna,

The following description relates to an antenna and relates to a very small antenna using a high-permittivity meta-material.

An antenna converts electric signals represented by voltage and current and electromagnetic waves represented by an electric field and a magnetic field with each other. The change of the electromagnetic field outside the antenna and the electrical signal on the antenna lead interfere with each other, so that the antenna can sense an electromagnetic wave signal floating in the atmosphere or emit an electromagnetic wave signal into the atmosphere.

INDUSTRIAL APPLICABILITY The present invention can achieve miniaturization of a dipole antenna by using a unique arrangement structure of a matching structure with a metamaterial having a high dielectric constant and a dipole antenna.

The antenna according to an exemplary embodiment includes a high dielectric constant meta material including an antenna structure and a metal pattern disposed at regular intervals in the antenna structure.

The antenna according to an exemplary embodiment may include a plurality of thin film dielectrics stacked in the meta-material, and each of the plurality of thin-film dielectrics may include a metal pattern disposed at the regular intervals.

The first metal cell forming the metal pattern included in the first thin film dielectric and the second metal cell forming the metal pattern included in the second thin film dielectric adjacent to the first thin film dielectric are parallel to the second thin film dielectric at regular intervals Can be spaced in one direction.

The constant spacing may be half the width of the second metal cell.

The dielectric between the plurality of metal cells forming the metal pattern may be insulating.

The antenna structure may include a dipole antenna formed on one side and a matching structure formed on the other side.

The dipole antenna may be formed on one side of a thin PET film, and the matching structure may be formed on the other side of the PET film.

The matching structure may be a loop-shaped metal.

The dipole antenna may include a capacitive impedance characteristic, and the matching structure may include a fluid impedance characteristic.

A method of manufacturing an antenna according to an exemplary embodiment includes forming a periodic metal pattern on each of a plurality of thin film dielectrics, forming a plurality of thin film dielectrics to form a metamaterial having a high dielectric constant, And < / RTI >

In the step of forming the metal pattern, the metal pattern may be periodically printed on each of the plurality of thin film dielectrics using a printed circuit board (PCB) method.

The antenna manufacturing method may further include forming the antenna structure, wherein the antenna structure is formed by forming a dipole antenna on one side of a thin PET film and forming a matching structure on the other side of the PET film .

According to one embodiment, there is provided an antenna capable of achieving miniaturization of a dipole antenna by using a unique arrangement structure of a matching structure with a metamaterial having a high dielectric constant and a dipole antenna.

FIG. 1 is a view showing the overall configuration of an antenna according to an embodiment.
FIG. 2 illustrates a meta-structure within a thin-film dielectric according to one embodiment.
3 is an xy plan view of a meta structure within a thin film dielectric according to one embodiment.
4 is an xz plan view of a meta-structure within a thin film dielectric according to one embodiment.
5 is a diagram illustrating an antenna structure according to an embodiment.
5 is a view showing a detailed configuration of an apparatus according to another embodiment.
6 (a) and 6 (b) are graphs showing characteristics of input impedance of an antenna according to an embodiment.
7 is a diagram illustrating characteristics of a return loss bandwidth of an antenna according to an embodiment.
8 is a flowchart illustrating a method of manufacturing an antenna according to an embodiment.

Specific structural or functional descriptions of embodiments are set forth for illustration purposes only and may be embodied with various changes and modifications. Accordingly, the embodiments are not intended to be limited to the particular forms disclosed, and the scope of the present disclosure includes changes, equivalents, or alternatives included in the technical idea.

The terms first or second, etc. may be used to describe various elements, but such terms should be interpreted solely for the purpose of distinguishing one element from another. For example, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

It is to be understood that when an element is referred to as being "connected" to another element, it may be directly connected or connected to the other element, although other elements may be present in between.

The singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, the terms "comprises ", or" having ", and the like, are used to specify one or more of the described features, numbers, steps, operations, elements, But do not preclude the presence or addition of steps, operations, elements, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the meaning of the context in the relevant art and, unless explicitly defined herein, are to be interpreted as ideal or overly formal Do not.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following description of the present invention with reference to the accompanying drawings, the same components are denoted by the same reference numerals regardless of the reference numerals, and a duplicate description thereof will be omitted.

FIG. 1 is a view showing the overall configuration of an antenna according to an embodiment.

According to one embodiment, the antenna comprises an antenna structure 30 and a high permittivity meta material 35. The high-permittivity meta-material 35 includes a metal pattern disposed at regular intervals inside.

