KR20170133733A - Contactor for preventing electric shock - Google Patents

Abstract

An ESD protection contactor according to the present invention includes a contact portion having an elastic force, a contact portion contacting the conductor of the electronic device, an ESD protection portion positioned between the contact portion and the circuit board spaced from the contact portion, And a capacitor portion located laterally of the ESD protection portion.
Thus, according to the present invention, the current due to the ESD voltage can be bypassed to the ground, thereby preventing breakage of the internal circuit caused by static electricity, It is possible to prevent the electric shock of the user.
Further, as the communication signal input from the outside is received or passed through the capacitor unit, the attenuation of the signal can be reduced or minimized.

Description

{Contactor for preventing electric shock}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric shock protection contactor, and more particularly, to an electric shock protection contactor capable of preventing an electric shock of a user from a leakage current caused by a power source flowing from the outside.

Various electronic components such as smart phones are integrated with various components according to their functions. An electronic device is provided with an antenna capable of receiving various frequency bands such as a wireless LAN (wireless LAN), a Bluetooth (Bluetooth), and a GPS (Global Positioning System) And can be installed in a case constituting an electronic device. Therefore, a contactor for electrical connection is provided between the antenna provided in the case and the built-in circuit board of the electronic device.

Meanwhile, in recent years, with the emphasis on high-quality images and durability of electronic devices, the spread of terminals made of metallic materials is increasing. That is, the spread of smart phones having a frame made of metal or a case made of metal except the screen display portion on the front is increasing.

However, when the case is made of a metal material, a static electricity having an instantaneous high voltage may be introduced through an external metal case, and the static electricity may flow into the internal circuit through the contactor and break the circuit.

Also, when a charger having no overcurrent protection circuit is used in an electronic device to which a metal case is applied, an electric shock may occur when a smartphone is used during charging. That is, when the smartphone is charged using the non-genuine charger or the defective charger, the smartphone can be moved to the ground of the internal circuit and delivered to the case where the user touches. Thus, when the user contacts the case during charging of the electronic device, an electric shock may occur to the user.

Therefore, in providing a contactor for electrically connecting a case and an internal circuit, a contactor capable of preventing the destruction of an internal circuit caused by static electricity and an electric shock of a user is needed.

Korean Patent No. 10-0809249

The present invention provides an electric shock protection contactor capable of preventing an electric shock of a user from a leakage current caused by a power source flowing from the outside and protecting an internal circuit from a leakage current caused by static electricity.

The present invention provides an electric shock protection contactor capable of minimizing attenuation of communication signals flowing from the outside and transmitting the same.

An electric shock protection contactor according to the present invention comprises: a contact part having contact with a conductor of an electronic device and having an elastic force; An ESD protection part positioned between the contact part and the circuit board spaced apart from the contact part; And a capacitor portion located between the contact portion and the circuit board, the capacitor portion being located laterally of the ESD protection portion.

One side of each of the capacitor portion and the ESD protection portion is connected to the contact portion, and the other side is connected to the circuit board.

The capacitor portion includes a capacitor having internal electrodes facing each other, and the capacitor does not overlap the ESD protection portion.

The capacitor portion and the ESD protection portion are formed at the same height.

The ESD protection unit includes a plurality of capacitor units disposed at one side and the other of the ESD protection unit, at least one ESD protection member is formed between the plurality of capacitor units, and the plurality of capacitor units and the ESD protection unit are formed on the same plane As shown in FIG.

The ESD protection part is formed on one side in the width direction between the contact part and the circuit board, and the capacitor part is formed on the other side.

The capacitor portion and the ESD protection portion are spaced apart from each other, and the spacing space is an empty space.

The capacitor portion and the ESD protection portion are spaced apart from each other, and a connection block is formed in the spacing space. The connection block is formed to be connected to the capacitor portion and the ESD protection portion.

The connection block includes at least one of a dielectric, a ceramic, and a varistor.

And a connection portion formed between the capacitor portion and the ESD protection portion and the circuit board, wherein one side of the connection portion is connected to the circuit board, and the connection portion includes at least one of a dielectric, a ceramic, and a varistor .

The ESD protection unit may be at least one of a suppressor type including a discharge material and a varistor type.

And a coupling unit coupling the capacitor unit and the ESD protection unit to the contact unit and including a conductive material.

The coupling portion includes a conductive bonding agent, and is disposed between the capacitor portion and the ESD protection portion and the contact portion, and bonds the capacitor portion and the ESD protection portion to the contact portion.

Wherein the coupling portion includes at least one of a capacitor portion and an ESD protection portion and a coupling member that is coupled to the contact portion and mechanically couples the capacitor portion and the ESD protection portion to the contact portion, And is electrically connected to the capacitor unit and the ESD protection unit.

A contact portion contacting the conductor of the electronic device and having an elastic force; Each of which is disposed between the contact portion and the circuit board spaced apart from the contact portion and each having one side electrically connected to the contact portion and the other side electrically connected to the circuit board, An electric shock protection unit having an ESD protection unit; And an engaging portion connected to the contact portion and gripping at least a part of the electric shock protection portion to be coupled to the contact portion and including a conductive material.

Wherein the shape of the electric shock protection portion comprises a first region extending in a first direction and a second region extending in the first direction so as to correspond to the first region and being a region located under the first region , A length of a second direction intersecting with the first direction of the first region is formed to be longer than a second direction of the second region, and both edges of the first region in the second direction are longer than the second region Wherein each of the capacitor portion and the ESD protection portion is formed so as to be located in at least one of the first region and the second region, and the engaging portion is provided with at least a protruding region of the first region, Respectively.

The capacitor portion and the ESD protection portion are formed in the first region and the second region, respectively, and the coupling portion is fastened to grip at least one of the capacitor portion and the ESD protection portion formed corresponding to the protruding region of the first region .

Wherein the capacitor portion and the ESD protection portion are formed in the first region and the capacitor portion and the ESD protection portion are formed in the second region, The first region and the second region of the protection portion are formed differently from each other, and the coupling portion is coupled to one of the capacitor portion and the ESD protection portion formed in the first region.

Wherein the first region is formed with a connection portion connected to any one of the capacitor portion and the ESD protection portion and the capacitor portion and the ESD protection portion in the first region, Wherein the first region and the second region of the capacitor portion and the ESD protection portion are formed differently from each other, and the coupling portion is formed between the capacitor portion and the ESD protection portion formed in the first region, The ESD protection unit, and the connection unit.

The capacitor portion and the ESD protection portion are formed in the first region so as to be laterally arranged, and the capacitor portion and the ESD protection portion are extended in a direction in which the capacitor portion and the ESD protection portion are arranged and arranged, And a connection part formed between the capacitor part and the ESD protection part and the circuit board, the connection part extending in a direction in which the capacitor part and the ESD protection part are arranged and arranged in the second area; A capacitor connection electrode formed on the connection member, the capacitor connection electrode electrically connecting the capacitor unit and the circuit board; And an ESD connection electrode formed on the connection member and electrically connecting the ESD protection unit and the circuit board.

The capacitor portion and the ESD protection portion are formed in the second region so as to be laterally arranged. The capacitor portion and the ESD protection portion are extended in a direction in which the capacitor portion and the ESD protection portion are arranged and arranged. And a connection member formed between the capacitor unit and the ESD protection unit and the contact unit, the connection unit extending in a direction in which the capacitor unit and the ESD protection unit are arranged and arranged in the first area; A capacitor connection electrode formed on the connection member, the capacitor connection electrode electrically connecting the capacitor unit and the contact unit; And an ESD connection electrode formed on the connection member and electrically connecting the ESD protection unit and the contact unit.

The capacitor portion and the ESD protection portion are spaced apart from each other.

And a connection block is formed between the capacitor portion and the ESD protection portion which are spaced apart from each other in the first region, and one side surface and the other side surface are connected to the capacitor portion and the ESD protection portion, respectively.

A plating layer is formed on at least one of the outer surface of the electric shock protection portion facing the coupling portion and the outer surface facing the circuit board.

The electric shock protection canctor according to the embodiment of the present invention is formed such that the capacitor portion and the ESD protection portion are formed at the same height or on the same plane. That is, the ESD protection part and the capacitor part according to the embodiment are arranged in the vertical direction so that the positions in the width direction are not superimposed, but are spaced apart from each other so as to be arranged in the width direction between the contact part and the circuit board, .

The ESD protection part of the ESD protection contact can bypass the ESD voltage current to the ground part to prevent damage to the internal circuit due to static electricity and to cut off the electric current below the ESD or breakdown voltage, .

Further, as the communication signal input from the outside is received or passed through the capacitor unit, the attenuation of the signal can be reduced or minimized.

Since the capacitor portion and the ESD protection portion are separately provided and each of them is positioned between the conductor and the circuit board, the manufacturing is simple and easy. In other words, the manufacturing process is simple, compared to forming a capacitor portion and an ESD protection portion together in one device so as to overlap the capacitor portion and the ESD protection portion. Therefore, the manufacturing time can be reduced.

1 is a cross-sectional view of an electric shock protection contactor according to a first embodiment of the present invention;
Figs. 2 and 3 are cross-sectional views showing the electric shock protection contactor according to the first and second modified embodiments of the first embodiment
4A to 4D are sectional views showing an ESD protection unit according to the first embodiment of the present invention and an ESD protection unit according to the first to third modification examples of the first embodiment
5 is a cross-sectional view illustrating an ESD protection unit according to a second embodiment of the present invention.
6 is a cross-sectional view of an electric shock protection contactor according to a second embodiment of the present invention
7 is a cross-sectional view showing an electric shock protection contactor according to a third embodiment of the present invention
8 is a cross-sectional view of an electric shock protection contactor according to a fourth embodiment of the present invention
9 to 13 are views showing an electric shock protection contactor according to a fifth embodiment of the present invention
14 to 16 are views showing an electric shock protection contactor according to a sixth embodiment of the present invention
17 to 21 are views showing an electric shock protection contactor according to a seventh embodiment of the present invention
22 and 23 are views showing an electric shock protection contactor according to an eighth embodiment of the present invention

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but is capable of other various forms of implementation, and that these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know completely.

An electric shock protection contactor according to an embodiment of the present invention relates to an electric shock protection contactor that protects an internal circuit from a leakage current caused by static electricity while preventing an electric shock of a user from a leakage current caused by an external power source. Further, there is provided an electric shock protection contactor capable of minimizing signal attenuation and transmitting the same.

More specifically, it may be an electric shock protection contact applied to a portable electronic device such as a smart phone, a tablet PC, a laptop, a DMB, a camera, and the like. In addition, the electric shock protection contactor according to the embodiment is positioned between a case constituting an electronic device and a circuit board having an internal circuit, and has an elastic force to mitigate the transfer of an external force to a circuit board.

2. Description of the Related Art Electronic apparatuses generally include a case 10 that functions as an antenna that forms an overall appearance and can receive an external signal if necessary, A circuit board 20 having an internal circuit and an electric shock protection contactor positioned between the case 10 and the circuit board 20.

Here, the case 10 is formed of a conductive material such as a metal to serve as a beautiful appearance and an antenna. The case 10 made of a conductive material may be referred to as a "conductor" of an electronic device.

Hereinafter, an electric shock protection contactor according to an embodiment of the present invention will be described with reference to the drawings.

