KR20180109678A - Die bonding device and method of manufacturing semiconductor device - Google Patents

Abstract

The present invention provides a die bonding apparatus capable of determining a pre-maintenance timing without complicating the apparatus configuration of the die bonding apparatus. The die bonding apparatus includes a bonding section for bonding a die supplied from a die supply section to a substrate supplied from a substrate supply section, and a control section for controlling the bonding section. (B) capturing the substrate and a die bonded to the substrate with the imaging device, and transferring the substrate and the substrate bonded to the substrate (C) recognizing the position of the substrate on the basis of the position of the substrate recognized in (a) and the position of the substrate recognized in (b) Diagnose the condition.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a die bonding apparatus,

The present disclosure relates to a die bonding apparatus, and is applicable, for example, to a die bonding apparatus having a self-diagnosis function.

There is a step of assembling a package by mounting a semiconductor chip (hereinafter simply referred to as a semiconductor chip) on a wiring board or a lead frame (hereinafter, simply referred to as a board) in a part of the manufacturing process of the semiconductor device, (Dicing step) of dividing a die from a semiconductor wafer (hereinafter simply referred to as a wafer) and a bonding step of mounting the divided die on a substrate. The semiconductor manufacturing apparatus used in the bonding process is a die bonding apparatus such as a die bonder.

Japanese Patent Laid-Open No. 7-141021

In the conventional die bonder, the problem of the operation of the apparatus can not be known until a defective product occurs. Thus, in order to prevent defective bonding due to the problem of the operation of the apparatus, the pre-maintenance of the die bonder is carried out periodically or according to the number of production. However, in this method, since it is necessary to take a large safety margin in order to completely prevent defects, the number of times of maintenance increases and the throughput decreases.

It is an object of the present disclosure to provide a die bonding apparatus capable of determining a pre-maintenance timing without complicating a device configuration of the die bonding apparatus.

Other tasks and novel features will be apparent from the description of the present specification and the accompanying drawings.

An outline of representative examples of the present disclosure will be briefly described below.

That is, the die bonding apparatus includes a die supplying section, a substrate supplying section, a bonding section for bonding the die supplied from the die supplying section onto a substrate supplied from the substrate supplying section or a die already bonded to the substrate, And a control unit for controlling the substrate supply unit and the bonding unit. The bonding section includes a bonding head having a collet for attracting the die, and a first imaging device capable of imaging the substrate and the die bonded to the substrate. (B) capturing, by the first imaging device, a die bonded to the substrate and the substrate, and (c) imaging the substrate with the first imaging device, (C) recognizing the position of the substrate recognized in (a) and the position of the substrate recognized in (b) by recognizing the position of the die bonded to the substrate, Thereby diagnosing the fixed state of the substrate.

According to the die bonding apparatus, the pre-maintenance timing can be determined without complicating the apparatus configuration of the die bonding apparatus.

1 is a schematic top view showing a die bonder according to an embodiment.
Fig. 2 is a schematic side view for explaining the movement of the bonding head and the like seen in the direction of the arrow A shown in Fig.
Fig. 3 is a view showing an external perspective view of the die supply portion. Fig.
4 is a schematic sectional view showing the main part of the die supply portion.
5 is a flowchart showing the bonding operation of FIG.
6 is a diagram showing the results of board recognition before and after bonding.
Fig. 7 is a flowchart showing the bonding operation according to Modification 1. Fig.
8 is a flowchart showing the bonding operation according to the second modification.
9 is a diagram showing the results of die recognition before and after bonding.
10 is a schematic overall top view showing a die bonder according to Modification 3. Fig.
11 is a schematic side view for explaining the movement of the pickup head, the bonding head, and the like as seen in the direction of arrow A shown in Fig.

The inventors of the present invention have studied a method of highly precisely determining the timing of pre-maintenance. As a result, it is possible to determine the timing by diagnosing a mechanism or the like that affects the bonding accuracy by using the recognition result in the continuous operation . The present invention is based on this new knowledge.

