KR20170070411A - Led lamp structure for lighting - Google Patents

Abstract

The present invention relates to an LED lamp capable of significantly extending the lifetime and use of an LED lamp by designing a component such as an electrolytic capacitor which greatly affects the lifetime of the product according to temperature in an LED lamp to avoid heat, The LED assembly having the LED chips disposed therein; A base having an inner hollow portion and coupled to the LED assembly on one side and a conductive cap supplied from the outside on the other side; A main circuit board fixed to a lower space of the inner hollow portion of the base to convert the power supplied from the conductive cap to a DC power and supply the power to the LED assembly; And an auxiliary circuit board fixed to an upper space of the inner hollow portion of the base to be separated from the main circuit board and having an electrolytic capacitor electrically connected to the main circuit board.

Description

[0001] DESCRIPTION [0002] LED LAMP STRUCTURE FOR LIGHTING [0003]

The present invention relates to an LED lamp capable of significantly extending the lifetime and use of an LED lamp by designing components such as an electrolytic capacitor which greatly affects the lifetime of the product according to temperature in the LED lamp to avoid heat.

Recently, LED technology has been rapidly developed, and as a result, LED lamp has become widely popular as a next-generation lighting fixture. The reason for this is that LED lamps have higher energy efficiency, longer life, and less environmental impact than conventional lighting devices.

Generally, the AC power applied from the outside is rectified by the DC power source and applied to the LED lamp, so that the LED lamp is turned on.

For products that use LEDs as lighting, a power supply unit that converts AC to DC, that is, a switching mode power supply (SMPS), will be used.

The SMPS must use a smoothing circuit to rectify the switching pulse while converting AC to DC and to make it into complete DC. Since the smoothing circuit utilizes the charging and discharging characteristics of the capacitor, the smoothing circuit basically includes the electrolytic capacitor.

However, unlike LED Package Chip, which guarantees high efficiency and long lifetime, the lifetime of converter that drives LED is much lower than the lifetime of LED chip. This is because the lifetime of the most important electrolytic capacitors among the components of the SMPS is drastically deteriorated as the internal temperature rises.

Aluminum electrolytic capacitors use electrolytic solutions as dielectrics. Therefore, deterioration of electrolyte and evaporation (seizure change) are accelerated as temperature rises, resulting in much shorter service life than LED chips. Of course, the higher the internal temperature of the LED lamp, the shorter the service life of the LED converter, and thus the lifetime of the LED chip can not be guaranteed at all.

FIG. 1 shows a circuit board of an LED lamp according to the prior art, in which a converter 11, an electrolytic capacitor 15 and the like are all mounted on one circuit board 10.

That is, all of the converters (SMPS) currently used for LED lamps are constructed by mounting both heat generating components and non-heat generating components on one circuit board 10. The problem with such a structure is that the majority of the heat generated by the LED chip itself and heat generated by the semiconductor, transformer, etc., which are the main components of the converter, exceed 100 ° C. However, these components do not affect the lamp life of 50,000 hours, which is the guaranteed lifetime of the LED lamp, since the maximum operating temperature is usually 150 ° C.

However, the problem is that the electrolytic capacitor 15, which is placed on the same circuit board 10 together, causes the temperature rise of the peripheral components, so that the radiation of air or the lead of the heat- The surface temperature of the electrolytic capacitor rises along with the heat transfer to the lead of the electrolytic capacitor, which has a detrimental effect on the life of the electrolytic capacitor.

That is, the lifespan of the electrolytic capacitor is very important because it is the lifetime of the LED lamp. In general, the lifetime of the electrolytic capacitor is about 7,000 hours in the environment of 105 ° C, which is far below the guaranteed lifetime of the LED lamp. , Hot rooms, etc.), the life of the LED lamp is much more fatal.

Due to such a problem, the electrolytic capacitor may be designed to be replaced by a connector as in Patent Document 1, or an electrolytic capacitor may be added to the side portion as in Patent Document 2 to improve the flicker, Are disclosed. However, this does not suggest a fundamental method for improving the lifetime of the electrolytic capacitor, and it is still a hassle of replacement, and the avoidance design from the internal temperature is insufficient and can not be a fundamental method for extending the life of the product including the electrolytic capacitor.

