KR20160020484A - Method for producing aliphatic or partially aromatic polyamides, said method comprising a solid-phase polymerization process - Google Patents
Method for producing aliphatic or partially aromatic polyamides, said method comprising a solid-phase polymerization processInfo
- Publication number
- KR20160020484A KR20160020484A KR1020167000650A KR20167000650A KR20160020484A KR 20160020484 A KR20160020484 A KR 20160020484A KR 1020167000650 A KR1020167000650 A KR 1020167000650A KR 20167000650 A KR20167000650 A KR 20167000650A KR 20160020484 A KR20160020484 A KR 20160020484A
- Authority
- KR
- South Korea
- Prior art keywords
- polyamide
- acid
- ipda
- aliphatic
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 47
- 229920006012 semi-aromatic polyamide Polymers 0.000 title claims abstract description 45
- 229920003231 aliphatic polyamide Polymers 0.000 title claims abstract description 31
- 125000001931 aliphatic group Chemical group 0.000 title claims abstract description 27
- 238000006116 polymerization reaction Methods 0.000 title claims description 22
- 239000007790 solid phase Substances 0.000 title claims description 19
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 239000004952 Polyamide Substances 0.000 claims abstract description 67
- 229920002647 polyamide Polymers 0.000 claims abstract description 67
- 229920002292 Nylon 6 Polymers 0.000 claims description 82
- 239000000203 mixture Substances 0.000 claims description 58
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 claims description 36
- -1 alicyclic dicarboxylic acids Chemical class 0.000 claims description 35
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 33
- 238000000465 moulding Methods 0.000 claims description 32
- 239000000835 fiber Substances 0.000 claims description 28
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 claims description 18
- 239000004953 Aliphatic polyamide Substances 0.000 claims description 13
- 125000003118 aryl group Chemical group 0.000 claims description 13
- 229920000299 Nylon 12 Polymers 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 10
- 239000000654 additive Substances 0.000 claims description 8
- 150000003951 lactams Chemical class 0.000 claims description 7
- 150000002763 monocarboxylic acids Chemical class 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 6
- 150000001412 amines Chemical class 0.000 claims description 5
- 239000012744 reinforcing agent Substances 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 4
- 150000004984 aromatic diamines Chemical class 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000004753 textile Substances 0.000 claims description 3
- 230000000996 additive effect Effects 0.000 claims description 2
- 229920006119 nylon 10T Polymers 0.000 claims description 2
- YQYUWUKDEVZFDB-UHFFFAOYSA-N mmda Chemical compound COC1=CC(CC(C)N)=CC2=C1OCO2 YQYUWUKDEVZFDB-UHFFFAOYSA-N 0.000 claims 1
- 229920006117 poly(hexamethylene terephthalamide)-co- polycaprolactam Polymers 0.000 claims 1
- 229920000642 polymer Polymers 0.000 description 17
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 15
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 15
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 14
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 13
- 150000004985 diamines Chemical class 0.000 description 12
- 239000003063 flame retardant Substances 0.000 description 12
- 238000002360 preparation method Methods 0.000 description 12
- 239000003381 stabilizer Substances 0.000 description 12
- 239000003054 catalyst Substances 0.000 description 11
- 239000003365 glass fiber Substances 0.000 description 11
- 239000010949 copper Substances 0.000 description 10
- 239000002245 particle Substances 0.000 description 10
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 9
- 150000002148 esters Chemical class 0.000 description 9
- 150000003839 salts Chemical class 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000005749 Copper compound Substances 0.000 description 8
- 229920002302 Nylon 6,6 Polymers 0.000 description 8
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 8
- 238000009833 condensation Methods 0.000 description 8
- 230000005494 condensation Effects 0.000 description 8
- 150000001880 copper compounds Chemical class 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 8
- 239000000178 monomer Substances 0.000 description 8
- 238000006068 polycondensation reaction Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010408 film Substances 0.000 description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 6
- 239000011261 inert gas Substances 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 235000011054 acetic acid Nutrition 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 150000001991 dicarboxylic acids Chemical class 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 5
- 239000012071 phase Substances 0.000 description 5
- 235000019260 propionic acid Nutrition 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 4
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 239000001361 adipic acid Substances 0.000 description 4
- 235000011037 adipic acid Nutrition 0.000 description 4
- 125000002723 alicyclic group Chemical group 0.000 description 4
- 150000008064 anhydrides Chemical class 0.000 description 4
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 4
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 4
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 4
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 4
- 239000012760 heat stabilizer Substances 0.000 description 4
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- DPBLXKKOBLCELK-UHFFFAOYSA-N pentan-1-amine Chemical compound CCCCCN DPBLXKKOBLCELK-UHFFFAOYSA-N 0.000 description 4
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 229920001169 thermoplastic Polymers 0.000 description 4
- 239000004416 thermosoftening plastic Substances 0.000 description 4
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 4
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 4
- IGSBHTZEJMPDSZ-UHFFFAOYSA-N 4-[(4-amino-3-methylcyclohexyl)methyl]-2-methylcyclohexan-1-amine Chemical group C1CC(N)C(C)CC1CC1CC(C)C(N)CC1 IGSBHTZEJMPDSZ-UHFFFAOYSA-N 0.000 description 3
- 239000005711 Benzoic acid Substances 0.000 description 3
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- 229920000305 Nylon 6,10 Polymers 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 3
- 235000020661 alpha-linolenic acid Nutrition 0.000 description 3
- 150000001408 amides Chemical class 0.000 description 3
- 239000002216 antistatic agent Substances 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 235000010233 benzoic acid Nutrition 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 239000004917 carbon fiber Substances 0.000 description 3
- 239000012986 chain transfer agent Substances 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 150000001879 copper Chemical class 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 239000005357 flat glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 229960004488 linolenic acid Drugs 0.000 description 3
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- RTWNYYOXLSILQN-UHFFFAOYSA-N methanediamine Chemical compound NCN RTWNYYOXLSILQN-UHFFFAOYSA-N 0.000 description 3
- 150000002924 oxiranes Chemical class 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 3
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 3
- XRBCRPZXSCBRTK-UHFFFAOYSA-N phosphonous acid Chemical class OPO XRBCRPZXSCBRTK-UHFFFAOYSA-N 0.000 description 3
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 239000012266 salt solution Substances 0.000 description 3
- 150000003336 secondary aromatic amines Chemical class 0.000 description 3
- 229920006024 semi-aromatic copolyamide Polymers 0.000 description 3
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(ii) oxide Chemical class [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 description 3
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 description 2
- BYEAHWXPCBROCE-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropan-2-ol Chemical compound FC(F)(F)C(O)C(F)(F)F BYEAHWXPCBROCE-UHFFFAOYSA-N 0.000 description 2
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 2
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 2
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 2
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- OBETXYAYXDNJHR-UHFFFAOYSA-N 2-Ethylhexanoic acid Chemical compound CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 2
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 description 2
- KBMSFJFLSXLIDJ-UHFFFAOYSA-N 6-aminohexanenitrile Chemical compound NCCCCCC#N KBMSFJFLSXLIDJ-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000004114 Ammonium polyphosphate Substances 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000005639 Lauric acid Substances 0.000 description 2
- 240000006240 Linum usitatissimum Species 0.000 description 2
- 235000004431 Linum usitatissimum Nutrition 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- BHHGXPLMPWCGHP-UHFFFAOYSA-N Phenethylamine Chemical compound NCCC1=CC=CC=C1 BHHGXPLMPWCGHP-UHFFFAOYSA-N 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004954 Polyphthalamide Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 229960002684 aminocaproic acid Drugs 0.000 description 2
- 125000004202 aminomethyl group Chemical group [H]N([H])C([H])([H])* 0.000 description 2
- 235000019826 ammonium polyphosphate Nutrition 0.000 description 2
- 229920001276 ammonium polyphosphate Polymers 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 229920006231 aramid fiber Polymers 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 229920006018 co-polyamide Polymers 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 2
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 2
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- ZJIPHXXDPROMEF-UHFFFAOYSA-N dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O ZJIPHXXDPROMEF-UHFFFAOYSA-N 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 239000002657 fibrous material Substances 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 2
- LELOWRISYMNNSU-UHFFFAOYSA-N hydrogen cyanide Chemical compound N#C LELOWRISYMNNSU-UHFFFAOYSA-N 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 238000012693 lactam polymerization Methods 0.000 description 2
- 150000002611 lead compounds Chemical class 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
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- 238000007142 ring opening reaction Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910021647 smectite Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229960004274 stearic acid Drugs 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 125000003011 styrenyl group Chemical class [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- LTURHSAEWJPFAA-UHFFFAOYSA-N sulfuric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OS(O)(=O)=O.NC1=NC(N)=NC(N)=N1 LTURHSAEWJPFAA-UHFFFAOYSA-N 0.000 description 1
- 150000003503 terephthalic acid derivatives Chemical class 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000003878 thermal aging Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000003017 thermal stabilizer Substances 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- IUTCEZPPWBHGIX-UHFFFAOYSA-N tin(2+) Chemical class [Sn+2] IUTCEZPPWBHGIX-UHFFFAOYSA-N 0.000 description 1
- FBGKGORFGWHADY-UHFFFAOYSA-L tin(2+);dihydroxide Chemical compound O[Sn]O FBGKGORFGWHADY-UHFFFAOYSA-L 0.000 description 1
- 229910021509 tin(II) hydroxide Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- 210000002105 tongue Anatomy 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003623 transition metal compounds Chemical class 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- IVIIAEVMQHEPAY-UHFFFAOYSA-N tridodecyl phosphite Chemical compound CCCCCCCCCCCCOP(OCCCCCCCCCCCC)OCCCCCCCCCCCC IVIIAEVMQHEPAY-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- CNUJLMSKURPSHE-UHFFFAOYSA-N trioctadecyl phosphite Chemical compound CCCCCCCCCCCCCCCCCCOP(OCCCCCCCCCCCCCCCCCC)OCCCCCCCCCCCCCCCCCC CNUJLMSKURPSHE-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000002025 wood fiber Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/28—Preparatory processes
- C08G69/30—Solid state polycondensation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/46—Post-polymerisation treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/04—Polyamides derived from alpha-amino carboxylic acids
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Polyamides (AREA)
Abstract
본 발명은 폴리아미드 프리폴리머를 고상 중합시키는, 지방족 또는 반방향족 폴리아미드의 제조 방법에 관한 것이다.TECHNICAL FIELD The present invention relates to a process for producing an aliphatic or semiaromatic polyamide in which a polyamide prepolymer is solid-state polymerized.
Description
본 발명은 폴리아미드 프리폴리머를 고상 중합시키는, 지방족 또는 반방향족 폴리아미드의 제조 방법에 관한 것이다.TECHNICAL FIELD The present invention relates to a process for producing an aliphatic or semiaromatic polyamide in which a polyamide prepolymer is solid-state polymerized.
폴리아미드는 세계적으로 대규모로 생산되는 중합체 중 하나이며, 필름, 섬유 및 재료에서 용도의 주요 분야 외에, 다수의 추가 최종 용도에 쓸모가 있다. 폴리아미드 중에서, 폴리아미드-6-(폴리카프로락탐) 및 폴리아미드-6,6(나일론, 폴리헥사메틸렌아디프아미드)이 최대량으로 제조되는 중합체이다. 폴리아미드-6,6은 주로 화학양론 양으로 소위 AH 염 용액, 즉 아디프산과 1,6-디아미노헥산(헥사메틸렌디아민)을 포함하는 수용액의 중축합에 의해 제조된다. 폴리아미드-6을 제조하는 종래의 방법은 ε-카프로락탐의 가수분해 개환 중합이며, 여전히 공업적 중요성은 매우 크다. 폴리아미드-6 및 폴리아미드-6,6에 대한 종래의 제조 방법은 예를 들어 문헌[Kunststoffhandbuch, 3/4 Technische Thermoplaste: Polyamide [Plastics Handbook, 3/4 Industrial Thermoplastics: Polyamides], Carl Hanser Verlag, 1998, Munich, p. 42-71]에 기재되어 있다.Polyamides are one of the polymers that are produced on a large scale worldwide and are useful for many additional end uses besides the main fields of application in films, fibers and materials. Among polyamides, polyamido-6- (polycaprolactam) and polyamide-6,6 (nylon, polyhexamethyleneadipamide) are polymers produced in the maximum amount. Polyamide-6,6 is prepared by the polycondensation of an aqueous solution comprising a so-called AH salt solution, namely adipic acid and 1,6-diaminohexane (hexamethylenediamine), in a stoichiometric amount. The conventional method for producing polyamide-6 is the hydrolytic ring-opening polymerization of? -Caprolactam, and still has a very large industrial importance. Conventional production processes for polyamide-6 and polyamide-6,6 are described, for example, in Kunststoffhandbuch, 3/4 Technische Thermoplaste: Polyamide [Plastics Handbook, 3/4 Industrial Thermoplastics: Polyamides], Carl Hanser Verlag, 1998 , Munich, p. 42-71.
폴리아미드의 추가 중요 그룹은 반결정 또는 비정질 열가소성 반방향족 폴리아미드의 그룹이며, 이들 폴리아미드는 중요한 공업용 플라스틱으로서 광범위한 용도가 공지되었다. 이들은 특히 이들의 고온 안정성에 주목할 만하며, 또한 고온 폴리아미드(HTPA)로 언급되고 있다. HTPA의 용도에 대한 중요한 분야는 전기 및 전자 부품의 제조이며, 무연 조건 하의 납땜 조작(무연 납땜)에서 사용하는데 적합한 중합체는 특히 폴리프탈아미드(PPA)를 기초로 한 중합체이다. HTPA는 특히 플러그 커넥터, 마이크로스위치와 마이크로버튼 및 반도체 부품, 예를 들어 발광 다이오드(LED)의 반사기 하우징의 제조에 쓸모가 있다. HTPA의 용도에 대해 추가 중요 분야는 고온 자동차 응용 분야이다. 여기서 중요한 특성은 사용된 중합체의 양호한 열 노화 저항성, 및 높은 강도와 인성 및 용접선 강도이다. 비정질 HTPA 또는 결정 함량이 매우 낮은 HTPA는 투명하며, 투명도가 유리한 응용 분야에 특히 적합하다. 반결정 HTPA는 일반적으로 높은 주위 온도에서 장기간 안정성에 주목할 만하며, 예를 들어 엔진실 에어리어에서의 응용에 적합하다.A further important group of polyamides is the group of semi-crystalline or amorphous thermoplastic semi-aromatic polyamides, and these polyamides are important industrial plastics for a wide range of applications. They are notable for their high temperature stability, and are also referred to as high temperature polyamides (HTPA). An important area for the use of HTPA is the production of electrical and electronic components, and polymers suitable for use in soldering operations (lead-free soldering) under lead-free conditions are, in particular, polyphthalamide (PPA) based polymers. HTPA is particularly useful for manufacturing plug connectors, microswitches and micro button and semiconductor components, for example, the reflector housings of light emitting diodes (LEDs). A further important area of application for HTPA is high temperature automotive applications. Important properties here are good thermal aging resistance of the polymers used, and high strength and toughness and weld line strength. The amorphous HTPA or HTPA with very low crystalline content is transparent and is particularly suitable for applications where transparency is favored. Semi-crystalline HTPA is generally noted for long term stability at high ambient temperatures, and is suitable, for example, for applications in engine room areas.
반방향족 폴리아미드의 제조는 일반적으로 1 이상의 디아민과 1 이상의 디카르복실산, 및 임의로 추가 단량체 성분, 예를 들어 락탐, ω-아미노산, 모노아민, 모노카르복실산 및 이들의 혼합물로부터의 염 수용액의 형성으로 시작되며, 단, 성분 중 1 이상은 방향족 기를 갖는다. 염 용액의 형성 후에는 액상으로의 올리고머화가 이어지며, 이 동안에는 일반적으로 물이 여전히 제거되지 않는다. 이 올리고머화의 종료 시에, 올리고머는 평균 예를 들어 4∼10개의 반복 단위를 갖는다. 분자량을 추가로 증가시키기 위해, 그 다음 2개의 별도 경로가 이용 가능하다. 제1 변형에서, 형성된 올리고머를 탈수에 의해 고체상으로 전환하고, 소위 고체 상태 중합(SSP) 처리한다. 제2 변형에서, 물을 제어된 방식으로 제거하고, 온도를 증가시켜 수용액을 추가 중축합을 위해 용융물로 전환시킨다. 용융물 또는 고상으로의 중합 종료 시에, 수 평균 분자량이 약 500∼12000 g/mol인 프리폴리머가 얻어진다.The preparation of the semi-aromatic polyamides is generally carried out in an aqueous salt solution from one or more diamines and one or more dicarboxylic acids and optionally further monomer components, for example lactam, omega-amino acids, monoamines, monocarboxylic acids and mixtures thereof With the proviso that at least one of the components has an aromatic group. After formation of the salt solution, oligomerization into the liquid phase continues, during which time water is generally still not removed. At the end of this oligomerization, the oligomer has an average of, for example, 4 to 10 repeating units. In order to further increase the molecular weight, the following two separate routes are available. In a first variant, the oligomer formed is converted into a solid by dehydration and is subjected to so-called solid state polymerization (SSP). In a second variant, water is removed in a controlled manner and the temperature is increased to convert the aqueous solution to a melt for further polycondensation. Upon completion of the polymerization to the melt or solid phase, a prepolymer having a number average molecular weight of about 500 to 12000 g / mol is obtained.