For example, when the substrate is not normally fixed, the bonding accuracy is not stable. Whether or not the substrate is fixed can be judged by recognizing it twice or more. In addition, a bad state process is limited by comparing the die position and stability before bonding with the die appearance result after bonding.

Specifically, for example, the recognition of the substrate is usually performed before bonding and after bonding (appearance inspection). The substrate fixing state is diagnosed by comparing before and after bonding, the die position by the die back is monitored before bonding, Pickup state, and bonding state.

Thus, it is possible to find a problem of a mechanism that affects the bonding accuracy without adding a new mechanism or the like. Further, the timing of the pre-maintenance can be accurately determined, and the throughput can be improved without deteriorating the quality.

Hereinafter, embodiments and modifications will be described with reference to the drawings. In the following description, the same constituent elements are denoted by the same reference numerals, and repeated explanation may be omitted. Further, in order to make the explanation more clearly, the drawings are schematically expressed in terms of the width, thickness, shape, etc. of each part, as compared with the actual form, but are merely examples and do not limit the interpretation of the present invention.

[Example]

1 is a schematic top view of a die bonder according to an embodiment. Fig. 2 is a schematic side view for explaining a schematic configuration and an operation of the bonding head and the peripheral portion thereof as viewed from the arrow A in Fig.

The die bonder 10 is a die bonder having a single conveyance lane and a single bonding head. The die bonder 10 is roughly classified into a package substrate P (hereinafter, referred to as a package area P) (15 places in Fig. 1) on which a product area 9 for picking up the dies D from the die supply part 1 and bonding them onto the substrate 9 or the already bonded die D, A transfer section 5 for transferring the substrate 9 to the mounting position, a substrate supply section 6 for supplying the substrate 9 to the transfer section 5, A substrate carry-out section 7, and a control section 8 for monitoring and controlling the operation of each section.

First, the die supply unit 1 includes a wafer holding table 12 for holding a wafer 11 having a plurality of grades of dies and a holding table 12 for holding up the die D by pushing up the die D from the wafer 11 Unit (13). The wafer holding table 12 is moved in the X and Y directions by driving means (not shown) disposed at a lower portion of the wafer holding table 12, and when the die D is picked up from the wafer 11, Is moved so as to overlap the push-up unit 13 in a planar manner.

The bonding section 4 has a collet 42 for sucking and holding the die D pushed up to the push-up unit 13 at the front end thereof. The die D is picked up, A Y-driving section 43 for moving the bonding head 41 in the Y-direction, and a Y-drive section 43 for moving the bonding head 41 in the package area P, (First image pickup device) 44 for picking up the image of the die (not shown) and recognizing the bonding position of the die D to be bonded, And a die recognition camera (second image pickup device) 45 for recognizing the position. The pick-up is performed based on the classification map indicating the grade of the die of the wafer 11. [ The classification map is stored in advance in the control unit 8. [ Further, the bonding head 41 has respective driving portions (not shown) for moving the collet 42 up and down and in the X direction, and is movable up and down and left and right as indicated by arrows in Fig.

With this configuration, the bonding head 41 corrects the pickup position / posture based on the image pickup data of the die recognition camera 45, picks up the die D, The die D is bonded to the package area P of the substrate 9,

The transport section 5 has two transport chutes for transporting the substrate 9. [ For example, the substrate 9 is moved to a conveyance belt (not shown) provided in two conveyance chutes.

With such a configuration, the substrate 9 is stacked on the conveyance lane 51 in the substrate supply section 6, moved to the bonding position along the transport chute, and moved to the substrate carry-out section 7 after bonding. Thereafter, the substrate may be moved from the substrate carry-out section 7 toward the substrate supply section 6 to bond the die to another package area of the substrate 9, or to further bond the die onto the die. It is also possible to reciprocate a plurality of times between the substrate supply section 6 and the substrate carry-out section 7 to die-bond the dice in multiple layers.

Next, the configuration of the die feeder 1 will be described with reference to Figs. 3 and 4. Fig. Fig. 3 is a view showing an external perspective view of the die supply portion. Fig. 4 is a schematic sectional view showing the main part of the die supply portion.

