KR20170137592A - By-directional electrically conductive, by-directional electrically conductive pattern module and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a bidirectional conductive pin, a bidirectional conductive pattern module and a method of manufacturing the same. The bidirectional conductive pin according to the present invention is characterized in that the electrically conductive thin plate has an upper contact portion formed by winding a thin plate having an electric conductivity in the form of a spool in the vertical direction and elastically supporting the contact portion in the upward direction, A lower contact portion formed to be wound in a spiral shape and elastically supporting the lower contact portion when the lower contact portion is in contact with the lower contact portion, and at least one connection portion electrically connecting the upper contact portion and the lower contact portion. Accordingly, the metal thin plate having conductivity is patterned, and the upper contact portion and the lower contact portion of the spring-loaded type are formed by patterning the molds or the like, and the connecting portions are twisted together in the circumferential direction so as to be twisted, So that one bidirectional conductive pin can be realized in the vertical direction.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bidirectional conductive pin, a bidirectional conductive pattern module, and a method of manufacturing the same. BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

The present invention relates to a bidirectional conductive pin, a bidirectional conductive pattern module, and a method of manufacturing the same. More particularly, the present invention relates to a bidirectional conductive pin, a bidirectional conductive pattern module, and a manufacturing method thereof that can overcome the disadvantages of a pogo- ≪ / RTI >

The semiconductor device is subjected to a manufacturing process and then an inspection is performed to determine whether the electrical performance is good or not. Inspection is carried out with a semiconductor test socket (or a connector or a connector) formed so as to be in electrical contact with a terminal of a semiconductor element inserted between a semiconductor element and an inspection circuit board. Semiconductor test sockets are used in burn-in testing process of semiconductor devices in addition to final semiconductor testing of semiconductor devices.

The size and spacing of terminals or leads of semiconductor devices are becoming finer in accordance with the development of technology for integrating semiconductor devices and miniaturization trends and there is a demand for a method of finely forming spaces between conductive patterns of test sockets.

However, conventional Pogo-pin type semiconductor test sockets have a limitation in manufacturing semiconductor test sockets for testing integrated semiconductor devices. 1 to 3 are views showing an example of a conventional pogo-pin type semiconductor test socket disclosed in Korean Patent Laid-Open No. 10-2011-0065047.

1 to 3, the conventional semiconductor test socket 100 includes a housing 110 having a through hole 111 formed at a position corresponding to the terminal 131 of the semiconductor device 130 in a vertical direction, A pogo-pin 120 mounted in the through hole 111 of the housing 110 for electrically connecting the terminal 131 of the semiconductor device 130 and the pad 141 of the test apparatus 140, Lt; / RTI >

The configuration of the pogo-pin 120 includes a barrel 124 having a cylindrical shape, which is used as a pogo-pin body and has an empty interior, and a barrel 124 formed below the barrel 124 A contact tip 123 and a spring 122 connected to the contact tip 123 within the barrel 124 for contraction and expansion movement and a spring 122 connected to the contact tip 123, 130 for performing up-and-down movement in accordance with the contact with the contact pins 121.

At this time, the spring 122 contracts and expands while absorbing the mechanical impact transmitted to the contact pin 121 and the contact tip 123, and the pad 131 of the semiconductor device 130 and the pad (141) are electrically connected to check whether there is an electrical failure.

In the conventional pogo-pin type semiconductor test socket, a physical spring is used to maintain the elasticity in the vertical direction, and a spring and a pin are inserted into the barrel, and a barrel It is required to be inserted into the through hole of the housing again, so that the process is complicated and the manufacturing cost increases due to the complexity of the process.

In addition, the physical structure itself for realizing the electrical contact structure having elasticity in the up and down direction has a limitation in realizing the fine pitch, and in recent years, it has already reached a limit to be applied to the integrated semiconductor device.

In order to overcome the limitations of a pogo-pin type semiconductor device, a technique has been proposed in which a perforated pattern is formed in a vertical direction on a silicon body made of a silicone material of elastic material, To form a conductive pattern.

However, the PCR type semiconductor test socket also has a problem due to the structural limitations of the PCR type semiconductor test socket, such as shortening the lifetime due to the disengagement of the conductive powder filled in the inside.