유럽특허출원 제0 693 515 A1호에서는 하기 단계 a) 내지 e)를 포함하는 다단계 배치 조작으로 반결정 또는 비정질, 열가소적 가공 가능한 반방향족 폴리아미드의 전 축합물(precondensate)을 제조하는 방법을 기재하고 있다:European Patent Application No. 0 693 515 A1 describes a process for preparing precondensates of semi-crystalline or amorphous, thermoplastic processible semi-aromatic polyamides in a multistage batch operation comprising the following steps a) to e) It has:
a) 디아민(들) 및 디카르복실산(들)로부터 염(들)의 제조를 위한 염 형성 상 및 120℃ 내지 220℃의 온도 및 23 bar 이하의 압력에서 저 분자량 올리고아미드를 제공하는 임의로 부분 전 반응(prereaction),(a) a salt forming phase for the preparation of the salt (s) from the diamine (s) and the dicarboxylic acid (s) and optionally a portion providing a low molecular weight oligomer at a temperature of 120 ° C. to 220 ° C. and a pressure of 23 bar or less. Prereaction,
b) 임의로 단계 a)로부터 용액의 제조 종료 시에 존재하는 조건 하에 제2 반응 용기 또는 교반 오토클레이브로 이 용액의 이동,b) optionally transferring the solution from step a) to a second reaction vessel or stirred autoclave under conditions present at the end of the preparation of the solution,
c) 제공된 온도로 반응기 내용물의 가열 및 제어된 증기 방출 또는 임의로 오토클레이브에 연결된 증기 생성기로부터 증기의 제어된 도입에 의해 유지되는 제공된 값으로 부분 증기 압력의 제어된 조정을 통해, 전 축합물로 전환이 촉진되는 반응 상,c) heating the reactor contents to the furnace temperature and converting to a precondensate via controlled adjustment of the partial steam pressure to a given value, which is maintained by controlled introduction of steam from the steam generator optionally connected to the autoclave, In this accelerated reaction phase,
d) 반응기 내용물의 온도와 부분 증기 압력이 각각 하류 공정 단계로 전 축합물의 이동을 위해 파악된 값으로 설정되는 과정에서, 적어도 10 분간 유지되어야 하는 정지 상태 상으로서,d) a stationary phase which must be maintained for at least 10 minutes in the process of setting the temperature of the reactor contents and the partial steam pressure to values determined for the movement of the precondensate in the downstream processing stage, respectively,
융점이 280℃를 초과하는 반결정 (코)폴리아미드의 전 축합물의 경우에 상 c) 및 d) 동안 반응기 내용물의 온도가 265℃를 초과하지 않아야 하며, 특히, 반응기 내용물의 온도 및 중합체의 아미드기 농도에 대해 사용될 최소 부분 증기 압력 PH2O(최소)의 의존에 관해 더 정확하게 한정된 경계 조건이 상 c) 및 d) 동안 상기 반결정 (코)폴리아미드에 대해 일치되어야 하는 정지 상태 상, 및In the case of a total condensate of semi-crystalline (co) polyamides having a melting point above 280 ° C, the temperature of the reactor contents during phases c) and d) must not exceed 265 ° C, in particular the temperature of the reactor contents and the amide (Co) polyamides during phases c) and d), and more preferably, on the basis of the difference between the minimum partial vapor pressure P H2O
e) 전 축합물이 최종 반응 장치에 용융 상태에서 바로 또는 고체 상태 및 임의로 추가 공정 단계를 통과한 후 공급될 수 있는 배출 상.e) Exhaust phase which can be fed into the final reactor immediately after the molten state has passed the condensation or in the solid state and optionally further processing steps.
소정 고분자량을 얻기 위해, 프리폴리머에 대해 일반적으로 중축합을 실시한다. 이 중축합에 관해서는, 유럽특허출원 제0 693 515 A1호는 구체적인 상세를 포함하지 않는다. 종래 기술을 알아야만 상기 언급된 연속 압출기에서의 중축합이 가능하다.In order to obtain a predetermined high molecular weight, polycondensation is generally carried out for the prepolymer. Regarding this polycondensation, European Patent Application No. 0 693 515 A1 does not contain specific details. The polycondensation in the above-mentioned continuous extruder is possible only when the prior art is known.
독일특허 제41 42 978호에서는 1 층 이상의 코폴리아미드 보호 층과 1 층 이상의 코폴리아미드 차단 층으로 이루어진, 재사용 가능한 포장재용 다층 복합 시스템을 기재하고 있으며, 여기서 사용된 코폴리아미드는 배치식으로 제조된다. 실시예에 의하면, 코폴리아미드는 질소를 살포하면서 압력 오토클레이브에서 용융물로 제조된다. 고상으로의 중축합에 대한 기재는 없다.DE 41 42 978 describes a multilayer composite system for reusable packaging materials consisting of one or more copolyamide protective layers and one or more layers of copolyamide barrier layers, . According to an embodiment, the copolyamide is made into a melt in a pressure autoclave while spraying nitrogen. There is no description about the polycondensation to the solid phase.
국제특허출원 공개 제2004/055084호에서는 적어도 하기 단량체 또는 이들의 전 축합물: a) 테레프탈산, b) 탄소 원자가 44개 이하인 1 이상의 이합체화 지방산 및 c) 화학식 H2N-(CH2)X-NH2(x는 4-18의 정수임)의 1 이상의 지방족 디아민의 축합에 의해 제조된 반결정, 열가소적 가공 가능한, 반방향족 코폴리아미드를 기재하고 있다. 코폴리아미드의 제조를 위해, 공지된 방법을 일반적으로 참조할 뿐이다. 실시예에서, 전축합물에 대해 오토클레이브 내에서 용융물로 후축합을 실시한다. 후축합 동안의 불활성 가스의 사용에 대한 개시는 없다.International Patent Application Publication No. 2004/055084, at least to a monomer or a condensate before: a) terephthalic acid, b) at least one carbon atom less than 44 dimerized fatty acid, and c) the formula H 2 N- (CH 2) X - Thermoplastic processible semiaromatic copolyamides prepared by condensation of one or more aliphatic diamines of the formula NH 2 (x being an integer from 4 to 18). For the preparation of copolyamides, only known methods are generally referred to. In the examples, post condensation is carried out with the melt in an autoclave for all condensates. There is no disclosure of the use of inert gases during post condensation.
미국특허출원 제2003/0176624 A1호는 크실렌디아민을 주성분으로 하는 폴리아미드의 고상 건조 또는 고상 중합을 위한 공정을 기재한다. 이 고상 중합은 불활성 가스 스트림 중에서 또는 감압 하에서 일어난다.U.S. Patent Application No. 2003/0176624 Al describes a process for solid phase drying or solid state polymerization of polyamides based on xylylenediamine. This solid phase polymerization takes place in an inert gas stream or under reduced pressure.
국제특허출원 공개 제2007/048728호는 아미노 말단기 함량이 15 mmol/kg 미만인 아디프산 및 m-크실렌디아민으로부터 형성된 폴리아미드를 기재한다. 프리폴리머를 우선 제조하는데, 이는 임의로 추출 및 고상 축합시킬 수 있다. 감압 하에서 또는 불활성 가스 하에서 고상 축합을 실시할 수 있다.International Patent Application Publication No. 2007/048728 describes polyamides formed from adipic acid and m-xylylenediamine having an amino end group content of less than 15 mmol / kg. The prepolymer is first prepared, which can be optionally extracted and solid-phase condensed. Solid-phase condensation can be carried out under reduced pressure or under an inert gas.
본 발명의 목적은 개선된 지방족 또는 반방향족 폴리아미드의 제조 방법을 제공하는 것이다. 이는 유리한 생성물 특성, 더욱 구체적으로는 너무 넓지 않은 분자량 분포 및/또는 낮은 겔 함량을 특징으로 한다.It is an object of the present invention to provide a process for preparing an improved aliphatic or semiaromatic polyamide. This is characterized by advantageous product properties, more specifically not too broad a molecular weight distribution and / or low gel content.
놀랍게도, 지방족 또는 반방향족 폴리아미드의 프리폴리머에 대해 승압에서 그리고 불활성 가스의 존재 하에 밀폐 용기 내에서 고상 중합을 실시할 때, 이 목적이 달성됨이 밝혀졌다. 고상 중합 동안 용기 내부로부터 환경에의 성분, 구체적으로 물의 배출이 없을 수 있어서, 이는 특히 놀랍다.Surprisingly, it has been found that this object is achieved when the solid phase polymerization is carried out in a sealed vessel at elevated pressure and in the presence of an inert gas for the prepolymer of aliphatic or semiaromatic polyamides. This is particularly surprising since during solid phase polymerization there may be no release of constituents, in particular water, from the interior of the container into the environment.
본 발명은 우선 지방족 또는 반방향족 폴리아미드의 제조 방법으로서,The present invention relates to a process for producing an aliphatic or semiaromatic polyamide,
a) 지방족 또는 반방향족 폴리아미드의 프리폴리머를 제공하고,a) providing a prepolymer of an aliphatic or semiaromatic polyamide,
b) 처리 조건 하에서, 불활성인 가스의 존재 하에, 승온 및 승압에서, 단계 a)에서 제공되는 프리폴리머를 밀폐 용기 내에서 고상 중합시키는 방법을 제공한다.b) subjecting the prepolymer provided in step a) to solid phase polymerization in a closed vessel under elevated temperature and elevated pressure in the presence of an inert gas under process conditions.
본 발명은 상기 및 하기 정의된 방법에 의해 얻을 수 있는 지방족 또는 반방향족 폴리아미드를 더 제공한다.The present invention further provides an aliphatic or semiaromatic polyamide obtainable by the process as defined above and below.
본 발명은 추가로 상기에 및 하기 정의된 방법에 의해 얻을 수 있는 1 이상의 폴리아미드를 포함하는 폴리아미드 몰딩 조성물을 제공한다. 본 발명은 추가로 이러한 폴리아미드 몰딩 조성물로부터 제조되는 몰딩을 제공한다.The present invention further provides a polyamide molding composition comprising at least one polyamide obtainable by the process defined above and below. The present invention further provides moldings made from such polyamide molding compositions.
본 발명은 필름, 모노필라멘트, 섬유, 얀 또는 텍스타일 패브릭의 제조를 위한, 상기 및 하기 정의된 방법에 의해 얻을 수 있는 지방족 폴리아미드의 용도를 더 제공한다.The present invention further provides the use of aliphatic polyamides obtainable by the methods defined above and below, for the production of films, monofilaments, fibers, yarns or textile fabrics.
본 발명은 상기에 및 하기 정의된 방법에 의해 얻을 수 있는 반방향족 폴리아미드의 용도, 바람직하게는 전기 및 전자 부품의 제조 및 고온 자동차 응용 분야를 위한 용도를 더 제공한다.The present invention further provides uses for semiaromatic polyamides obtainable by the processes defined above and below, preferably for the production of electrical and electronic components and for applications in high temperature automotive applications.
"고상 중합"은 일반적으로 폴리아미드의 유리 전이 온도 이상과 융점 이하 범위의 온도 내에서 분자량을 증가시키는 축합 반응을 의미하는 것으로 이해된다. 이 온도 범위 내에서는, 폴리아미드의 원하지 않는 열 분해를 실질적으로 피할 수 있다."Solid phase polymerization" is understood to mean a condensation reaction which increases the molecular weight generally within the range of the glass transition temperature of the polyamide to the melting point or lower. Within this temperature range, unwanted thermal decomposition of the polyamide can be substantially avoided.
"밀폐 용기 내에서의 고상 중합"은 중합 온도가 얻어진 후, 용기 내부와 환경 사이의 질량 전달이 발생하지 않음을 의미하는 것으로 이해된다. 더욱 구체적으로는, 고상 중합 동안 가스 스트림이 용기를 통과하지 않는다. 따라서, 고상 중합 동안, 용기 내부로부터 환경에의 성분, 예를 들어 물의 배출이 없다. 밀폐 용기 내에서의 본 발명의 고상 중합에 있어서는 용기 내부와 환경 사이의 열 교환은 대조적으로 허용된다."Solid phase polymerization in a closed vessel" is understood to mean that no mass transfer occurs between the interior of the vessel and the environment after the polymerization temperature is obtained. More specifically, the gas stream does not pass through the vessel during the solid state polymerization. Thus, during solid phase polymerization, there is no release of constituents, e.g. water, from the interior of the container to the environment. In the solid phase polymerization of the present invention in a closed vessel, heat exchange between the interior of the vessel and the environment is allowed in contrast.
본 발명의 문맥에서 프리폴리머는 분자량을 증가시키는 축합 반응이 가능한 보완적인 작용기를 갖는 중합체 화합물을 포함하는 조성물을 지칭한다.In the context of the present invention, a prepolymer refers to a composition comprising a polymeric compound having a complementary functional group capable of a condensation reaction to increase molecular weight.
산 성분과 디아민 성분, 및 또한 사용된 임의 락탐 성분의 단량체의 축합은 각 단량체로부터 유도되는 아미드의 형태로 반복 단위 또는 말단 기를 형성한다. 이들 단량체는 일반적으로 코폴리아미드에 존재하는 모든 반복 단위와 말단 기의 95 mol%, 특히 99 mol%에 달한다. 추가로, 코폴리아미드는 또한 단량체, 예를 들어 디아민의 분해 반응 또는 부 반응으로부터 유래할 수 있는 소량의 다른 반복 단위를 포함할 수 있다.Condensation of monomers of an acid component and a diamine component, and also any lactam component used, forms a repeating unit or terminal group in the form of an amide derived from each monomer. These monomers generally amount to 95 mol%, especially 99 mol%, of all repeating units and terminal groups present in the copolyamide. In addition, copolyamides may also contain small amounts of other repeating units that may result from the decomposition or side reactions of monomers, such as diamines.
폴리아미드는 약호를 사용하여 본 발명의 문맥에서 지정되며, 이들 중 일부는 본 기술에서 관례적이며, 이들은 문자 PA 이어서 숫자와 문자로 이루어진다. 이들 약호 중 일부는 DIN EN ISO 1043-1에서 표준화되어 있다. H2N-(CH2)x-COOH 형태의 아미노카르복실산 또는 상응하는 락탐으로부터 유도될 수 있는 폴리아미드는 PA Z로서 확인되며, 여기서 Z는 단량체 중 탄소 원자 수를 나타낸다. 예를 들어, PA 6은 ε-카프로락탐 또는 ω-아미노카프로산의 중합체를 나타낸다. H2N-(CH2)x-NH2 및 HOOC-(CH2)y-COOH 형태의 디아민과 디카르복실산으로부터 유도되는 폴리아미드는 PA Z1Z2로서 확인되며, 여기서 Z1은 디아민 중 탄소 원자 수를 나타내고, Z2는 디카르복실산 중 탄소 원자 수를 나타낸다. 코폴리아미드는 성분을 슬래시로 분리된, 이들 비율의 수열로 열거함으로써 지정된다. 예를 들어, PA 66/610은 헥사메틸렌디아민, 아디프산과 세바스산의 코폴리아미드이다. 본 발명에 따라 사용되는 방향족 또는 지환족 기가 있는 단량체에 대해, 하기 문자 약호가 사용된다: T = 테레프탈산, I = 이소프탈산, MXDA = m-크실렌디아민, IPDA = 이소포론디아민, PACM = 4,4'-메틸렌비스(시클로헥실아민), MACM = 2,2'-디메틸-4,4'-메틸렌비스(시클로헥실아민).Polyamides are designated in the context of the present invention using the abbreviations, some of which are conventional in the art, and these are the letters PA followed by numbers and letters. Some of these codes are standardized in DIN EN ISO 1043-1. Aminocarboxylic acids in the form of H 2 N- (CH 2 ) x -COOH or polyamides which may be derived from the corresponding lactam are identified as PA Z, wherein Z represents the number of carbon atoms in the monomers. For example, PA 6 represents a polymer of? -Caprolactam or? -Aminocaproic acid. Polyamides derived from diamines and dicarboxylic acids in the form of H 2 N- (CH 2 ) x -NH 2 and HOOC- (CH 2 ) y -COOH are identified as PA Z1Z2 where Z1 is the number of carbon atoms in the diamine And Z2 represents the number of carbon atoms in the dicarboxylic acid. Copolyamides are designated by listing the components as a series of these ratios separated by slashes. For example, PA 66/610 is a copolyamide of hexamethylenediamine, adipic acid and sebacic acid. For monomers with aromatic or alicyclic groups used according to the invention, the following letter designations are used: T = terephthalic acid, I = isophthalic acid, MXDA = m-xylenediamine, IPDA = isophoronediamine, PACM = '-Methylenebis (cyclohexylamine), MACM = 2,2'-dimethyl-4,4'-methylenebis (cyclohexylamine).