1 is a cross-sectional view illustrating an electric shock protection contactor according to a first embodiment of the present invention. Figs. 2 and 3 are sectional views showing an electric shock protection contactor according to first and second modified examples of the first embodiment. Fig. 4A to 4D are cross-sectional views illustrating an ESD protection unit according to a first embodiment of the present invention and an ESD protection unit according to first to third modification examples of the first embodiment. 5 is a cross-sectional view illustrating an ESD protection unit according to a second embodiment of the present invention. 6 is a cross-sectional view illustrating an electric shock protection contactor according to a second embodiment of the present invention. 7 is a cross-sectional view illustrating an electric shock protection contactor according to a third embodiment of the present invention. 8 is a cross-sectional view illustrating an electric shock protection contactor according to a fourth embodiment of the present invention.

9 to 13 are views showing an electric shock protection contactor according to a fifth embodiment of the present invention. 14 to 16 are views showing an electric shock protection contactor according to a sixth embodiment of the present invention. 17 to 21 are views showing an electric shock protection contactor according to a seventh embodiment of the present invention. 22 and 23 are views showing an electric shock protection contactor according to an eighth embodiment of the present invention.

As shown in FIG. 1, the electric shock protection contactor 1000 according to the first embodiment includes a contact portion 300a in electrical contact with the case 10 of the electronic device and having an elastic force, And capacitors 500a and 500b and an ESD protection unit 400 that are positioned between the circuit board 20 and the case 10 and the circuit board 20 on one side and the other side. The contact portion 300a also includes a coupling portion 600a for coupling or fastening the capacitor portions 500a and 500b and the ESD protection portion 400 to each other. Here, the capacitor units 500a and 500b and the ESD protection unit 400 are spaced apart from each other, and the space between the capacitor units 500a and 500b and the ESD protection unit 400 is an empty space.

That is, in the ESD protection contactor 1000 according to the embodiment, the capacitor portions 500a and 500b are formed on both sides of the ESD protection portion 400. [ In other words, the ESD protection part 400 is formed between the plurality of capacitor parts 500a and 500b spaced apart in the width direction (left-right direction).

In other words, the capacitor units 500a and 500b and the ESD protection unit 400 are formed in parallel, or the capacitor units 500a and 500b and the ESD protection unit 400 are formed at the same height or on the same plane. In other words, the ESD protection parts 500a and 500b and the capacitor part 400 according to the embodiment are arranged in the vertical direction so that the contact parts 300a and the circuit board 20 Are spaced apart from one another in the width direction.

The contact portion 300a is made of a material having elasticity and containing a conductive material so as to mitigate the impact when an external force is applied from the outside of the electronic device. The contact portion 300a may be in the form of a clip as shown in FIG. More specifically, the contact portion 300a is opposed to the case 10, and includes a first extension portion 310 at least a portion of which is in contact with the case 10, a capacitor portion 500a at the lower side of the first extension portion 310, A second extension 320 formed to extend in parallel with the ESD protection unit 400 and a second extension 320 extending from the first extension 310 to the second extension 320, And an extension portion 330.

The first extending portion 310 is connected to the third extending portion 330 at one end and extends in one direction from the third extending portion 330. The first extending portion 310 is partially extended toward the case 10, So as to be in contact with the case 10. In addition, the region adjacent to the other end of the first extending portion 310 may have a convex curvature in a direction in which the case 10 is located. In other words, of the region of the first extension 310, a shape having a bent portion whose upper end is located away from the third extension 330 or whose peripheral region including the other end of the first extension 310 is bent upward And the bending portion is provided so as to be in contact with the case 10.

The second extension portion 320 is preferably extended from the upper surface of the coupling portion 600a so as to be parallel or parallel to the coupling portion 600a and is also coupled to the upper surface of the coupling portion 600a.

The third extending portion 330 extends to connect the other end of the first extending portion 310 and the other end of the second extending portion 320, and may be extended to have a curvature. When the third extension part 330 is pressed by an external force, the circuit board 20 is pressed in a direction in which the circuit board 20 is positioned, and when the external force is released, it is restored to its original state.

The clip-shaped contact portion 300a may be formed of a material including a metal material such as copper (Cu).

In the above description, the contact portion 300a is a clip in the first embodiment, but the contact portion may be a gasket.

That is, as in the first modification of the first embodiment shown in FIG. 2, a contact portion 300b in the form of a gasket is positioned between the case 10 and the ESD protection portion 400, (Not shown). The gasket contact portion 300b includes an inner member 340 having an elastic force and a conductive layer 350 formed on a surface of the inner member 340. [

The inner member 340 may be formed of a polymer synthetic resin such as a polyurethane foam, a PVC, a silicone, an ethylene vinyl acetate copolymer, or a polyethylin, a natural rubber (NR), a butylene rubber (SBR), an ethylene propylene rubber Rubber such as rubber (NBR) and neoprene, synthetic rubber sheets or sponge sheets may be used.

The conductive layer 350 may be formed to surround the outer circumferential surface of the inner member 340. The conductive layer 350 may be formed of various conductive materials such as carbon black, graphite, gold, silver, copper, nickel, and aluminum.

3, a hole 360 may be formed in the inner member 340, and the hole 360 may be formed in the inner member 340 so that the elastic force or the shock- Is a means that is supplementarily formed. Here, the shape of the hole 360 may be variously changed, such as a circular shape, an elliptical shape, and a polygonal shape.

As described above, the contact portion 300a or 300b is formed to be in contact with the case 10 of an electronic device made of a conductor. However, the contact portion 300a or 300b may be formed to be in contact with any configuration of an electronic device made of a conductive material, and more preferably, to be in contact with a conductor of a configuration serving as an antenna for transmitting an external communication signal .

Hereinafter, in describing the electric shock preventive contactor according to the embodiments of the present invention, it is exemplified that the contact portion is in the form of a clip as shown in Fig. However, in all embodiments, the contact portion 300b of the gasket type shown in Figs. 2 and 3 can be applied to the contact portion.

The ESD protection unit 400 cuts off an electrostatic voltage transmitted to a case (or a conductor) through an internal circuit of the circuit board 20 and bypasses an ESD voltage transmitted from the outside to the internal circuit through a case (or a conductor) .

The ESD protection unit 400 according to embodiments of the present invention is formed to be positioned between a plurality of capacitor units 500a and 500b arranged in the width direction between the case 10 and the circuit board 20. [ As a more specific example, the capacitor portions 500a and 500b may be formed on both sides of the ESD protection portion 400. At this time. The ESD protection unit 400 is formed so that the capacitor units 500a and 500b and the vertical height of the capacitor units 500a and 500b are the same or coplanar with each other so that the positions of the capacitor units 500a and 500b in the width direction do not overlap do. In addition, the ESD protection unit 400 is formed to correspond to the grounding portion of the circuit board.

The ESD protection unit 400 according to the first embodiment is a so-called suppressor type ESD protection unit. The ESD protection unit 400 includes an ESD laminate 410 formed by stacking at least one sheet, an outer surface facing the case 10 on the outer surface of the ESD laminate 410, A plurality of external electrodes 421 and 422 formed on the external surfaces of the ESD multilayer body 410 and extending in a direction intersecting the external electrodes 421 and 422 in the ESD multilayer body 410 and the plurality of external electrodes 421 and 422, And a plurality of ESD protection layers 430 formed between the internal electrodes 423 and 424 and a plurality of internal electrodes 423 and 424 arranged to be connected to each other.

Hereinafter, the stacked body 410 of the ESD protection unit 400 is referred to as an ESD stacked body 410 in order to distinguish it from the stacked body 510 of the capacitors 500a and 500b to be described later.

The ESD laminate 410 may be a structure in which a plurality of insulating sheets are laminated, and the insulating sheet may be a dielectric sheet having a predetermined permittivity, for example, a dielectric constant of 10 to 20,000.

The external electrodes 421 and 422 are formed on the outer surface of the ESD laminate body 410 facing the case 10 and on the outer surface facing the circuit board 20. The external electrodes formed on the upper surface of the ESD multilayer body 410 facing the case 10, that is, the upper surface of the ESD multilayer body 410 are referred to as a first external electrode 421, a lower surface that is an external surface facing the circuit board 20 Is referred to as a second external electrode 422.

Each of the first and second external electrodes 421 and 423 extends in the width direction of the ESD multilayer body 410 in the upper and lower surfaces of the ESD multilayer body 410, 421 are electrically connected to the case 10 through the coupling portion 600a and the contact portion 300a and the second external electrode 422 is electrically connected to the circuit board 20. [ The first and second external electrodes 421 and 422 may be formed of at least one of a metal material such as Ag, Ag / Pd, Cu, Pd, Au, and Al.

Although not shown, a plating layer may be further formed on the outer peripheral surfaces of the first and second external electrodes 421 and 422, respectively. The plating layer may be formed by laminating, for example, a Ni plating layer and a Sn or Sn / Ag plating layer.

After the first and second plating layers are formed on the outer surface of the first outer electrode 421 and the outer surface of the second outer electrode 422, the upper portion of the ESD protection portion 400 is brought into contact with the coupling portion, And the lower portion of the protection unit 400 is brought into contact with the circuit board 20. When the first and second plating layers are heated, the first and second plating layers are melted and bonded or bonded to the coupling portion 600a and the circuit board 20, respectively.

Each of the plurality of internal electrodes 423 and 424 extends in the direction intersecting the extending direction of the external electrodes 421 and 422 in the ESD laminate 410, And are spaced apart in the extending direction. The plurality of internal electrodes 423 and 424 arranged in the extending direction of the external electrodes 421 and 422 are alternately connected to the first and second external electrodes 421 and 422, The inner electrode 423 connected to the second external electrode 421 and the internal electrode 424 connected to the second external electrode 422 partially overlap each other in the vertical direction. An internal electrode 423 connected to the first external electrode 421 to extend in a direction in which the second external electrode 422 is positioned and the other end to be spaced apart from the second external electrode 422, An internal electrode 424 having one end connected to the second external electrode 422 and extending in a direction in which the first external electrode 421 is positioned and the other end being spaced apart from the first external electrode 421, The extension direction is formed so as to partially overlap.

For example, two internal electrodes (hereinafter referred to as first and second internal electrodes 423 and 424) and one end of the first internal electrode 423 are connected to the first external electrode 421, 2 extending in the direction in which the external electrode 422 is located, and spaced apart from the second external electrode 422. One end of the second internal electrode 424 is connected to the second external electrode 422 so as to extend in a direction in which the first external electrode 421 is located and is spaced apart from the first external electrode 421. The first internal electrode 423 and the second internal electrode 424 are formed so that their formation positions are partially overlapped.

The internal electrodes 423 and 424 may be formed of at least one of a metal material such as Ag, Ag / Pd, Cu, Pd, Au, and Al.

An ESD protection layer 430 is formed between the first internal electrode 423 and the second internal electrode 424 within the ESD laminate 410. That is, the ESD protection layer 430 is formed in the overlapping region of the first internal electrode 423 and the second internal electrode 424.

The ESD protection layer 430 is formed on the insulating sheet positioned between the first inner electrode 423 and the second inner electrode 424 among the plurality of insulating sheets constituting the ESD laminate 410, A through hole is formed in a region where the formation position of the electrode 423 and the second internal electrode 424 overlap with each other and an ESD protection material is buried in the through hole using a thick film printing process to form an ESD protection layer 430 . In other words, an ESD protection layer 430 is formed by embedding an ESD protection material after forming a through hole on one insulation sheet, and first and second Internal electrodes 423 and 424 may be formed to form the ESD protection layer 430. [

The ESD protection layer 430 may be formed of one layer including a material including an ESD protection material, as shown in FIGS. 1 and 4A. For example, the ESD protection material may include a conductive ceramic and an insulating ceramic, and the ESD protection layer 430 may be formed of a mixture of a conductive ceramic and an insulating ceramic. In this case, the ESD protection layer 430 can be formed by mixing conductive ceramics and insulating ceramics at a mixing ratio of, for example, 10:90 to 90:10. As the blending ratio of the insulating ceramic increases, the discharge starting voltage increases, and as the blending ratio of the conductive ceramic increases, the discharge starting voltage may be lowered. Therefore, the mixing ratio of the conductive ceramics and the insulating ceramics is adjusted so as to obtain a predetermined discharge starting voltage.