Since the metamaterial 35 having high dielectric constant and the antenna structure 30 are defective, the antenna can be realized in a very small size. The metamaterial 35 may be comprised of a thin film dielectric including a periodic metal pattern. The antenna structure 30 may include a matching structure 20 with a dipole antenna. The dipole antenna may include a left pole 10, a right pole 11 and a feeder 15.

The metamaterial 35 may be formed by forming a periodic metal pattern on the thin film dielectric and laminating a plurality of such thin film dielectrics. The metamaterial 35 thus formed may have a characteristic of a high dielectric constant. For example, the relative permittivity of the meta-material 35 may be between 200 and 300.

Electric field localization may occur due to periodic metal pattern formation in the thin film dielectric. Due to the localization of the electric field, a local electric field can be strongly formed compared to a macroscopic effective electric field. The effective electric flux density inside the meta-material 35 can be strengthened due to the strongly formed local electric field. Through this, the meta material 35 can have the property of a high dielectric constant.

The antenna structure 30 may implement matching for the antenna function by a unique arrangement structure of the matching structure with the dipole antenna. Matching can be achieved by adjusting the resistance component and the reactance component at the input impedance of the antenna structure by the unique arrangement structure of the dipole antenna and the matching structure.

FIG. 2 illustrates a meta-structure within a thin-film dielectric according to one embodiment.

According to one embodiment, the meta-material 35 of Figure 1 comprises a plurality of stacked thin-film dielectrics. Each of the plurality of thin film dielectrics includes a metal pattern arranged at regular intervals. Here, the dielectric between the plurality of metal cells 40, 50 forming the metal pattern is insulating.

The metal pattern in the meta material 35 may include a plurality of metal cells 40 and 50 arranged at regular intervals in the x and y directions. The plurality of metal cells 40, 50 may have the same shape and size. The plurality of metal cells 40, 50 may have a rectangular shape.

The metal patterns in the xy plane can be spaced apart by a constant distance h _d in the z direction. The smaller h _d , the more metal patterns can be included in a certain volume, and miniaturization of the antenna can be achieved. Therefore, h _d can be set as small as possible. The spacing between the nearest metal cells 40, 50 included in each of the metal patterns in the xy plane may be s. Each of the metal patterns of the xy plane can be shifted by an interval s. Each of the metal cells 40 and 50 may be arranged in a zigzag shape on a plan view. For example, the spacing s may correspond to half the width of the metal cell.

The electromagnetic wave can proceed in the z direction with reference to the xyz coordinate system in Fig. Polarization of the electric field in the x direction and the y direction may strongly occur due to the metal pattern arranged at regular intervals. The relative permittivity of the meta material 35 can be equivalently increased due to the polarization of the strongly generated electric field. As described above, strong local electric field polarization occurs between the arrayed metal cells 40 and 50 formed inside the meta material 35 by the electromagnetic waves traveling in the z direction, and the relative dielectric constant of the meta material 35 Can be increased.

3 is an xy plan view of a meta structure within a thin film dielectric according to one embodiment. 4 is an xz plan view of a meta-structure within a thin film dielectric according to one embodiment. FIGS. 3 and 4 are views for describing the three-dimensional structure of FIG. 2 in more detail in the xy plane and the xz plane.

According to one embodiment, the first metal cell forming the metal pattern included in the first thin-film dielectric and the second metal cell forming the metal pattern included in the second thin-film dielectric adjacent to the first thin- Lt; RTI ID = 0.0 > 2 < / RTI > For example, where a constant spacing can mean half the width of the second metal cell.

Referring to FIG. 3, the meta-material 35 may include a structure in which the metal cells 40 and 50 are repeated three-dimensionally. Here, the metal cells 40 and 50 are spaced apart from each other in the x, y, and z directions. Each metal cell 40, 50 may be of the same size. For example, when the metal cells 40 and 50 are square, the length of one side of the metal cells 40 and 50 may be b, and the interval between adjacent metal cells 40 and 50 on the xy plane may be ab have.

Referring to FIG. 4, the meta-material 35 may include a structure in which the metal cells 40 and 50 are repeated three-dimensionally. In the z direction, each of the metal cells 40, 50 may have a thickness of hm, and each of the metal cells 40, 50 may be spaced apart by hd. The thickness of the metal cells 40, 50 may be much smaller than the left or right side of the metal cells 40, 50. Between the metal cells 40 and 50, a dielectric material having an insulating property may be included.

For example, when the metal cells 40 and 50 are square and the length of one side is b and the length from the one side of the metal cells 40 and 50 to the corresponding side of the adjacent metal cells 40 and 50 is a , The thickness of the metal cells 40 and 50 is hm, and the spacing between the metal cells 40 and 50 in the z direction is hd, the dielectric constant epsilon _d can be calculated by Equation (1).