Accordingly, there is a demand for development of other types of semiconductor test sockets after finishing the problems of the height limit and the semiconductor test socket of the other type such as the PCR type semiconductor test socket while enabling the implementation of the fine pitch.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in order to solve the above problems, and it is an object of the present invention to overcome the disadvantages of the pogo-pin type and PCR type semiconductor test socket and to provide a bidirectional conductive Pin, a bidirectional conductive pattern module, and a method of manufacturing the same.

According to the present invention, there is provided a bidirectional conductive pin according to the present invention, comprising: an upper contact portion formed by winding a conductive thin plate in a spiral shape about an axis in an up-down direction and elastically supporting the contact portion in an upward direction; A lower contact portion formed by winding the upper and lower directions in a spiral shape and elastically supporting the lower contact portion in contact with the lower contact portion and at least one connection portion electrically connecting the upper contact portion and the lower contact portion, Directional conductive pin.

Here, the upper contact portion, the lower contact portion, and the connection portion may be formed by patterning a conductive thin plate and patterning the base pattern so that the base pattern is wound around the upper and lower directions in a spiral shape.

The connector may further include an elastic insulative pin body formed between the upper contact part and the lower contact part so that the connection part is received therein.

The apparatus may further include at least one internal support portion extending downward from the upper contact portion and having a lower end spaced apart from the lower contact portion by a predetermined distance.

The inner dry portion of the upper contact portion may protrude upward from the outer dry portion and may be stepped outward in the radial direction.

The inner dry portion of the lower contact portion may protrude downward from the outer dry portion and may be stepped outward in the radial direction.

The connection portion may have a predetermined width in the transverse direction to support the upper contact portion and the lower contact portion in the vertical direction between the upper contact portion and the lower contact portion.

According to another aspect of the present invention, there is provided a bidirectional conductive pattern module, comprising: an insulating main body; and an insulative main body disposed in the insulative main body so as to be spaced apart from each other in the lateral direction, And a plurality of bidirectional conductive pins exposed on the upper surface and the lower surface of the substrate; Wherein each of the bidirectional conductive pins comprises: an upper contact portion formed by winding a conductive thin plate in a spiral shape in the vertical direction and elastically supporting the contact portion in an upward direction; A lower contact portion formed to be curled and supported to elastically support at the time of contact in a downward direction and at least one connection portion electrically connecting the upper contact portion and the lower contact portion, do.

Here, the upper contact portion, the lower contact portion, and the connection portion may be formed by patterning a conductive thin plate and patterning the base pattern so that the base pattern is wound around the upper and lower directions in a spiral shape.

The apparatus may further include at least one internal support portion extending downward from the upper contact portion and having a lower end spaced apart from the lower contact portion by a predetermined distance.

The inner dry portion of the upper contact portion may protrude upward from the outer dry portion and may be stepped outward in the radial direction.

Here, the inner dry portion of the lower contact portion may protrude downward from the outer dry portion and may be stepped outward in the radial direction.

The connection portion may have a predetermined width in the transverse direction to support the upper contact portion and the lower contact portion in the vertical direction between the upper contact portion and the lower contact portion.

According to another aspect of the present invention, there is provided a method of manufacturing a bidirectional conductive pattern module, comprising: (a) patterning a conductive thin plate to form a plurality of upper contact patterns spaced apart from each other in the lateral direction, A plurality of lower contact patterns spaced apart from the plurality of upper contact patterns in the direction of the base and having at least one connection pattern connecting the upper contact patterns and the lower contact patterns at mutually corresponding positions, Forming a pattern; (b) plating the base pattern; (c) connecting the plurality of upper contact portions, the plurality of lower contact portions, and the corresponding upper contact portions and the lower contact portions by axially moving the upper contact patterns and each of the lower contact patterns so as to have a spring- And a step of forming a connection portion for connecting the conductive pattern module to the conductive pattern module.

Here, (d) an insulating main body of an elastic material having elasticity such that the connecting portion is received in the upper surface and the lower surface of the plurality of lower contact portions are exposed in the upper and lower directions, respectively, And forming the second electrode layer.

In the step (a), the connection pattern may be formed in a diagonal direction to connect the upper contact patterns and the lower contact patterns corresponding to each other.