The die supply unit 1 includes a wafer holding table 12 that moves in the horizontal direction (XY direction) and a push-up unit 13 that moves in the vertical direction. The wafer holding table 12 includes an expanding ring 15 holding the wafer ring 14 and a dicing tape 16 held by the wafer ring 14 and having a plurality of dies D adhered horizontally And has a supporting ring 17 for positioning. The push-up unit 13 is disposed inside the support ring 17.

The die supply section 1 lowers the expanding ring 15 holding the wafer ring 14 when the die D is lifted. As a result, the dicing tape 16 held on the wafer ring 14 is stretched to widen the distance between the dies D, and the die D is moved downward by the lifting unit 13 from the die D, So that the pickup performance of the die D is improved. A film-shaped adhesive material called a die attach film (DAF) 18 is attached between the wafer 11 and the dicing tape 16. [ In the wafer 11 having the die attach film 18, dicing is performed on the wafer 11 and the die attach film 18. Therefore, in the peeling step, the wafer 11 and the die attach film 18 are peeled from the dicing tape 16.

The control unit 8 includes a memory for storing a program (software) for monitoring and controlling the operation of each part of the die bonder 10 and a central processing unit (CPU) for executing a program stored in the memory. For example, the control unit 8 introduces various kinds of information such as image information from the substrate recognition camera 44 and the substrate recognition camera 44, the position of the bonding head 41, And controls the operation of each component such as operation.

As described above, the die bonder 10 includes a wafer recognition camera 24 that recognizes the posture of the die D on the wafer 11, and a wafer recognition camera 24 that picks up the position of the die And a substrate recognition camera 44 for recognizing a mounting position on the bonding stage BS. The reason why the attitude correction between the recognized cameras must be performed is that the wafer recognition camera 24 and the die recognition camera 45 involved in picking up by the bonding head 41 and the die recognition camera 45 are bonded to the mounting position by the bonding head 41 Which is the substrate recognition camera 44 involved. In the present embodiment, the wafer D camera 24 is used to position the die D, and the substrate recognition camera 44 is used to determine the position of the package area P and the position of the package area P P of the die bonded to the die.

5 is a flowchart for explaining a die bonding process in the die bonding apparatus according to the embodiment.

The control section 8 first takes the wafer ring 14 holding the wafer 11 from the wafer cassette and mounts the wafer ring 12 on the wafer holding table 12, To the reference position where the pickup of the die D is performed (wafer loading). Subsequently, the control unit 8 performs fine adjustment so that the placement position of the wafer 11 exactly coincides with the reference position, from the image acquired by the wafer recognition camera 24. [

Subsequently, the control unit 8 moves the wafer holding table 12 on which the wafer 11 is loaded by pitching the wafer holding table 12 at a predetermined pitch and holding the wafer holding table 12 horizontally, thereby placing the die D to be picked up first in the pickup position ). The wafer 11 is inspected for each die by an inspection apparatus such as a prober in advance, and map data indicating good and defective for each die is generated and stored in the storage device of the control unit 8. [ Whether the die D to be picked up is good or defective is determined by the map data. The control unit 8 moves the wafer holding table 12 on which the wafer 11 is placed by a predetermined pitch when the die D is a defective product and then moves the die D to be picked up to the pickup position So that the die D of the defective product is skipped.

The control unit 8 photographs the main surface (upper surface) of the die D to be picked up by the wafer recognition camera 24 and calculates the position shift amount from the picked up position of the die D to be picked up . The control unit 8 moves the wafer holding table 12 on which the wafers 11 are loaded based on the position shift amount and accurately positions the die D to be picked up at the pickup position )).

The control unit 8 loads the substrate 9 on the conveyance lane 51 from the substrate supply unit 6 (substrate loading). The control unit 8 moves the substrate 9 to the bonding position (substrate transport).

The control unit 8 picks up the substrate with the substrate recognition camera 44 before bonding to recognize the position of the package area P of the substrate 9 for bonding and performs positioning (substrate recognition (step S4)).