5 is a diagram illustrating an antenna structure according to an embodiment.

According to one embodiment, the antenna structure 30 of FIG. 1 may include a dipole antenna formed on one side and a matching structure 20 formed on the other side. The dipole antenna may include a left pole 10 and a right pole 11. According to one embodiment, the dipole antenna is formed on one side of the thin PET film, and the matching structure can be formed on the other side of the PET film.

The dipole antenna may be a short dipole and generally exhibits a capant impedance characteristic due to its short dipole characteristics. Since the antenna structure 30 has to be small and spherical, the matching structure 20 can be formed at the bottom of the PET film.

The dipole antenna may include a capacitive impedance characteristic and the matching structure 20 may include a fluid impedance characteristic. The matching structure 20 may be a metal of a loop structure. The loop structure allows the matching structure 20 to have inductive impedance characteristics and to compensate for the capacitive impedance characteristics of the dipole antenna. The magnitude of the inductive impedance can be controlled by adjusting the width x and the length y of the matching structure 20. [ The matching can be achieved by compensating the capacitive impedance characteristic of the dipole antenna by the matching structure 20. [ Through this, the voltage applied to the dipole antenna can be resonated.

6 (a) is a graph showing characteristics of input impedance of a conventional antenna. 6 (b) is a diagram illustrating the characteristics of the input impedance of the antenna according to one embodiment.

Referring to FIG. 6 (a), the impedance characteristic 60 of a conventional antenna not including a matching structure is shown in a Smith chart. 6 (b) is a graph showing the impedance characteristic 61 of the antenna including the matching structure according to one embodiment in a Smith chart.

For example, a conventional antenna can be designed to resonate at 2.45 GHz. Referring to FIG. 6 (a), the antenna exhibits a capacitive impedance characteristic at 2.45 GHz. Referring to Fig. 6 (b), the impedance characteristics of the antenna including the matching structure are shown. Here, a graph in which the antenna is resonated by compensating the capacitive impedance characteristic by the loop type matching structure is shown.

7 is a diagram illustrating characteristics of a return loss bandwidth of an antenna according to an embodiment.

The left pole and the right pole of the antenna are broken wires, and the electric signal can no longer proceed in the broken part. The antenna causes the dipole to resonate at a specific frequency so that the signal does not return, but forms the electromagnetic field energy and emits it to the outside.

As described above, the antenna is a one-port device including only an input port without an output port, and can have only the value of the S11 component indicating the input reflection coefficient, and shows a resonance graph as shown in FIG. Here, the value of the S11 component at a specific frequency is deeper, and the radiation efficiency of the file recording antenna is high and the matching can be evaluated to be good. The larger the width of the fine valley, the more bandwidth the antenna can accommodate.

Referring to FIG. 7, a return-loss bandwidth characteristic of an antenna according to an embodiment is shown. Referring to FIG. 7, the antenna exhibits a bandwidth characteristic of about 1 MHz based on a reflection loss of -10 dB, centering on a resonant frequency of 2.45 GHz.

8 is a flowchart illustrating a method of manufacturing an antenna according to an embodiment.

According to one embodiment, an antenna manufacturing apparatus can form a metamaterial having a high dielectric constant by using a low-cost PCB (Printed Circuit Board) process, and can combine a metamaterial having a high dielectric constant with an antenna structure to produce a small- have.

According to one embodiment, in step 801, the antenna fabrication apparatus may form a periodic metal pattern on each of the plurality of thin film dielectrics. The antenna manufacturing apparatus can form a metal pattern by printing a metal pattern on each of a plurality of thin film dielectrics periodically using a printed circuit board (PCB) method.

According to one embodiment, in step 803, the antenna manufacturing apparatus may form a plurality of thin-film dielectrics to form a high-permittivity meta-material.

According to one embodiment, in step 805, the antenna manufacturing apparatus may combine the meta-material and the antenna structure. Here, the antenna manufacturing apparatus can form the antenna structure by the PCB method. The antenna manufacturing apparatus can print the dipole antenna on the top of the thin PET film. The antenna manufacturing apparatus can print a loop-shaped registration structure on the bottom of the PET film. Thus, after the antenna structure and the matching structure are formed on both sides of the PET film, the high dielectric constant meta material can be combined with the antenna structure.