The upper contact pattern and the lower contact pattern corresponding to each other in the step (c) may be formed with the upper contact part and the lower contact part at positions corresponding to the upper and lower directions by being vertically coaxial with each other about the same axis.

In the step (a), at least one inner supporting pattern protruding from the upper contact pattern in the direction of the lower contact pattern is formed together with the conductive thin plate in the patterning process; The inner support pattern may form an inner support portion extending downward from the upper contact portion through the step (c).

The upper contact pattern may be formed to have a different width in the vertical direction or to be stepped in the lateral direction so that the inner curled portion of the upper contact portion protrudes upward from the outer curled portion and is stepped outward in the radial direction .

The lower contact pattern may be formed to have a different width in the vertical direction or to be stepped in the lateral direction so that the inner curled portion of the lower contact portion protrudes downward from the outer curled portion and is stepped outward in the radial direction .

The connection pattern may be formed to have a predetermined width in a lateral direction so that the connection portion supports the upper contact portion and the lower contact portion in the vertical direction between the upper contact portion and the lower contact portion.

According to another aspect of the present invention, there is provided a method of manufacturing a bidirectional conductive pin, the method comprising: fabricating a bidirectional conductive pattern module according to the method of manufacturing the bidirectional conductive pattern module; And a step of cutting the insulating main body of each of the plurality of bidirectional conductive pins in the vertical direction by cutting each of the upper contact portion, the lower contact portion and the connecting portion connected to each other to form a plurality of bidirectional conductive fins .

According to the present invention, according to the present invention, a thin metal plate having conductivity is patterned, and a method such as a mold is formed to form a top contact portion and a bottom contact portion of a spring-loaded type by winding a pattern, So that a bi-directional conductive pin can be realized in the up-and-down direction.

In addition, when the upper contact portion of the spring-loaded type contacts the terminal of the semiconductor element, for example, the ball, the inner portion of the spring is contacted first and then the outer portion is sequentially contacted to provide stable contact and stable restoration when contact is removed do.

Further, the metal thin plate is patterned by using an etching or stamping method, and is formed by rolling it into a cylindrical shape by a mold or the like, so that the manufacturing method is simplified and the manufacturing cost can be remarkably reduced.

Further, a bidirectional conductive pattern module in which a plurality of patterns are simultaneously formed in the lateral direction to form a plurality of bidirectional conductive pins in the lateral direction, and a plurality of conductive patterns are formed in the lateral direction and the depth direction, So that the socket can be manufactured.

Figs. 1 to 3 are views for explaining a conventional pogo-pin type semiconductor test socket,
4 is a view for explaining the principle of forming a bidirectional conductive pin according to an embodiment of the present invention,
5 and 6 are views for explaining the method of manufacturing the bidirectional conductive pin and the bidirectional conductive pattern module according to the present invention,
7 to 11 are views showing various examples of the base pattern according to the present invention,
12 and 13 are views showing an example of a bidirectional conductive pin according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

4 is a view for explaining the principle of forming the bidirectional conductive fins 10 according to the present invention. Referring to FIG. 4 (b), the bidirectional conductive pin 10 according to the present invention includes an upper contact portion 11, a lower contact portion 12, and a connection portion 13. In addition, the bi-directional conductive pin 10 according to the present invention may further include a pin body 14.

The bidirectional conductive pin 10 according to the present invention is fabricated using a base plate 100a formed through patterning of a conductive thin plate, for example, a thin metal plate, as shown in FIG. 4 (a). The base pattern 100a includes an upper contact pattern 11a, a lower contact pattern 12a, and at least one connection pattern 13a connecting them as shown in Fig. 4 (a).

As shown in FIG. 4 (c), when the upper contact pattern 11a and the lower contact pattern 12a of the base pattern 100a are rotated two or more times in the vertical direction as the axis Axis The upper contact portion 11 and the lower contact portion 12 of the bidirectional conductive pin 10 according to the present invention can be formed.

4 (a), the connection pattern 13a is formed between the upper contact pattern 11a and the lower contact pattern 12a in the diagonal direction with the upper contact pattern 11a and the lower contact pattern 12a, When the upper contact pattern 11a and the lower contact pattern 12a are formed in the shape of a spiral so as to form the upper contact portion 11 and the lower contact portion 12 together, and has a twisted shape as shown in Fig.