Korea Patent No. 1529078 Korean Patent No. 1211094

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems of the prior art and it is an object of the present invention to provide an LED lamp converter in which components such as electrolytic capacitors, LED lamp.

Another object of the present invention is to provide an LED lamp in which a component such as an electrolytic capacitor is separately installed in a converter of an LED lamp so as to be avoided from heat, thereby extending the service life of the electrolytic capacitor and greatly increasing the use area of the LED lamp .

According to an aspect of the present invention, there is provided an LED lamp structure including: an LED assembly having a plurality of LED chips arranged on an LED substrate; A base having an inner hollow portion and coupled to the LED assembly on one side and a conductive cap supplied from the outside on the other side; A main circuit board fixed to a lower space of the inner hollow portion of the base to convert the power supplied from the conductive cap to a DC power and supply the power to the LED assembly; And an auxiliary circuit board fixed to an upper space of the inner hollow portion of the base to be separated from the main circuit board and having an electrolytic capacitor electrically connected to the main circuit board.

Further, the auxiliary circuit board is installed in the upper space inside the conductive cap, and the upper space is narrower than the lower space, and the LED lamp is compact or bulb type.

According to the present invention, the life of the electrolytic capacitor can be extended by at least two times by separating and installing components such as an electrolytic capacitor which greatly affects the lifetime of the product in the converter of the LED lamp, Can also be extended to provide a very high degree of satisfaction to the manufacturer or user.

In addition, as the life span of the product is extended, it directly affects the marketing, it can greatly affect the development of overseas sales and sales, and the user can secure the stable and long life, thereby saving the expenses.

Especially, since it has a remarkable effect on the lifetime of existing products even in a high temperature environment, the range of use of the product can be increased and the market of the LED lamp can be further activated.

1 is a view showing a circuit board of a conventional LED lamp.
2A and 2B are an exploded perspective view and an assembled perspective view illustrating an LED lamp structure according to an embodiment of the present invention.
3 is a perspective view illustrating a base according to an embodiment of the present invention.
FIG. 4 is a cross-sectional view of a base for explaining a separate installation of a circuit board according to an embodiment of the present invention. FIG.
5 is a view showing an example of separation of an electrolytic capacitor according to an embodiment of the present invention.
6 is a view showing a molding state of a base according to an embodiment of the present invention.

It is to be understood that the words or words used in the present specification and claims are not to be construed in a conventional or dictionary sense and that the inventor can properly define the concept of a term in order to describe its invention in the best possible way And should be construed in light of the meanings and concepts consistent with the technical idea of the present invention.

Throughout the specification, when an element is referred to as "comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise. It should be noted that the terms such as " part, "" module, " .

The terms "first "," second ", and the like throughout the specification are intended to distinguish one component from another and should not be limited by these terms. For example, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

It is to be understood that the term "and / or" throughout the specification includes all possible combinations from one or more related items. For example, the meaning of "first item, second item and / or third item" may be presented from two or more of the first, second or third items as well as the first, second or third item It means a combination of all the items that can be.

It is to be understood that when an element is referred to as being "connected" to another element throughout the specification, it may be directly connected to the other element, but other elements may be present in between. Also, other expressions describing the relationship between the components, such as "between" and "between" or "neighboring to" and "directly adjacent to" should be interpreted as well.

Identification codes (e.g., a, b, c, ...) in each step throughout the specification are used for convenience of description, and the identification codes do not limit the order of each step, Unless the context clearly states a particular order, it may take place differently from the stated order. That is, each step may occur in the same order as described, may be performed substantially concurrently, or may be performed in reverse order.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

First, an LED lamp structure for a high luminosity will be discussed with reference to FIGS. 2 to 6. FIG.

2A and 2B are an exploded perspective view illustrating a LED lamp according to an embodiment of the present invention and a combined view thereof. The LED lamp 100 includes an LED assembly 110 and a base 150. The LED lamp 100 shown is a compact type.

The LED assembly 110 is configured such that a plurality of LED chips 113 are arranged in series and in parallel and emit light in accordance with an applied DC voltage. The shape of the LED assembly 110 may vary widely depending on needs and applications. For example, the LED assembly 110 can be manufactured in various forms such as a bulb, a tube, a radial, and a flat, as well as a compact type. The present invention can be applied.