In addition, the ESD protection layer 430 may be formed by stacking a conductive layer and an insulating layer in a predetermined laminated structure. That is, the ESD protection layer 430 may be formed by laminating the conductive layer and the insulating layer at least once to divide the conductive layer and the insulating layer. For example, the ESD protection layer 430 may have a two-layer structure in which the conductive layers 431a and 431b and the insulating layer 432 are laminated, and the conductive layer 431, the insulating layer 432, Layer structure may be formed by stacking the first and second electrodes 431 and 431. In addition, the conductive layers 431a and 431b and the insulating layer 432 may be repeatedly laminated a plurality of times to form a laminate structure of three or more layers. For example, a three-layered ESD protection structure in which a first conductive layer 431a, an insulating layer 432, and a second conductive layer 431b are stacked as in the first modification of the ESD protection layer 430 shown in FIG. 4B A layer 430 may be formed.

As another example, the ESD protection layer 430 may further include an air gap in a predetermined region. For example, an air gap may be formed between the layers in which the conductive material and the insulating material are mixed, or an air gap may be formed between the conductive layer and the insulating layer. That is, a first mixed layer of an electrically conductive material and an insulating material, an air gap and a second mixed layer may be laminated, or a conductive layer, an air gap and an insulating layer may be laminated. In the latter case, for example, the ESD protection layer 430 may include a first conductive layer 431a, a first insulating layer 432a, an air gap 433, 2 insulating layer 432b and a second conductive layer 431b may be stacked. That is, insulating layers 432a and 432b may be formed between the first conductive layer 431a and the second conductive layer 431b, and an air gap 433 may be formed between the insulating layers 432a and 432b.

In the above description, the ESD protection layer 430 according to the first to third embodiments has been described in which an ESD protection layer is formed by embedding a separate ESD protection material in the through hole. However, the ESD protection layer 430 may not be formed of a conductive material and an insulating material, but may include only the air gap 433, as in the third modification shown in FIG. 4D.

The air gap 433 may be formed by filling a polymer material and then performing a firing process to remove the polymer material.

The conductive layers 431a and 431b of the ESD protection layer 430 lower the energy level when an overvoltage is input, thereby preventing structural breakdown of the ESD due to overvoltage. The conductive material for forming the conductive layers 431a and 431b may be a conductive ceramic and the conductive ceramic may be at least one of La, Ni, Co, Cu, Zn, Ru, Ag, Pd, Pt, W, May be used.

The insulating material mixed with the conductive material can be made of a discharge inducing material and can function as an electrical barrier having a porous structure. Such an insulating material may be an insulating ceramic, and the insulating ceramic may be a ferroelectric material having a dielectric constant of about 50 to 50,000. For example, the insulating ceramic may be a dielectric material powder such as MLCC, or a mixture containing at least one of BaTiO ₃ , BaCO ₃ , TiO ₂ , Nd, Bi, Zn and Al ₂ O ₃ . The insulating layer 432 may be formed of a porous structure formed with a plurality of pores each having a size of about 1 nm to 5 μm and formed with a porosity of 30% to 80%. That is, the insulating layer 432 is formed of an electrically insulating material that can not conduct current, but a gap is formed, so that current can flow through the gap. At this time, as the size of the gap increases or the porosity increases, the discharge start voltage may be lowered. On the contrary, if the size of the gap becomes smaller or the porosity becomes lower, the discharge start voltage may increase. However, if the pore size exceeds 5 占 퐉 or the porosity exceeds 80%, it may be difficult to maintain the shape of the ESD protection layer 430. Therefore, the pore size and the porosity of the insulating layer 432 can be adjusted to adjust the discharge start voltage while maintaining the shape of the ESD protection layer 430.

On the other hand, when the ESD protection layer 430 is formed of a mixed material of an insulating material and a conductive material, an insulating ceramic having micropores and porosity may be used as the insulating material. Further, the insulating layer 432 has a lower resistance than the resistance of the insulating sheet by microvoids, and partial discharge can be made through the microvoids. That is, the insulating layer 432 is formed with microvoids, and partial discharge is performed through the microvoids.

The ESD protection unit 400 may block the electrostatic voltage transmitted to the case (or conductor) through the internal circuit of the circuit board and may be connected to the case (or conductor) through the contact unit 300a Bypasses the current due to the overvoltage or the electrostatic voltage not lower than the discharge start voltage to the ground.

In the above description, the ESD protection unit 400 has been described as a suppressor type. However, the ESD protection unit 400 is not limited thereto and may be, for example, a Varistor type.

5, the ESD protection unit 400 according to the second embodiment is a varistor type. Referring to FIG. 5, the ESD protection unit 400 includes an ESD laminate 410 formed by stacking at least one sheet having a variable resistance value according to a voltage, First and second external electrodes 421 and 422 formed on the external surface of the ESD multilayer body 410 opposite to the case 10 and the external surface facing the circuit board 20 on the external surface of the ESD multilayer body 410, First and second internal electrodes 423 and 423 formed to extend in a direction intersecting the first and second external electrodes 421 and 422 and alternately connected to the first and second external electrodes 421 and 422, 424).

The ESD stack body 410 according to the second embodiment is a stacked structure in which a current flows when a voltage higher than a breakdown voltage is applied and a current having a nonlinear electrical characteristic in which a current does not flow when a voltage lower than a breakdown voltage is applied . For example, ESD laminated body 410 can be formed of a material having varistor characteristics, and more specific examples ESD laminate 410 _{ZnO, Bi 2 O 3, Pr} 6 0 11, CO 3 O 4, Mn 2 O _3, may be formed of a material containing CaCO ₃ and SrTiO _3, BaTiO ₃ at least one of.

At this time, the entire ESD laminate 410 may be formed of a varistor material, or only a laminate region between the first internal electrode 423 and the second internal electrode 424 may be formed of a varistor material, The region may be formed of an insulating sheet.

As described above, according to the ESD protection unit 400 having the ESD laminate 410 including the varistor material, the electrostatic voltage transmitted to the case (or conductor) through the internal circuit of the circuit board is cut off, (Or conductor) and the current due to the overvoltage or the electrostatic voltage which is higher than the breakdown voltage flowing through the contact portion 300a to the ground.

The ESD protection unit 400 of the suppressor type and the varistor type described above is provided with one first and second internal electrodes 426 and 424. However, the present invention is not limited thereto, and a plurality of the first internal electrodes 423 And a plurality of second internal electrodes 424 may be provided. Accordingly, the first and second internal electrodes 423 and 424 are repeatedly arranged such that the first internal electrode 423 and the second internal electrode 424 alternate with each other.

In addition, the ESD protection unit 400 is not limited to the above-described suppressor type and varistor type, and any element having a function of bypassing the electrostatic voltage and blocking the electrostatic voltage may be applied, But may be changed into any structure and shape.

1 to 3, one ESD protection unit is provided. However, the present invention is not limited to this, and a plurality of ESD protection units may be provided.

The capacitor units 500a and 500b are positioned between the contact unit 300a and the circuit board 20 and allow a communication signal flowing from the case 10 serving as an antenna to pass therethrough.

The first capacitor unit 500a and the second capacitor unit 500a are provided with ESD protection (hereinafter, referred to as " ESD protection "). The ESD protection contactor according to the embodiment includes two capacitor units (hereinafter referred to as first and second capacitor units 500a and 500b) The ESD protection unit 400 is disposed at a distance from the ESD protection unit 400 in the direction of one side and the other side. The first and second capacitor units 500a and 500b are formed on the same plane or on the same plane as the ESD protection unit 400 so that the ESD protection unit 400 and the ESD protection unit 400 Positions are formed so as not to overlap each other.

Each of the first and second capacitor units 500a and 500b includes a laminated body 510 in which at least one sheet is laminated, an outer surface facing the case 10 from the outer surface of the laminated body 510, A plurality of external electrodes 521 and 522 formed on outer surfaces opposed to the plurality of outer electrodes 521 and 522 and a plurality of outer electrodes 521 and 522 extending in a direction intersecting the plurality of outer electrodes 521 and 522, And a plurality of internal electrodes 523 and 524 arranged so as to be alternated with the internal electrodes 522 and 522.

Hereinafter, in order to distinguish the stack 510 of the capacitor unit 500 from the stack 410 of the ESD protection unit 400 described above, it is referred to as a capacitor stack 510.

The capacitor laminate 510 may be formed by stacking a plurality of sheets made of at least one of dielectric, ceramic, and varistor.

External electrodes 521 and 522 are formed on the outer surface of the capacitor stack 510. The outer surface of the capacitor stack 510 facing the case 10 and the external surface of the capacitor stack 510 facing the circuit board 20 Electrodes 521 and 522 are formed. That is, a first external electrode 521 is formed on the upper surface of the capacitor stack body 510, and a second external electrode 522 is formed on the lower surface. The first external electrode 521 is electrically connected to the case 10 through the coupling portion 600a and the contact portion 300a and the second external electrode 522 is electrically connected to the circuit board 20 do. The first and second external electrodes 521 and 522 may be formed of at least one of a metal material such as Ag, Ag / Pd, Cu, Pd, Au, and Al.

Although not shown, a plating layer may further be formed on the outer circumferential surfaces of the first and second outer electrodes 521 and 522, respectively. The plating layer may be formed by laminating, for example, a Ni plating layer and a Sn or Sn / Ag plating layer.

The first and second plating layers are respectively formed on the outer surface of the first outer electrode 521 and the outer surface of the second outer electrode 522 and then the upper portion of the capacitor portion 500 is brought into contact with the coupling portion to be connected, The lower part of the circuit board 500 is brought into contact with the circuit board 20. When the first and second plating layers are heated, the first and second plating layers are melted and bonded or bonded to the coupling portion 600a and the circuit board 20, respectively.

Each of the plurality of internal electrodes 523 and 524 extends in the direction intersecting the external electrodes 521 and 522 in the capacitor laminate 510 and is connected to the first and second external electrodes 521 and 522, Respectively. The plurality of internal electrodes 523 and 524 according to the embodiment extend in the vertical direction within the capacitor stack body 510 and the plurality of internal electrodes 523 and 524 are formed so that a part of their extending directions overlap each other.

One end of the first internal electrode 523 is connected to the first external electrode 521 to extend in a direction in which the second external electrode 522 is located and the other end is spaced apart from the second external electrode 522. On the other hand, the second internal electrode 524 is connected to the second external electrode 522 to extend in a direction in which the first external electrode 521 is located and the other end is formed to be spaced apart from the first external electrode 521 .

The internal electrodes 523 and 524 may be formed of at least one of a metal material such as Ag, Ag / Pd, Cu, Pd, Au, and Al.

A capacitor C is formed in a region of the capacitor stack body 510 between the first internal electrode 523 and the second internal electrode 524 according to the structure and configuration of the capacitor units 500a and 500b.