The control unit 8 picks up the die D from the dicing tape 16 by the bonding head 41 including the collet 42 after placing the die D to be picked up accurately at the pickup position (Step S2) and die-bonded to the package area P of the substrate 9 or the die already bonded to the package area P of the substrate 9 based on the substrate recognition result of step S4 (step S5). The back side of the picked-up die D may be picked up by the die recognition camera 45 and the position of the die D may be inspected (step S3). This step is an option.

After bonding the die D, the control unit 8 checks whether the bonding position is correct. The control unit 8 again recognizes the position of the package area P of the board 9 by imaging the package area P of the board 9 with the board recognition camera 44 in order to check the result of the bonding mounting (Step S6). The control unit 8 recognizes the position of the die D by capturing the die D by the substrate recognition camera 44 (step S7) and recognizes the position of the die D bonded from the substrate recognition and die recognition result Inspection is performed. The control section 8 performs numerical output, inspection, and judgment in comparison with the previously registered bonding positions.

The control section 8 performs self-diagnosis described later (step S9). If there is no abnormality, the next bonding is performed (step S8).

Thereafter, the die D is bonded to the package area P of the substrate 9 one by one according to the same procedure. When the bonding of one substrate is completed, the substrate 9 is moved to the substrate carry-out section 7 (substrate carry) and the substrate 9 is transferred to the substrate carry-out section 7 (unloading the substrate).

Further, the dies D are peeled from the dicing tape 16 one by one according to the same procedure. The dicing tape 16, the wafer ring 14, and the like which hold the die D on the outer shape of the wafer 11 are unloaded onto the wafer cassette .

Subsequently, the self-diagnosis (step S9) will be described with reference to Fig. Fig. 6 is a view showing the substrate recognition result and the appearance inspection result. Fig. 6 (A) shows the case where the substrate fixing is insufficient, and Fig. 6 (B) shows the case where the substrate fixing is normal. The horizontal axis in Fig. 6 shows the number of times of bonding (number of starts) and the vertical axis shows the position (mu m) of the substrate with respect to the reference. The number of times of bonding in FIG. 6B is 1 to 304, and the number of bonding in FIG. 6A is 870 to 1000.

The control unit 8 compares the substrate recognition results before and after bonding to calculate the position movement amount of the substrate. When the position movement amount of the substrate is equal to or larger than a predetermined amount, the control unit 8 determines that the substrate is insufficient and warns it.

Specifically, the controller 8 compares the position of the step positions of board recognition package area (P) in the S4 (P _S4) and step S6 board recognition package area (P) in the (P _S6) , And calculates the difference (the amount of positional movement of the substrate). In Fig. 6 (A) where the number of starts is large, the fluctuations of P _S4 and P _S6 are large, and the amount of movement of the substrate is also large. In Fig. 6B where the number of starts is small, the fluctuation of P _S4 and P _S6 is smaller than that of Fig. 6A, and the amount of positional movement of the substrate is also small. 6 (A) and 6 (B), the positional shift amount of the substrate is not shown, but the positional shift amount of the substrate is a difference between the positions of the substrates before and after bonding, and can be easily grasped from the figure. As shown in Fig. 6 (A), when the positional shift amount of the substrate is large, the controller 8 determines that the substrate is insufficiently fixed, and as shown in Fig. 6B, If it is small, it is determined that the substrate is fixed normally.

For example, the control unit 8 determines that the substrate is sufficiently fixed (normal) when the substrate is moved to a position of 1 to 5 m, the normal fluctuation range is 5 to 10 m, do. If it is determined that the substrate is insufficiently fixed, for example, insufficient mechanical clamping, insufficient fixing due to suction, insufficient fixing of the camera and lens can be considered, and if the mechanical clamp is insufficient, the height is reconsidered. Review pipe breakage and review loose and peeled when camera and lens fixation are insufficient.