The embodiments described above may be implemented in hardware components, software components, and / or a combination of hardware components and software components. For example, the devices, methods, and components described in the embodiments may be implemented within a computer system, such as, for example, a processor, a controller, an arithmetic logic unit (ALU), a digital signal processor, such as an array, a programmable logic unit (PLU), a microprocessor, or any other device capable of executing and responding to instructions. The processing device may execute an operating system (OS) and one or more software applications running on the operating system. The processing device may also access, store, manipulate, process, and generate data in response to execution of the software. For ease of understanding, the processing apparatus may be described as being used singly, but those skilled in the art will recognize that the processing apparatus may have a plurality of processing elements and / As shown in FIG. For example, the processing unit may comprise a plurality of processors or one processor and one controller. Other processing configurations are also possible, such as a parallel processor.

The components described in the embodiments may be implemented by one or more programmable logic devices such as a digital signal processor (DSP), a processor, a controller, an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), other electronic devices, Or a combination of hardware and software. At least some of the processes or functions described in the embodiments may be implemented by software, and the software may be recorded on a recording medium. The components, functions and processes described in the embodiments may be implemented by a combination of hardware and software.

The software may include a computer program, code, instructions, or a combination of one or more of the foregoing, and may be configured to configure the processing device to operate as desired or to process it collectively or collectively Device can be commanded. The software and / or data may be in the form of any type of machine, component, physical device, virtual equipment, computer storage media, or device , Or may be permanently or temporarily embodied in a transmitted signal wave. The software may be distributed over a networked computer system and stored or executed in a distributed manner. The software and data may be stored on one or more computer readable recording media.

The method according to an embodiment may be implemented in the form of a program command that can be executed through various computer means and recorded in a computer-readable medium. The computer readable medium may include program instructions, data files, data structures, and the like, alone or in combination. Program instructions to be recorded on a computer-readable medium may be those specially designed and constructed for an embodiment or may be available to those skilled in the art of computer software. Examples of computer-readable media include magnetic media such as hard disks, floppy disks and magnetic tape; optical media such as CD-ROMs and DVDs; magnetic media such as floppy disks; Magneto-optical media, and hardware devices specifically configured to store and execute program instructions such as ROM, RAM, flash memory, and the like. Examples of program instructions include machine language code such as those produced by a compiler, as well as high-level language code that can be executed by a computer using an interpreter or the like. The hardware devices described above may be configured to operate as one or more software modules to perform the operations of the embodiments, and vice versa.

Although the embodiments have been described with reference to the drawings, various technical modifications and variations may be applied to those skilled in the art. For example, it is to be understood that the techniques described may be performed in a different order than the described methods, and / or that components of the described systems, structures, devices, circuits, Lt; / RTI > or equivalents, even if it is replaced or replaced.

10: Left pole
11: Right pole
15:
20: Matching structure
30: Antenna structure
35: Metamaterial

Claims (12)

Antenna structure; And
A high-permittivity meta material including a metal pattern disposed at regular intervals inside
/ RTI > The method according to claim 1,
Wherein the meta material comprises a plurality of laminated thin film dielectrics,
Wherein each of the plurality of thin film dielectrics includes a metal pattern arranged at the predetermined interval,
antenna. 3. The method of claim 2,
The first metal cell forming the metal pattern included in the first thin film dielectric and the second metal cell forming the metal pattern included in the second thin film dielectric adjacent to the first thin film dielectric are parallel to the second thin film dielectric at regular intervals Spaced apart in one direction,
antenna. The method of claim 3,
Wherein the constant spacing is half the width of the second metal cell,
antenna. 3. The method of claim 2,
Wherein a dielectric between the plurality of metal cells forming the metal pattern is made of an insulating material,
antenna. The method according to claim 1,
Wherein the antenna structure comprises a dipole antenna formed on one side and a matching structure formed on the other side,
antenna. The method according to claim 6,
Wherein the dipole antenna is formed on one side of a thin PET film, and the matching structure is formed on the other side of the PET film,
antenna. The method according to claim 6,
Wherein the matching structure is a metal of a loop structure,
antenna. 8. The method of claim 7,
Wherein the dipole antenna comprises a capacitive impedance characteristic, and wherein the matching structure comprises a fluid impedance characteristic,
antenna. In the antenna manufacturing method,
Forming a periodic metal pattern on each of the plurality of thin film dielectrics;
Stacking the plurality of thin film dielectrics to form a metamaterial having a high dielectric constant; And
Combining the meta-material with the antenna structure
Gt; antenna. ≪ / RTI > 11. The method of claim 10,
The forming of the metal pattern may include:
Wherein the metal pattern is periodically printed on each of the plurality of thin film dielectrics using a printed circuit board (PCB)
A method for manufacturing an antenna. 11. The method of claim 10,
The antenna manufacturing method further includes forming the antenna structure,
Wherein forming the antenna structure comprises:
A dipole antenna is formed on one side of a thin PET film and a matching structure is formed on the other side of the PET film.
A method for manufacturing an antenna.

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