The capacitor units 500a and 500b will now be described with reference to the capacitor stack 510 and the first and second external electrodes 521 and 522 formed on the upper and lower surfaces of the capacitor stack 510, And a capacitor C formed in the capacitor 510. Here, the capacitor C extends in the direction intersecting the external electrodes 521 and 522 in the capacitor laminate 510, that is, in the up-and-down direction, and the first and second Internal electrodes 523 and 524 and a capacitor stack body 510 in a region between the first internal electrode 521 and the second internal electrode 522.

The capacitor units 500a and 500b pass the communication signal flowing from the case 10, which functions as an antenna and the contact unit 300a.

Although two capacitor units 500a and 500b have been described above, two or more capacitor units may be provided.

Although the first and second internal electrodes 423 and 424 are provided in the capacitor units 500a and 500b as described above, the present invention is not limited thereto. The plurality of first internal electrodes 423 and the plurality of And a second internal electrode 424 may be provided. Accordingly, the first and second internal electrodes 423 and 424 can be repeatedly arranged such that the first internal electrode 423 and the second internal electrode 424 alternate with each other.

In the above description, two capacitor units 500a and 500b are provided. However, the present invention is not limited to this, and one or two or more capacitor units may be provided. In the above description, two capacitor units 500a and 500b are provided, and one capacitor unit is disposed on one side of the ESD protection unit 400 and one capacitor unit is disposed on the other side of the ESD protection unit 400 . However, the present invention is not limited to this, and a plurality of capacitor portions may be formed in at least one of the one direction of the ESD protection portion 400 and the other direction of the ESD protection portion 400.

Also, in the above description, one ESE protection unit is provided between two capacitor units. However, the present invention is not limited to this, and a plurality of ESE protection units may be provided between the two capacitor units.

The coupling portion 600a is located between the contact portion 300a and the ESD protection portion 400 and between the capacitor portions 500a and 500b to electrically connect the ESD protection portion 400 and the capacitor portions 500a and 500b to the contact portion 300a. The coupling portion 600a according to the embodiment is a conductive adhesive layer having conductivity and adhesion function. The conductive adhesive layer is applied to the lower surface of the contact portion 300a and when the upper surface of the capacitor portions 500a and 500b and the upper surface of the ESD protection portion 400 are in contact with each other, The capacitor units 500a and 500b, and the ESD protection unit 400 are bonded to each other. At this time, the overvoltage or the ESD voltage current, the communication signal, etc., which is higher than the discharge start voltage applied to the contact portion 300a, are electrically connected to the capacitor portions 500a and 500b or the ESD protection portion 400 through the coupling portion 600a, Lt; / RTI >

In the present embodiment, the capacitors 500a and 500b and the ESD protection unit are coupled to the contact unit 300a by the coupling unit 600a. However, the coupling unit 600a may be omitted.

Hereinafter, the electric shock protection contactor 1000 according to the first embodiment described above will be described again in terms of the positional relationship between the capacitor units 500a and 500b and the ESD protection unit 400. FIG.

Referring to FIG. 1, the ESD protection unit 400 according to the first embodiment includes a contact portion 300a having an elastic force, which contacts the case 10, and a contact portion 300b, which is located between the contact portion 300a and the circuit board 20 The capacitor unit 500a and 500b are connected to the contact unit 300a at one side and the circuit board 20 at the other side. The capacitor unit 500a and 500b are located between the contact unit 300a and the circuit board 20, And the other side includes an ESD protection unit 400 connected to the circuit board 20. [ The ESD protection unit 400 may further include a coupling unit 600a coupling the capacitor units 500a and 500b and the ESD protection unit 400 to the contact unit 300a.

In the first embodiment, capacitor units 500a and 500b are formed on both sides of the ESD protection unit 400. The ESD protection unit 400 and the first and second capacitor units 500a and 500b are formed at the same height or the same Plane. The first capacitor units 500a and 500b, the ESD protection unit 400, and the second capacitor units 500a and 500b are spaced apart from each other, and the spacing space is an empty space.

At this time, the upper parts of the ESD protection part 400 and the capacitor parts 500a and 500b are connected to the contact part 300a, and the lower part is connected to the circuit board 20. According to the ESD protection contactor 1000, the ESD protection unit 400 and the capacitor C do not overlap with each other. In other words, the positions of the ESD protection unit 400 and the capacitor C in the width direction are different from each other.

Each of the first and second capacitor units 500a and 500b and the ESD protection unit 400 may be separately manufactured and positioned between the contact unit 300a and the circuit board 20. [

The ESD protection unit 400 and the capacitor units 500a and 500b are formed on the contact portions 300a and 300b as described above in the second embodiment through the seventh embodiment, And is disposed between the circuit boards 20 so that one side is connected to the contact portion 300a and the other side is connected to the circuit board 20. [ The ESD protection unit 400 and the capacitor C are formed so as not to overlap with each other. In addition, the ESD protection unit 400 is not limited to the suppressor type (any one of Figs. 4A to 4D) and may be formed of a varistor type (Fig. 5).

The first to seventh embodiments may be variously combined with each other.

In the first embodiment described above, the first capacitor units 500a and 500b, the ESD protection unit 400, the ESD protection unit 400 and the second capacitor units 500a and 500b are spaced apart from each other, .

However, the present invention is not limited to this, and may be configured to fill the spaces between the first capacitor unit 500a and the ESD protection unit 400 and between the ESD protection unit 400 and the second capacitor unit 500a.

6, a connection is made between the first capacitor unit 500a and the ESD protection unit 400 and between the ESD protection unit 400 and the second capacitor unit 500b, respectively, as in the second embodiment shown in FIG. Blocks 700a and 700b may be formed.

That is, the electric shock protection contactor 1000 according to the second embodiment includes a contact portion 300a having an elastic force, electrically contacting the case 10 of the electronic device, a contact portion 300a having an elastic force, a contact portion 300a between the contact portion 300a and the circuit board 20 First and second capacitor units 500a and 500b spaced from each other in the width direction (left and right direction) and connected to the case 10 and the circuit board 20, first and second capacitor units 500a and 500b, 500b and an ESD formed between the first capacitor unit 500a and the second capacitor unit 500b so as to be connected to the case 10 and the circuit board 20, A first connection block 700a formed to connect the protection unit 400 and the first capacitor unit 500a to the ESD protection unit 400 and a second connection block 700b connected between the first capacitor unit 500a and the ESD protection unit 400 And a second connection block 700b formed to connect the first and second connection blocks. The contact portion 300a includes a coupling portion 600a for coupling or fastening the capacitor portions 500a and 500b, the ESD protection portion 400, and the connection blocks 700a and 700b.

One side of the first connection block 700a is in contact with one side of the first capacitor unit 500a and the other side of the first connection block 700a is in contact with one side of the ESD protection unit 400 do. One side of the second connection block 700b is in contact with the other side of the ESD protection part 400 and the other side of the second connection block 700b is in contact with one side of the second capacitor part 500b do.

The first and second connection blocks 700a and 700b may be formed by stacking a plurality of sheets made of an insulating material such as a dielectric material having a predetermined permittivity, for example, a dielectric constant of 10 to 20,000, or a ceramic or a varistor, .

The first and second capacitor portions 500a and 500b, the ESD protection portion 400 and the first and second connection blocks 700a and 700b are electrically connected to the contact portion 100a of the contact protection contact 1000, (Left-right direction) between the circuit board 300a and the circuit board 20, and are interconnected. The first and second external electrodes 521 and 522 of the first capacitor unit 500a and the first and second external electrodes 421 and 422 of the ESD protection unit 400 are connected to the first connection block 700a, And the first and second external electrodes 521 and 522 of the second capacitor unit 500b and the first and second external electrodes 421 and 422 of the ESD protection unit 400 are electrically connected to the second connection block (700b).

The ESD protection contactor 1000 according to the first and second embodiments includes a plurality of capacitor units 500a and 500b and capacitor units 500a and 500b are formed on both sides of the ESD protection unit 400 .

However, the present invention is not limited thereto, and one capacitor unit 500 and one ESD protection unit 400 may be provided as in the case of the ESD contactor 1000 according to the third embodiment shown in FIG. 7, The ESD protection unit 400 may be formed on one side or between the contact unit 300a and the circuit board 20 so as to be offset. That is, the ESD protection unit 400 is formed on one side between the contact unit 300a and the circuit board 20, and the capacitor unit 500 is extended from the other side in the direction in which the ESD protection unit 400 is located . At this time, the other side of the capacitor unit 500 is spaced apart from the ESD protection unit 400, and the spacing space may be an empty space.

In this case, the width of the capacitor unit 500 may be longer than that of the first and second embodiments. The number of the internal electrodes or the capacitors C or the number of the capacitors C may be increased as compared with the first and second embodiments. .

A plurality of first inner electrodes 523 connected to the first outer electrodes 521 and a plurality of second inner electrodes 524 connected to the second outer electrodes 522 are formed in the capacitor stack body 510. [ Respectively. The first internal electrode 523 and the second internal electrode 524 are alternately arranged and arranged in the width direction of the capacitor stack body 510 a plurality of times. For example, as shown in FIG. 7, two first internal electrodes 523 and two second internal electrodes 524 may be provided. In the width direction of the capacitor laminate 510, The first internal electrode 523, the second internal electrode 524, the first internal electrode 523, and the second internal electrode 524.

According to the structure and configuration of the capacitor unit 500, a capacitor C is formed between the plurality of first internal electrodes 523 and a plurality of capacitor internal electrodes 524 between the regions of the capacitor stack body 510 .

In the third embodiment, the capacitor unit 500 and the ESD protection unit 400 are separated from each other, and the spacing space is an empty space.

However, the present invention is not limited thereto, and the connection block 700 may be filled in the space between the capacitor unit 500 and the ESD protection unit 400, as in the fourth embodiment shown in FIG.

That is, the shock-protective contactor according to the fourth embodiment has contact portions 300a, which are in electrical contact with the case 10 of the electronic device and have elasticity, The ESD protection unit 400, the capacitor unit 500, and the ESD protection unit 400, which are spaced apart from each other in the direction (left-right direction) and connected to the case 10 and the circuit board 20, And a connection block 700 configured to connect between the protection units 400. [ The connector 300 includes a coupling portion 600a for coupling or fastening the capacitor portion 500, the ESD protection portion 400, and the connection block 700 to the contact portion 300a.

One side of the connection block 700 is in contact with one side of the capacitor unit 500 and the other side of the connection block 700 is in contact with one side of the ESD protection unit 400.

The connection block 700 may be made of a dielectric material having an insulating material such as a dielectric constant of, for example, 10 to 20,000. Further, the connection block may be constituted by stacking a plurality of dielectric sheets a plurality of times.

The capacitor unit 500, the ESD protection unit 400 and the connection block 700 are disposed between the contact unit 300a and the circuit board 20 in the width direction Left and right directions), and are interconnected. The first and second external electrodes 521 and 522 of the capacitor unit 500 and the first and second external electrodes 421 and 422 of the ESD protection unit 400 are insulated by the connection block 700 .

In the first to fourth embodiments described above, the coupling portion 600a made of the conductive adhesive layer is formed between the capacitor portion 500a, 500b or 500 and the ESD protection portion 400 and the contact portion 300a, (500a, 500b or 500) and the ESD protection portion 400 are bonded to the contact portion 300a.

However, the present invention is not limited thereto, and the capacitor unit 500a, 500b or 500 and the ESD protection unit 400 may be mechanically coupled to the contact unit 300a. The mechanical coupling unit 600b may be, .

Hereinafter, an electric shock protection contactor according to fifth to seventh embodiments of the present invention will be described with reference to FIGS. 9 to 20. FIG.