According to the embodiments described above, it is possible to provide a die bonder and a bonding method capable of determining the pre-maintenance timing without complicating the device configuration of the die bonder. Thereby, it is possible to provide a die-bonder with high precision, and high accuracy can be maintained.

<Modifications>

Hereinafter, some representative variations will be exemplified. In the following description of the modified example, the same reference numerals as in the above-described embodiments can be used for the parts having the same configuration and function as those described in the above-mentioned embodiments. In the following description of the present invention, it is to be understood that the description of the embodiments described above may be properly exploited within the scope not technically inconsistent with the present invention. In addition, some or all of the above-described embodiments, and all or part of the plurality of modified examples, may be suitably applied in combination within a range not technically contradictory.

(Modified Example 1)

In the embodiment, step S3 is an option (OPTION), but in the first modification, step S3 is performed. Modification 1 is the same as the embodiment except for the self diagnosis. The self diagnosis (step SA) according to Modification Example 1 will be described with reference to FIG. Fig. 7 is a flowchart showing the bonding operation according to Modification 1. Fig.

The control unit 8 performs positional inspection of the back surface of the die before bonding (position correction may be performed based on the result of the position inspection, or may not be performed). The position of the die D in the die back position inspection in step S3 is compared with the position of the registered die, and the difference (positional movement amount of the die) is calculated.

For example, the control section 8 determines that the die recognition / pick-up is normal when the positional movement amount of the die is 1 to 5 占 퐉, the normal variation range is 5 to 10 占 퐉, . If it is determined that the picked-up position is abnormal, for example, a die recognition problem or a deviation upon pickup can be considered. If the problem is a die recognition problem, the resolution, the registration pattern, and the like are reconsidered.

(Modified example 2)

In the embodiment, step S3 is an option (OPTION), but in the second modification, step S3 is performed in the same manner as in the first modification. Modification 2 is the same as the embodiment except for the self diagnosis. The self diagnosis (steps S9 and SB) according to Modification 2 will be described with reference to Figs. 8 and 9. Fig.

8 is a flowchart showing the bonding operation according to the second modification. Fig. 9 is a diagram showing the result of the die back position inspection and the appearance inspection result in the case where the pickup is more than the bonding and the bonding is normal. 9, the abscissa indicates the number of times of bonding (number of starts), and the ordinate indicates the position (탆) of the die relative to the reference. The number of times of bonding in Fig. 9 is 1 to 320.

The control unit 8 compares the die recognition results before and after bonding to calculate the amount of positional movement of the die. If the die back position before bonding is significantly different from the appearance inspection result, it is determined that there is a problem in the substrate fixing state or the bonding process, do.

Specifically, the controller 8 compares the position (P _S3) and position (P _S7) of the die at the die position recognized at the step S7 of the die (D) on the back surface of the step S3, the die position check, the (Positional movement amount of the die) is calculated. In Fig. 9, the directions of variation of P _S3 and P _S7 tend to be the same, and the amount of positional movement is relatively small.

For example, when the positional shift amount of the die is 1 to 5 占 퐉 (positional deviation with respect to the die reference tends to be the same before and after bonding), the control section 8 determines whether the substrate is sufficiently fixed When the thickness is in the range of 5 to 10 占 퐉 (when the positional deviation relative to the reference of the die tends to be the same before and after the bonding), it is determined that the variation is usually in the range of fluctuation. When it is judged that the substrate is insufficient or bonding abnormality is found, the control unit 8 compares the substrate recognition results before and after bonding to calculate the position movement amount of the substrate. When the position movement amount of the substrate is a predetermined amount or more, do. If it is determined that the substrate is fixed properly, the control unit 8 determines that the bonding is abnormal. If it is judged that the bonding is abnormal, the bonding head or the collet abnormality or the bonding pressure failure may be considered. If the bonding head or the collet is abnormal, the mechanical rattling is checked. If the bonding pressure is bad, the height or temperature is reviewed.

(Modification 3)

The embodiment has a configuration in which the die D is picked up from the wafer in the bonding head 41. Modification 3 is different from the first embodiment in that in order to shorten the moving distance of the bonding head 41 and shorten the processing time, And the intermediate stage 31 is provided between the bonding portion 4 and the bonding portion 4.