4 (c), when the terminal of the semiconductor element, for example, a ball, comes in contact with the upper contact portion 11 of the above-mentioned spring shape in the downward direction from the upper direction, The first part comes first in contact with the ball and descends in the downward direction and comes in contact sequentially in the order of (2) and (3), so that the elastic contact has a restoring force to restore the original state after the contact is removed. That is, it is elastically supported when it comes in contact with the upper direction.

Likewise, when the terminals of the inspection circuit board are brought into contact with the lower contact portion 12 from the lower direction to the upper direction, the contact portions are sequentially brought in contact with the inner side portion of the spring-loaded type from the inner side portion to the outer side portion so as to elastically support the contact in the lower direction .

The connection part 13 electrically connects the upper contact part 11 and the lower contact part 12 so that the upper contact part 11, the connection part 13 and the lower contact part 12 form one conductive line in the vertical direction So that it can be used for inspection of semiconductor devices.

The pin body 14 is formed to receive the connection portion 13 between the upper contact portion 11 and the lower contact portion 12 to support the upper contact portion 11 and the lower contact portion 12. The pin body 14 is made of an insulating material having elasticity, for example, a silicon material.

Hereinafter, a method for manufacturing the bidirectional conductive pattern module 100 and the bidirectional conductive pin 10 according to the present invention will be described in detail with reference to FIGS. 5 and 6. FIG.

Referring to FIGS. 5 and 6, first, a metal thin plate is prepared and a metal thin plate is patterned to form a base pattern 100a as shown in FIG. 5 (a). Here, the metal thin plate may be made of a conductive material, but conductivity may be formed through a plating process to be described later, so that the conductivity of the thin metal plate may not be essential. The material of the metal foil may be formed of copper or a copper alloy, for example, BeCu. In the present invention, an etching method or a stamping method is applied as a metal thin plate patterning method.

5A, the base pattern 100a formed through the patterning process of the metal thin plate includes a plurality of upper contact patterns 11a, a plurality of lower contact patterns 12a, And a connection pattern 13a connecting the contact pattern 11a and the lower contact pattern 12a. Here, the configuration of one upper contact pattern 11a, the lower contact pattern 12a, and the connection pattern 13a connecting them is shown in FIG. 4 (a) The connecting pattern 13a has a shape which is warped in the transverse direction.

The plurality of upper contact patterns 11a are formed to be spaced from each other in the transverse direction. The plurality of lower contact patterns 12a are spaced apart from each other in the vertical direction from the upper contact pattern 11a.

The base pattern 100a is formed so as to cover the upper contact patterns 11a so that subsequent operations using the upper contact patterns 11a, the lower contact patterns 12a, and the connection patterns 13a can be performed simultaneously. And a lower support pattern 122 connected to the lower contact patterns 12a and the lower connection patterns 124. The upper support pattern 121 and the lower support pattern 122 are connected to each other by an upper connection pattern 123,

When the fabrication of the base pattern 100a is completed, the plating process proceeds to improve the conductivity of the base pattern 100a. In the present invention, nickel plating and gold plating are sequentially performed.

When the plating process is completed, as shown in FIG. 4C, the upper contact patterns 11a and the lower contact patterns 12a are vertically pivoted so as to have a spring shape, the upper contact portion 11, the lower contact portion 12 and the connection portion 13 are formed as shown in Fig. The connecting portion 13 is formed by twisting the connecting pattern 13a when the upper contact pattern 11a and the lower contact pattern 12a are wound in a spiral shape.

Here, the upper contact portion 11a and the lower contact portion 12a corresponding to each other can be formed with the upper contact portion 11 and the lower contact portion 12 at positions corresponding to the upper and lower directions, .

5 (c), when the upper contact portion 11, the lower contact portion 12, and the connection portion 13 are formed as described above, the upper surface of each upper contact portion 11, The insulating main body 110 is formed such that the lower surface of the lower contact portion 12 is exposed in the upward and downward directions. 5 (c), the insulating body 110 is formed so that the connection portion 13 can be received therein to such an extent that the lower side portion of the upper contact portion 11 and the upper side portion of the lower contact portion 12 are covered For example.