In the LED assembly 110, a plurality of LED substrates 111 are spaced apart at regular intervals with respect to a vertical axis, and LED chips 113 are arranged in series on each LED substrate 111. A chip protecting tube 115 is attached to the outside of the LED substrate 111 and a heat radiating member 119 for cooling the heat generated from the LED chip 113 is formed on the LED substrate 111. Since the structure of the LED assembly 110 is not different from that of the conventional LED assembly 110, detailed description thereof will be omitted.

The base 150 is composed of a housing 151 and a conductive cap 159. The housing 151 is composed of a coupling part 152, a head part 155 and an inner hollow part as shown in FIG. 3, The inner hollow portion consists of a lower space 154 and an upper space 156, respectively.

That is, the housing 151 includes a coupling portion 152 to which the LED assembly 110 is coupled at the lower end of the body, a head portion 155 to which the conductive cap 159 is coupled at the upper end of the housing, And an inner hollow portion 152, 156 in which the inner hollow portions 152, 156 are installed. The conductive cap 159 is spirally coupled to the outside of the head portion 155 of the housing 151 to supply the AC power input from the external socket to the converter.

The base 150 is a basic member to which the LED assembly 110 is coupled, a converter is incorporated in the inner hollow portion, and a conductive cap 159 that supplies external input power to the converter. The shape of the housing 151 may vary depending on the structure of the conductive cap 159 and the LED assembly 110.

3, the lower hollow space 154 is formed wider than the upper space 156 and the outer hollow part of the upper space 156, that is, the head part 155, And a conductive cap 159 is coupled to the conductive cap 159. The base 150 and the LED assembly 110 are fastened to each other by fastening bolts 152. The fastening holes 152 are formed at regular intervals on the lower edge of the housing 151 to fasten the LED assembly 110, Lt; / RTI >

The converter (SMPS) is mounted on the lower space 154 and the upper space 156 of the base as shown in FIG. 4. The converter is divided into a main circuit board 160 and an auxiliary circuit board 170 have. 5, the main circuit board 160 on which the transformer and the electronic parts of the converter 165 are mounted and the auxiliary circuit board 170 on which the electrolytic capacitor 175 is mounted are formed separately from each other.

4, a converter 165 is mounted in the lower space 154 of the base 150 to convert the external AC power applied from the conductive cap 159 to a predetermined DC power and output the LED power to the LED assembly 110 The main circuit board 160 is mounted. Meanwhile, the converter requires at least one electrolytic capacitor in order to convert the AC power to the DC power, and the electrolytic capacitor 175 is mounted on the separate auxiliary circuit board 170 and installed in the upper space 156. That is, the at least one electrolytic capacitor 175 for smoothing AC to DC is separated from the main circuit board 160 and mounted on a separate auxiliary circuit board 170 through which the electrolytic capacitor 175 is connected to the converter 165, As shown in FIG.

Since only the electrolytic capacitor 175 is mounted on the auxiliary circuit board 170, the auxiliary circuit board 170 can be implemented in a smaller size than the main circuit board 160. The auxiliary circuit board 170 can be installed in the upper space 156, which is a narrow space. At this time, in order to improve the assembling property and fixability of the auxiliary circuit board 170, the protrusions 157 may be formed on the inner wall of the upper space 156 at regular intervals, (Not shown) may be formed.

That is, by inserting the groove of the auxiliary circuit board 170 into the protruding step 157 and pushing it into the upper space 156, the mounting and fixing performance can be improved. In the case of the protruding jaws 157, three or more protruding jaws 157 may be provided at regular intervals, but about four protruding jaws 157 may be appropriate considering workability. It is preferable that the height of the projecting step 157 is made larger than the depth of the groove so that the edge of the auxiliary circuit board 170 does not come into contact with the inner wall of the upper space 156, The molding member must be able to flow to the end of the upper space 156 during the molding of the parts 154 and 156, and there must be an installation work space for the tongs and the like.

The auxiliary circuit board 170 having the electrolytic condenser 175 mounted thereon is disposed at a position farther from the LED assembly 110 so that the LED assembly 110 So that the thermal influence of the main circuit board 110 and the main circuit board 160 can be avoided as much as possible. Although not shown, in order to more effectively block the heat transfer from the main circuit board 160 to the auxiliary circuit board 170, a heat insulating plate may be additionally provided between the two boards.