A die bonder according to Modification Example 3 will be described with reference to Figs. 10 and 11. Fig. 10 is a schematic top view of a die bonder according to Modification 3. Fig. 11 is a schematic side view for explaining a schematic configuration and an operation of the pick-up head, the bonding head and the peripheral portion thereof as seen from the arrow A in Fig.

The die bonder 10A according to the modification is a die bonder having a single conveyance lane and a single bonding head. The die bonder 10A includes a die supply part 1 for supplying a die D to be mounted on the package area P of the substrate 9 and a pickup part 1 for picking up a die from the die supply part 1, (3) for picking up the die (D) of the alignment part and picking up the package area (P) of the substrate (9) or the already bonded die A substrate feeding section 6 for feeding the substrate 9 to the transfer section 5, a transfer section 5 for transferring the substrate 9 to the mounting position, A substrate carry-out section 7 for receiving the mounted substrate 9, and a control section 8 for monitoring and controlling the operation of each section.

The pick-up unit 2 has a collet 22 for sucking and holding the die D pushed up by the push-up unit 13 at the tip thereof, and picks up the die D, Pickup head 21 and a Y-drive section 23 of a pick-up head for moving the pickup head 21 in the Y-direction. The pick-up is performed based on the classification map indicating the grade of the die of the wafer 11. [ The classification map is stored in advance in the control unit 8. [ The pick-up head 21 has respective driving portions (not shown) for moving the collet 22 up and down and in the X-direction, and is movable up and down and left and right as indicated by arrows in Fig.

 The alignment section 3 has an intermediate stage 31 for temporarily mounting the die D and a stage recognition camera 32 for recognizing the die D on the intermediate stage 31. [

The bonding section 4 has the same structure as the pick-up head 21 and picks up the die D from the intermediate stage 31 and feeds the bonding head 4 to the packaging area P of the substrate 9, A collet 42 mounted on the tip of the bonding head 41 for attracting and holding the die D, a Y driver 43 for moving the bonding head 41 in the Y direction, (Not shown) of the package area P of the substrate 9 and recognize the bonding position of the die D to be bonded. BS denotes a bonding area. Further, the bonding head 41 has respective driving sections (not shown) for moving the collet 42 up and down and in the X direction, and is movable up and down and left and right as indicated by arrows in FIG.

With this arrangement, the bonding head 41 corrects the pickup position and posture based on the image pickup data of the stage recognition camera 32, picks up the die D from the intermediate stage 31, (D) is bonded to the package area (P) of the substrate (9) based on the image pickup data of the substrate (44).

Next, the die bonding process in the die bonder according to Modification Example 3 will be described with reference to Fig. The die bonding process of Modification Example 3 is the same as the embodiment except for the pickup of Step S2.

The control unit 8 picks up the die D from the dicing tape 16 by the pick-up head 21 including the collet 22 after accurately positioning the die D to be picked up at the pickup position , And is loaded on the intermediate stage 31 (die handling). The control unit 8 captures the detection of the posture deviation (rotation deviation) of the die loaded on the intermediate stage 31 with the stage recognition camera 32. [ The control unit 8 rotates the intermediate stage 31 on the plane parallel to the mounting position having the mounting position by the swing drive device (not shown) provided on the intermediate stage 31 to rotate the intermediate stage 31 Thereby correcting the misalignment.

The control unit 8 picks up the die D from the intermediate stage 31 by the bonding head 41 including the collet 42 (step S2) Die bonding is performed on the die bonded to the package area P of the substrate 9 (step S5). The back side of the picked up die D may be picked up by the die recognition camera 45 and the die back position may be inspected (step S3).

The die bonder according to Modification Example 3 can perform the same self diagnosis as that of the embodiment, Modifications 1 and 2. [ Since the die bonder 10A is provided with the stage recognition camera 32, the self-diagnosis of Modifications 1 and 2 may be performed using the stage recognition camera 32 instead of the die recognition camera 45. [ Instead of or in combination with the die recognition camera 45, a recognition camera 25 for imaging the back side of the die picked up by the pickup head may be used.