For example, after the base pattern 100a shown in FIG. 5 (b) is installed in a metal mold, liquid silicone is injected and then cured to form the insulating main body 110. FIG. The upper surface of the upper contact portion 11 and the lower surface of the lower contact portion 12 are exposed to the outside of the insulating main body 110 and the remaining portions of the upper contact portion 11, The remaining portion, and the connection portion 13 are located inside the insulative main body 110.

When the insulating main body 110 is completed as described above, the upper connection pattern 123 and the lower connection pattern 123 are formed along the perforated lines C1 and C2 shown in FIG. 5 (c) The conductive pattern module 100 can be manufactured as shown in FIG. 6 (a).

The bidirectional conductive pattern modules 100 and 100 are electrically connected to a plurality of bidirectional conductive pins 10 in a state where the bidirectional conductive pattern modules 100 and 100 are spaced apart from each other in the transverse direction inside the insulating bodies 110 and 110, . At this time. The upper contact portion 11, the lower contact portion 12 and the connection portion 13 constitute one bidirectional conductive pin 10 and form one conductive line in the vertical direction.

By arranging the plurality of bidirectional conductive pattern modules 100 in the depth direction, a semiconductor test socket having a plurality of conductive patterns in the horizontal direction and the depth direction can be formed.

6A is cut along the perforated line C3 by laser cutting or the like, it is possible to manufacture one bidirectional conductive pin 10 as shown in FIG. 6B The remaining portion of the insulating body 110 between the upper contact portion 11 and the lower contact portion 12 forms the pin body 14 of the bidirectional conductive pin 10. [ The bidirectional conductive pin 10 thus manufactured can be replaced with a conventional pogo pin.

7 to 11 are views showing examples of various types of base patterns 100a. The technical idea according to the present invention is as described above, and various modifications and variations of the base pattern 100a shown in Figs. 7 to 11 are also included in the technical idea of the present invention. That is, those skilled in the art will be able to manufacture the base pattern 100a according to various modifications within the scope of the technical idea of the present invention, in addition to the embodiments illustrated in the present invention.

10 shows examples in which the shapes of the upper contact portion 11 and the lower contact portion 12 are changed according to the shape of the upper contact pattern 11a and the lower contact pattern 12a. 11A, when the inner supporting pattern 15a is formed from the upper contact pattern 11a to the lower side, the inner supporting pattern 15a is formed in the insulating main body 110 or the pin main body 14, the inner supporting portion 15 as shown in Fig. 5 (b) is formed. At this time, the inner supporting pattern 15a may be formed together with the metal thin plate during patterning of the base plate 100a through patterning of the thin metal plate.

Hereinafter, a bidirectional conductive pin 10 'according to another embodiment of the present invention will be described with reference to FIG.

Referring to FIG. 12, the bidirectional conductive pin 10 'according to the present invention includes an upper contact portion 11', a lower contact portion 12 ', and a connection portion 13'. Also, as in the previous embodiments, the bidirectional conductive pin 10 'may include an inner support 15' and a pin body 14.

Here, in the embodiment shown in FIG. 12, as shown in FIG. 12A, the upper contact pattern 11a 'is formed to be stepped in the lateral direction. Accordingly, when the upper contact pattern 11a 'is formed into a spiral shape with the vertical direction as an axis to form the upper contact portion 11', as shown in FIG. 12 (b), the upper contact portion 11 ' The inner dry portion protrudes upward from the outer dry portion. That is, as shown in FIG. 12 (b), the upper contact portion 11 'is formed so as to be stepped outward in the radial direction.

Accordingly, when the terminal of the semiconductor element is brought into contact with the upper surface of the upper contact portion 11 ', the inner curled portion first contacts and moves downward, and further the outer curled portion is contacted, Lt; / RTI >

In the embodiment shown in FIG. 12, the upper contact pattern 11a 'is formed to be stepped in the lateral direction. However, as in the embodiment shown in FIGS. 10B, 10C and 10D, The upper contact patterns 11a 'are formed to have different widths in the vertical direction, so that the upper contact portions 11' can be formed to protrude upward toward the inner side.

Similarly, as shown in Fig. 12A, the lower contact pattern 12a 'may be formed to be stepped in the transverse direction. Accordingly, when the lower contact pattern 12a 'is rolled up in the form of a spool in the vertical direction as shown in FIG. 12 (b), the lower contact portion 12' The inner curled portion protrudes downward from the outer curled portion. That is, as shown in Fig. 12 (b), the lower contact portion 12 'is stepped radially outward.