이후, 표현 "C1-C4-알킬"은 비치환된 직쇄 및 분지쇄 C1-C4-알킬기를 포함한다. C1-C4-알킬기의 예는 특히 메틸, 에틸, 프로필, 이소프로필, n-부틸, 이소부틸, sec-부틸, tert-부틸(1,1-디메틸에틸)이다.Hereafter, the expression "C 1 -C 4 -alkyl" includes unsubstituted straight and branched C 1 -C 4 -alkyl groups. Examples of C 1 -C 4 -alkyl groups are especially methyl, ethyl, propyl, isopropyl, n-butyl, isobutyl, sec-butyl, tert-butyl (1,1-dimethylethyl).
이후 언급되는, 방향족 디카르복실산, 지방족 디카르복실산, 지환족 디카르복실산 및 모노카르복실산에서, 카르복실기는 각각 비유도체화 형태로 또는 유도체의 형태로 존재할 수 있다. 디카르복실산의 경우에, 어느 카르복실기도 유도체의 형태로 있을 수 없거나, 한 카르복실기 또는 양쪽 카르복실기가 유도체의 형태로 있을 수 있다. 적합한 유도체는 무수물, 에스테르, 산 염화물, 니트릴 및 이소시아네이트이다. 바람직한 유도체는 무수물 또는 에스테르이다. 디카르복실산의 무수물은 단량체 형태로 또는 중합체 형태로 있을 수 있다. 바람직한 에스테르는 알킬 에스테르와 비닐 에스테르이며, 더 바람직하게는 C1-C4-알킬 에스테르, 특히 메틸 에스테르 또는 에틸 에스테르이다. 디카르복실산은 바람직하게는 모노- 또는 디알킬 에스테르, 더 바람직하게는 모노- 또는 디-C1-C4-알킬 에스테르, 더 바람직하게는 모노메틸 에스테르, 디메틸 에스테르, 모노에틸 아세테르 또는 디에틸 에스테르의 형태이다. 디카르복실산은 추가로 바람직하게는 모노- 또는 디비닐 에스테르의 형태이다. 디카르복실산은 추가로 바람직하게는 혼합 에스테르, 더 바람직하게는 C1-C4-알킬 성분이 상이한 혼합 에스테르, 특히 메틸 에틸 에스테르의 형태이다.In the aromatic dicarboxylic acid, the aliphatic dicarboxylic acid, the alicyclic dicarboxylic acid and the monocarboxylic acid which will be mentioned later, the carboxyl groups may each be present in the non-dihydrogenated form or in the form of derivatives. In the case of a dicarboxylic acid, either the carboxyl group may not be in the form of a derivative, or one carboxyl group or both carboxyl groups may be present in the form of a derivative. Suitable derivatives are anhydrides, esters, acid chlorides, nitriles and isocyanates. Preferred derivatives are anhydrides or esters. The anhydrides of dicarboxylic acids may be in monomeric form or in polymeric form. Preferred esters are alkyl esters and vinyl esters, more preferably C 1 -C 4 -alkyl esters, especially methyl esters or ethyl esters. The dicarboxylic acid is preferably a mono- or dialkyl ester, more preferably a mono- or di-C 1 -C 4 -alkyl ester, more preferably a monomethyl ester, dimethyl ester, monoethylacetate or diethyl It is in the form of esters. The dicarboxylic acid is further preferably in the form of a mono- or divinyl ester. The dicarboxylic acid is further preferably in the form of a mixed ester, more preferably a mixed ester in which the C 1 -C 4 -alkyl component is different, in particular methylethylester.
폴리아미드 형성에 적합한 1 이상의 성분을 포함하는 수성 조성물의 중축합에 의해 프리폴리머가 얻어진다.A prepolymer is obtained by polycondensation of an aqueous composition comprising at least one component suitable for polyamide formation.
바람직하게는, 프리폴리머(및 이에 따른 지방족 또는 반방향족 폴리아미드)는Preferably, the prepolymer (and thus the aliphatic or semiaromatic polyamide)
A) 비치환된 또는 치환된 방향족 디카르복실산 및 비치환된 또는 치환된 방향족 디카르복실산의 유도체,A) a derivative of an unsubstituted or substituted aromatic dicarboxylic acid and an unsubstituted or substituted aromatic dicarboxylic acid,
B) 비치환된 또는 치환된 방향족 디아민,B) an unsubstituted or substituted aromatic diamine,
C) 지방족 또는 지환족 디카르복실산 및 이의 유도체,C) aliphatic or alicyclic dicarboxylic acids and their derivatives,
D) 지방족 또는 지환족 디아민,D) an aliphatic or alicyclic diamine,
E) 모노카르복실산 및 이의 유도체,E) monocarboxylic acids and derivatives thereof,
F) 모노아민,F) monoamine,
G) 적어도 삼작용성 아민,G) at least a trifunctional amine,
H) 락탐,H) lactam,
I) ω-아미노산,I) omega-amino acid,
K) A) 내지 I)와 다르고, 이들과 공축합 가능한 화합물K) a compound which is different from A) to I) and is capable of co-
에서 선택되는 혼입 성분을 포함한다.≪ / RTI >
적합한 실시형태는 지방족 폴리아미드이다. PA Z1Z2 형태(예를 들어 PA 66)의 지방족 폴리아미드에 대해, 성분 C) 및 D) 중 적어도 한 성분이 존재하여야 하고, 성분 A) 및 B)의 어느 것도 존재할 수 없다는 조건이 적용된다. PA Z 형태(예를 들어 PA 6 또는 PA 12)의 지방족 폴리아미드에 대해, 적어도 성분 H)가 존재하여야 한다는 조건이 적용된다.A suitable embodiment is an aliphatic polyamide. For an aliphatic polyamide of the PA Z1Z2 form (e.g. PA 66), the conditions are such that at least one of the components C) and D) must be present and that none of the components A) and B) can be present. For an aliphatic polyamide of the PA Z form (e.g. PA 6 or PA 12), the proviso that at least component H) is present is applied.
바람직한 실시형태는 반방향족 폴리아미드이다. 반방향족 폴리아미드에 대해, 성분 A) 및 B) 중 적어도 한 성분 및 성분 C) 및 D) 중 적어도 한 성분이 존재하여야 한다는 조건이 적용된다.A preferred embodiment is a semi-aromatic polyamide. For semiaromatic polyamides, the proviso that at least one of the components A) and B) and at least one of the components C) and D) must be present.
방향족 디카르복실산 A)는 바람직하게는 각 경우에 비치환된 또는 치환된 프탈산, 테레프탈산, 이소프탈산, 나프탈렌디카르복실산 또는 디페닐디카르복실산, 및 상기 언급된 방향족 디카르복실산의 유도체와 혼합물로부터 선택된다.Aromatic dicarboxylic acid A) is preferably in each case unsubstituted or substituted phthalic acid, terephthalic acid, isophthalic acid, naphthalene dicarboxylic acid or diphenyl dicarboxylic acid, and the above-mentioned aromatic dicarboxylic acid Derivatives and mixtures thereof.
치환된 방향족 디카르복실산 A)는 바람직하게는 C1-C4-알킬 라디칼이 적어도 1개(예를 들어 1, 2, 3 또는 4 개)이다. 더 구체적으로는, 치환된 방향족 디카르복실산 A)는 C1-C4-알킬 라디칼이 1 또는 2개이다. 이들은 바람직하게는 메틸, 에틸, n-프로필, 이소프로필, n-부틸, 이소부틸, sec-부틸 및 tert-부틸로부터 선택되며, 더 바람직하게는 메틸, 에틸 및 n-부틸, 구체적으로 메틸 및 에틸, 특히 메틸이다. 치환된 방향족 디카르복실산 A)는 또한 아미드화를 파괴하지 않는 추가 작용기, 예를 들어 5-설포이소프탈산, 및 이의 염과 유도체를 지닐 수 있다. 이의 바람직한 예는 디메틸 5-설포이소프탈레이트의 나트륨 염이다.The substituted aromatic dicarboxylic acids A) preferably have at least one, for example 1, 2, 3 or 4, C 1 -C 4 -alkyl radicals. More specifically, the substituted aromatic dicarboxylic acid A) has 1 or 2 C 1 -C 4 -alkyl radicals. These are preferably selected from methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl and tert-butyl, more preferably methyl, ethyl and n- , Especially methyl. Substituted aromatic dicarboxylic acids A) may also have further functional groups which do not destroy amidation, such as 5-sulfoisophthalic acid, and salts and derivatives thereof. A preferred example thereof is the sodium salt of dimethyl 5-sulfoisophthalate.
바람직하게는, 방향족 디카르복실산 A)는 비치환된 테레프탈산, 비치환된 이소프탈산, 비치환된 나프탈렌디카르복실산, 2-클로로테레프탈산, 2-메틸테레프탈산, 5-메틸이소프탈산 및 5-설포이소프탈산으로부터 선택된다.Preferably, the aromatic dicarboxylic acid A) is selected from the group consisting of unsubstituted terephthalic acid, unsubstituted isophthalic acid, unsubstituted naphthalene dicarboxylic acid, 2-chloroterephthalic acid, 2-methylterephthalic acid, 5- ≪ / RTI > sulfoisophthalic acid.
더 바람직하게는, 사용된 방향족 디카르복실산 A)는 테레프탈산, 이소프탈산 또는 테레프탈산과 이소프탈산의 혼합물이다.More preferably, the aromatic dicarboxylic acid A) used is terephthalic acid, isophthalic acid or a mixture of terephthalic acid and isophthalic acid.
바람직하게는, 본 발명에 따라 제공된 반방향족 폴리아미드 프리폴리머는 모든 디카르복실산 중 방향족 디카르복실산의 비율이 적어도 50 mol%, 더 바람직하게는 70 mol% 내지 100 mol%이다. 구체적인 실시형태에서, 본 발명에 따른 방법에 의해 제조된 반방향족 폴리아미드(및 단계 a)에서 제공되는 프리폴리머)는 테레프탈산 또는 이소프탈산 또는 테레프탈산과 이소프탈산의 혼합물의 비율이 모든 디카르복실산을 기준으로 적어도 50 mol%, 바람직하게는 70 mol% 내지 100 mol%이다.Preferably, the proportion of the aromatic dicarboxylic acid in all dicarboxylic acids is at least 50 mol%, more preferably 70 mol% to 100 mol%, in the semiaromatic polyamide prepolymer provided according to the present invention. In a specific embodiment, the semiaromatic polyamide prepared by the process according to the invention (and the prepolymer provided in step a)) is such that the ratio of terephthalic acid or isophthalic acid or a mixture of terephthalic acid and isophthalic acid is higher than that of all dicarboxylic acids At least 50 mol%, preferably 70 mol% to 100 mol%.
방향족 디아민 B)는 바람직하게는 비스(4-아미노페닐)메탄, 3-메틸벤지딘, 2,2-비스(4-아미노페닐)프로판, 1,1-비스(4-아미노페닐)시클로헥산, 1,2-디아미노벤젠, 1,4-디아미노벤젠, 1,4-디아미노나프탈렌, 1,5-디아미노나프탈렌, 1,3-디아미노톨루엔(들), m-크실렌디아민, N,N'-디메틸-4,4'-비페닐디아민, 비스(4-메틸아미노페닐)메탄, 2,2-비스(4-메틸아미노페닐)-프로판 또는 이들의 혼합물로부터 선택된다.Aromatic diamine B) is preferably selected from the group consisting of bis (4-aminophenyl) methane, 3-methylbenzidine, 2,2-bis (4-aminophenyl) propane, Diaminobenzene, 1,4-diaminobenzene, 1,4-diaminonaphthalene, 1,5-diaminonaphthalene, 1,3-diaminotoluene (s), m-xylenediamine, N, N (4-methylaminophenyl) methane, 2,2-bis (4-methylaminophenyl) -propane or mixtures thereof.
지방족 또는 지환족 디카르복실산 C)는 바람직하게는 옥살산, 말론산, 숙신산, 글루타르산, 아디프산, 피멜산, 수베르산, 아젤라산, 세바스산, 운데칸-α,ω-디카르복실산, 도데칸-α,ω-디카르복실산, 말레산, 푸마르산 또는 이타콘산, 시스- 및 트란스-시클로헥산-1,2-디카르복실산, 시스- 및 트란스-시클로헥산-1,3-디카르복실산, 시스- 및 트란스-시클로헥산-1,4-디카르복실산, 시스- 및 트란스-시클로펜탄-1,2-디카르복실산, 시스- 및 트란스-시클로펜탄-1,3-디카르복실산 및 이들의 혼합물로부터 선택된다.Aliphatic or alicyclic dicarboxylic acid C) is preferably selected from oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecane- Dicarboxylic acid, fumaric acid or itaconic acid, cis- and trans-cyclohexane-1,2-dicarboxylic acid, cis- and trans-cyclohexane-1 Dicarboxylic acid, cis- and trans-cyclohexane-1,4-dicarboxylic acid, cis- and trans-cyclopentane-1,2-dicarboxylic acid, cis- and trans- 1,3-dicarboxylic acid, and mixtures thereof.
지방족 또는 지환족 디아민 D)는 바람직하게는 에틸렌디아민, 프로필렌디아민, 테트라메틸렌디아민, 헵타메틸렌디아민, 헥사메틸렌디아민, 펜타메틸렌디아민, 옥타메틸렌디아민, 노나메틸렌디아민, 2-메틸-1,8-옥타메틸렌디아민, 데카메틸렌디아민, 운데카메틸렌디아민, 도데카메틸렌디아민, 2-메틸펜타메틸렌디아민, 2,2,4-트리메틸헥사메틸렌디아민, 2,4,4-트리메틸헥사메틸렌디아민, 5-메틸노나메틸렌디아민, 2,4-디메틸옥타메틸렌디아민, 5-메틸노난디아민, 비스(4-아미노시클로헥실)메탄, 3,3'-디메틸-4,4'-디아미노디시클로헥실메탄 및 이들의 혼합물로부터 선택된다.The aliphatic or alicyclic diamine D) is preferably selected from the group consisting of ethylenediamine, propylenediamine, tetramethylenediamine, heptamethylenediamine, hexamethylenediamine, pentamethylenediamine, octamethylenediamine, nonamethylenediamine, Methylene diamine, methylene diamine, decamethylene diamine, undecamethylene diamine, dodecamethylene diamine, 2-methylpentamethylene diamine, 2,2,4-trimethylhexamethylene diamine, 2,4,4-trimethylhexamethylene diamine, Methylene diamine, 2,4-dimethyloctamethylene diamine, 5-methyl nonanediamine, bis (4-aminocyclohexyl) methane, 3,3'-dimethyl-4,4'-diamino dicyclohexyl methane, .
더 바람직하게는, 디아민 D)는 헥사메틸렌디아민, 2-메틸펜타메틸렌디아민, 옥타메틸렌디아민, 노나메틸렌디아민, 데카메틸렌디아민, 운데카메틸렌디아민, 도데카메틸렌디아민, 비스(4-아미노시클로헥실)메탄, 3,3'-디메틸-4,4'-디아미노디시클로헥실메탄 및 이들의 혼합물로부터 선택된다.More preferably, the diamine D) is at least one selected from the group consisting of hexamethylene diamine, 2-methylpentamethylene diamine, octamethylene diamine, nonamethylene diamine, decamethylene diamine, undecamethylene diamine, dodecamethylene diamine, bis (4-aminocyclohexyl) Methane, 3,3'-dimethyl-4,4'-diaminodicyclohexyl methane, and mixtures thereof.
구체적인 실시에서, 반방향족 폴리아미드는 헥사메틸렌디아민, 비스(4-아미노시클로헥실)메탄(PACM), 3,3'-디메틸-4,4'-디아미노디시클로헥실메탄(MACM), 이소포론디아민(IPDA) 및 이들의 혼합물로부터 선택되는 1 이상의 공중합 디아민 D)를 포함한다.In a specific embodiment, the semiaromatic polyamides include hexamethylenediamine, bis (4-aminocyclohexyl) methane (PACM), 3,3'-dimethyl- Diamine (IPDA), and mixtures thereof.
구체적인 실시에서, 반방향족 폴리아미드는 공중합 디아민 D)로서 헥사메틸렌디아민만을 포함한다.In a specific embodiment, the semiaromatic polyamide comprises only hexamethylenediamine as the copolymerized diamine D).
추가의 구체적인 실시에서, 반방향족 폴리아미드는 공중합 디아민 D)로서 비스(4-아미노시클로헥실)메탄만을 포함한다.In a further specific embodiment, the semiaromatic polyamide comprises only bis (4-aminocyclohexyl) methane as the copolymerized diamine D).