While the invention made by the present inventors has been specifically described based on the embodiments, the examples and the modifications, the present invention is not limited to the embodiments, the examples and the modifications, There is no.

In Modifications 1 and 2, the die recognition camera for picking up the die back is used for the position recognition of the die before bonding, but a wafer recognition camera may be used.

Alternatively, a flip chip bonder may be used in which a driving portion for rotating the collet is provided and the flip head capable of reversing the upper and lower sides of the pickup die is used. It is also possible to use a die bonder having a pickup section, a mounting section including an aligning section and a bonding section, and a die bonder having a plurality of feed lanes, and a die bonder having a plurality of mounting sections including a pickup section, an aligning section and a bonding section, .

1: die feeder 11: wafer
12: wafer holding table 13: push-up unit
2: Pickup section 21: Pickup head
22: Collet 23: Y-driving part of pickup
3: alignment part 31: intermediate stage
32: stage recognition camera 4: bonding section
41: bonding head 42: collet
43: Y driving part of bonding head 44: substrate recognition camera
5: conveying section 51: conveying lane
6: substrate feeding part 7: substrate carrying part
8: control unit 9: substrate
10: die bonder BS: bonding stage
D: die P: package area

Claims (16)

A die supply section,
A substrate supply unit,
A bonding unit for bonding a die supplied from the die supply unit to a substrate supplied from the substrate supply unit or a die already bonded to the substrate,
A controller for controlling the die supply unit, the substrate supply unit, and the bonding unit,
And,
The bonding unit may include:
A bonding head having a collet for absorbing the die;
A first imaging device capable of imaging the substrate and the die bonded to the substrate;
And,
Wherein,
(a) recognizing the position of the substrate by imaging the substrate with the first imaging device,
(b) sensing a position of the die bonded to the substrate and the substrate by imaging the substrate and a die bonded to the substrate with the first imaging device, inspecting a relative position of the substrate and the die,
(c) diagnosing the fixed state of the substrate based on the position of the substrate recognized in (a) and the position of the substrate recognized in (b)
Die bonding apparatus. The method according to claim 1,
Wherein the control unit calculates a substrate position movement amount which is a difference between a position of the substrate recognized in (a) and a position of the substrate recognized in (b), and when the substrate position movement amount is equal to or greater than a predetermined amount, The die bonding apparatus comprising: A die supply section,
A substrate supply unit,
A bonding unit for bonding a die supplied from the die supply unit to a substrate supplied from the substrate supply unit or a die already bonded to the substrate,
A controller for controlling the die supply unit, the substrate supply unit, and the bonding unit,
And,
The bonding unit may include:
A bonding head having a collet for absorbing the die;
And a back surface of the die picked up by the bonding head is image-
And,
Wherein,
(a) recognizing the position of the die by imaging the die with the second imaging device,
(b) diagnoses a pick-up deviation or a die recognition state of the die based on the position of the die recognized in (a) and the position of the die registered in advance. The method of claim 3,
The control unit calculates a die position shift amount which is a difference between the position of the die recognized in (a) and the position of the die registered in advance, and when the die position shift amount is equal to or larger than a predetermined amount, the die pick- The die bonding apparatus comprising: A die supply section,
A substrate supply unit,
A bonding unit for bonding a die supplied from the die supply unit to a substrate supplied from the substrate supply unit or a die already bonded to the substrate,
A controller for controlling the die supply unit, the substrate supply unit, and the bonding unit,
And,
The bonding unit may include:
A bonding head having a collet for absorbing the die;
A first imaging device capable of imaging the substrate and a die bonded to the substrate;
And a back surface of the die picked up by the bonding head is image-
And,
Wherein,
(a) recognizing the position of the substrate by imaging the substrate with the first imaging device,
(b) recognizing the position of the die by imaging the die with the second imaging device,
(c) recognizing a position of the die bonded to the substrate and the substrate by imaging the substrate and a die bonded to the substrate with the first imaging device, inspecting a relative position of the substrate and the die,