9 to 13 are views showing an electric shock protection contactor according to a fifth embodiment of the present invention. 14 to 16 are views showing an electric shock protection contactor according to a sixth embodiment of the present invention. 17 to 20 are views showing an electric shock protection contactor according to a seventh embodiment of the present invention.

9 is a cross-sectional view taken along line A-A 'of FIG. 9, and FIG. 11 is a cross-sectional view taken along the line B-B' of FIG. 9, FIG. 12 is a cross-sectional view taken along line C-C 'of FIG. 9. FIG. 13 is a view for explaining a modification of the fifth embodiment.

15 is a cross-sectional view taken along the line D-D 'of FIG. 14, and FIG. 16 is a cross-sectional view taken along line CC' of FIG. 9, Fig.

17 is a three-dimensional view showing an electric shock protection contactor according to a seventh embodiment of the present invention. FIG. 18 is a sectional view of the electric shock protection contact shown in FIG. 17 to explain the arrangement or formation of the capacitor unit, Fig. 3 is a three-dimensional view showing a state in which the coupling portion is separated from the electric shock protection portion in Fig. 19 is a cross-sectional view taken along line C-C 'in Fig.

20 is a sectional view for explaining an electric shock protection contactor according to a modification of the seventh embodiment.

9 to 12, an electric shock protection contactor 1000 according to a fifth embodiment of the present invention includes a contact portion 300a which is in electrical contact with a case 10 of an electronic device and has an elastic force, The ESD protection unit 400 and the contact units 300a and 300b are disposed between the circuit board 20 and the case 10 and the circuit board 20, And a coupling portion 600a for mechanically or physically coupling the capacitor portions 500a and 500b and the ESD protection portion 400 to each other. Here, the capacitor units 500a and 500b and the ESD protection unit 400 are spaced apart from each other, and the space between the capacitor units 500a and 500b and the ESD protection unit 400 is an empty space.

That is, the electrostatic protection contactor 1000 according to the fifth embodiment has capacitor portions 500a and 500b similar to the first embodiment shown in FIG. 1 and an ESD protection portion 400, The coupling portion 600b having a fastening function is used instead of the coupling portion 600b.

Hereinafter, the ESD protection unit 400 and the capacitor units 500a and 500b, which are positioned between the circuit board 20 and the contact unit 300a, The structure is referred to as an " electric shock protection portion 50 ". That is, the electric shock protection unit 50 is positioned between the contact unit 300a and the circuit board 20, and the electric shock protection unit 50 includes the ESD protection unit 400 and the capacitor units 500a and 500b.

The overall shape of the electric shock protection part 50 according to the embodiment is configured in a substantially alphabetical "T" shape to have a protruding area, for easy fastening with the coupling part.

The electric shock protection 50 is formed by extending in the X-axis direction (first direction) and the Y-axis direction (second direction) (First direction) and a Y-axis direction (second direction) so as to be smaller in area than the first area A1 and located below the first area A1 and the first area A1, And a second region A2 formed.

Here, the length of the Y axis (second direction) intersecting the X axis (first direction) of the first region A1 is formed to be longer than the Y axis (second direction) of the second region A2, The end of the first region A1 in the Y-axis (second direction) is formed to protrude from the second region A2. That is, the first region A1 has a protruding region P that is further projected in the Y-axis direction as compared with the second region A2. At this time, it is preferable that the second region A2 is arranged to be positioned at the lower center of the first region A1, and accordingly, the first region A1 is the amount in the Y-axis direction with respect to the second region A2 A protruding region P is provided. The length of the first area A1 in the X axis (first direction) and the length of the second area A2 in the X axis (first direction) may be the same.

Thus, the entire shape of the electric shock protection portion 50 includes the first area A1 and the second area A2 described above, and is in the form of an alphabet "T" shape.

Each of the first area A1 and the second area A2 described above may be a meaning of "area" or "space " or position in which the capacitor parts 500a and 500b and the ESD protection part 400 are formed.

To describe the electric shock protection unit 50 again, the electric shock protection unit 50 is formed to include the first area and the second area described above and has the alphabet "T" shape.

The engaging portion 600b is fastened to grip at least the protruding region P of the first region A1.

Each of the first area A1 and the second area A2 of the electric shock protection contactor 1000 according to the fifth embodiment includes first and second capacitor parts 500a and 500b and an ESD protection part 400 do. In other words, the first and second capacitor parts 500a and 500b and the ESD protection part 400 are formed in the first area A1 and the second area A2, respectively. This does not mean that the first capacitor unit 500a, the second capacitor unit 500b and the ESD protection unit 400 are separately provided in the first area A1 and the second area A2, respectively. That is, the first capacitor unit 500a is formed over the first area A1 and the second area A2, and the second capacitor unit 500b is formed over the first area A1 and the second area A2. The ESD protection unit 400 is formed over the first area A1 and the second area A2 and the first capacitor unit 500a, the ESD protection unit 400 and the second capacitor unit 500b Are arranged and arranged in the first direction.

Hereinafter, the electric shock protection contactor according to the fifth embodiment will be described in more detail.

Each of the first and second capacitor portions 500a and 500b is configured such that the approximate shape of the outer appearance of the first and second capacitor portions 500a and 500b is an alphabetical "T" shape. More specifically, the capacitor units 500a and 500b include a capacitor laminate 510 in which at least one sheet is stacked, a plurality of capacitor units 500a and 500b facing the case 10 or the coupling unit 600b on the outer surface of the capacitor laminate 510 First and second external electrodes 521 and 522 formed on the outer surface and the outer surface opposite to the circuit board 20 and the first and second outer electrodes 521 and 522 in the capacitor laminate 510, And a plurality of internal electrodes 523 and 524 extending in an intersecting direction and arranged to be alternately connected to the first and second external electrodes 521 and 522.

Referring to FIG. 10, the capacitor laminate 510 may have a shape having a long side and a short side, for example, a shape viewed from the short side direction may be an alphabet 'T' shape. Hereinafter, it is defined as an X-axis direction (or first direction) in the long-side direction and a Y-axis direction (second direction) in the short-side direction.

In other words, the X-axis direction is a direction in which the plurality of internal electrodes 523 and 524 are arranged and the Y-axis direction is a direction intersecting or orthogonal to the X-axis direction.

As described above, the capacitor laminate 510 has an alphabetical " T " shape in cross-section as viewed from its overall shape or short side direction. More specifically, the capacitor laminate 510 includes a capacitor upper laminate 510a and a capacitor lower laminate 510b formed by stacking upper and lower parts. The capacitor upper laminate 510a and the capacitor lower laminate 510b 510b have the same or similar lengths in the X direction and the length of the capacitor upper layer body 510a in the Y direction is larger than that of the capacitor lower layer body 510b. Thus, the shape in which the capacitor upper stacked body 510a and the capacitor lower stacked body 510b are coupled in the vertical direction becomes an approximately alphabetical "T" 10, the upper laminate 510 is further protruded in both directions in the Y-axis direction on the basis of the lower laminate 520, and the protruding area of the capacitor upper laminate 510a P are fastened to the coupling portion 600b.

Although the capacitor upper laminate 510a and the capacitor lower laminate 510b have been described above as separate constituents, the capacitor laminate 510 may be an integral type. Each of the capacitor upper laminate 510a and the capacitor lower laminate 510b may be formed by laminating a plurality of sheets made of at least one of dielectric, ceramic, and varistor.

The first external electrode 521 is formed on the upper surface and the side surface of the capacitor upper layer body 510a and connected to the first internal electrode 523 and the second external electrode 522 is connected to the lower capacitor layer body 510b, And is connected to the second internal electrode 524. The first and second external electrodes 521 and 522 can be formed by applying at least one of a conductive material such as Ag, Ag / Pd, Cu, Pd, Au and Al to the outer surface of the laminate by a printing method.

13A, plating layers 526a and 526b may be further formed on the outer surfaces of at least one of the first external electrode 521 and the second external electrode 522. Further, as shown in FIG. For example, a Ni plating layer and a Sn or Sn / Ag plating layer may be laminated.

The first and second plating layers 526a and 526b are formed on the outer surface of the first outer electrode 521 and the outer surface of the second outer electrode 522 and then the upper portion of the capacitor portions 500a and 500b is connected to the coupling portion 600b so that the lower portions of the capacitor portions 500a, 500b are brought into contact with the circuit board 20. When the first and second plating layers 526a and 526b are heated, the first and second plating layers 526a and 526b are melted and bonded or bonded to the coupling portion 600b and the circuit board 20, do.

9 and 11, the ESD protection unit 400 is configured such that the approximate shape of the outer appearance of the ESD protection unit 400 is an alphabetical "T" shape. More specifically, the ESD protection unit 400 includes an ESD laminate 410 formed by stacking at least one sheet, an outer surface facing the case 10 on the outer surface of the ESD laminate 410, A plurality of external electrodes 421 and 422 formed on the external surfaces opposite to the external electrodes 421 and 422 and extending in a direction intersecting the external electrodes 421 and 422 in the ESD laminate 410, And a plurality of internal electrodes 423 and 424 and an ESD protection layer 430 formed between the internal electrodes 423 and 424 so as to be alternately connected to the electrodes 422 and 422.

Referring to FIG. 11, the ESD laminate 410 may have a long side and a short side. For example, the ESD laminate 410 may have an alphabetical T shape. Hereinafter, the long side direction of the ESD protection unit 400 is defined as an X axis direction (or first direction), and the short side direction is defined as a Y axis direction (second direction).

The ESD laminate 410 of the ESD protection unit 400 has an alphabetical " T " shape in cross-section as viewed in its overall shape or short side direction. More specifically, the ESD laminate 410 includes an ESD upper laminate 410a and an ESD lower laminate 410b formed by stacking upper and lower layers. The ESD upper laminate 410a and the ESD lower laminate 410b 410b have the same or similar lengths in the X direction, and the length of the ESD upper laminate 410a in the Y direction is larger than that of the ESD lower laminate 410b. Thus, the shape in which the ESD upper layer body 410a and the ESD lower layer body 410b are combined in the vertical direction becomes an approximately alphabetical "T" 9 and 11, the upper laminate 410a is further protruded in both directions in the Y-axis direction on the basis of the ESD lower laminate 410b, and the upper capacitor laminate 510a And the protruding area P of the protruding part P is fastened to the coupling part 600b.

Although the ESD upper laminate 410a and the ESD lower laminate 410b have been described above as separate constituents, the ESD laminate 410 may be an integral type. In addition, each of the ESD upper laminate 410a and the ESD lower laminate 410b may be formed by laminating a plurality of sheets made of at least one of dielectric, ceramic, and varistor.

The first outer electrode 421 is formed on the upper surface and the side surface of the ESD upper laminate 410a and connected to the first inner electrode 423 and the second outer electrode 422 is connected to the ESD lower laminate 410b. And is connected to the second internal electrode 424. The first and second external electrodes 421 and 422 can be formed by applying at least one of a conductive material such as Ag, Ag / Pd, Cu, Pd, Au and Al to the outer surface of the laminate by a printing method.

13B, plating layers 426a and 426b may be further formed on the outer surfaces of at least one of the first external electrode 421 and the second external electrode 422. In addition, For example, a Ni plating layer and a Sn or Sn / Ag plating layer may be laminated.