Accordingly, when the terminals of the inspection circuit board come into contact with the lower surface of the lower contact portion 12 ', the inner curled portion first comes into contact with the lower portion and moves further downward. In addition, Contact becomes possible.

In the embodiment shown in FIG. 12, the lower contact pattern 12a 'is formed to be stepped in the lateral direction. However, as in the embodiment shown in FIGS. 10B, 10C, and 10D, The lower contact patterns 12a 'are formed to have different widths in the vertical direction, so that the lower contact portions 12' can be formed to protrude downward toward the inner side.

Hereinafter, a bidirectional conductive pin 10 '' according to another embodiment of the present invention will be described with reference to FIG.

Referring to FIG. 13, the bidirectional conductive pin 10 '' according to the present invention includes an upper contact portion 11 '', a lower contact portion 12 '', and a connection portion 13 ''. In the embodiment shown in Fig. 13, an example in which the inner supporting portion 15 'is not provided is shown.

In the embodiment shown in Fig. 13, the pin body 14 is not formed, and the connection portion 13 '' is formed between the upper contact portion 11 '' and the lower contact portion 12 ''. And the lower contact portion 12 " are supported. 13 (a), the connection pattern 13a '' is formed to have a predetermined width in the transverse direction, through which the upper contact pattern 11a '' and the lower contact pattern 12a ' The connecting portion 13 '' formed by the connecting pattern 13a '' at this time is formed in the same manner as the connecting portion 13 '' shown in FIG. 13 (a) the upper contact portion 11 '' and the lower contact portion 12 '' are supported in the vertical direction as shown in Fig.

At this time, the width of the connection pattern 13a '' in the transverse direction is such that the connection portion 13 '' formed by the connection pattern 13a '' has a cylindrical shape or is formed so as to form only a part of the cylinder As shown in FIG.

Although several embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various modifications may be made without departing from the principles and spirit of the invention . The scope of the invention will be determined by the appended claims and their equivalents.

10: bi-directional conductive pin
11: upper contact portion 11a: upper contact pattern
12: lower contact portion 12a: lower contact pattern
13: Connection 13a: Connection pattern
14: pin body 15: inner support
15a: internal supporting pattern 100: bi-directional conductive pattern module
110: insulative body 100a: base pattern
121: upper support pattern 122: lower support pattern
123: upper connection pattern 124: lower connection pattern

Claims (22)