(d) diagnose the substrate fixing state and the bonding state based on the position of the die recognized in (b) and the position of the die recognized in (c). 6. The method of claim 5,
Wherein the control unit calculates a die position movement amount which is a difference between a position of the die recognized in (b) and a position of the die recognized in (c), and when the die position movement amount is a predetermined amount or more, And judges that the bonding is abnormal. The method according to claim 6,
Wherein, when it is judged that the substrate is insufficient in fixing or is abnormal in bonding,
Wherein the controller determines that the substrate is insufficiently fixed when the substrate position movement amount is equal to or greater than a predetermined amount by calculating a substrate position movement amount which is a difference between the position of the substrate recognized in (a) and the position of the substrate recognized in (c)
And determines that the bonding is abnormal if the substrate position movement amount is less than a predetermined amount. 8. The method according to any one of claims 1 to 7,
Wherein the die supply section holds the wafer ring holding the dicing tape to which the die is attached,
Wherein the bonding head picks up the die from the dicing tape. 8. The method according to any one of claims 1 to 7,
Further comprising a pickup section and an alignment section between the die supply section and the bonding section,
Wherein the pick-up section has a pickup head having a collet for attracting the die,
Wherein the alignment section has an intermediate stage for loading a die picked up by the pickup head,
Wherein the bonding head picks up the die from the intermediate stage. (a) capturing a substrate and recognizing the position of the substrate;
(b) bonding a die onto the substrate or a die already bonded to the substrate; and
(c) recognizing a position of the die bonded to the substrate and the substrate by imaging the substrate and a die bonded to the substrate, and examining a relative position between the substrate and the die;
(d) a step of diagnosing the fixed state of the substrate based on the position of the substrate recognized in the step (a) and the position of the substrate recognized in the step (c)
And a step of forming the semiconductor device. 11. The method of claim 10,
In the step (d), a substrate position shift amount which is a difference between a position of the substrate recognized in the step (a) and a position of the substrate recognized in the step (c) is calculated. When the substrate position shift amount is a predetermined amount or more, And determines that the substrate is insufficiently fixed. (a) recognizing the position of the die by picking up a back side of the die picked up at the bonding head,
(b) bonding the die to the substrate or die already bonded to the substrate;
(c) a step of diagnosing a pick-up shift or a die recognition state of the die based on the position of the die recognized in (a) and the position of the die registered in advance
And a step of forming the semiconductor device. 13. The method of claim 12,
The step (c) may further include: calculating a die position shift amount which is a difference between a position of the die recognized in the step (a) and a position of the die registered in advance, and when the die position shift amount is a predetermined amount or more, Is a recognition problem. (a) capturing a substrate and recognizing the position of the substrate;
(b) recognizing the position of the die by picking up the back side of the die picked up at the bonding head,
(c) bonding the die to the substrate or die already bonded to the substrate;
(d) imaging a die bonded to the substrate and the substrate to recognize a position of the die bonded to the substrate and the substrate, and inspecting a relative position between the substrate and the die;
(e) a step of diagnosing the substrate recognition and bonding state based on the position of the die recognized in the step (b) and the position of the die recognized in the step (d)
And a step of forming the semiconductor device. 15. The method of claim 14,
Wherein the step (e) calculates a die position movement amount which is a difference between the position of the die recognized in (b) and the position of the die recognized in (d), and when the die position movement amount is a predetermined amount or more, Fixed insufficient, or abnormal bonding. 16. The method of claim 15,
In the step (e), when it is determined that the substrate is insufficient in fixing or is abnormal in bonding,
A substrate position shift amount which is a difference between a position of the substrate recognized in the step (a) and a position of the substrate recognized in the step (d) is calculated, and when the substrate position shift amount is a predetermined amount or more, the substrate is determined to be insufficient ,
And determining that the bonding is abnormal if the substrate position movement amount is less than a predetermined amount.

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