The structure of the present invention is as shown in FIG. 1, in which an electrolytic capacitor 15 is placed on one circuit board 10 and the electrolytic capacitor, which receives the heat of the converter and the heat of the LED as radiation heat, By prior arrangement, it corresponds to a structure that blocks or separates the propagation path of radiant heat while maintaining performance.

Particularly important in the present invention is that the electrolytic capacitor 175 having a low temperature is separated from the main circuit board 160 having a lot of heat sources and installed in the upper space 156 of the base 150 to which the conductive cap 159 is coupled . As the electrolytic capacitor 175 is mounted on the head portion 155 in the base, heat is radiated through the external conductive cap 159 and the socket, thereby further lowering the surface temperature of the electrolytic capacitor.

The inner hollow portions 154 and 156 of the base 150 are subjected to the insulation molding process 200 as shown in FIG. 6 so that the electrolytic condenser 175 can avoid the direct radiant heat transmitted from the lower converter 165 And a part of the heat of the base 150 is discharged to the outside through the molding and the exposed conductive cap 159 to increase the heat avoiding effect. The molding member 200 is injected into the lower space 154 through a filling hole (not shown) of the main circuit board 160 when molding the hollow inside the base 150, The molding member is injected to the end of the upper space 156 through the space between the inner wall of the auxiliary circuit board 170 and the auxiliary circuit board 170 so that the entire inner hollow portion is molded with resin.

Generally, all electrical and electronic products convert AC to DC, and in this process, conversion losses occur, which are caused by heat generation. Particularly, LEDs used in LED lighting show a heat loss of about 10% even with current technology, so research on heat dissipation is still going on.

Unlike other products, lighting has many places to use 24 hours a day, so whether or not to use the technology to extend the service life is a measure of product sales. Guarantee of the lifetime of LED products 5 years or 50,000 hours are now taken for granted, but this is a normal room temperature condition, and there are many places where the environment is worse than expected, and consumers are expecting the same lifetime to be guaranteed in such a high temperature environment. .

In the LED lamp 100, since the life of the electrolytic capacitor 175 is the lifetime of the lamp, specifications of the electrolytic capacitor 175 may be described. For example, if the electrolytic capacitor is labeled "100㎌ 450V 105 ℃ 7,000 hours", it means that 7,000 hours can be used at a maximum of 105 캜 (capacitor surface temperature).

The life (T (H)) of the electrolytic capacitor can be calculated by the following equation.

[Equation]

Tmax is the manufacturer display temperature of the electrolytic capacitor, and Ta is the actual use temperature of the electrolytic capacitor (actual surface temperature of the capacitor).

For example, when the electrolytic capacitor at 105 ° C for 10,000 hours is used at 85 ° C (condenser surface temperature), its lifetime becomes 40,000 hours (10,000 × 2 ^{((105-85) / 10)} ). When the electrolytic capacitor at a temperature of 105 ° C for 10,000 hours is used at 75 ° C (condenser surface temperature), its lifetime becomes 80,000 hours (10,000 × 2 ^{((105-75) / 10)} ).

That is, if the surface temperature of the electrolytic capacitor 175 is reduced by about 10 ° C, its service life is doubled, and if the surface temperature is reduced by 20 ° C, its lifetime is increased by four times. Therefore, even if the temperature of the electrolytic capacitor can be lowered by about 10 占 폚, the lifetime of the capacitor, that is, the lifetime of the LED lamp, can be doubled.

Therefore, in the case of an electrolytic capacitor having a spec of 20,000 hours at 85 ° C, it is only necessary to lower the surface temperature of the electrolytic capacitor by at least 10 ° C in order to ensure the lifetime of the LED lamp to be 40,000 hours even at 85 ° C.

The following table shows the temperature rise test of the LED lamp (45 W compact lamp) according to the present invention. The test was conducted in a state where the external environment was set from 25 캜 to 70 캜. The temperature change was also measured in a state where the installation direction of the LED lamp 100 was changed (horizontal installation and vertical installation (downward)). The temperature measurement position includes a middle middle LED of the LED assembly 110 (Tj = 110 占 폚), a heat sink 119, a Trans and electronic parts of the main circuit board 160, The temperature of the electrolytic capacitor 175 (105 DEG C / 20,000 Hr) of the substrate 170 was measured. The horizontal installation is a case where the LED lamp 100 is installed horizontally on the ground, and the downward vertical installation is a vertical installation where the LED assembly 110 is located below the base 150.