The first and second plating layers 426a and 426b are formed on the outer surface of the first outer electrode 421 and the outer surface of the second outer electrode 422 and then the upper portion of the ESD protection portion 400 is connected to the coupling portion 600b And the lower portion of the ESD protection unit 400 is brought into contact with the circuit board 20. [ When the first and second plating layers 426a and 426b are heated, the first and second plating layers 426a and 426b are melted and bonded or bonded to the coupling portion 600b and the circuit board 20, do.

As described above, the electric shock protection contactor 1000 according to the fifth embodiment includes a coupling portion 600b having a coupling function. That is, the engaging portion 600b has a protruding region P of the upper stacked body 510a and 410a which is further projected in the Y-axis direction than the upper face of the electric shock protection portion 50 and the lower stacked body 510b and 410b. (Not shown).

More specifically, the coupling portion 600b is positioned corresponding to the upper surface of the upper stacked body 510a, 410a of each of the capacitor portions 500a, 500b and the ESD protection portion 400, and the upper stacked body 510a, An upper fastening member 610 extending in a direction corresponding to the X axis and Y axis extending directions of the upper fastening members 410a and 410a, a side fastening member 620 extending downward from both ends in the Y axis direction of the upper fastening member 610, Axis direction and extending in the Y axis direction from the side fastening member 620 and extending in the Y axis direction relative to the lower stacked bodies 510b and 410b so as to correspond to the lower surfaces of the upper stacked bodies 510a and 410b, Member 630 as shown in FIG.

The coupling portion 600b is fastened so as to grip the electric shock protection portion 50 or the protruding region P of the first region A1 as described above. The edge of the upper fastening member 610, The upper surface and the side fastening member 620 are coupled to the side of the projecting region P and the lower fastening member 630 to be engaged with the lower surface of the projecting region P. [

Here, an empty space is provided between the upper fastening member 610, the side fastening member 620, and the lower fastening member 630 of the coupling portion 600b, (A1) is inserted. The coupling portion 600b may be formed of a conductive material such as copper (Cu).

In the fifth embodiment, the pair of capacitor portions 500a and 500b and the ESD protection portion 400 are spaced apart from each other. The coupling portion 600B according to the fifth embodiment is configured such that the side coupling member 620 and the lower coupling member 630 each have a spacing space between the first capacitor portion 500a and the ESD protection portion 400, The spacing space between the capacitor portion 500B and the ESD protection portion 400 may be open.

The contact portion 300a may be integrally formed with the coupling portion 600b. For example, the contact portion 300a may include a first extension portion 310 and a third extension portion 330, and the third extension portion 330 may be connected to the upper fastening member 610 of the coupling portion 600b It can be integrated. Here, the second extension portion 320 of the contact portion 300a may be replaced with the coupling portion 600b or the upper coupling member 610 of the coupling portion 600b.

When the engaging portion 600b is fastened to the ESD protection portion 50 as described above, the upper portion of each of the first region A1 of the ESD protection portion, the capacitor portions 500a and 500b, and the ESD protection portion 400, The fastening members 510a and 410b can be fastened in such a manner as to be fitted in the space between the upper fastening member 610, the side fastening member 620 and the lower fastening member 630 of the engaging portion 600b. Thus, the electric shock protection unit 50, that is, the capacitor units 500a and 500b and the ESD protection unit 400 are mechanically coupled to the contact unit 300a by the coupling unit 600b.

If the contact portion 300a and the capacitor portion 500 or the ESD protection portion 400 are mechanically coupled to each other using the coupling portion 600b including the coupling member or the joint instead of the conductive adhesive layer, The resistance can be lowered compared to the first to fourth embodiments.

In the above-described fifth embodiment, the pair of capacitor units 500a and 500b and the ESD protection unit 400 are spaced apart from each other, and the spacing space is an empty space.

However, the present invention is not limited to this, and the ESD protection unit 400 may be provided between the first capacitor unit 500a and the ESD protection unit 400, the second capacitor unit 500b, 400, and a coupling portion 600b having a fastening function can be applied thereto.

That is, the shock protection contactor 1000 according to the sixth embodiment includes a contact portion 300a that is in electrical contact with the case 10 of the electronic device and has an elastic force, and each contact portion 300a has a contact portion 300a and a circuit board 20 And one side surface and the other side surface of the first capacitor unit 500a and the second capacitor unit 500b connected to the circuit board 20 and the case 10 are connected to the ESD protection unit 400 and the first capacitor unit 500a Connecting blocks 700a and 700b are respectively provided between the ESD protection unit 400 and the ESD protection unit 400 and the second capacitor unit 500b and the capacitor units 500a and 500b and the ESD protection unit 500b are formed on the contact unit 300a, And a coupling portion 600a for mechanically or physically coupling the protection portion 400. [

The electric shock protection contactor 1000 according to the sixth embodiment includes capacitor units 500a and 500b, an ESD protection unit 400 and connection blocks 700a and 700b similar to the second embodiment shown in FIG. 6 And a coupling portion 600b having a coupling function is used instead of the conductive layered structure.

The structure including the capacitor units 500a and 500b, the ESD protection unit 400 and the connection blocks 700a and 700b positioned between the contact unit 300a and the circuit board 20 is referred to as an electric shock protection unit 50). That is, the electric shock protection unit 50 according to the sixth embodiment includes the first and second capacitor units 500a and 500b spaced apart from each other, and the first capacitor unit 500a and the second capacitor unit 500b, The ESD protection unit 400 is disposed between the first capacitor unit 500a and the ESD protection unit 400 and has one side and the other side connected to the first capacitor unit 500a and the ESD protection unit 400 The ESD protection unit 400 is disposed between the first connection block 700a and the second capacitor unit 500b and the ESD protection unit 400. The ESD protection unit 400 includes a first capacitor unit 500b and a second capacitor unit 500b, And a second connection block 700b formed to be connected to the second connection block 700b.

That is, each of the first region A1 and the second region A2 according to the sixth embodiment includes first and second capacitor units 500a and 500b, an ESD protection unit 400, first and second capacitor units 500a and 500b, And connection blocks 700a and 700b. In other words, the first and second capacitor units 500a and 500b, the ESD protection unit 400, and the first and second connection blocks 700a and 700b are formed in the first area A1 and the second area A2, respectively. 700b are formed. That is, the first capacitor unit 500a is formed over the first area A1 and the second area A2, and the second capacitor unit 500b is formed over the first area A1 and the second area A2. And the ESD protection portion 400 is formed over the first region A1 and the second region A2. The first connection block 700a is formed over the first region A1 and the second connection block 700b is formed over the first region A1 and the second region A2, become. The first capacitor unit 500a, the first connection block 700a, the ESD protection unit 400, the second connection block 700b, and the second capacitor unit 500b are arranged in the first direction.

In other words, the overall shape of each of the first and second capacitor units 500a and 500b, the ESD protection unit 400, and the first and second connection blocks 700a and 700b is an alphabetical "T" The overall shape in which the first and second capacitor units 500a and 500b, the ESD protection unit, and the first and second connection blocks 700a and 700b are connected is an alphabetical "T"

The coupling portion 600b includes upper and side portions of the pair of capacitor portions 500a and 500b, a protruding region P protruding in the Y axis direction, upper and side portions of the ESD protection portion 400, So that the protruding area P protruding from the protruding area P can be grasped.

That is, the upper fastening member 610 of the coupling portion 600b has a protruding region P in each of the pair of capacitor portions 500, the ESD protection portion 400, and the first and second connection blocks 700a and 700b. And the lower fastening member 630 is fastened to the lower portion corresponding to the protruding region P. The upper and lower fastening members 620,

In other words, the coupling portion 600b is fastened so as to grip the protruding region P of the electric shock protection portion 50. The edge of the upper fastening member 610 is connected to the upper surface of the projecting region P, The lower fixing member 630 is engaged with the lower surface of the protruding area P and the lower fixing member 630 is coupled with the lower surface of the protruding area P.

The capacitor units 500a and 500b and the ESD protection unit 400 may be formed of the same material as that of the letter "A " in order to apply the coupling unit 600b having a fastening function in the electric protection protection contactor according to the fifth and sixth embodiments, T "shape.

However, the present invention is not limited to this. As in the case of the seventh embodiment shown in FIGS. 17 to 19, a connection part (for example, a capacitor) 500a and 500b and a ESD protection part 400 800) may be further formed to have a "T" shape.

That is, the shock protection contactor 1000 according to the seventh embodiment includes a contact portion 300a that is in electrical contact with the case 10 of the electronic device and has elasticity, a contact portion 300a between the contact portion 300a and the circuit board 20 First and second capacitor units 500a and 500b spaced from each other in the width direction (left and right direction) and connected to the case 10 and the circuit board 20, first and second capacitor units 500a and 500b, 500b and an ESD formed between the first capacitor unit 500a and the second capacitor unit 500b so as to be connected to the case 10 and the circuit board 20, A first connection block 700a formed to connect the protection unit 400 and the first capacitor unit 500a to the ESD protection unit 400 and a second connection block 700b connected between the first capacitor unit 500a and the ESD protection unit 400 The capacitor units 500a and 500b, the ESD protection unit 400, the first and second connection blocks 700a and 700b, and the circuit board 20, The ESD protection unit 400 and the first and second connecting blocks 700a and 700b and the other side of the ESD protection unit 400 is connected to the circuit board 20 by the capacitor unit 500a and 500b, And includes a connection portion 800. The capacitor unit 500a and 500b, the ESD protection unit 400, and the coupling unit 600b mechanically coupling the first and second connection blocks 700a and 700b to the contact unit.

That is, the shock-protective contactor 1000 according to the seventh embodiment further includes a connecting portion 800 in the shock-protective contactor 1000 according to the second embodiment shown in FIG. 6, (600a) is removed, and a coupling portion (600b) as a mechanical coupling means is provided.

The ESD protection unit 400 includes the capacitor units 500a and 500b disposed between the contact unit 300a and the circuit board 20 and the connection blocks 700a and 700b and the connection unit 800. [ Is referred to as an electric shock protection portion (50). That is, the electric shock protection unit 50 according to the seventh embodiment includes first and second capacitor units 500a and 500b spaced apart from each other, an ESD protection unit 400 formed between the first capacitor unit and the second capacitor, And a first connection block 500 disposed between the first capacitor unit 500a and the ESD protection unit 400 and having one side surface and the other side connected to the first capacitor unit 500a and the ESD protection unit 400, And the ESD protection unit 400. The ESD protection unit 400 includes a first capacitor unit 500a and a second capacitor unit 500b. The first capacitor unit 500b and the ESD protection unit 400 are connected to the second capacitor unit 500b and the ESD protection unit 400, respectively. 2 connection block 700b and the lower portion of the first capacitor unit 500a, the first connection block 700a, the ESD protection unit 400, the second connection block 700b and the second capacitor unit 500b And includes a connection portion 800.

The overall shape of the electric shock protection portion 50 according to the embodiment is configured in an approximately alphabetical "T" shape to have a protruding region.

That is, the first region A1 according to the seventh embodiment includes the first and second capacitor units 500a and 500b, the ESD protection unit 400, and the first and second connection blocks 700a and 700b . In other words, the first and second capacitor units 500a and 500b, the ESD protection unit 400, and the first and second connection blocks 700a and 700b are formed in the first region A1. The first capacitor unit 500a, the first connection block 700a, the ESD protection unit 400, the second connection block 700b, and the second capacitor unit 500b are arranged in the first direction.

A connection portion 800 is formed in the second region A2.