추가의 구체적인 실시에서, 반방향족 폴리아미드는 공중합 디아민 D)로서 3,3'-디메틸-4,4'-디아미노시클로헥실메탄(MACM)만을 포함한다.In a further specific embodiment, the semiaromatic polyamide comprises only 3,3'-dimethyl-4,4'-diaminocyclohexylmethane (MACM) as the copolymerized diamine D).
추가의 구체적인 실시에서, 반방향족 폴리아미드는 공중합 디아민 D)로서 이소포론디아민(IPDA)만을 포함한다.In a further specific embodiment, the semiaromatic polyamide comprises only isophoronediamine (IPDA) as the copolymerized diamine D).
프리폴리머(및 상응하는 지방족 및 반방향족 폴리아미드)는 1 이상의 공중합 모노카르복실산 E)를 포함할 수 있다. 모노카르복실산 E)는 본 발명에 따라 제조되는 폴리아미드를 말단 캐핑하는데 도움이 된다. 적합한 모노카르복실산은 원칙적으로 폴리아미드 축합의 반응 조건 하에 이용 가능한 아미노기 중 적어도 일부와 반응할 수 있는 모든 모노카르복실산이다. 적합한 모노카르복실산 E)는 지방족 모노카르복실산, 지환족 모노카르복실산 및 방향족 모노카르복실산이다. 이들은 아세트산, 프로피온산, n-, 이소- 또는 tert-부티르산, 발레르산, 트리메틸아세트산, 카프로산, 에난트산, 카프릴산, 펠라르곤산, 카프르산, 운데칸산, 라우르산, 트리데칸산, 미리스트산, 팔미트산, 스테아르산, 피발산, 시클로헥산카르복실산, 벤조산, 메틸벤조산, α-나프탈렌카르복실산, β-나프탈렌카르복실산, 페닐아세트산, 올레산, 리시놀레산, 리놀레산, 리놀렌산, 에루스산, 콩, 아마인, 피마자유 식물 및 해바라기로부터의 지방산, 아크릴산, 메타크릴산, Versatic® 산, Koch® 산 및 이들의 혼합물을 포함한다.The prepolymer (and the corresponding aliphatic and semiaromatic polyamides) may comprise at least one copolymerized monocarboxylic acid E). Monocarboxylic acid E) helps to end-cap polyamides prepared according to the present invention. Suitable monocarboxylic acids are in principle all monocarboxylic acids capable of reacting with at least some of the available amino groups under the reaction conditions of polyamide condensation. Suitable monocarboxylic acids E) are aliphatic monocarboxylic acids, alicyclic monocarboxylic acids and aromatic monocarboxylic acids. These may be selected from acetic acid, propionic acid, n-, iso- or tert-butyric acid, valeric acid, trimethylacetic acid, caproic acid, enanthic acid, caprylic acid, pelargonic acid, capric acid, undecanoic acid, lauric acid, Naphthalenecarboxylic acid, p-naphthalenecarboxylic acid, phenylacetic acid, oleic acid, ricinoleic acid, linoleic acid, linolenic acid, stearic acid, fumaric acid, It includes linolenic acid, erucic acid, soybean, linseed, castor oil plants, and fatty acids from sunflower, acrylic acid, methacrylic acid, Versatic acid ®, ® Koch acid, and mixtures thereof.
사용된 모노카르복실산 E)가 불포화 카르복실산 또는 이들의 유도체인 경우, 시판 중합 억제제의 존재 하에 작업하는 것을 권장할 만하다.If the monocarboxylic acid E) used is an unsaturated carboxylic acid or derivative thereof, it is advisable to work in the presence of a commercial polymerization inhibitor.
더 바람직하게는, 모노카르복실산 E)는 아세트산, 프로피온산, 벤조산 및 이들의 혼합물로부터 선택된다.More preferably, the monocarboxylic acid E) is selected from acetic acid, propionic acid, benzoic acid, and mixtures thereof.
구체적인 실시에서, 프리폴리머(및 상응하는 지방족 및 반방향족 폴리아미드)는 공중합 모노카르복실산 E)로서 프로피온산만을 포함한다.In a specific embodiment, the prepolymer (and the corresponding aliphatic and semiaromatic polyamides) comprise only propionic acid as the copolymerized monocarboxylic acid E).
추가의 구체적인 실시에서, 프리폴리머(및 상응하는 지방족 및 반방향족 폴리아미드)는 공중합 모노카르복실산 E)로서 벤조산만을 포함한다.In a further specific embodiment, the prepolymer (and the corresponding aliphatic and semiaromatic polyamides) comprise only benzoic acid as the copolymerized monocarboxylic acid E).
추가의 구체적인 실시에서, 프리폴리머(및 상응하는 지방족 및 반방향족 폴리아미드)는 공중합 모노카르복실산 E)로서 아세트산만을 포함한다.In a further specific embodiment, the prepolymer (and the corresponding aliphatic and semiaromatic polyamides) comprise only acetic acid as the copolymerized monocarboxylic acid E).
프리폴리머(및 상응하는 지방족 및 반방향족 폴리아미드)는 1 이상의 공중합 모노아민 F)를 포함할 수 있다. 이러한 문맥에서, 지방족 폴리아미드는 단지 공중합 지방족 모노아민 또는 지환족 모노아민을 포함한다. 모노아민 F)는 본 발명에 따라 제조된 폴리아미드를 말단 캐핑하는데 도움이 된다. 적합한 모노아민은 원칙적으로 폴리아미드 축합의 반응 조건 하에 이용 가능한 카르복실기 중 적어도 일부와 반응할 수 있는 모든 모노아민이다. 적합한 모노아민 F)는 지방족 모노아민, 지환족 모노아민 및 방향족 모노아민이다. 이들은 메틸아민, 에틸아민, 프로필아민, 부틸아민, 펜틸아민, 헥실아민, 헵틸아민, 옥틸아민, 데실아민, 스테아릴아민, 디메틸아민, 디에틸아민, 디프로필아민, 디부틸아민, 시클로헥실아민, 디시클로헥실아민, 아닐린, 톨루이딘, 디페닐아민, 나프틸아민 및 이들의 혼합물을 포함한다.The prepolymer (and the corresponding aliphatic and semiaromatic polyamides) may comprise at least one copolymerized monoamine F). In this context, the aliphatic polyamides include only copolymerized aliphatic monoamines or cycloaliphatic monoamines. Monoamine F) helps to end-cap polyamides prepared according to the present invention. Suitable monoamines are in principle all monoamines capable of reacting with at least some of the available carboxyl groups under the reaction conditions of polyamide condensation. Suitable monoamines F) are aliphatic monoamines, alicyclic monoamines and aromatic monoamines. These may be selected from the group consisting of methylamine, ethylamine, propylamine, butylamine, pentylamine, hexylamine, heptylamine, octylamine, decylamine, stearylamine, dimethylamine, diethylamine, dipropylamine, dibutylamine, cyclohexylamine , Dicyclohexylamine, aniline, toluidine, diphenylamine, naphthylamine, and mixtures thereof.
프리폴리머(및 상응하는 지방족 및 반방향족 폴리아미드)의 제조를 위해, 추가로 적어도 1개의 적어도 삼작용성 아민 G)를 사용하는 것이 가능하다. 이들은 N'-(6-아미노헥실)-헥산-1,6-디아민, N'-(12-아미노도데실)도데칸-1,12-디아민, N'-(6-아미노헥실)-도데칸-1,12-디아민, N'-[3-(아미노메틸)-3,5,5-트리메틸시클로헥실]헥산-1,6-디아민, N'-[3-(아미노메틸)-3,5,5-트리메틸시클로헥실]도데칸-1,12-디아민, N'-[(5-아미노-1,3,3-트리메틸시클로헥실)메틸]헥산-1,6-디아민, N'-[(5-아미노-1,3,3-트리메틸시클로헥실)메틸]도데칸-1,12-디아민, 3-[[[3-(아미노메틸)-3,5,5-트리메틸시클로헥실]아미노]메틸-3,5,5-트리메틸시클로헥산아민, 3-[[(5-아미노-1,3,3-트리메틸시클로헥실)메틸아미노]메틸]-3,5,5-트리메틸시클로헥산아민, 3-(아미노메틸)-N-[3-(아미노메틸)-3,5,5-트리메틸시클로헥실]-3,5,5-트리메틸시클로헥산아민을 포함한다. 바람직하게는, 적어도 삼작용성 아민 G)이 사용되지 않는다.For the preparation of prepolymers (and corresponding aliphatic and semiaromatic polyamides) it is also possible to use at least one further at least one trifunctional amine G). These include, but are not limited to, N '- (6-aminopentyl) -hexane-1,6-diamine, N' - (12-aminododecyl) dodecane-1,12- Diamine, N '- [3- (aminomethyl) -3,5-trimethylcyclohexyl] hexane-1,6-diamine, Diaminocyclohexyl] dodecane-1,12-diamine, N '- [(5-amino-1,3,3-trimethylcyclohexyl) methyl] hexane- Amino] -1,3,3-trimethylcyclohexyl) methyl] dodecane-1,12-diamine, 3 - [[[3- (aminomethyl) -3,5,5- trimethylcyclohexyl] Trimethylcyclohexaneamine, 3 - [[(5-amino-1,3,3-trimethylcyclohexyl) methylamino] methyl] -3,5,5-trimethylcyclohexaneamine, 3- (Aminomethyl) -N- [3- (aminomethyl) -3,5,5-trimethylcyclohexyl] -3,5,5-trimethylcyclohexaneamine. Preferably, at least a trifunctional amine G) is not used.
적합한 락탐 H)는 ε-카프로락탐, 2-피페리돈(δ-발레로락탐), 2-피롤리돈(γ-부티로락탐), 카프릴락탐, 에난톨락탐, 라우릴락탐 및 이들의 혼합물이다.Suitable lactams H) include, but are not limited to, ε-caprolactam, 2-piperidone (δ-valerolactam), 2-pyrrolidone (γ-butyrolactam), caprylactam, enantholactam, lauryllactam, to be.
적합한 ω-아미노산 I)는 6-아미노카프로산, 7-아미노헵탄산, 11-아미노운데칸산, 12-아미노도데칸산 및 이들의 혼합물이다.Suitable ω-amino acids I) are 6-aminocaproic acid, 7-aminoheptanoic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid and mixtures thereof.
A) 내지 I)와 다르고, 이들과 공축합 가능한, 적합한 화합물 K)는 적어도 삼염기성 카르복실산, 디아미노카르복실산 등이다.Suitable compounds K) which are different from A) to I) and are co-condensable therewith are at least tribasic carboxylic acids, diaminocarboxylic acids and the like.
적합한 화합물 K)는 추가로 4-[(Z)-N-(6-아미노헥실)-C-히드록시카본이미도일]벤조산, 3-[(Z)-N-(6-아미노헥실)-C-히드록시카본이미도일]벤조산, (6Z)-6-(6-아미노헥실이미노)-6-히드록시헥산카르복실산, 4-[(Z)-N-[(5-아미노-1,3,3-트리메틸시클로헥실)메틸]-C-히드록시카본이미도일]벤조산, 3-[(Z)-N-[(5-아미노-1,3,3-트리메틸시클로헥실)메틸]-C-히드록시카본이미도일]벤조산, 4-[(Z)-N-[3-(아미노메틸)-3,5,5-트리메틸시클로헥실]-C-히드록시카본이미도일]벤조산, 3-[(Z)-N-[3-(아미노메틸)-3,5,5-트리메틸시클로헥실]-C-히드록시카본이미도일]벤조산 및 이들의 혼합물이다.Suitable compounds K) are furthermore 4 - [(Z) -N- (6-aminohexyl) -C- hydroxycarbonimidoyl] benzoic acid, 3 - [(Z) - (hydroxycarbonimidoyl) benzoic acid, (6Z) -6- (6-aminohexylamino) -6-hydroxyhexanecarboxylic acid, 4- [ 3 - [(Z) -N - [(5-amino-1,3,3-trimethylcyclohexyl) methyl] - C - [(Z) -N- [3- (aminomethyl) -3,5,5-trimethylcyclohexyl] -C- hydroxycarbonimidoyl] benzoic acid, 3- [ (Z) -N- [3- (aminomethyl) -3,5,5-trimethylcyclohexyl] -C-hydroxycarbonimidoyl] benzoic acid and mixtures thereof.
바람직한 실시형태에서, 본 발명에 따른 방법은 지방족 폴리아미드의 제조에 쓸모가 있다.In a preferred embodiment, the process according to the invention is useful for the production of aliphatic polyamides.
이 경우에, 폴리아미드는 바람직하게는 PA 6, PA 11, PA 12, PA 46, PA 66, PA 666, PA 69, PA 610, PA 612, PA 96, PA 99, PA 910, PA 912, PA 1212, 및 이들의 공중합체 및 혼합물로부터 선택된다.In this case, the polyamide is preferably PA 6, PA 11, PA 12, PA 46, PA 66, PA 666, PA 69, PA 610, PA 612, PA 96, PA 99, PA 910, PA 912, PA 1212, and copolymers and mixtures thereof.
더 구체적으로는, 지방족 폴리아미드는 PA 6, PA 66 또는 PA 666이며, 가장 바람직하게는 PA 6이다.More specifically, the aliphatic polyamide is PA 6, PA 66 or PA 666, and most preferably PA 6.
추가의 바람직한 실시형태에서, 본 발명에 따른 방법은 반방향족 폴리아미드의 제조에 쓸모가 있다.In a further preferred embodiment, the process according to the invention is useful for the preparation of semi-aromatic polyamides.
이 경우에, 폴리아미드는 바람직하게는 PA 6.T, PA 9.T, PA 8.T, PA 10.T, PA 12.T, PA 6.I, PA 8.I, PA 9.I, PA 10.I, PA 12.I, PA 6.T/6, PA 6.T/10, PA 6.T/12, PA 6.T/6.I, PA6.T/8.T, PA 6.T/9.T, PA 6.T/10T, PA 6.T/12.T, PA 12.T/6.T, PA 6.T/6.I/6, PA 6.T/6.I/12, PA 6.T/6.I/6.10, PA 6.T/6.I/6.12, PA 6.T/6.6, PA 6.T/6.10, PA 6.T/6.12, PA 10.T/6, PA 10.T/11, PA 10.T/12, PA 8.T/6.T, PA 8.T/66, PA 8.T/8.I, PA 8.T/8.6, PA 8.T/6.I, PA 10.T/6.T, PA 10.T/6.6, PA 10.T/10.I, PA 10T/10.I/6.T, PA 10.T/6.I, PA 4.T/4.I/46, PA 4.T/4.I/6.6, PA 5.T/5.I, PA 5.T/5.I/5.6, PA 5.T/5.I/6.6, PA 6.T/6.I/6.6, PA MXDA.6, PA IPDA.I, PA IPDA.T, PA MACM.I, PA MACM.T, PA PACM.I, PA PACM.T, PA MXDA.I, PA MXDA.T, PA 6.T/IPDA.T, PA 6.T/MACM.T, PA 6.T/PACM.T, PA 6.T/MXDA.T, PA 6.T/6.I/8.T/8.I, PA 6.T/6.I/10.T/10.I, PA 6.T/6.I/IPDA.T/IPDA.I, PA 6.T/6.I/MXDA.T/MXDA.I, PA 6.T/6.I/MACM.T/MACM.I, PA 6.T/6.I/PACM.T/PACM.I, PA 6.T/10.T/IPDA.T, PA 6.T/12.T/IPDA.T, PA 6.T/10.T/PACM.T, PA 6.T/12.T/PACM.T, PA 10.T/IPDA.T, PA 12.T/IPDA.T 및 이들의 공중합체 및 혼합물로부터 선택된다.In this case, the polyamide is preferably selected from PA 6.T, PA 9.T, PA 8.T, PA 10.T, PA 12.T, PA 6.I, PA 8.I, PA 9.I, PA 10.I, PA 12.I, PA 6.T / 6, PA 6.T / 10, PA 6.T / 12, PA 6.T / 6.I, PA 6.T / 8.T, PA 6 6.T / 10T, PA 6.T / 12.T, PA 12.T / 6.T, PA 6.T / 6.I / 6, PA 6.T / 6. I / 12, PA 6.T / 6.I / 6.10, PA 6.T / 6.I / 6.12, PA 6.T / 6.6, PA 6.T / 6.10, PA 6.T / 6.12, PA 10. T / 6, PA 10.T / 11, PA 10.T / 12, PA 8.T / 6.T, PA 8.T / 66, PA 8.T / 8.I, PA 8.T / 8.6, PA 10.T / 6.I, PA 10.T / 6.T, PA 10.T / 6.6, PA 10.T / 10.I, PA 10T / 10.I / 6.I, PA 4.T / 4.I / 46, PA 4.T / 4.I / 6.6, PA 5.T / 5.I, PA 5.T / 5.I / 5.6, PA 5.T / PA.I / 6.6, PA 6.T / 6.I / 6.6, PA MXDA.6, PA IPDA.I, PA IPDA.T, PA MACM.I, PA MACM.T, PA PACM.I, PA PACM / RTI > 6.T / IPDA.T, PA 6.T / MACM.T, PA 6.T / PACM.T, PA 6.T / MXDA.T, PA MXDA.I, 6.T / 6.I / 8.T / 8.I, PA 6.T / 6.I / 10.T / 10.I, PA 6.T / 6.I / IPDA.T / IPDA.I, PA 6.T / 6.I / MXDA.T / MXDA.I, PA 6.T / 6.I / MACM.T / MACM.I, PA 6.T / 6.I / PACM.T / PACM.I , PA 6.T / 10.T / IPDA.T, PA 6.T / 12.T / IPDA.T, PA 6.T / 10.T / PACM.T, PA 6.T / 12.T / PACM .T, PA 10.T / IPDA.T, P A 12. T / IPDA.T, and copolymers and mixtures thereof.