In the bidirectional conductive pin,
An upper contact portion which is formed by winding a thin plate having conductivity in a spiral shape in the vertical direction as an axis and elastically supporting the contact portion in contact with the upper portion,
A lower contact portion which is formed by winding a conductive thin plate in a spiral shape around the vertical direction and elastically supporting the contact portion when the contact portion is in a downward direction,
And at least one connection portion electrically connecting the upper contact portion and the lower contact portion. The method according to claim 1,
Wherein the upper contact portion, the lower contact portion, and the connection portion are formed by patterning a thin plate having conductivity, and a base pattern is formed in a manner that the base pattern is wound around the up and down direction in a spiral shape. The method according to claim 1,
Further comprising a resilient insulative pin body formed between the upper contact portion and the lower contact portion such that the connection portion is received therein. The method according to claim 1,
Further comprising: at least one internal support portion extending downward from the upper contact portion and having a lower end spaced apart from the lower contact portion by a predetermined distance. The method according to claim 1,
Wherein the inner curled portion of the upper contact portion protrudes upward from the outer curled portion and is formed to be stepped outward in the radial direction. The method according to claim 1,
Wherein the inner curled portion of the lower contact portion protrudes downward from the outer curled portion so as to be stepped outward in the radial direction. The method according to claim 1,
Wherein the connecting portion is formed to have a predetermined width in the transverse direction to support the upper contact portion and the lower contact portion in the vertical direction between the upper contact portion and the lower contact portion. In the bidirectional conductive pattern module,
An insulating main body,
And a plurality of bidirectional conductive pins disposed within the insulating body so as to be spaced apart from each other in a lateral direction, and each of the upper and lower portions are exposed to upper and lower surfaces of the insulating body;
Each of the bidirectional conductive pins
An upper contact portion which is formed by winding a thin plate having conductivity in a spiral shape in the vertical direction as an axis and elastically supporting the contact portion in contact with the upper portion,
A lower contact portion which is formed by winding a conductive thin plate in a spiral shape around the vertical direction and elastically supporting the contact portion when the contact portion is in a downward direction,
And at least one connection portion for electrically connecting the upper contact portion and the lower contact portion. 9. The method of claim 8,
Wherein the upper contact portion, the lower contact portion, and the connection portion are formed with a base pattern formed by patterning a thin plate having conductivity in a manner that the base pattern is wound around the up and down direction in a spiral shape. 9. The method of claim 8,
Further comprising: at least one internal support portion extending downward from the upper contact portion and having a lower end spaced apart from the lower contact portion by a predetermined distance. 9. The method of claim 8,
Wherein the inner curled portion of the upper contact portion protrudes upward from the outer curled portion and is formed to be stepped outward in the radial direction. 9. The method of claim 8,
Wherein the inner curled portion of the lower contact portion protrudes downward from the outer curled portion so as to be stepped radially outward. 9. The method of claim 8,
Wherein the connection portion is formed to have a predetermined width in the transverse direction to support the upper contact portion and the lower contact portion in the vertical direction between the upper contact portion and the lower contact portion. A method of manufacturing a bidirectional conductive pattern module,
(a) a plurality of upper contact patterns spaced apart from each other in the transverse direction by patterning a thin plate having conductivity, a plurality of lower contact patterns spaced apart from each other in the vertical direction by a plurality of the upper contact patterns, Forming a base pattern having at least one connection pattern connecting the upper contact pattern and the lower contact pattern at mutually corresponding positions;
(b) plating the base pattern;
(c) connecting the plurality of upper contact portions, the plurality of lower contact portions, and the corresponding upper contact portions and the lower contact portions by axially moving the upper contact patterns and each of the lower contact patterns so as to have a spring- Wherein the step of forming the conductive pattern module comprises the steps of: 15. The method of claim 14,
(d) forming an insulating main body made of an insulating material having elasticity so that the connecting portions are received in the upper and lower directions of the upper surfaces of the plurality of upper contact portions and the lower surfaces of the plurality of lower contact portions, respectively Wherein the step of forming the conductive pattern module comprises the steps of: 15. The method of claim 14,
Wherein the connection pattern is formed in a diagonal direction so as to connect the upper contact pattern and the lower contact pattern corresponding to each other in the step (a). 15. The method of claim 14,
Wherein the upper contact portion and the lower contact portion correspond to each other in the step (c), the upper contact portion and the lower contact portion are formed at positions corresponding to the upper and lower directions, A method of manufacturing a pattern module. 15. The method of claim 14,
In the step (a), at least one inner supporting pattern protruding from the upper contact pattern in the direction of the lower contact pattern is formed together with the conductive thin plate in the patterning process;
Wherein the inner supporting pattern forms an inner supporting portion extending downward from the upper contact portion through the step (c). 15. The method of claim 14,
The upper contact pattern is formed to have a width in the vertical direction different from that of the upper contact pattern or to be stepped in the lateral direction so that the inner curled portion of the upper contact portion protrudes upward from the outer curled portion and is stepped outward in the radial direction Wherein the conductive pattern module is formed of a conductive material. 15. The method of claim 14,
Wherein the lower contact pattern is formed to have a width in the vertical direction different from that of the lower contact pattern or to be stepped in the lateral direction so that the inner curled portion of the lower contact portion protrudes downward from the outer curled portion to be stepped outward in the radial direction Wherein the conductive pattern module is formed of a conductive material. 15. The method of claim 14,
Wherein the connection pattern is formed to have a predetermined width in a lateral direction, and the connection portion supports the upper contact portion and the lower contact portion in the vertical direction between the upper contact portion and the lower contact portion. . In a method for manufacturing a bidirectional conductive pin,
22. A method of manufacturing a bi-directional conductive pattern module according to any one of claims 14 to 21,
And forming a plurality of bidirectional conductive fins by cutting the insulating main body of the bidirectional conductive pattern module in the vertical direction and cutting each of the upper contact portion, the lower contact portion and the connection portion connected to each other, Way.

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