The ESD protection unit 400 and the first and second connection blocks 700a and 700b are connected to a connection unit 800. The ESD protection unit 400 includes first and second capacitor units 500a and 500b, ) Are connected in an alphabetical "T " shape. The length of the connection part 800 in the Y axis direction is the length of the first capacitor part 500a, the first connection block 700a, the ESD protection part 400, the second connection block 700b and the second capacitor part 500b are arranged in the order of the Y-axis direction and the Y-axis direction. Thus, the protruding regions P are provided in the both side directions of the support portion 800 in the Y-axis direction.

The coupling portion 600b is connected to the upper and side portions of the first capacitor portion 500a, the first connection block 700a, the ESD protection portion 400, the second connection block 700b, and the second capacitor portion 500b, , And a protruding region (P) protruding in the Y-axis direction can be grasped. That is, the engaging portion 600b is fastened to grip the protruding region P of the electric shock protection portion 50. The edge of the upper fastening member 610 is connected to the upper surface of the projecting region P, the side fastening member 620, And the lower fastening member 630 is engaged with the lower surface of the protruding area P.

The connection unit 800 includes the capacitor units 500a and 500b, the ESD protection unit 400, the connection member 810 extending in the left and right direction from the lower portion of the first and second connection blocks 700a and 700b, Connecting electrodes (hereinafter referred to as first and second capacitor connecting electrodes 820a and 820b) formed to electrically connect the first and second capacitor units 500a and 500b and the circuit board 20, And a connecting electrode (hereinafter, ESD connecting electrode 830) formed on the member 810 and formed to electrically connect the ESD protection unit 400 and the circuit board 20.

The connecting member 810 may be formed of any one of a dielectric material having a dielectric constant, for example, a dielectric constant of 10 to 20,000, or a varistor. Further, the laminate may be constituted by stacking a plurality of dielectric sheets a plurality of times.

The length of the connecting member 810 of the connecting portion 800 in the left and right direction is the same as that of the connecting portion 800 of the first capacitor 500a, the first connecting block 700a, the ESD protecting portion 400, the second connecting block 700b, It is preferable that the capacitor portions 500b are formed to be shorter than the interconnected lengths arranged in one direction.

The connection member 810 of the connection unit 800 may include a first capacitor unit 500a, a first connection block 700a, an ESD protection unit 400, a second connection block 700b, a second capacitor unit 500b The first capacitor unit 500a and the second capacitor unit 500b protrude in both directions of the connection member 810 of the connection unit 800. [

The first capacitor electrode 820a is an electrode for connecting the first capacitor unit 500a and the circuit board 20 and extends in the vertical direction in the connecting member 810. One end of the first capacitor electrode 820a is connected to the first capacitor unit 500a, A first connection electrode 821a connected to the second external electrode 522 of the connection member 810 and a second connection electrode 822a formed to be connected to the first connection electrode 821a and the circuit board 20 on the lower surface of the connection member 810, .

The second capacitor electrode 820b is an electrode that connects the second capacitor unit 500b and the circuit board 20 and extends in the vertical direction in the connecting member 810. The second capacitor electrode 820b has one end connected to the second capacitor unit A first connection electrode 821b connected to the second external electrode 522 of the connection member 810 and a second connection electrode 821b formed on the lower surface of the connection member 810 and connected to the circuit board 20, 822b.

The ESD connection electrode 830 is an electrode for connecting the ESD protection unit 400 and the circuit board 20 and extends in the vertical direction in the connection member 810. One end of the electrode extends in the second direction of the ESD protection unit 400 A first connecting electrode 831 connected to the external electrode 422 and a second connecting electrode 832 connected to the first connecting electrode 831 and the circuit board 20 on the lower surface of the connecting member 810 .

In this connection portion 800, the first connection electrodes 821a and 821b of the first and second capacitor connection electrodes 820a and 820b and the first connection 810b of the ESD connection electrode 830 are connected to each other in the connection member 810, The electrodes 831 are spaced apart from each other in the width direction of the connecting member 810.

The second connection electrodes 822a and 822b of the first and second capacitor connection electrodes 820a and 820b and the second connection electrode 832 of the ESD connection electrode 830 are connected to the connection member 810 Direction.

The first and second connection electrodes 821a, 821b, 822a and 822b of the first and second capacitor connection electrodes 820a and 820b and the first and second connection electrodes 831 and 322 of the ESD connection electrode 830 ) May be formed of at least one of Ag, Ag / Pd, Cu, Pd, Au, and Al.

The coupling portion 600b may be formed of a conductive material, for example, copper (Cu). The external communication signal flowing into the contact unit 300a passes through the first capacitor unit 500a and the second capacitor unit 500b through the coupling unit 600b as the conductive unit and is connected to the first And the second capacitor connecting electrodes 820a and 820b.

An overvoltage or an ESD voltage higher than the discharge start voltage flowing through the case 10 and the contact portion 300a from the outside is bypassed to the ground via the ESD protection unit 400 and the ESD connection electrode 830 . The electrostatic voltage introduced through the internal circuit of the circuit board 10 is cut off by the ESD protection unit.

In the seventh embodiment, the connection part 800 is formed under the two capacitor parts 500a and 500b, one ESD protection part 400, and the first and second connection blocks 700a and 700b. .

However, the present invention is not limited to this, and a connection portion may be formed under one capacitor portion 500 and one ESD protection portion 400.

For example, the ESD protection unit 400 may include one capacitor unit 500 and one ESD protection unit 400, as in the first modification of the seventh embodiment shown in FIG. 20, And may be formed on one side or offset on one side between the circuit board 20 and the unit 300a. That is, the ESD protection unit 400 is formed on one side between the contact unit 300a and the circuit board 20, and the capacitor unit 500 is extended from the other side in the direction in which the ESD protection unit 400 is located . A connection block 700 is formed between the capacitor unit 500 and the ESD protection unit 400 and is connected to the capacitor unit 500 and the ESD protection unit 400.

The connecting portion 800 is formed on the connecting portion 810 and the connecting portion 810 extending from the lower portion of the connecting block 700 in the left and right directions. The capacitor portion 500, the ESD protecting portion 400, (Hereinafter referred to as a capacitor connecting electrode 820) and a connecting member 810 formed to electrically connect the ESD protection unit 400 and the circuit board 20 (Hereinafter referred to as an ESD connecting electrode 830).

The capacitor electrode 820 is an electrode for connecting the capacitor unit 500 and the circuit board 20 and extends in the vertical direction in the connecting member 810. One end of the capacitor electrode 820 is connected to the second external electrode of the capacitor unit 500 And a second connection electrode 822 connected to the first connection electrode 821 and the circuit board 20 on the lower surface of the connection member 810. The first connection electrode 821 and the second connection electrode 822 are connected to each other.

The ESD connection electrode 830 is an electrode for connecting the ESD protection unit 400 and the circuit board 20 and extends in the vertical direction in the connection member 810. One end of the electrode extends in the second direction of the ESD protection unit 400 A first connecting electrode 831 connected to the external electrode 422 and a second connecting electrode 832 connected to the first connecting electrode 831 and the circuit board 20 on the lower surface of the connecting member 810 .

The first connection electrode 821 of the capacitor connection electrode 820 and the first connection electrode 831 of the ESD connection electrode 830 are electrically connected to the connection member 810 in the connection member 810. [ Are spaced apart from each other in the width direction. The second connecting electrode 822 of the capacitor connecting electrode 820 and the second connecting electrode 832 of the ESD connecting electrode 830 are spaced apart from each other in the width direction of the connecting member 810.

An external communication signal input to the contact unit 300a passes through the capacitor unit 500 through the coupling unit 600b as a conductive member and is connected to the capacitor connection of the connection unit 800. [ And is input to the circuit board 20 through the electrode 820.

An overvoltage or an ESD voltage higher than the discharge start voltage flowing through the case 10 and the contact portion 300a from the outside is bypassed to the ground via the ESD protection unit 400 and the ESD connection electrode 830 . The ESD protection unit 400 blocks the electrostatic voltage flowing through the internal circuit of the circuit board 10. [

In the first modification of the seventh embodiment described above, the capacitor portion 500 and the ESD protection portion 400 are formed in the first region A1 and the connection portion 800 is formed in the second region A2 .

21, a connection portion 800 is formed in the first region A1 and an ESD protection portion 400 is formed in the second region A2. In this case, And a capacitor unit 500 may be formed.

In the fifth and sixth embodiments, the capacitor portion and the ESD protection portion are formed over the first region and the second region. In the seventh embodiment, the capacitor portion and the ESD protection portion are formed in the first region, The connection portion is formed.

However, the present invention is not limited thereto, and the capacitor portion and the ESD protection portion may be formed in at least one of the first region and the second region, and the formation position thereof is formed so as not to overlap in the left-right direction (or the width direction).

22, the ESD protection unit 400 is formed in the first area A1, the capacitor unit 500 is formed in the second area A2, and the ESD protection unit 400 is formed in the second area A2. The protective portion 400 and the capacitor portion 500 are formed so as not to overlap with each other in the lateral width direction (e.g., the X-axis direction). For example, the ESD protection part 400 is formed to be positioned on the right side of the first area A1, and the capacitor part 500 is formed to be offset to the left side in the second area A2. A first connection part 900a is formed in the first area A1 to be connected to one side of the ESD protection part 400 and electrically connected to the capacitor part 500 formed in the second area A2, The second connection part 900b is formed to be electrically connected to the ESD protection part 400 formed in the first area A1 and connected to one side of the capacitor part 500 in the second area A2.

The first connection part 900a is connected to the ESD stack body 410 in the lateral direction of the ESD multilayer body 410 and includes a first connection member 910a formed to correspond to the capacitor part 500 located at the lower side, A first connection electrode (hereinafter, referred to as a first capacitor connection electrode 921a) formed to be electrically connected to the contact portion on the upper surface of the first connection member 910a, a first connection electrode 921b which is one end in the first connection member 910a, And a second connection electrode (hereinafter referred to as a second capacitor connection electrode 922a) which is connected to the connection electrode 921a and whose other end is connected to the first external electrode 521 of the capacitor unit 500. Here, the first capacitor connecting electrode 921a is formed to be spaced apart from the first external electrode 421 of the ESD protection unit 400.

The second connection unit 900b is connected to the capacitor laminate 510 in the lateral direction of the capacitor stack body 510 and is connected to the second connection member 900 formed to correspond to the ESD protection unit 400 positioned on the upper side. A first connection electrode (hereinafter referred to as a first ESD connection electrode 921b) formed in the second connection member 910b so that one end thereof is connected to the second external electrode 422 of the ESD protection unit 400, A second connection electrode (hereinafter referred to as a second ESD connection electrode 922b) formed at one end of the lower surface of the second connection member 910b and connected to the first ESD connection electrode 921b and the other end of the connection electrode 910b, . The second ESD connection electrode 922b is spaced apart from the second external electrode 522 of the capacitor unit 500 and is formed to correspond to the grounding portion of the circuit board 20.

The first and second connecting members 910a and 910b may be a structure in which a plurality of insulating sheets are laminated, and the insulating sheet may be a dielectric sheet having a predetermined permittivity, for example, 10-20000.

The lengths of the ESD protection unit 400 and the first connection unit 900a formed in the first area A1 in the second direction are interconnected in the second area A2 by the capacitor unit 500 and the ESD protection unit 400, Is shorter than the length of the second connection portion 900b in the second direction, and the overall external shape is an English alphabet 'T' character.

According to the electric shock protection contactor of the eighth embodiment, the electric shock voltage transmitted from the circuit board 20 is transmitted to the ESD protection unit 400 through the second connection unit 900b and is interrupted. The overvoltage or the electrostatic voltage, which is higher than the discharge start voltage flowing through the case (or the conductor) and the contact portion 300a from the outside, bypasses the ground through the ESD protection unit 400 and the second connection unit 900b. do.