이 경우에, 폴리아미드는 더 바람직하게는 PA 6.T, PA 9.T, PA 10.T, PA 12.T, PA 6.I, PA 9.I, PA 10.I, PA 12.I, PA 6.T/6.I, PA 6.T/6, PA6.T/8.T, PA 6.T/10T, PA 10.T/6.T, PA 6.T/12.T, PA12.T/6.T, PA IPDA.I, PA IPDA.T, PA 6.T/IPDA.T, PA 6.T/6.I/IPDA.T/IPDA.I, PA 6.T/10.T/IPDA.T, PA 6.T/12.T/IPDA.T, PA 6.T/10.T/PACM.T, PA 6.T/12.T/PACM.T, PA 10.T/IPDA.T, PA 12.T/IPDA.T 및 이들의 공중합체 및 혼합물로부터 선택된다.In this case, the polyamide is more preferably PA 6.T, PA 9.T, PA 10.T, PA 12.T, PA 6.I, PA 9.I, PA 10.I, PA 12.I , PA 6.T / 6.I, PA 6.T / 6.T, PA 6.T / 8.T, PA 6.T / 10T, PA 10.T / PA12.T / 6.T, PA IPDA.I, PA IPDA.T, PA 6.T / IPDA.T, PA 6.T / 6.I / IPDA.T / IPDA.I, PA 6.T / 10 / RTI > T / IPDA.T, PA 6.T / 12.T / IPDA.T, PA 6.T / 10.T / PACM.T, PA 6.T / 12.T / PACM.T, PA 10.T / IPDA.T, PA 12.T / IPDA.T, and copolymers and mixtures thereof.
구체적인 실시에서, 반방향족 폴리아미드는 PA 6.T/6.I이다.In a specific embodiment, the semiaromatic polyamide is PA 6.T / 6.I.
추가의 구체적인 실시에서, 반방향족 폴리아미드는 PA 6.T/6.I/IPDA.T/IPDA.I이다.In a further specific embodiment, the semiaromatic polyamide is PA 6.T / 6.I / IPDA.T / IPDA.I.
추가의 구체적인 실시에서, 반방향족 폴리아미드는 PA 6.T/6.I/MXDA.T/MXDA.I이다.In a further specific embodiment, the semiaromatic polyamide is PA 6.T / 6.I / MXDA.T / MXDA.I.
본 발명에 따라 제공되는 프리폴리머의 제조를 위해, 폴리아미드 형성에 적합한 1 이상의 성분을 포함하는 수성 조성물이 일반적으로 사용된다. 프리폴리머는 원칙적으로 당업계의 숙련자에게 공지된 통상적인 공정에 의해 제조될 수 있다.For the preparation of the prepolymers provided according to the invention, aqueous compositions comprising at least one component suitable for polyamide formation are generally used. The prepolymers can in principle be prepared by conventional processes known to those skilled in the art.
반방향족 폴리아미드 올리고머를 제조하기 위한 적합한 방법은 예를 들어 유럽특허출원 제0 693 515 A1호에 기재되어 있다.Suitable methods for preparing the semi-aromatic polyamide oligomers are described, for example, in European Patent Application No. 0 693 515 A1.
프리폴리머의 제조에 사용되는 수성 조성물은 바람직하게는 함수량이 조성물의 총 중량을 기준으로 20 내지 55 중량%, 더 바람직하게는 25 내지 50 중량%이다. 구체적인 실시형태에서, 1 이상의 디아민과 1 이상의 카르복실산의 염을 포함하는 수용액이 제공된다. 이 용액은 바람직하게는 함수량이 용액의 총 중량을 기준으로 20 내지 55 중량%, 더 바람직하게는 25 내지 50 중량%이다.The aqueous composition used in the preparation of the prepolymer is preferably 20 to 55% by weight, more preferably 25 to 50% by weight, based on the total weight of the composition. In a specific embodiment, there is provided an aqueous solution comprising a salt of at least one diamine and at least one carboxylic acid. The solution preferably has a water content of 20 to 55% by weight, more preferably 25 to 50% by weight, based on the total weight of the solution.
폴리아미드 형성에 적합한 1 이상의 성분과 물 외에, 프리폴리머의 제조에 사용되는 수성 조성물은 추가 성분을 포함할 수 있다. 이들은 바람직하게는 촉매, 사슬 이동제, 적용 관련 첨가제 및 이들의 혼합물로부터 선택된다. 적합한 첨가제는 난연제, 무기와 유기 안정화제, 윤활제, 염료, 핵생성제, 금속 안료, 금속 플레이크, 금속 코팅 입자, 정전기 방지제, 전도성 첨가제, 이형제, 광학적 광택제, 소포제, 충전제 및/또는 보강제 등이다.In addition to one or more components and water suitable for polyamide formation, the aqueous composition used in the preparation of the prepolymer may contain additional components. These are preferably selected from catalysts, chain transfer agents, application-related additives and mixtures thereof. Suitable additives include flame retardants, inorganic and organic stabilizers, lubricants, dyes, nucleating agents, metal pigments, metal flakes, metal coated particles, antistatic agents, conductive additives, release agents, optical brighteners, defoamers, fillers and / or reinforcers.
프리폴리머의 제조를 위해, 1 이상의 촉매를 사용하는 것이 가능하다. 적합한 촉매는 바람직하게는 무기 및/또는 유기 인, 주석 또는 납 화합물, 및 이들의 혼합물로부터 선택된다.For the preparation of the prepolymer, it is possible to use at least one catalyst. Suitable catalysts are preferably selected from inorganic and / or organic phosphorus, tin or lead compounds, and mixtures thereof.
촉매로서 적합한 주석 화합물의 예는 일염기성 또는 다염기성 카르복실산의 주석(II) 산화물, 주석(II) 수산화물, 주석(II) 염, 예를 들어 주석(II) 디벤조에이트, 주석(II) 디(2-에틸헥사노에이트), 주석(II) 옥살레이트, 디부틸주석 산화물, 부틸주석 산(C4H9-SnOOH), 디부틸주석 디라우레이트 등을 포함한다. 적합한 납 화합물은 예를 들어 납(II) 산화물, 납(II) 수산화물, 납(II) 아세테이트, 염기성 납(II) 아세테이트, 납(II) 카르보네이트 등이다.Examples of suitable tin compounds as catalysts are tin (II) oxides, tin (II) hydroxide, tin (II) salts such as tin (II) dibenzoate, tin (II) oxide of monobasic or polybasic carboxylic acids, Di (2-ethylhexanoate), tin (II) oxalate, dibutyltin oxide, butyltin acid (C 4 H 9 -SnOOH), dibutyltin dilaurate and the like. Suitable lead compounds are, for example, lead (II) oxide, lead (II) hydroxide, lead (II) acetate, basic lead (II) acetate, lead (II) carbonate and the like.
바람직한 촉매는 인 화합물 예를 들어 인산, 아인산, 하이포아인산, 페닐포스폰산, 페닐포스핀산 및/또는 1가 내지 3가 양이온, 예를 들어 Na, K, Mg, Ca, Zn 또는 Al과 이들의 염 및/또는 이들의 에스테르, 예를 들어 인산트리페닐, 아인산트리페닐 또는 아인산트리스(노닐페닐)이다. 특히 바람직한 촉매는 하이포아인산과 이의 염, 예를 들어 하이포아인산나트륨이다.Preferred catalysts are phosphorus compounds such as phosphoric acid, phosphorous acid, hypophosphorous acid, phenylphosphonic acid, phenylphosphinic acid and / or mono- to trivalent cations such as Na, K, Mg, Ca, Zn or Al and their salts And / or their esters, such as triphenyl phosphate, triphenyl phosphite or phosphorous tris (nonylphenyl). Particularly preferred catalysts are hypophosphorous acid and its salts, for example sodium hypophosphite.
촉매는 바람직하게는 수성 조성물의 총 중량을 기준으로 0.005 내지 2.5 중량%의 양으로 사용된다.The catalyst is preferably used in an amount of from 0.005 to 2.5% by weight, based on the total weight of the aqueous composition.
하이포아인산 및/또는 하이포아인산 염을 폴리아미드 형성에 적합한 성분들(= 성분 A) 내지 K))의 총량을 기준으로 50 내지 1000 ppm, 더 바람직하게는 100 내지 500 ppm의 양으로 사용하는 것이 특히 바람직하다.It is particularly advantageous to use hypophosphorous acid and / or hypophosphite in an amount of 50 to 1000 ppm, more preferably 100 to 500 ppm, based on the total amount of components (= components A) to K) suitable for polyamide formation desirable.
개환 락탐 중합은 촉매의 사용 없이 순수하게 가수분해로 수행될 수 있다. 활성화 음이온 락탐 중합의 경우에, 락탐 음이온의 형성을 가능하게 하는 촉매가 사용된다. 적합한 촉매와 활성화제가 당업계의 숙련자에게 공지되어 있다. 아미노니트릴의 중축합, 예를 들어 6-아미노카프로니트릴(ACN)로부터 폴리아미드-6의 제조는 불균일 촉매, 예를 들어 TiO2의 존재 하에 수행될 수 있다.The ring-opening lactam polymerization can be carried out by pure hydrolysis without the use of a catalyst. In the case of activated anion lactam polymerization, a catalyst is used which enables the formation of a lactam anion. Suitable catalysts and activators are known to those skilled in the art. The preparation of polyamide-6 from polycondensation of aminonitrile, for example 6-aminocapronitrile (ACN), can be carried out in the presence of a heterogeneous catalyst, for example TiO 2 .
몰 질량의 조절을 위해, 1 이상의 사슬 이동제를 사용하는 것이 가능하다. 적합한 사슬 이동제는 폴리아미드 형성에 적합한 성분에서 상기에 언급된, 모노카르복실산 A)와 모노아민 F)이다. 사슬 이동제는 바람직하게는 아세트산, 프로피온산, 부티르산, 발레르산, 카프로산, 라우르산, 스테아르산, 2-에틸헥산산, 시클로헥산산, 벤조산, 3-(3,5-디-tert-부틸-4-히드록시페닐)프로판산, 3,5-디-tert-부틸-4-히드록시벤조산, 3-(3-tert-부틸-4-히드록시-5-메틸페닐)프로판산, 2-(3,5-디-tert-부틸-4-히드록시벤질티오)아세트산, 3,3-비스(3-tert-부틸-4-히드록시페닐)부탄산, 부틸아민, 펜틸아민, 헥실아민, 2-에틸헥실아민, n-옥틸아민, n-도데실아민, n-테트라데실아민, n-헥사데실아민, 스테아릴아민, 시클로헥실아민, 3-(시클로헥실아미노)프로필아민, 메틸시클로헥실아민, 디메틸시클로헥실아민, 벤질아민, 2-페닐에틸아민, 2,2,6,6-테트라메틸피페리딘-4-아민, 1,2,2,6,6-펜타메틸피페리딘-4-아민, 4-아미노-2,6-디-tert-부틸페놀 및 이들의 혼합물로부터 선택된다. 또한 이동제로서 아미노기 또는 산기와 반응할 수 있는 다른 일작용성 화합물, 예를 들어 무수물, 이소시아네이트, 산 할로겐화물 또는 에스테르를 사용하는 것이 가능하다. 사슬 이동제의 통상 사용량은 프리폴리머 kg 당 5 내지 500 mmol, 바람직하게는 폴리아미드 올리고머 kg 당 10 내지 200 mmol 범위 내이다.For controlling the molar mass, it is possible to use at least one chain transfer agent. Suitable chain transfer agents are the monocarboxylic acids A) and monoamines F) mentioned above in a component suitable for polyamide formation. The chain transfer agent is preferably selected from the group consisting of acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, lauric acid, stearic acid, 2-ethylhexanoic acid, cyclohexanoic acid, benzoic acid, 3- Hydroxyphenyl) propanoic acid, 3- (3-tert-butyl-4-hydroxyphenyl) propanoic acid, 3,5-di-tert- (3-tert-butyl-4-hydroxyphenyl) butanoic acid, butylamine, pentylamine, hexylamine, 2-tert- butyl-4-hydroxybenzylthio) acetic acid, But are not limited to, ethylhexylamine, n-octylamine, n-dodecylamine, n-tetradecylamine, n-hexadecylamine, stearylamine, cyclohexylamine, 3- (cyclohexylamino) propylamine, methylcyclohexylamine, Dimethylcyclohexylamine, benzylamine, 2-phenylethylamine, 2,2,6,6-tetramethylpiperidin-4-amine, 1,2,2,6,6-pentamethylpiperidine-4- Amine, 4-amino-2,6-di-tert-butylphenol, and mixtures thereof. It is also possible to use other monofunctional compounds, such as anhydrides, isocyanates, acid halides or esters, which can react with amino groups or acid groups as transfer agents. The usual amount of chain transfer agent is in the range of 5 to 500 mmol per kg of prepolymer, preferably 10 to 200 mmol per kg of polyamide oligomer.
필요한 경우, 촉매 및 사슬 이동제가 아닌 추가 첨가제가 수성 조성물에 첨가될 수 있다. 첨가제는 예를 들어 산화방지제, 광 안정화제, 표준 가공 조제, 핵생성제 및 결정화 촉진제를 포함한다.If desired, additional additives may be added to the aqueous composition, such as catalysts and chain transfer agents. Additives include, for example, antioxidants, light stabilizers, standard processing aids, nucleating agents and crystallization promoters.
제공되는 프리폴리머는 바람직하게는 수 평균 분자량 Mn이 약 500∼약 12000 g/mol, 바람직하게는 약 1000∼4000 g/mol이다.The prepolymer that is provided is preferably the number average molecular weight M n of about 500~ about 12000 g / mol, preferably from about 1000~4000 g / mol.
단계 a)에서 제공되는 프리폴리머는 미분 입자 내지 과립 크기 범위의 입자 크기로 제공될 수 있다. 바람직하게는, 단계 a)에서 제공되는 프리폴리머는 입자 크기가 1 ㎛ 내지 10 mm 범위이다. 바람직한 실시형태는 100 ㎛ 내지 1 mm 범위의 입자 크기를 갖는 분말이다.The prepolymer provided in step a) may be provided in a particle size ranging from fine particle to granule size range. Preferably, the prepolymer provided in step a) has a particle size in the range of 1 [mu] m to 10 mm. A preferred embodiment is a powder having a particle size in the range of 100 [mu] m to 1 mm.
바람직하게는, 프리폴리머에 대해 단계 b)에서 사용되기 전에 성형을 실시한다. 바람직하게는, 프리폴리머의 성형은 펠릿화 및/또는 분쇄 조작을 포함한다. 폴리아미드의 펠릿화 및 분쇄를 위한 적합한 공정은 당업계의 숙련자에게 공지되어 있다. 적합한 공정은 예를 들어 문헌(Kunststoffhandbuch, 3/4 Technische Thermoplaste: Polyamide, Carl Hanser Verlag, 1998, Munich, p. 68-69)에 기재되어 있다. 구체적인 성형 공정은 마찬가지로 원칙적으로 당업계의 숙련자에게 공지된 수중 펠릿화이다. 적합한 실시에서, 폴리아미드를 우선 성형을 위한 1 이상의 스트랜드로 성형한다. 이를 목적으로 하여, 당업계의 숙련자에게 공지된 장치를 이용할 수 있다. 적합한 장치는 예를 들어 천공판, 노즐 또는 다이판이다. 스트랜드 직경은 바람직하게는 0.5 mm∼20 mm, 더 바람직하게는 1 mm∼5 mm, 가장 바람직하게는 1.5 mm∼3 mm 범위이다. 적합한 실시형태에서, 스트랜드로 성형된 폴리아미드를 자유 유동 형태에서 분쇄하여 폴리아미드 입자를 제공한다. 대안적인 실시형태에서, 스트랜드로 성형된 폴리아미드를 고화시킨 후, 분쇄하여 폴리아미드 입자를 제공한다. 프리폴리머의 분쇄에 적합한 밀(mill)은 예를 들어 해머 밀, 롤 밀, 볼 밀 등이다.Preferably, molding is carried out before being used in step b) for the prepolymer. Preferably, the shaping of the prepolymer comprises pelletizing and / or grinding operations. Suitable processes for pelleting and milling polyamides are known to those skilled in the art. Suitable processes are described, for example, in Kunststoffhandbuch, 3/4 Technische Thermoplaste: Polyamide, Carl Hanser Verlag, 1998, Munich, p. 68-69. The specific shaping process is likewise in principle an underwater pelletization known to those skilled in the art. In a suitable embodiment, the polyamide is first shaped into at least one strand for forming. For this purpose, devices known to those skilled in the art can be used. Suitable devices are, for example, apertured plates, nozzles or die plates. The strand diameter is preferably in the range of 0.5 mm to 20 mm, more preferably in the range of 1 mm to 5 mm, and most preferably in the range of 1.5 mm to 3 mm. In a preferred embodiment, the strand-shaped polyamide is pulverized in free-flowing form to provide polyamide particles. In an alternative embodiment, the strand-shaped polyamide is solidified and then ground to provide polyamide particles. Suitable mills for grinding prepolymers are, for example, hammer mills, roll mills, ball mills and the like.