[table]

As can be seen from the above table, the LED lamp 100 shows that the temperature of the component is changed according to the external temperature environment (25 ° C, 50 ° C, 60 ° C, 70 ° C) and the installation method have. According to the test, the surface temperature of the LED assembly 110 during horizontal installation is increased to 84.8 ° C at 25 ° C (external temperature environment) or 121.3 ° C at 70 ° C (external temperature environment) It can be seen that it is increased to 73.8 ° C at room temperature (external temperature environment) or to 95.9 ° C at 70 ° C (external temperature environment).

In addition, under the same conditions, the temperature on the main circuit board 160 side rises more vertically (downward) than the horizontal installation, and the temperature of the LED assembly 110 is higher in the horizontal installation than in the vertical installation .

What is important here is the temperature difference between the components of the main circuit board 160 and the electrolytic capacitor 175. This is because the electronic components and the transformer are installed on the main circuit board 160 and the electrolytic capacitors 175 are installed on the other circuit board 170. As shown in the above table, the surface temperature of the transformer at the vertical installation (downward) is increased to 96.2 ° C. at 50 ° C. (external temperature environment) or to 117.1 ° C. at 70 ° C. (external temperature environment) It can be seen that the temperature is 70.4 ° C at 50 ° C (external temperature environment) and 88.1 ° C at 70 ° C (external temperature environment). If the electrolytic capacitor 175 is installed on the main circuit board 160 as in the conventional case, the temperature distribution similar to that of the transformer or the electronic component is exhibited due to the own heat and the conductive heat of the peripheral components.

By disposing the electrolytic capacitor 175 on the main circuit board 160 in this way, the surface temperature of the electrolytic capacitor 175 is lowered to 10 to 20 degrees Celsius as compared with the transformer or electronic component mounted on the main circuit board 160 Respectively. As can be seen from the lifetime calculation formula, the lifetime of the product is at least two times longer, which can provide a great satisfaction to the manufacturer or the user.

Therefore, according to the present invention, by designing the temperature avoidance of the electrolytic capacitor compared to other company products, it is possible to express the specification of the high temperature use temperature up to 20 ° C or more, and the lifetime of the LED lamp can be guaranteed for a long time even in a high temperature environment. There is an advantage that can be widened further. The present invention can be applied to a compact type lamp (Compact Lamp (6W to 150W) and Bulb Lamp (5W to 15W) which is a converter built-in type lamp.

It is to be understood that the scope of the present invention is not limited by the embodiments of the present invention described above and that the appended drawings illustrate rather than limit the scope of the invention as defined by the appended claims and that the scope of the present invention is not limited thereto. It will be understood by those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention.

100: LED lamp 110: LED assembly
111: LED substrate 113: LED chip
119: Heat sink 150: Base
151: Housing 152:
154: lower space 155: head portion
156: upper space 157: protruding jaw
159: conductive cap 160: main circuit board (converter)
170: auxiliary circuit board (electrolytic capacitor) 200: molding member

Claims (5)

An LED assembly in which a plurality of LED chips are arranged on an LED substrate;
A base having an inner hollow portion and coupled to the LED assembly on one side and a conductive cap supplied from the outside on the other side;
A main circuit board fixed to a lower space of the inner hollow portion of the base to convert the power supplied from the conductive cap to a DC power and supply the power to the LED assembly; And
And an auxiliary circuit board fixed to an upper space of an inner hollow portion of the base to be separated from the main circuit board and having an electrolytic capacitor electrically connected to the main circuit board.
The method according to claim 1,
Wherein the auxiliary circuit board is installed in an upper space inside the conductive cap, and the upper space is narrower than the lower space.
The method according to claim 1,
Wherein the LED lamp is a compact or bulb type lamp.
The method according to claim 1,
Wherein a molding member is filled in the inner hollow portion of the base to waterproof and insulate the main circuit board and the auxiliary circuit board.
The method according to claim 1,
Wherein a plurality of protrusions are formed at a predetermined interval in an inner upper space of the base to be spaced apart from an inner wall of the upper space when the auxiliary circuit board is inserted.

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