In the above description, the first and second connection portions 900a and 900b are formed separately from the ESD protection portion 400 and the capacitor portion 500. [ However, the present invention is not limited thereto. First and second capacitor connecting electrodes 921a and 922b are formed in the ESD laminate 410, and first and second ESD connecting electrodes 921b and 922b May be formed (not shown).

The ESD protection region in which the ESD protection layer 430 is formed between the first and second internal electrodes 423 and 424 in the ESD protection unit 400 and the ESD protection region in which the capacitor C of the capacitor unit 500 is formed For example, the X-direction forming positions are not overlapped with each other. For example, the ESD protection region of the ESD protection unit 400 may be formed on the right side of the first region A1 and the capacitor C may be on the left side of the second region A2.

This is because the first and second internal electrodes 423 and 424 and the ESD protection layer 430 are formed on the right side of the center of the ESD stack body 410 when the ESD protection unit 400 is formed, The first and second external electrodes 421 and 422 may be formed on the outer surface of the body 410 so as to be connected to the first and second internal electrodes 423 and 424. The capacitor unit 500 includes first and second internal electrodes 523 and 524 formed on the right side with respect to the center of the capacitor stack body 510 and first and second internal electrodes 523 and 524 on the external surface of the capacitor stack body 510. [ 2 inner electrodes 523 and 524. The first and second outer electrodes 521 and 522 are connected to the first and second inner electrodes 523 and 524, respectively.

The first and second capacitor connecting electrodes 921a and 922a are formed to be electrically connected to the capacitor unit 500 formed in the second region A2 in the ESD multilayer body 410 formed in the first region A1 do. The first and second ESD connection electrodes 921b and 921b are electrically connected to the ESD protection unit 400 formed in the first region A1 on the capacitor stack body 510 formed in the second region A2. .

The antenna signal inputted from the outside is transmitted to the capacitor unit 500 through the first and second capacitor connecting electrodes 921a and 922a formed in the ESD laminate body 410 and inputted to the circuit board 20. The electrostatic voltage transmitted from the circuit board 20 is transmitted to the ESD protection unit 400 through the first and second ESD connection electrodes 921b and 922b formed in the capacitor stack body 510 to be cut off. The overvoltage or the electrostatic voltage of the ESD protection unit 400 and the capacitors stacked body 510, which are generated by the ESD protection unit 400 and the capacitor unit body 510, 2 ESD connection electrodes 921b and 922b to the ground.

The ESD protection part 400 is formed in the first area A1 and the capacitor part 500 is formed in the second area A2. 23, the capacitor section 500 is formed in the first area A1 and the ESD protection section 400 is formed in the second area A2. In this case, May be formed.

The first connection part 900a is formed to be electrically connected to the ESD protection part 400 formed in the second area A2 and connected to one side of the capacitor part 500 in the first area A1, The second connection portion 900b is formed in the second region A2 to be connected to one side of the ESD protection portion 400 and electrically connected to the capacitor portion 400 formed in the first region A1. The first and second connection electrodes 922a and 922b of the first connection unit 900a are ESD connection electrodes and the first and second connection electrodes 921b and 922b of the second connection unit 900b are capacitor connection electrodes .

In the eighth and eighth embodiments described above, one capacitor portion and an ESD protection portion are formed. However, the present invention is not limited thereto, and a plurality of ESD protection portions and capacitor portions may be provided in at least one of the first region and the second region.

As described above, the ESD protection contactor 1000 according to the embodiments of the present invention is formed such that the capacitor portions 500a and 500b and the ESD protection portion 400 are formed at the same height or on the same plane. That is, the ESD protection parts 500a and 500b and the capacitor part 400 according to the embodiment are arranged in the vertical direction so that the ESD protection parts 500a and 500b are not overlapped with each other in the width direction, but the ESD protection parts 500a and 500b are formed between the contact part 300a and the circuit board 20 Are spaced apart from one another so as to be arranged in the width direction, and are formed so as not to overlap the widthwise positions.

The ESD protection unit 400 formed in this way bypasses the ESD voltage to the ground so as to prevent the internal circuit from being damaged by the static electricity. The ESD protection unit 400 cuts off the electric current below the electric shock voltage or the breakdown voltage, .

Also, as the communication signal inputted from the outside is received or passed through the capacitor unit 500a, 500b or 500, the attenuation of the signal can be reduced or minimized.

Further, the capacitor unit 500a, 500b or 500 and the ESD protection unit 400 are separately provided, and each of the capacitor units 500a, 500b, or 500 is formed between the conductor and the circuit board. In other words, the capacitor unit 500a, 500b or 500 and the ESD protection unit are formed together so that the capacitor unit 500a, 500b or 500 and the ESD protection unit 400 are overlapped with each other. simple. Therefore, the manufacturing time can be reduced.

10: Case 20: Circuit board
300a, 300b: contact part 400: ESD protection part
500, 500a, 500b: capacitor parts 600a, 600b:
700, 700a, 700b: connection block 800: connection
820, 820a, 820b: capacitor connecting electrode
830: ESD connecting electrode
821a, 821b 831: first connecting electrode
822a, 822b 832: a second connecting electrode

Claims (24)

A contact portion contacting the conductor of the electronic device and having an elastic force;
An ESD protection part positioned between the contact part and the circuit board spaced apart from the contact part; And
A capacitor portion positioned between the contact portion and the circuit board in a lateral direction of the ESD protection portion;
And an electric contact. The method according to claim 1,
Wherein one end of each of the capacitor portion and the ESD protection portion is connected to the contact portion and the other end is connected to the circuit board. The method of claim 2,
Wherein the capacitor portion includes a capacitor having internal electrodes facing each other, and wherein the capacitor does not overlap the ESD protection portion. The method of claim 3,
Wherein the capacitor portion and the ESD protection portion are formed at the same height. The method of claim 4,
Wherein the capacitor unit includes a plurality of capacitor units located at one side and the other side of the ESD protection unit,
At least one ESD guard is formed between the plurality of capacitors,
Wherein the plurality of capacitor portions and the ESD protection portion are formed on the same plane. The method of claim 4,
Wherein the ESD protection unit is formed at one side in the width direction between the contact unit and the circuit board,
And the capacitor portion is formed on the other side. The method of claim 2,
Wherein the capacitor portion and the ESD protection portion are spaced apart from each other, and the spacing space is an empty space. The method of claim 2,
The capacitor portion and the ESD protection portion are spaced apart from each other, a connection block is formed in the spacing space,
And the connection block is connected to the capacitor portion and the ESD protection portion. The method of claim 8,
Wherein the connection block comprises at least one of a dielectric, a ceramic, and a varistor. The method according to claim 1,
And a connection portion formed between the capacitor portion and the ESD protection portion and the circuit board,
One side of the connecting portion is connected to the circuit board,
Wherein the connection portion comprises at least one of a dielectric, a ceramic, and a varistor. The method according to any one of claims 1 to 10,
Wherein the ESD protection unit is at least one of a suppressor type including a discharge material and a varistor type. The method according to any one of claims 1 to 10,
And an ESD protection unit coupled to the contact unit, the ESD protection unit including a coupling part including a conductive material. The method of claim 12,
Wherein the coupling portion comprises a conductive bonding agent and is positioned between the capacitor portion and the ESD protection portion and the contact portion to bond the capacitor portion and the ESD protection portion to the contact portion. The method of claim 12,
Wherein the coupling portion includes at least one of a capacitor portion and an ESD protection portion and a coupling member which is coupled to the contact portion and mechanically couples the capacitor portion and the ESD protection portion to the contact portion,
Wherein the coupling portion including the coupling member is electrically connected to the capacitor portion and the ESD protection portion. A contact portion contacting the conductor of the electronic device and having an elastic force;
Each of which is disposed between the contact portion and the circuit board spaced apart from the contact portion and each having one side electrically connected to the contact portion and the other side electrically connected to the circuit board, An electric shock protection unit having an ESD protection unit;
A coupling portion connected to the contact portion and holding at least a part of the electric shock protection portion to be coupled to the contact portion, the coupling portion including a conductive material;
And an electric contact. 16. The method of claim 15,
The shape of the shock-
A first region extending in the first direction and a second region extending in the first direction so as to correspond to the first region and being located below the first region,
Wherein a length of a second direction intersecting with the first direction of the first region is formed to be longer than a length of the second direction of the second region, Formed on the substrate,
Each of the capacitor portion and the ESD protection portion is formed in at least one of the first region and the second region,
And the engaging portion is fastened to grip at least a protruding region of the first region. 18. The method of claim 16,
Wherein the capacitor portion and the ESD protection portion are formed in the first region and the second region, respectively,
And the coupling portion is fastened to grip at least one of the capacitor portion and the ESD protection portion formed corresponding to the protruding region of the first region. 18. The method of claim 16,
And the ESD protection part is formed in the first area,
And the ESD protection unit is formed in the second region,
A first region and a second region of the capacitor portion and the ESD protection portion are formed differently from each other,
Wherein the coupling portion is engaged with one of the capacitor portion and the ESD protection portion formed in the first region. 18. The method of claim 16,
A connection portion formed to be connected to any one of the capacitor portion and the ESD protection portion in the first region and the capacitor portion and the ESD protection portion in the first region,
And the ESD protection unit is formed in the second region,
A first region and a second region of the capacitor portion and the ESD protection portion are formed differently from each other,
Wherein the coupling portion is engaged with at least one of the capacitor portion, the ESD protection portion, and the connection portion formed in the first region. 18. The method of claim 16,
The capacitor portion and the ESD protection portion are formed in the first region so as to be laterally aligned,
And a connection portion extending in a direction in which the capacitor portion and the ESD protection portion are arranged and arranged in the second region and connected to the circuit board,
The connecting portion
A connection member formed in the second region in a direction in which the capacitor unit and the ESD protection unit are arranged and arranged, the capacitor unit and the ESD protection unit being formed between the circuit substrate and the capacitor unit;
A capacitor connection electrode formed on the connection member, the capacitor connection electrode electrically connecting the capacitor unit and the circuit board; And
An ESD connection electrode formed on the connection member and electrically connecting the ESD protection unit and the circuit board;
And an electric contact. 18. The method of claim 16,
The capacitor portion and the ESD protection portion are formed in the second region so as to be laterally aligned,
And a connection portion extending in a direction in which the capacitor portion and the ESD protection portion are arranged and arranged in the first region and connected to the contact portion,
The connecting portion
A connection member extending from the first region in a direction in which the capacitor portion and the ESD protection portion are arranged and arranged, the connection portion being formed between the capacitor portion and the ESD protection portion and the contact portion;
A capacitor connection electrode formed on the connection member, the capacitor connection electrode electrically connecting the capacitor unit and the contact unit; And
An ESD connection electrode formed on the connection member and electrically connecting the ESD protection unit and the contact unit;
And an electric contact. The method of any one of claims 17, 20 and 21,
Wherein the capacitor portion and the ESD protection portion are spaced apart from each other. 23. The method of claim 22,
Wherein the connection block is formed between the capacitor portion and the ESD protection portion which are mutually spaced apart from each other in the first region, and one side surface and the other side surface are connected to the capacitor portion and the ESD protection portion, respectively. The method according to any one of claims 15 to 23,
A plating layer is formed on at least one of an outer surface of the electric shock protection portion facing the coupling portion and an outer surface facing the circuit board.

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