본 발명에 따른 방법의 단계 b)에서는, 단계 a)에서 제공되는 프리폴리머를 처리 조건 하에 불활성인 가스의 존재 하에서 승온 및 승압에서 밀폐 용기 내에서 고상 중합시킨다.In step b) of the process according to the invention, the prepolymer provided in step a) is subjected to solid phase polymerization in a closed vessel at elevated temperature and elevated pressure in the presence of a gas inert under the treatment conditions.
고상 중합에 적합한 밀폐 용기는 승압 범위에서 물질의 열 처리에 통상 사용되는 바의, 당업계의 숙련자에게 공지되어 있고 기밀 밀봉될 수 있는 압력 용기(오토클레이브)이다.Closed containers suitable for solid state polymerization are pressure vessels (autoclaves) which are known to those skilled in the art and which can be hermetically sealed, as is commonly used in the heat treatment of materials at elevated pressures.
단계 b)에서의 고상 중합에서, 밀폐 용기 내 온도는 바람직하게는 200∼290℃, 더 바람직하게는 250∼280℃ 범위이다.In the solid phase polymerization in step b), the temperature in the closed vessel is preferably in the range of 200 to 290 캜, more preferably in the range of 250 to 280 캜.
단계 b)에서의 고상 중합에서, 밀폐 용기 내 압력은 바람직하게는 1.5∼20 bar, 더 바람직하게는 2∼15 bar, 특히 3∼10 bar 범위이다. 특히 적합한 압력 범위는 4∼7 bar이다.In the solid phase polymerization in step b), the pressure in the sealed vessel is preferably in the range from 1.5 to 20 bar, more preferably from 2 to 15 bar, especially from 3 to 10 bar. A particularly suitable pressure range is 4 to 7 bar.
밀폐 용기 내에서의 단계 b)에서의 체류 시간은 바람직하게는 0.5 시간∼72 시간, 더 바람직하게는 1 시간∼48 시간, 특히 2 시간∼24 시간이다.The residence time in step b) in the closed vessel is preferably 0.5 to 72 hours, more preferably 1 to 48 hours, particularly 2 to 24 hours.
적합한 불활성 가스는 예를 들어 질소, CO2, 헬륨, 네온 및 아르곤, 및 이들의 혼합물이다. 질소를 사용하는 것이 바람직하다.Suitable inert gases are, for example, nitrogen, CO 2 , helium, neon and argon, and mixtures thereof. It is preferable to use nitrogen.
본 발명에 따른 방법으로 특히 유리한 특성을 갖는 반방향족 폴리아미드가 얻어진다.A semiaromatic polyamide having properties particularly advantageous in the process according to the invention is obtained.
본 발명의 문맥에서 수 평균 분자량 Mn 및 중량 평균 분자량 Mw에 대한 수치는 각각 겔 투과 크로마토그래피(GPC)에 의한 측정을 기준으로 한다. 보정을 위해, 다분산도가 낮은 중합체 표준물로서 PMMA를 사용하였다.In the context of the present invention, the values for the number average molecular weight M n and the weight average molecular weight M w are respectively based on measurements by gel permeation chromatography (GPC). For calibration, PMMA was used as a low polydispersity polymer standard.
본 발명 지방족 폴리아미드, 및 본 발명에 따른 방법에 의해 얻어진 이 폴리아미드는 바람직하게는 수 평균 분자량 Mn이 13,000 내지 28,000 g/mol 범위 내이다.The polyamide obtained by the process according to the invention, aliphatic polyamide, and the present invention is preferably in a number average molecular weight M n is 13,000 to 28,000 g / mol range.
본 발명 반방향족 폴리아미드, 및 본 발명에 따른 방법에 의해 얻어진 이 폴리아미드는 바람직하게는 수 평균 분자량 Mn이 13,000 내지 25,000 g/mol, 더 바람직하게는 15,000 내지 20,000 g/mol 범위 내이다.Is within the present invention, semi-aromatic polyamide, and a polyamide obtained by the method according to the invention preferably has a number average molecular weight M n is 13,000 to 25,000 g / mol, more preferably from 15,000 to 20,000 g / mol range.
본 발명 지방족 폴리아미드, 및 본 발명에 따른 방법에 의해 얻어진 이 폴리아미드는 바람직하게는 중량 평균 분자량 Mw가 20,000 내지 140,000 g/mol 범위 내이다.The inventive aliphatic polyamides and the polyamides obtained by the process according to the invention preferably have a weight average molecular weight M w in the range from 20,000 to 140,000 g / mol.
본 발명 반방향족 폴리아미드, 및 본 발명에 따른 방법에 의해 얻어진 이 폴리아미드는 바람직하게는 중량 평균 분자량 Mw가 25,000 내지 125,000 g/mol 범위 내이다.The inventive semiaromatic polyamides and the polyamides obtained by the process according to the invention preferably have a weight average molecular weight M w in the range from 25,000 to 125,000 g / mol.
본 발명 지방족 및 반방향족 폴리아미드, 및 본 발명에 따른 방법에 의해 얻어진 이 폴리아미드는 바람직하게는 다분산도 PD(= Mw/Mn)가 6을 초과하지 않고, 더 바람직하게는 5를 초과하지 않으며, 특히 3.5를 초과하지 않는다.The inventive aliphatic and semiaromatic polyamides and the polyamides obtained by the process according to the invention preferably have a polydispersity PD (= M w / M n ) of not more than 6, more preferably not more than 5 In particular, not exceeding 3.5.
본 발명에 따른 방법에 의해 얻을 수 있는 지방족 폴리아미드는 특히 필름, 모노필라멘트, 섬유, 얀 또는 텍스타일 패브릭의 제조에 적합하다. 본 문맥에서, 본 발명에 따라 제조되는 지방족 폴리아미드는 슬롯 다이 또는 환상 다이를 통해 평판 필름 또는 블로운(blown) 필름을 형성하고, 더 작은 직경의 환상 다이를 통해 모노필라멘트를 형성하는 용융 압출 중 가공에 특히 안정하다고 일반적으로 밝혀져 있다.The aliphatic polyamides obtainable by the process according to the invention are particularly suitable for the production of films, monofilaments, fibers, yarns or textile fabrics. In this context, the aliphatic polyamides produced in accordance with the present invention can be produced by forming a flat film or blown film through a slot die or annular die, and during melt extrusion to form a monofilament through a smaller diameter annular die It is generally known that it is particularly stable in processing.
본 발명에 따른 방법에 의해 얻을 수 있는 반방향족 폴리아미드는 비슷하게 유리한 특성이 있다.The semiaromatic polyamides obtainable by the process according to the invention are likewise of advantageous properties.
본 발명 반방향족 폴리아미드, 및 본 발명에 따른 방법에 의해 얻어진 이 폴리아미드는 바람직하게는 겔 함량이 폴리아미드의 총 중량을 기준으로 5 중량%를 초과하지 않는다.The inventive semiaromatic polyamides and the polyamides obtained by the process according to the invention preferably have a gel content of not more than 5% by weight, based on the total weight of the polyamides.
본 발명 반방향족 폴리아미드, 및 본 발명에 따른 방법에 의해 얻어진 이 폴리아미드는 바람직하게는 점도수가 80 내지 120 ml/g이다. 점도수(스타우딩거 함수, VN 또는 J로서 언급됨)는 VN = 1/c x (η-ηs)/ηs로서 정의된다. 점도수는 폴리아미드의 평균 몰 질량에 직접 관련되어 있으며, 중합체의 가공성에 대한 정보를 제공한다. 점도수는 우베로데(Ubbelohde) 점도계에 의해 EN ISO 307에 따라 측정될 수 있다.The inventive semiaromatic polyamides and the polyamides obtained by the process according to the invention preferably have a viscosity of 80 to 120 ml / g. (Referred to as a star right dinggeo function, VN or J) viscosity number is defined as VN = 1 / cx (η- η s) / η s. The viscosity number is directly related to the average molar mass of the polyamide and provides information on the processability of the polymer. The number of viscosities can be measured according to EN ISO 307 by Ubbelohde viscometer.
폴리아미드 몰딩 조성물Polyamide molding composition
본 발명은 추가로 1 이상의 본 발명 반방향족 코폴리아미드를 포함하는 폴리아미드 몰딩 조성물을 제공한다.The present invention further provides a polyamide molding composition comprising at least one inventive semiaromatic copolyamide.
폴리아미드 몰딩 조성물로서As the polyamide molding composition
A) 25 내지 100 중량%의, 상기에 한정한 바와 같은 1 이상의 반방향족 코폴리아미드,A) 25 to 100% by weight of at least one semi- aromatic copolyamide as defined above,
B) 0 내지 75 중량%의 1 이상의 충전제와 보강제,B) from 0 to 75% by weight of one or more fillers and reinforcing agents,
C) 0 내지 50 중량%의 1 이상의 첨가제를 포함하며,C) from 0 to 50% by weight of at least one additive,
여기서 성분 A) 내지 C)는 함께 합계 100 중량%인 폴리아미드 몰딩 조성물이 바람직하다.Here, the components A) to C) together are preferably 100% by weight in total of the polyamide molding composition.
용어 "충전제와 보강제"(= 성분 B)는 본 발명의 문맥에서 넓은 의미로 이해되며, 미립자 충전제, 섬유상 물질 및 임의의 중간 형태를 포함한다. 미립자 충전제는 먼지 형태의 입자로부터 큰 과립까지 광범위한 입자 크기를 가질 수 있다. 유용한 충전제 재료는 유기 또는 무기 충전제와 보강제를 포함한다. 예를 들어, 무기 충전제, 예를 들어 카올린, 백악, 규회석, 탈크, 탄산칼슘, 규산염, 이산화티탄, 산화아연, 흑연, 유리 입자, 예를 들어 유리 비드, 나노스케일 충전제, 예를 들어 탄소 나노튜브, 카본 블랙, 나노스케일 층상 규산염, 나노스케일 알루미나(Al2O3), 나노스케일 티타니아(TiO2), 그래핀(graphene), 영구 자기 또는 자화 가능한 금속 화합물 및/또는 합금, 층상 규산염 및 나노스케일 실리카(SiO2)를 사용하는 것이 가능하다. 충전제는 또한 표면 처리될 수 있다.The term "filler and reinforcing agent" (= component B) is understood in the context of the present invention in a broad sense and includes particulate fillers, fibrous materials and any intermediate forms. Particulate fillers can have a wide range of particle sizes, from dust-like particles to large granules. Useful filler materials include organic or inorganic fillers and reinforcing agents. For example, inorganic fillers such as kaolin, chalk, wollastonite, talc, calcium carbonate, silicates, titanium dioxide, zinc oxide, graphite, glass particles such as glass beads, nanoscale fillers such as carbon nanotubes , carbon black, nano-scale phyllosilicates, nanoscale alumina (Al 2 O 3), nanoscale titania (TiO 2), graphene (graphene), permanently magnetic or magnetized metal compound and / or alloy, the layer silicate and nanoscale It is possible to use silica (SiO 2 ). Fillers can also be surface treated.
본 발명 몰딩 조성물에 사용되는 층상 규산염의 예는 카올린, 사문석, 탈크, 운모, 질석, 일라이트, 스멕타이트, 몬모릴로나이트, 헥토라이트, 복 수산화물 또는 이들의 혼합물을 포함한다. 층상 규산염은 표면 처리될 수 있거나 처리되지 않을 수 있다.Examples of layered silicates used in the molding compositions of the present invention include kaolin, serpentine, talc, mica, vermiculite, ilite, smectite, montmorillonite, hectorite, bicarbonate or mixtures thereof. The layered silicate may or may not be surface treated.
추가로, 1 이상의 섬유상 물질을 사용하는 것이 가능하다. 이들은 바람직하게는 공지된 무기 강화 섬유, 예를 들어 붕소 섬유, 유리 섬유, 탄소 섬유, 실리카 섬유, 세라믹 섬유 및 현무암 섬유; 유기 강화 섬유, 예를 들어 아라미드 섬유, 폴리에스테르 섬유, 나일론 섬유, 폴리에틸렌 섬유 및 천연 섬유, 예를 들어 목 섬유, 아마 섬유, 마 섬유 및 사이잘 섬유로부터 선택된다.In addition, it is possible to use one or more fibrous materials. These are preferably inorganic known reinforcing fibers such as boron fibers, glass fibers, carbon fibers, silica fibers, ceramic fibers and basalt fibers; Organic reinforcing fibers such as aramid fibers, polyester fibers, nylon fibers, polyethylene fibers and natural fibers such as wood fibers, flax fibers, hemp fibers and sisal fibers.
유리 섬유, 탄소 섬유, 아라미드 섬유, 붕소 섬유, 금속 섬유 또는 티탄산칼륨 섬유를 사용하는 것이 특히 바람직하다.It is particularly preferable to use glass fibers, carbon fibers, aramid fibers, boron fibers, metal fibers or potassium titanate fibers.
특히, 세절 유리 섬유가 사용된다. 더 구체적으로는, 성분 B)는 유리 섬유 및/또는 탄소 섬유를 포함하며, 단섬유를 사용하는 것이 바람직하다. 이들은 바람직하게는 길이가 2 내지 50 mm 범위이고, 직경이 5 내지 40 ㎛이다. 대안으로, 연속 섬유(조방사)를 사용하는 것이 가능하다. 적합한 섬유는 단면적이 원형 및/또는 비원형인 섬유이며, 후자의 경우에 주 단면 축 대 보조 단면 축의 치수 비가 특히 >2, 바람직하게는 2 내지 8 범위, 더 바람직하게는 3 내지 5 범위이다.Particularly, fine fiberglass is used. More specifically, component B) comprises glass fibers and / or carbon fibers, preferably using short fibers. They are preferably in the range of 2 to 50 mm in length and 5 to 40 탆 in diameter. Alternatively, it is possible to use continuous fibers (crude yarn). Suitable fibers are fibers whose cross-sectional area is circular and / or non-circular, and in the latter case the aspect ratio of the major cross-sectional axis to the minor cross-sectional axis is in particular > 2, preferably in the range of 2 to 8, more preferably in the range of 3 to 5.
구체적인 실시에서, 성분 B)는 소위 "평판 유리 섬유"를 포함한다. 이들은 구체적으로 난형 또는 타원형이거나 또는 타원형이고 만입(들)이 구비되거나("고치"(cocoon) 섬유로 칭함), 또는 직사각형 또는 실질적으로 직사각형인 단면적을 가진다. 여기서 단면적이 비원형이고, 주 단면 축 대 보조 단면 축의 치수 비가 2 초과, 바람직하게는 2 내지 8, 특히 3 내지 5인 유리 섬유를 사용하는 것이 바람직하다.In a specific embodiment, component B) comprises so-called "flat glass fibers ". They are specifically oval or elliptical or elliptical and have indent (s) (referred to as "cocoon " fibers), or have a cross-sectional area that is rectangular or substantially rectangular. Here, it is preferable to use a glass fiber having a non-circular cross-sectional area and a dimensional ratio of the main section axis to the auxiliary section axis of more than 2, preferably 2 to 8, especially 3 to 5.
본 발명 몰딩 조성물의 강화를 위해, 또한 단면이 원형 및 비원형인 유리 섬유의 혼합물을 사용하는 것이 가능하다. 구체적인 실시에서, 상기에 한정한 바와 같은 평판 유리 섬유의 비율이 우세하며, 이들이 섬유 총 질량의 50 중량%를 초과하여 구성하는 것을 의미한다.In order to strengthen the molding composition of the present invention, it is also possible to use a mixture of glass fibers having a circular and non-circular cross-section. In a specific implementation, the proportion of flat glass fibers as defined above is predominant, meaning that they constitute more than 50% by weight of the total fiber mass.
유리 섬유의 조방사가 성분 B)로서 사용되는 경우, 이들은 바람직하게는 직경이 10 내지 20 ㎛, 바람직하게는 12 내지 18 ㎛이다. 이 경우에, 유리 섬유의 단면은 둥글거나, 난형, 타원형, 실질적으로 직사각형 또는 직사각형일 수 있다. 단면 축들의 비가 2 내지 5인 소위 평판 유리 섬유가 특히 바람직하다. 더 구체적으로는, E 유리 섬유가 사용된다. 그러나 또한 모든 다른 유리 섬유 형태, 예를 들어 A, C, D, M, S 또는 R 유리 섬유 또는 이들의 임의의 바람직한 혼합물, 또는 E 유리 섬유와 혼합물을 사용하는 것이 가능하다.When the glass fibers are used as component B), they preferably have a diameter of from 10 to 20 mu m, preferably from 12 to 18 mu m. In this case, the cross section of the glass fibers may be round, oval, elliptical, substantially rectangular or rectangular. So-called flat glass fibers with a ratio of cross-sectional axes of 2 to 5 are particularly preferred. More specifically, E glass fiber is used. However, it is also possible to use all other glass fiber forms, for example A, C, D, M, S or R glass fibers or any desired mixtures thereof, or E glass fibers and mixtures.
본 발명 폴리아미드 몰딩 조성물은 공지된 장섬유 강화 로드 펠릿의 제조 방법, 특히 연속 섬유 스트랜드(조방사)가 중합체 용융물로 완전히 포화된 다음 냉각되어 절단되는 인발 성형 방법에 의해 제조될 수 있다. 바람직하게는 펠릿 길이가 3 내지 25 mm, 특히 4 내지 12 mm인, 이러한 방식으로 얻어진 장섬유 강화 로드 펠릿은 통상의 가공 방법, 예를 들어 사출 성형 또는 프레스 성형에 의해 가공되어 몰딩을 제공할 수 있다.The polyamide molding composition of the present invention can be produced by a process for the production of known long fiber reinforced rod pellets, in particular by a draw-forming process wherein the continuous fiber strand (crude spinning) is fully saturated with the polymer melt and then cooled and cut. The long fiber reinforced rod pellets obtained in this way, preferably having a pellet length of from 3 to 25 mm, in particular from 4 to 12 mm, can be processed by conventional processing methods, for example injection molding or press molding, have.
본 발명 폴리아미드 몰딩 조성물은 폴리아미드 몰딩 조성물의 총 중량을 기준으로 바람직하게는 25 내지 75 중량%, 더 바람직하게는 33 내지 60 중량%의 1 이상의 충전제 또는 보강제 B)를 포함한다.The polyamide molding composition of the present invention preferably comprises 25 to 75 wt%, more preferably 33 to 60 wt% of one or more fillers or reinforcing agents B) based on the total weight of the polyamide molding composition.
적합한 첨가제 C)는 열 안정화제, 난연제, 광 안정화제(UV 안정화제, UV 흡수제 또는 UV 차단제), 윤활제, 염료, 핵생성제, 금속 안료, 금속 플레이크, 금속 코팅 입자, 정전기 방지제, 전도성 첨가제, 이형제, 광학적 광택제, 소포제 등이다.Suitable additives C) may be selected from the group consisting of heat stabilizers, flame retardants, light stabilizers (UV stabilizers, UV absorbers or UV screening agents), lubricants, dyes, nucleators, metal pigments, metal flakes, metal coating particles, antistatic agents, A release agent, an optical brightener, a defoaming agent, and the like.
성분 C)로서, 본 발명 몰딩 조성물은 바람직하게는 0.01 내지 3 중량%, 더 바람직하게는 0.02 내지 2 중량%, 특히 0.1 내지 1.5 중량%의 1 이상의 열 안정화제를 포함한다.As component C), the molding compositions of the present invention preferably comprise from 0.01 to 3% by weight, more preferably from 0.02 to 2% by weight, in particular from 0.1 to 1.5% by weight, of at least one heat stabilizer.
열 안정화제는 바람직하게는 구리 화합물, 이차 방향족 아민, 입체 장애 페놀, 아인산염, 포스포나이트 및 이들의 혼합물로부터 선택된다.The heat stabilizer is preferably selected from copper compounds, secondary aromatic amines, sterically hindered phenols, phosphites, phosphonites and mixtures thereof.
구리 화합물이 사용되는 경우, 구리의 양은 성분 A) 내지 C)의 합계를 기준으로 바람직하게는 0.003 내지 0.5 중량%, 특히 0.005 내지 0.3 중량%, 더 바람직하게는 0.01 내지 0.2 중량%이다.When a copper compound is used, the amount of copper is preferably 0.003 to 0.5% by weight, particularly 0.005 to 0.3% by weight, more preferably 0.01 to 0.2% by weight, based on the total of components A) to C).
이차 방향족 아민을 기초로 한 안정화제가 사용되는 경우, 이들 안정화제의 양은 성분 A) 내지 C)의 합계를 기준으로 바람직하게는 0.2 내지 2 중량%, 더 바람직하게는 0.2 내지 1.5 중량%이다.When stabilizers based on secondary aromatic amines are used, the amount of these stabilizers is preferably from 0.2 to 2% by weight, more preferably from 0.2 to 1.5% by weight, based on the sum of components A) to C).
입체 장애 페놀을 기초로 한 안정화제가 사용되는 경우, 이들 안정화제의 양은 성분 A) 내지 C)의 합계를 기준으로 바람직하게는 0.1 내지 1.5 중량%, 더 바람직하게는 0.2 내지 1 중량%이다.When a stabilizer based on a sterically hindered phenol is used, the amount of these stabilizers is preferably from 0.1 to 1.5% by weight, more preferably from 0.2 to 1% by weight, based on the sum of components A) to C).
아인산염 및/또는 포스포나이트를 기초로 한 안정화제가 사용되는 경우, 이들 안정화제의 양은 성분 A) 내지 C)의 합계를 기준으로 바람직하게는 0.1 내지 1.5 중량%, 더 바람직하게는 0.2 내지 1 중량%이다.When stabilizers based on phosphites and / or phosphonites are used, the amount of these stabilizers is preferably from 0.1 to 1.5% by weight, more preferably from 0.2 to 1% by weight, based on the sum of components A) to C) Weight%.
1가 또는 2가 구리의 적합한 화합물 C)는 예를 들어 무기산 또는 유기산 또는 1가 또는 2가 페놀과 1가 또는 2가 구리의 염, 1가 또는 2가 구리의 산화물 또는 암모니아, 아민, 아미드, 락탐, 시아나이드 또는 포스핀과 구리 염의 착물이며, 바람직하게는 할로겐화수소산 또는 시안화수소산의 Cu(I) 또는 Cu(II) 염 또는 지방족 카르복실산의 구리 염이다. 1가 구리 화합물 CuCl, CuBr, CuI, CuCN 및 Cu2O, 및 2가 구리 화합물 CuCl2, CuSO4, CuO, 아세트산구리(II) 또는 스테아르산구리(II)가 특히 바람직하다.Suitable compounds C) of monovalent or divalent copper are, for example, salts of inorganic or organic acids or mono- or dihydric phenols with mono- or di-valent copper, mono- or divalent copper or with ammonia, amines, amides, A complex of a lactam, cyanide or phosphine with a copper salt, preferably a Cu (I) or Cu (II) salt of a hydrohalic acid or hydrocyanic acid or a copper salt of an aliphatic carboxylic acid. Particularly preferred are monovalent copper compounds CuCl, CuBr, CuI, CuCN and Cu 2 O, and divalent copper compounds CuCl 2 , CuSO 4 , CuO, copper (II) acetate or copper (II) stearate.
구리 화합물은 시판되고 있거나, 이의 제조가 당업계의 숙련자에게 공지되어 있다. 구리 화합물은 그대로 또는 농축물의 형태로 사용될 수 있다. 농축물은 바람직하게는 구리 염을 고 농도로 포함하는 성분 A)와 동일한 화학 특성의 중합체를 의미하는 것으로 이해된다. 농축물의 사용이 표준 방법이며, 극소량의 공급 원료가 계량되어야 할 때 특히 빈번히 사용된다. 유리하게도, 구리 화합물은 추가 금속 할로겐화물, 특히 알칼리 금속 할로겐화물, 예를 들어 NaI, KI, NaBr, KBr과 조합하여 사용되며, 이 경우에 금속 할로겐화물 대 구리 할로겐화물의 몰 비는 0.5 내지 20, 바람직하게는 1 내지 10, 더 바람직하게는 3 내지 7이다.Copper compounds are commercially available, or the preparation thereof is known to those skilled in the art. The copper compound can be used as it is or in the form of a concentrate. The concentrate is understood to mean a polymer of the same chemical nature as component A), preferably containing a high concentration of copper salt. The use of concentrates is standard practice and is used particularly frequently when very small amounts of feedstock are to be weighed. Advantageously, the copper compound is used in combination with further metal halides, especially alkali metal halides such as NaI, KI, NaBr, KBr, in which case the molar ratio of metal halide to copper halide is from 0.5 to 20 , Preferably 1 to 10, more preferably 3 to 7.
이차 방향족 아민을 기초로 하고, 본 발명에 따라 사용 가능한 안정화제의 특히 바람직한 예는 아세톤과 페닐렌디아민의 부가물(Naugard A), 리놀렌산과 페닐렌디아민의 부가물, 4,4'-비스(α,α-디메틸벤질)디페닐아민(Naugard® 445), N,N'-디나프틸-p-페닐렌디아민, N-페닐-N'-시클로헥실-p-페닐렌디아민 또는 이들 2 이상의 혼합물이다.Particularly preferred examples of stabilizers which are based on secondary aromatic amines and which can be used according to the invention are adducts of acetone with phenylenediamine (Naugard A), adducts of linolenic acid with phenylenediamine, 4,4'-bis phenylenediamine, N, N'-dinaphthyl-p-phenylenediamine, N-phenyl-N'-cyclohexyl-p- / RTI >
입체 장애 페놀을 기초로 하고, 본 발명에 따라 사용 가능한 안정화제의 바람직한 예는 N,N'-헥사메틸렌비스-3-(3,5-디-tert-부틸-4-히드록시페닐)프로피온아미드, 비스(3,3-비스(4'-히드록시-3'-tert-부틸페닐)부탄산)글리콜 에스테르, 2,1'-티오에틸 비스(3-(3,5-디-tert-부틸-4-히드록시페닐)프로피오네이트, 4,4'-부틸리덴비스(3-메틸-6-tert-부틸페닐), 트리에틸렌 글리콜 3-(3-tert-부틸-4-히드록시-5-메틸페닐)프로피오네이트 또는 이들 안정화제 중 2 이상의 혼합물이다.Preferred examples of stabilizers based on sterically hindered phenols and usable according to the invention are N, N'-hexamethylenebis-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionamide , Bis (3,3-bis (4'-hydroxy-3'-tert-butylphenyl) butanoic acid) glycol ester, 2,1'-thioethyl bis (3- (3,5- Butylphenyl) propionate, 4,4'-butylidenebis (3-methyl-6-tert-butylphenyl), triethylene glycol 3- (3- 5-methylphenyl) propionate or a mixture of two or more of these stabilizers.
바람직한 아인산염과 포스포나이트는 트리페닐 포스파이트, 디페닐 알킬 포스파이트, 페닐 디알킬 포스파이트, 트리스(노닐페닐) 포스파이트, 트리라우릴 포스파이트, 트리옥타데실 포스파이트, 디스테아릴 펜타에리스리틸 디포스파이트, 트리스(2,4-디-tert-부틸페닐) 포스파이트, 디이소데실 펜타에리스리틸 디포스파이트, 비스(2,4-디-tert-부틸페닐) 펜타에리스리틸 디포스파이트, 비스(2,6-디-tert-부틸-4-메틸페닐) 펜타에리스리틸 디포스파이트, 디이소데실옥시 펜타에리스리틸 디포스파이트, 비스(2,4-디-tert-부틸-6-메틸페닐) 펜타에리스리틸 디포스파이트, 비스(2,4,6-트리스(tert-부틸페닐)) 펜타에리스리틸 디포스파이트, 트리스테아릴소르비톨 트리포스파이트, 테트라키스(2,4-디-tert-부틸페닐)-4,4'-비페닐렌 디포스포나이트, 6-이소옥틸옥시-2,4,8,10-테트라-tert-부틸-12H-디벤조-[d,g]-1,3,2-디옥사포스포신, 6-플루오로-2,4,8,10-테트라-tert-부틸-12-메틸디벤조-[d,g]-1,3,2-디옥사포스포신, 비스(2,4-디-tert-부틸-6-메틸페닐)메틸 포스파이트 및 비스(2,4-디-tert-부틸-6-메틸페닐)에틸 포스파이트이다. 더 구체적으로는, 트리스[2-tert-부틸-4-티오(2'-메틸-4'-히드록시-5'-tert-부틸)페닐-5-메틸]페닐 포스파이트 및 트리스(2,4-디-tert-부틸페닐) 포스파이트(Hostanox® PAR24: 바스프사(BASF SE)제 시판품)가 바람직하다.Preferred phosphites and phosphonites include triphenyl phosphite, diphenyl alkyl phosphite, phenyl dialkyl phosphite, tris (nonylphenyl) phosphite, trilauryl phosphite, trioctadecyl phosphite, distearyl pentaerythritol (2,4-di-tert-butylphenyl) pentaerythrityl diphosphite, bis (2,4-di-tert-butylphenyl) phosphite, diisodecylpentaerythrityl diphosphite, (2,4-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphite, diisodecyloxy pentaerythritol diphosphite, bis (2,4-di-tert-butylphenyl) pentaerythritol diphosphite, tristearyl sorbitol triphosphite, tetrakis (2,4-di- 4'-biphenylene diphosphonite, 6-isooctyloxy-2,4,8,10-tetra -tert-butyl-12H-dibenzo [d, g] -1,3,2-dioxaphosphosine, 6-fluoro-2,4,8,10-tetra- (2,4-di-tert-butyl-6-methylphenyl) methyl phosphite and bis (2,4-di-tert- butyl) -6-methylphenyl) ethyl phosphite. More specifically, it is possible to use tris [2- tert -butyl-4-thio (2'-methyl-4'-hydroxy-5'- (Di-tert-butylphenyl) phosphite (Hostanox (R) PAR24 (commercially available from BASF SE) is preferred.
열 안정화제의 바람직한 실시형태는 유기 열 안정화제(특히 Hostanox PAR 24 및 Irganox 1010), 비스페놀 A계 에폭시드(특히 Epikote 1001) 및 CuI와 KI를 기초로 한 구리 안정화의 조합에 있다. 유기 안정화제와 에폭시드로 이루어진 시판 안정화제 혼합물의 예는 바스프사제 Irgatec NC66이다. 더 구체적으로는, 오로지 CuI와 KI를 기초로 한 열 안정화가 바람직하다. 구리 또는 구리 화합물의 사용과 별도로, 추가 전이 금속 화합물, 특히 주기율표 VB, VIB, VIIB 또는 VIIIB족의 금속염 또는 금속 산화물의 사용이 배제된다. 또한, 주기율표 VB, VIB, VIIB 또는 VIIIB족의 전이 금속, 예를 들어 철분 또는 강분을 본 발명 몰딩 조성물에 첨가하지 않는 것이 바람직하다.Preferred embodiments of heat stabilizers are in combination with organic thermal stabilizers (especially Hostanox PAR 24 and Irganox 1010), bisphenol A based epoxides (especially Epikote 1001) and copper stabilizations based on CuI and KI. An example of a commercial stabilizer mixture consisting of an organic stabilizer and an epoxide is Irgatec NC66 from BASF. More specifically, thermal stabilization based on CuI and KI is preferred. Apart from the use of copper or copper compounds, the use of additional transition metal compounds, in particular metal salts or metal oxides of the Periodic Table VB, VIB, VIIB or VIIIB groups, is excluded. It is also preferred that no transition metal, such as iron or steel, of the periodic table VB, VIB, VIIB or VIIIB is added to the molding composition of the present invention.
본 발명 몰딩 조성물은 성분 A) 내지 C)의 총 중량을 기준으로 바람직하게는 0 내지 30 중량%, 더 바람직하게는 0 내지 20 중량%의 1 이상의 난연제를 첨가제 C)로서 포함한다. 본 발명 몰딩 조성물이 1 이상의 난연제를 포함하는 경우, 이들은 성분 A) 내지 C)의 총 중량을 기준으로 바람직하게는 0.01 내지 30 중량%, 더 바람직하게는 0.1 내지 20 중량%의 양으로 포함된다. 유용한 난연제 C)는 할로겐화 및 할로겐 비함유 난연제 및 이들의 상승제를 포함한다(또한 Gaechter/Mueller, 3rd edition 1989 Hanser Verlag, chapter 11 참조). 바람직한 할로겐 비함유 난연제는 적린, 포스핀산염 또는 디포스핀산염 및/또는 질소 함유 난연제 예를 들어 멜라민, 멜라민 시아누레이트, 멜라민 설페이트, 멜라민 보레이트, 멜라민 옥살레이트, 멜라민 포스페이트(일차, 이차) 또는 이차 멜라민 피로포스페이트, 네오펜틸 글리콜 붕산 멜라민, 구아니딘 및 당업계의 숙련자에게 공지된 이들의 유도체, 및 또한 중합체 멜라민 포스페이트(CAS No.: 56386-64-2 또는 218768-84-4, 및 또한 유럽특허 제1095030호), 암모늄 폴리포스페이트, 트리스히드록시에틸 이소시아누레이트(임의로 또한 트리스히드록시에틸 이소시아누레이트와의 혼합물로의 암모늄 폴리포스페이트)(유럽특허 제584567호)이다. 또한 N 함유 또는 P 함유 난연제, 또는 난연제로서 적합한 PN 축합물을 독일특허 제10 2004 049 342호에서 찾을 수 있으며, 산화물 또는 붕산염과 같이, 이러한 목적에 통상적인 상승제가 비슷할 수 있다. 적합한 할로겐화 난연제는 예를 들어 올리고머 브롬화 폴리카르보네이트(BC 52 Great Lakes) 또는 N이 4보다 큰 폴리펜타브로모벤질 아크릴레이트(FR 1025 Dead sea bromine), 에폭시드와 테트라브로모비스페놀 A의 반응 생성물, 브롬화 올리고머 또는 중합체 스티렌, 데클로레인(Dechlorane)이며, 이들은 통상적으로 상승제로서 안티몬 산화물과 함께 사용된다(세부 내용과 추가 난연제에 대해 독일특허출원 제10 2004 050 025호 참조).The inventive molding composition preferably comprises 0 to 30% by weight, more preferably 0 to 20% by weight, of one or more flame retardants as additives C), based on the total weight of components A) to C). When the molding composition of the present invention comprises at least one flame retardant, they are preferably contained in an amount of 0.01 to 30% by weight, more preferably 0.1 to 20% by weight, based on the total weight of components A) to C). Useful flame retardants C) include halogenated and halogen-free flame retardants and their synergists (see also Gaechter / Mueller, 3rd edition 1989 Hanser Verlag, chapter 11). Preferred halogen-free flame retardants are selected from the group consisting of rubbers, phosphinates or diphosphates and / or nitrogen containing flame retardants such as melamine, melamine cyanurate, melamine sulfate, melamine borate, melamine oxalate, melamine phosphate (primary, secondary) Melamine pyrophosphate, neopentyl glycol boric acid melamine, guanidine and derivatives thereof known to those skilled in the art, and also polymeric melamine phosphate (CAS No. 56386-64-2 or 218768-84-4, 1095030), ammonium polyphosphate, trishydroxyethylisocyanurate (optionally also ammonium polyphosphate as a mixture with trishydroxyethylisocyanurate) (EP 584567). N-containing or P-containing flame retardants, or PN condensates suitable as flame retardants can also be found in German Patent No. 10 2004 049 342, which may be analogous to elevators customary for this purpose, such as oxides or borates. Suitable halogenated flame retardants include, for example, oligomeric brominated polycarbonate (BC 52 Great Lakes) or polypentabromobenzyl acrylate with N greater than 4 (FR 1025 Dead sea bromine), reaction of epoxide with tetrabromobisphenol A Products, brominated oligomers or polymer styrenes, dechlorane, which are commonly used with antimony oxides as synergists (see German Patent Application No. 10 2004 050 025 for details and additional flame retardants).
본 발명 몰딩 조성물에 사용되는 정전기 방지제는 예를 들어 카본 블랙 및/또는 탄소 나노튜브일 수 있다. 카본 블랙의 사용으로 또한 몰딩 조성물의 흑색을 개선하는데 도움이 될 수 있다. 그러나 몰딩 조성물은 또한 금속 안료를 함유하지 않을 수 있다.The antistatic agent used in the molding composition of the present invention may be, for example, carbon black and / or carbon nanotubes. The use of carbon black can also help to improve the blackness of the molding composition. However, the molding composition may also contain no metallic pigment.
몰딩molding
본 발명은 추가로 본 발명 코폴리아미드 또는 폴리아미드 몰딩 조성물을 사용하여 제조되는 몰딩에 관한 것이다.The present invention further relates to a molding made using the copolyamide or polyamide molding composition of the present invention.
본 발명 반방향족 폴리아미드는 전기 및 전자 부품용 몰딩의 제조에 그리고 고온 자동차 응용 분야에 사용하는데 유리하게 적합하다.The inventive semiaromatic polyamides are advantageously suitable for use in the production of moldings for electrical and electronic components and for use in high temperature automotive applications.
구체적인 실시형태는 특히 실린더 헤드 커버, 엔진 후드, 급기 냉각기용 하우징, 급기 냉각기 밸브, 흡입 파이프, 흡입 매니폴드, 커넥터, 기어, 팬 임펠러, 냉각수 탱크, 열 교환기용 하우징 또는 하우징 부품, 냉각액 냉각기, 급기 냉각기, 서모스탯, 워터 펌프, 가열 소자, 고정 부품으로부터 선택되는, 자동차 부문용 부품의 형태로 또는 구성 요소의 부품으로서의 몰딩이다.Particular embodiments include in particular a cylinder head cover, an engine hood, a housing for an air supply chiller, an air supply chiller valve, a suction pipe, a suction manifold, a connector, a gear, a fan impeller, a cooling water tank, a housing or housing part for a heat exchanger, A cooling device, a thermostat, a water pump, a heating element, a fixed part, or as a component part of a component.
추가의 구체적인 실시형태는 인쇄 회로 기판, 인쇄 회로 기판의 부품, 하우징 구성물, 필름, 또는 와이어의 전기 또는 전자 수동 또는 능동 구성 요소로서 또는 이들의 부품으로서의, 더 구체적으로는 스위치, 플러그, 부싱, 배전기, 계전기, 저항기, 축전기, 와인딩 또는 와인딩 본체, 램프, 다이오드, LED, 트랜지스터, 커넥터, 레귤레이터, 집적 회로(IC), 프로세서, 조절기, 기억 소자 및/또는 센서의 형태로 또는 이들의 부품으로서의 몰딩이다.Additional specific embodiments include electrical or electronic passive or active components of a printed circuit board, components of a printed circuit board, a housing component, a film, or a wire, or as an active component or as a component thereof, more specifically a switch, plug, bushing, Is a molding in the form of, or as part of, a relay, a resistor, a capacitor, a winding or winding body, a lamp, a diode, an LED, a transistor, a connector, a regulator, an integrated circuit (IC), a processor, a regulator, .
본 발명 반방향족 폴리아미드는 추가로 무연 조건 하의 납땜 조작(무연 납땜)에 사용하는 데에, 플러그 커넥터, 마이크로스위치, 마이크로버튼 및 반도체 부품, 특히 발광 다이오드(LED)의 반사기 하우징의 제조에 특히 적합하다.The present semi-aromatic polyamides are particularly suitable for the production of plug connectors, microswitches, micro-buttons and semiconductor components, in particular reflector housings of light emitting diodes (LEDs), for use in soldering operations (lead-free soldering) Do.
구체적인 실시형태는 전기 또는 전자 부품용 고정 요소, 예를 들어 스페이서, 볼트, 필릿(fillet), 푸시인 가이드(push-in guide), 스크루 및 너트로서의 몰딩이다.Specific embodiments are moldings as fixing elements for electrical or electronic components, such as spacers, bolts, fillets, push-in guides, screws and nuts.
소켓, 플러그 커넥터, 플러그 또는 부싱의 형태로 또는 이들의 부품으로서의 몰딩이 특히 바람직하다. 몰딩은 바람직하게는 기계적 인성을 필요로 하는 기능 소자를 포함한다. 이러한 기능 소자의 예는 필름 힌지, 스냅 인 후크 및 스프링 텅이다.Molding in the form of sockets, plug connectors, plugs or bushings, or as parts thereof, is particularly preferred. The molding preferably includes functional elements that require mechanical toughness. Examples of such functional elements are film hinges, snap-in hooks and spring tongues.
자동차 내장재에서 가능한 용도는 대시보드, 조향축 스위치, 좌석 부품, 헤드레스트, 중앙 콘솔, 기어박스 부품 및 도어 모듈을 위한 것이며, 자동차 외장재에서 가능한 용도는 도어 핸들, 외장 거울 부품, 앞 유리 와이퍼 부품, 앞 유리 와이퍼 보호 하우징, 그릴, 루프 레일, 선루프 프레임, 엔진 커버, 실린더 헤드 커버, 흡입 파이프, 앞 유리 와이퍼, 및 외장 차체 부품을 위한 것이다.Applications available in automotive interiors are for dashboards, steering shaft switches, seat components, head restraints, central consoles, gearbox components and door modules. Applications for automotive exterior trim include door handles, exterior mirror components, windscreen wiper components, For windshield wiper protection housings, grille, roof rails, sunroof frames, engine covers, cylinder head covers, suction pipes, windshield wipers, and exterior bodywork parts.
주방 및 가정 부문을 위한, 흐름이 개선된 폴리아미드의 가능한 용도는 주방 기계, 예를 들어 프라이어, 다리미, 손잡이용 부품의 제조이며, 또한 정원과 레저 부문에서의 응용 분야, 예를 들어 관계 시스템 또는 정원 설비용 부품 및 도어 핸들이다.The possible uses of flow-improved polyamides for the kitchen and home sector are the manufacture of kitchen machines, for example for fryers, irons and handles, as well as applications in the garden and leisure sector, Garden fittings and door handles.
하기 실시예는 본 발명을 예시하는데 도움이 되지만, 이를 어느 식으로든 한정하지 않는다.The following examples are intended to illustrate but not limit the invention in any way.
실시예Example
분석 방법:Analysis method:
GPC에 의한 분자량 측정: Measurement of molecular weight by GPC:
표준물: PMMAStandard Water: PMMA
용리액: 헥사플루오로이소프로판올 + 0.05% 트리플루오로아세트산칼륨Eluent: Hexafluoroisopropanol + 0.05% Potassium trifluoroacetate
유속: 1 ml/분Flow rate: 1 ml / min
컬럼 압력: 예비 컬럼 7.5 MPa, 분리 컬럼 75 MPaColumn pressure: preliminary column 7.5 MPa, separation column 75 MPa
컬럼 세트: 1개의 예비 컬럼(l = 5 cm), 2개의 분리 컬럼(각각 l = 30 cm)Column set: One preliminary column (l = 5 cm), two separation columns (l = 30 cm each)
검출기: DRI(굴절 지수 검출기) Agilent 1100Detector: DRI (refractive index detector) Agilent 1100
중합체의 겔 함량은 GPC에 의해 간접 측정하였다. 이를 목적으로 하여, 폴리아미드의 샘플을 헥사플루오로이소프로판올 + 0.05% 트리플루오로아세트산칼륨에 용해시키고, 공경이 0.2 ㎛인 필터(Millipore Millex FG)를 통해 여과하였다. 이어서, GPC로부터 용리된 중합체의 농도를 측정하였다. 측정된 농도(여과 전에 사용된 중합체 기준)와, 여과 전에 사용된 중합체의 양에 의해 제공된 이론적 중합체 농도의 차이로부터, 겔 함량을 산출하였다.The gel content of the polymer was determined indirectly by GPC. For this purpose, a sample of polyamide was dissolved in hexafluoroisopropanol + 0.05% potassium trifluoroacetate and filtered through a filter with a pore size of 0.2 m (Millipore Millex FG). The concentration of polymer eluted from the GPC was then measured. The gel content was calculated from the difference in theoretical polymer concentration provided by the measured concentration (polymer basis used before filtration) and the amount of polymer used before filtration.
유럽특허출원 제0 693 515 A1호, 실시예 9.1 내지 9.3에 기재된 바와 같이 하여 프리폴리머를 제조하였다.A prepolymer was prepared as described in European Patent Application No. 0 693 515 A1, Examples 9.1 to 9.3.
Claims (18)
a) 지방족 또는 반방향족 폴리아미드의 프리폴리머(prepolymer)를 제공하고,
b) 처리 조건 하에서 불활성인 가스의 존재 하에, 승온(elevated temperature) 및 승압(elevated pressure)에서, 단계 a)에서 제공되는 프리폴리머를 밀폐 용기 내에서 고상 중합시키는 방법.As a method for producing an aliphatic or semi-aromatic polyamide,
a) providing a prepolymer of an aliphatic or semi-aromatic polyamide,
b) subjecting the prepolymer provided in step a) to solid-state polymerization in an airtight container at elevated temperature and elevated pressure in the presence of a gas inert under the treatment conditions.
A) 비치환된 또는 치환된 방향족 디카르복실산 및 비치환된 또는 치환된 방향족 디카르복실산의 유도체,
B) 비치환된 또는 치환된 방향족 디아민,
C) 지방족 또는 지환족 디카르복실산 및 이의 유도체,
D) 지방족 또는 지환족 디아민,
E) 모노카르복실산 및 이의 유도체,
F) 모노아민,
G) 적어도 삼작용성 아민,
H) 락탐,
I) ω-아미노산,
K) A) 내지 I)와 다르고, 이들과 공축합 가능한(cocondensable) 화합물
에서 선택되는 중합 성분을 포함하는 방법.The process according to claim 1, wherein the prepolymer provided in step a)
A) a derivative of an unsubstituted or substituted aromatic dicarboxylic acid and an unsubstituted or substituted aromatic dicarboxylic acid,
B) an unsubstituted or substituted aromatic diamine,
C) aliphatic or alicyclic dicarboxylic acids and their derivatives,
D) an aliphatic or alicyclic diamine,
E) monocarboxylic acids and derivatives thereof,
F) monoamine,
G) at least a trifunctional amine,
H) lactam,
I) omega-amino acid,
K) A) to I), and a cocondensable compound
≪ / RTI >
A) 25∼100 중량%의, 제9항 내지 제12항 중 어느 한 항에 정의되거나 또는 제1항 내지 제8항 중 어느 한 항에 정의된 방법에 의해 얻을 수 있는 1 이상의 폴리아미드,
B) 0∼75 중량%의 1 이상의 충전제와 보강제,
C) 0∼50 중량%의 1 이상의 첨가제
를 포함하며,
여기서 성분 A)∼C)는 함께 합계 100 중량%인 폴리아미드 몰딩 조성물.14. The method of claim 13,
A) from 25 to 100% by weight of at least one polyamide obtainable by the process defined in any one of claims 9 to 12 or by the process defined in any one of claims 1 to 8,
B) from 0 to 75% by weight of one or more fillers and reinforcing agents,
C) from 0 to 50% by weight of at least one additive
/ RTI >
Wherein the components A) to C) together are 100% by weight in total.
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| PCT/EP2014/062124 WO2014198770A1 (en) | 2013-06-12 | 2014-06-11 | Method for producing aliphatic or partially aromatic polyamides, said method comprising a solid-phase polymerization process |
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| CN105968804A (en) * | 2016-07-04 | 2016-09-28 | 黄河科技学院 | Flame-retardant and high-temperature-resistant nylon composite material and preparation method thereof |
| CN106118044A (en) * | 2016-07-04 | 2016-11-16 | 黄河科技学院 | Flame-resistant high-temperature-resistant Nylon Nanocomposite and preparation method thereof |
| KR20200055727A (en) | 2017-09-28 | 2020-05-21 | 듀폰 폴리머스, 인크. | Polymerization process |
| CN109054365B (en) * | 2018-07-11 | 2022-10-04 | 青岛万林橡塑科技有限公司 | Preparation method of solid-phase polymerization graphene nylon heat conduction material |
| CN109265678B (en) * | 2018-09-19 | 2021-07-06 | 中仑塑业(福建)有限公司 | Polyamide resin, preparation method thereof and molded product |
| CN115286785B (en) * | 2022-08-18 | 2023-09-12 | 鞍山七彩化学股份有限公司 | High-temperature-resistant nylon based on m-xylylenediamine and preparation method thereof |
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| US20120065339A1 (en) * | 2010-09-10 | 2012-03-15 | Basf Se | Process for producing polyamide that is stable during processing |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024071761A1 (en) * | 2022-09-28 | 2024-04-04 | 한화솔루션 주식회사 | Preparation method of polyamide |
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| WO2014198770A1 (en) | 2014-12-18 |
| MX2015017204A (en) | 2016-11-11 |
| HUE039181T2 (en) | 2018-12-28 |
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| KR102206951B1 (en) | 2021-01-25 |
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| US20160137783A1 (en) | 2016-05-19 |
| SG11201510173QA (en) | 2016-01-28 |
| US9701790B2 (en) | 2017-07-11 |
| IL242874B (en) | 2019-07-31 |
| CN105722891B (en) | 2018-08-24 |
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| ES2671319T3 (en) | 2018-06-06 |
| SI3008111T1 (en) | 2018-06-29 |
| CA2914105A1 (en) | 2014-12-18 |
| CN105722891A (en) | 2016-06-29 |
| PT3008111T (en) | 2018-06-01 |
| TR201807305T4 (en) | 2018-06-21 |
| CA2914105C (en) | 2021-09-07 |
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